SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

D High-Performance Static CMOS Technology D Dual 10-Bit Analog-to-Digital Conversion

D Includes the T320C2xLP Core CPU Module
Object Compatible With the TMS320C2xx D 28 Individually Programmable, Multiplexed
Source Code Compatible With I/O Pins
TMS320C25 D Phase-Locked-Loop (PLL)-Based Clock
Upwardly Compatible With TMS320C5x Module
132-Pin Plastic Quad Flat Package
(PQ Suffix) D Watchdog Timer Module (With Real-Time
50-ns Instruction Cycle Time Interrupt)
D Industrial and Automotive Temperature D Serial Communications Interface (SCI)
Available Module
D Memory D Serial Peripheral Interface (SPI) Module
544 Words 16 Bits of On-Chip D Six External Interrupts (Power Drive
Data/Program Dual-Access RAM Protect, Reset, NMI, and Three Maskable
16K Words 16 Bits of On-Chip Program Interrupts)
Flash EEPROM D Four Power-Down Modes for Low-Power
224K Words 16 Bits of Total Memory Operation
Address Reach (64K Data, 64K Program
and 64K I/O, and 32K Global Memory
D Scan-Based Emulation
Space) D Development Tools Available:
D Event-Manager Module Texas Instruments (TI) ANSI
12 Compare/Pulse-Width Modulation C Compiler, Assembler/Linker, and
(PWM) Channels C-Source Debugger
Three 16-Bit General-Purpose Timers Scan-Based Self-Emulation (XDS510)
With Six Modes, Including Continuous Third-Party Digital Motor Control and
Upand Up/Down Counting Fuzzy-Logic Development Support
Three 16-Bit Full-Compare Units With
Deadband
Three 16-Bit Simple-Compare Units
Four Capture Units (Two With
Quadrature Encoder-Pulse Interface
Capability)

description
The TMS320F240 (F240) device is a member of a family of DSP controllers based on the TMS320C2xx
generation of 16-bit fixed-point digital signal processors (DSPs). This family is optimized for digital motor/motion
control applications. The DSP controllers combine the enhanced TMS320 architectural design of the C2xLP
core CPU for low-cost, high-performance processing capabilities and several advanced peripherals optimized
for motor/motion control applications. These peripherals include the event manager module, which provides
general-purpose timers and compare registers to generate up to 12 PWM outputs, and a dual10-bit
analog-to-digital converter (ADC), which can perform two simultaneous conversions within 6.1 s. See the
functional block diagram.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

XDS510 is a trademark of Texas Instruments.

Other trademarks are the property of their respective owners.

 
  
       !"# $ % Copyright 2002, Texas Instruments Incorporated

$   !  !  &   
'  

$$ ()%
$ ! * $     #) #$
 *  ## !  %

POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443 1




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Table of Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
PQ Package (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . 4 External Memory Interface . . . . . . . . . . . . . . . . . . . . . 38
Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Event-Manager (EV) Module . . . . . . . . . . . . . . . . . . . . 39
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 11 Analog-to-Digital Converter (ADC) Module . . . . . . . . 42
Serial Peripheral Interface (SPI) Module . . . . . . . . . . 44
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Serial Communications Interface (SCI) Module . . . . 46
System-Level Functions . . . . . . . . . . . . . . . . . . . . . . . . . 12 Watchdog (WD) and Real-Time
Device Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Interrupt (RTI) Module . . . . . . . . . . . . . . . . . . . . . 48
Peripheral Memory Map . . . . . . . . . . . . . . . . . . . . . . . . 14 Scan-Based Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Digital I/O and Shared Pin Functions . . . . . . . . . . . . . 15 TMS320F240 Instruction Set . . . . . . . . . . . . . . . . . . . . . 50
Digital I/O Control Registers . . . . . . . . . . . . . . . . . . . . 17 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Device Reset and Interrupts . . . . . . . . . . . . . . . . . . . . 17 Device and Development-Support Tool Nomenclature 58
Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . 59
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . 60
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Recommended Operating Conditions . . . . . . . . . . . . . 60
Functional Block Diagram of the Electrical Characteristics Over Recommended
TMS320F240 DSP CPU . . . . . . . . . . . . . . . . . . . . . 29 Operating Free-Air Temperature Range . . . . . . . . 61
F240 DSP Core CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Register File Compilation . . . . . . . . . . . . . . . . . . . . . . . . 96
Internal Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

2 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

REVISION HISTORY

REVISION DATE PRODUCT STATUS HIGHLIGHTS

Removed TMS320C240 as it is an obsolete device.

Updated descriptions of the following pins in the Terminal Functions

table:
PWM1/CMP1PWM6/CMP6
OSCBYP
TRST

Updated the following figures:

Figure 3, Shared Pin Configuration
Figure 6, System Module Interrupt Structure
Figure 12, Analog-to-Digital Converter Module
Figure 16, TMS320 Device Nomenclature
Figure 20, Recommended Crystal/Clock Connection

Added the following figures:

Figure 31, Case With Crystal
E November 2002 Production Data Figure 32, Case With External Oscillator

Updated the following tables:

Table 15, Development Support Tools
Table 16, TMS320F240-Specific Development Tools
Table 20, Register File Compilation
[ADCTRL1 and ADCTRL2]

Updated the following sections:

Low-Power Modes
Flash EEPROM
Capture Unit
Analog-to-Digital Converter (ADC) Module
[Digital Value equation]
Development Support
External Reference Crystal With PLL-Circuit-Enabled Clock
Option
10-Bit Dual Analog-to-Digital Converter (ADC)

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PQ PACKAGE
(TOP VIEW)

CV SS

DVDD
DVDD

DVDD
CVDD
STRB
V SS

V SS

V SS
R/W

W/R

A15
A14
A13
A12

A10
A11
WE
BR

DS
PS
D6
D5
D4

D3
D2
D1
D0

A9

A8
A7
A6
IS
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
D7 18 116 A5
D8 19 115 A4
VSS 20 114 A3
DVDD 21 113 VSS
D9 22 112 A2
D10 23 111 A1
D11 24 110 A0
D12 25 109 TMRCLK/IOPB7
D13 26 108 TMRDIR/IOPB6
D14 27 107 T3PWM/T3CMP/IOPB5
D15 28 106 T2PWM/T2CMP/IOPB4
VSS 29 105 T1PWM/T1CMP/IOPB3
TCK 30 104 VSS
TDI 31 103 DVDD
TRST 32 102 PWM9/CMP9/IOPB2
TMS 33 101 PWM8/CMP8/IOPB1
TDO 34 100 PWM7/CMP7/IOPB0
RS 35 99 PWM6/CMP6
READY 36 98 PWM5/CMP5
MP/MC 37 97 PWM4/CMP4
EMU0 38 96 PWM3/CMP3
EMU1/OFF 39 95 PWM2/CMP2
NMI 40 94 PWM1/CMP1
PORESET 41 93 DVDD
RESERVED 42 92 VSS
SCIRXD/IO 43 91 ADCIN8/IOPA3
SCITXD/IO 44 90 ADCIN9/IOPA2
SPISIMO/IO 45 89 ADCIN10
VSS 46 88 ADCIN11
DVDD 47 87 VSSA
SPISOMI/IO 48 86 VREFLO
SPICLK/IO 49 85 VREFHI
VCCP/WDDIS 50 84 VCCA
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
CVDD

DVDD
XTAL2

V SS

V SS

V SS
XINT1
SPISTE/IO

XTAL1/CLKIN

CAP3/IOPC6
CAP4/IOPC7

ADCIN0/IOPA0
ADCIN1/IOPA1
XINT2/IO
XINT3/IO
OSCBYP

XF/IOPC2
BIO/IOPC3

ADCIN2
ADCIN3
ADCIN4
ADCIN5
ADCIN6
ADCIN7
ADCSOC/IOPC0

ADCIN15
ADCIN14
ADCIN13
ADCIN12
CLKOUT/IOPC1

CAP1/QEP1/IOPC4
CAP2/QEP2/IOPC5
PDPINT

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions

TERMINAL
TYPE DESCRIPTION
NAME NO.
EXTERNAL INTERFACE DATA/ADDRESS SIGNALS
A0 (LSB) 110
A1 111
A2 112
A3 114
A4 115
A5 116
A6 117 Parallel address bus A0 [least significant bit (LSB)] through A15 [most significant bit (MSB)]. A15A0
A7 118 are multiplexed to address external data/program memory or I/O. A15A0 are placed in
O/Z
A8 119 high-impedance state when EMU1/OFF is active low and hold their previous states in power-down
A9 122 modes.
A10 123
A11 124
A12 125
A13 126
A14 127
A15 (MSB) 128
D0 (LSB) 9
D1 10
D2 11
D3 12
D4 15
D5 16
D6 17 Parallel data bus D0 (LSB) through D15 (MSB). D15D0 are multiplexed to transfer data between the
D7 18 TMS320F240 and external data/program memory and I/O space (devices). D15D0 are placed in the
I/O/Z
D8 19 high-impedance state when not outputting, when in power-down mode, when reset (RS) is asserted,
D9 22 or when EMU1/OFF is active low.
D10 23
D11 24
D12 25
D13 26
D14 27
D15 (MSB) 28
EXTERNAL INTERFACE CONTROL SIGNALS
DS 129 Data, program, and I/O space select signals. DS, PS, and IS are always high unless low-level asserted
PS 131 O/Z for communication to a particular external space. They are placed in the high-impedance state during
IS 130 reset, power down, and when EMU1/OFF is active low.
Data ready. READY indicates that an external device is prepared for the bus transaction to be
READY 36 I completed. If the device is not ready (READY is low), the processor waits one cycle and checks
READY again.
Read/write signal. R/W indicates transfer direction during communication to an external device. It is
R/W 4 O/Z normally in read mode (high), unless low level is asserted for performing a write operation. It is placed
in the high-impedance state during reset, power down, and when EMU1/OFF is active low.
Strobe. STRB is always high unless asserted low to indicate an external bus cycle. It is placed in the
STRB 6 O/Z
high-impedance state during reset, power down, and when EMU1/OFF is active low.
Write enable. The falling edge of WE indicates that the device is driving the external data bus
(D15D0). Data can be latched by an external device on the rising edge of WE. WE is active on all
WE 1 O/Z
external program, data, and I/O writes. WE goes in the high-impedance state following reset and when
EMU1/OFF is active low.
Write/read. W/R is an inverted form of R/W and can connect directly to the output enable of external
W/R 132 O/Z
devices. W/R is placed in the high-impedance state following reset and when EMU1/OFF is active low.
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions (Continued)

TERMINAL
TYPE DESCRIPTION
NAME NO.
EXTERNAL INTERFACE CONTROL SIGNALS (CONTINUED)
Bus request. BR is asserted during access of external global data memory space. BR can be
BR 5 O/Z used to extend the data memory address space by up to 32K words. BR goes in the
high-impedance state during reset, power down, and when EMU1/OFF is active low.
Flash-programming voltage supply. If VCCP = 5 V, then WRITE/ERASE can be made to the
ENTIRE on-chip flash memory blockthat is, for programming the flash. If VCCP = 0 V, then
VCCP/WDDIS 50 I WRITE/ERASE of the flash memory is not allowed, thereby protecting the entire memory block
from being overwritten. VCCP/WDDIS also functions as a hardware watchdog disable. The
watchdog timer is disabled when VCCP/WDDIS = 5 V and bit 6 in WDCR is set to 1.
ADC INPUTS (UNSHARED)
ADCIN2 74 I
ADCIN3 75 I
ADCIN4 76 I
Analog inp
inputs
ts to the first ADC
ADCIN5 77 I
ADCIN6 78 I
ADCIN7 79 I
ADCIN10 89 I
ADCIN11 88 I
ADCIN12 83 I
Analog inp
inputs
ts to the second ADC
ADCIN13 82 I
ADCIN14 81 I
ADCIN15 80 I
BIT I/O AND SHARED FUNCTIONS PINS
Bidirectional digital I/O.
ADCIN0/IOPA0 72 I/O Analog input to the first ADC.
ADCIN0/IOPA0 is configured as a digital input by all device resets.
Bidirectional digital I/O.
ADCIN1/IOPA1 73 I/O Analog input to the first ADC.
ADCIN1/IOPA1 is configured as a digital input by all device resets.
Bidirectional digital I/O.
ADCIN9/IOPA2 90 I/O Analog input to the second ADC.
ADCIN9/IOPA2 is configured as a digital input by all device resets.
Bidirectional digital I/O.
ADCIN8/IOPA3 91 I/O Analog input to the second ADC.
ADCIN8/IOPA3 is configured as a digital input by all device resets.
Bidirectional digital I/O. Simple compare/PWM 1 output. The state of PWM7/CMP7/IOPB0 is
determined by the simple compare/PWM and the simple action control register (SACTR). It
PWM7/CMP7/IOPB0 100 I/O/Z
goes to the high-impedance state when unmasked PDPINT goes active low.
PWM7/CMP7/IOPB0 is configured as a digital input by all device resets.
Bidirectional digital I/O. Simple compare/PWM 2 output. The state of PWM8/CMP8/IOPB1 is
determined by the simple compare/PWM and the SACTR. It goes to the high-impedance state
PWM8/CMP8/IOPB1 101 I/O/Z
when unmasked PDPINT goes active low. PWM8/CMP8/IOPB1 is configured as a digital input
by all device resets.
Bidirectional digital I/O. Simple compare/PWM 3 output. The state of PWM9/CMP9/IOPB2 is
determined by the simple compare/PWM and SACTR. It goes to the high-impedance state
PWM9/CMP9/IOPB2 102 I/O/Z
when unmasked PDPINT goes active low. PWM9/CMP9/IOPB2 is configured as a digital input
by all device resets.
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions (Continued)

TERMINAL
TYPE DESCRIPTION
NAME NO.
BIT I/O AND SHARED FUNCTIONS PINS (CONTINUED)
Bidirectional digital I/O. Timer 1 compare output. T1PWM/T1CMP/IOPB3 goes to the high-
T1PWM/T1CMP/
105 I/O/Z impedance state when unmasked PDPINT goes active low. This pin is configured as a digital
IOPB3
input by all device resets.
Bidirectional digital I/O. Timer 2 compare output. T2PWM/T2CMP/IOPB4 goes to the high-
T2PWM/T2CMP/
106 I/O/Z impedance state when unmasked PDPINT goes active low. This pin is configured as a digital
IOPB4
input by all device resets.
Bidirectional digital I/O. Timer 3 compare output. T3PWM/T3CMP/IOPB5 goes to the high-
T3PWM/T3CMP/
107 I/O/Z impedance state when unmasked PDPINT goes active low. This pin is configured as a digital
IOPB5
input by all device resets.
Bidirectional digital I/O. Direction signal for the timers. Up-counting direction if TMRDIR/IOPB6
TMRDIR/IOPB6 108 I/O is low, down-counting direction if this pin is high.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
TMRCLK/IOPB7 109 I/O External clock input for general-purpose timers.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
ADCSOC/IOPC0 63 I/O External start of conversion input for ADC.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
CAP1/QEP1/IOPC4 67 I/O Capture 1 or QEP 1 input.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
CAP2/QEP2/IOPC5 68 I/O Capture 2 or QEP 2 input.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
CAP3/IOPC6 69 I/O Capture 3 input.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O.
CAP4/IOPC7 70 I/O Capture 4 input.
This pin is configured as a digital input by all device resets.
Bidirectional digital I/O. External flag output (latched software-programmable signal). XF is
XF/IOPC2 65 I/O used for signaling other processors in multiprocessing configurations or as a general-purpose
output pin. This pin is configured as an external flag output by all device resets.
Bidirectional digital I/O. Branch control input. BIO is polled by the BIOZ instruction. If BIO is low,
BIO/IOPC3 66 I/O the CPU executes a branch. If BIO is not used , it should be pulled high. This pin is configured
as a branch-control input by all device resets.
Bidirectional digital I/O. Clock output. Clock output is selected by the CLKSRC bits in the
CLKOUT/IOPC1 64 I/O
SYSCR register. This pin is configured as a DSP clock output by a power-on reset.
SERIAL COMMUNICATIONS INTERFACE (SCI) AND BIT I/O PINS
SCI asynchronous serial port transmit data, or general-purpose bidirectional I/O. This pin is
SCITXD/IO 44 I/O
configured as a digital input by all device resets.
SCI asynchronous serial port receive data, or general-purpose bidirectional I/O. This pin is
SCIRXD/IO 43 I/O
configured as a digital input by all device resets.
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions (Continued)

TERMINAL
TYPE DESCRIPTION
NAME NO.
SERIAL PERIPHERAL INTERFACE (SPI) AND BIT I/O PINS
SPI slave in, master out , or general-purpose bidirectional I/O. This pin is configured as a digital
SPISIMO/IO 45 I/O
input by all device resets.
SPI slave out, master in, or general-purpose bidirectional I/O. This pin is configured as a digital
SPISOMI/IO 48 I/O
input by all device resets.
SPI clock, or general-purpose bidirectional I/O. This pin is configured as a digital input by all
SPICLK/IO 49 I/O
device resets.
SPI slave transmit enable (optional), or general-purpose bidirectional I/O. This pin is configured
SPISTE/IO 51 I/O
as a digital input by all device resets.
COMPARE SIGNALS
PWM1/CMP1 94
Compare or PWM outputs. The state of these pins is determined by the compare/PWM and
PWM2/CMP2 95
the full action control register (ACTR). CMP1CMP6 go to the high-impedance state when un-
PWM3/CMP3 96
O/Z masked PDPINT goes active low.
PWM4/CMP4 97
After power up and PORESET is high, the PWM/CMP pins are high-impedance once the
PWM5/CMP5 98
internal clock is stable (see Figure 31 and Figure 32).
PWM6/CMP6 99
INTERRUPT AND MISCELLANEOUS SIGNALS
Reset input. RS causes the TMS320F240 to terminate execution and sets PC = 0. When RS
RS 35 I/O is brought to a high level, execution begins at location zero of program memory. RS affects (or
sets to zero) various registers and status bits.
MP/MC (microprocessor/microcomputer) select. If MP/MC is low, internal program memory is
MP/MC 37 I
selected. If it is high, external program memory is selected.
Nonmaskable interrupt. When NMI is activated, the device is interrupted regardless of the state
NMI 40 I
of the INTM bit of the status register. NMI has programmable polarity.
Power-on reset. PORESET causes the TMS320F240 to terminate execution and sets PC = 0.
When PORESET is brought to a high level, execution begins at location zero of program
PORESET 41 I
memory. PORESET affects (or sets to zero) the same registers and status bits as RS. In addi-
tion, PORESET initializes the PLL control registers.
XINT1 53 I External user interrupt no. 1
External user interrupt no. 2. General-purpose bidirectional I/O. This pin is configured as a
XINT2/IO 54 I/O
digital input by all device resets.
External user interrupt no. 3. General-purpose bidirectional I/O. This pin is configured as a
XINT3/IO 55 I/O
digital input by all device resets.
Maskable power-drive protection interrupt. If PDPINT is unmasked and it goes active low, the
PDPINT 52 I
timer compare outputs immediately go to the high-impedance state.
CLOCK SIGNALS
PLL oscillator output. XTAL2 is tied to one side of a reference crystal when the device is in PLL
mode (CLKMD[1:0] = 1x, CKCR0.76). This pin can be left unconnected in oscillator bypass
XTAL2 57 O
mode (OSCBYP VIL). This pin goes in the high-impedance state when EMU1/OFF is active
low.
PLL oscillator input. XTAL1/CLKIN is tied to one side of a reference crystal in PLL mode
XTAL1/CLKIN 58 I/Z (CLKMD[1:0] = 1x, CKCR0.76), or is connected to an external clock source in oscillator
bypass mode (OSCBYP VIL).
OSCBYP 56 I Bypass on-chip oscillator if low
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions (Continued)

TERMINAL
TYPE DESCRIPTION
NAME NO.
SUPPLY SIGNALS
CVSS 8 I Digital core logic ground reference

3
14
20
29
46
59
VSS I Digital logic ground
gro nd reference
61
71
92
104
113
120

VSSA 87 I Analog ground reference

2
13
21
47
DVDD I Digital I/O logic supply voltage
62
93
103
121
7
CVDD I Digital core logic supply
s ppl voltage
oltage
60
VCCA 84 I Analog supply voltage
VREFHI 85 I ADC analog voltage reference high
VREFLO 86 I ADC analog voltage reference low
TEST SIGNALS
JTAG test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on
test-access port (TAP) input signals (TMS and TDI) are clocked into the TAP controller, instruction reg-
TCK 30 I
ister, or selected test data register of the C2xx core on the rising edge of TCK. Changes at the TAP
output signal (TDO) occur on the falling edge of TCK.
JTAG test data input (TDI). TDI is clocked into the selected register (instruction or data) on a rising
TDI 31 I
edge of TCK.
JTAG test data output (TDO). The contents of the selected register (instruction or data) are shifted out
TDO 34 O/Z
of TDO on the falling edge of TCK. TDO is in the high-impedance state when OFF is active low.
JTAG test mode select. This serial control input is clocked into the TAP controller on the rising edge
TMS 33 I
of TCK.
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

Terminal Functions (Continued)

TERMINAL
TYPE DESCRIPTION
NAME NO.
TEST SIGNALS (CONTINUED)
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the
TRST 32 I operations of the device. If this signal is not connected or driven low, the device operates in its function-
al mode, and the test reset signals are ignored.
Emulator pin 0. When TRST is driven low, EMU0 must be high for activation of the /OFF condition.
EMU0 38 I/O/Z When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined
as input/output through the scan.
Emulator pin 1/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to
or from the emulator system and is defined as input/output through JTAG scan. When TRST is driven
low, this pin is configured as OFF. When EMU1/OFF is active low, it puts all output drivers in the
EMU1/OFF 39 I/O/Z
high-impedance state. OFF is used exclusively for testing and emulation purposes (not for
multiprocessing applications); therefore, for OFF condition, the following conditions apply:
TRST = low, EMU0 = high, EMU1/OFF = low
RESERVED 42 I Reserved for test. This pin has an internal pulldown and must be left unconnected.
I = input, O = output, Z = high impedance

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

functional block diagram

Data Bus

Test/ 7

Emulation

Flash DARAM DARAM

EEPROM B0 B1/B2
External 41

Memory
Program Bus Interface

Memory Software
C2xx
Control Wait-State

Instruction CPU Generation
Register

Interrupts Program

Controller Event
Initialization Input Manager

ARAU Shifter Multiplier

Status/ General-
4

Control ALU TREG Purpose
Registers Timers

Auxiliary
Registers Accumulator PREG 9

Compare
Memory- Units

Mapped
Output Product

Registers Shifter Shifter
Capture/
4

Quadrature
Encoder

Pulse (QEP)

PDPINT

4
Interrupts

Clock System-Interface 20
Digital Input/Output
3 Module Module

Reset

Peripheral Bus

Dual 10-Bit

Serial- Serial-
Analog- Peripheral Communications Watchdog

to-Digital Interface Interface Timer
Converter

16 4 2

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

description (continued)

Table 1. Characteristics of the TMS320F240 DSP Controller

ON-CHIP MEMORY (WORDS)
FLASH POWER CYCLE PACKAGE
RAM SUPPLY TIME TYPE
EEPROM
(V) (ns) PIN COUNT
DATA DATA/PROG PROG
288 256 16K 5 50 PQ 132P

architectural overview
The functional block diagram provides a high-level description of each component in the F240 DSP controller.
The TMS320F240 device is composed of three main functional units: a C2xx DSP core, internal memory, and
peripherals. In addition to these three functional units, there are several system-level features of the F240 that
are distributed. These system features include the memory map, device reset, interrupts, digital input/output
(I/O), clock generation, and low-power operation.

system-level functions
device memory map
The TMS320F240 implements three separate address spaces for program memory, data memory, and I/O.
Each space accommodates a total of 64K 16-bit words. Within the 64K words of data space, the 256 to
32K words at the top of the address range can be defined to be external global memory in increments of powers
of two, as specified by the contents of the global memory allocation register (GREG). Access to global memory
is arbitrated using the global memory bus request (BR) signal.
On the F240, the first 96 (05Fh) data memory locations are either allocated for memory-mapped registers or
are reserved. This memory-mapped register space contains various control and status registers including those
for the CPU.
All the on-chip peripherals of the F240 device are mapped into data memory space. Access to these registers
is made by the CPU instructions addressing their data-memory locations. Figure 1 shows the memory map.

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device memory map (continued)

Program Program Data

Hex Hex Hex

0000 Interrupts 0000 Interrupts 0000 Memory-Mapped
(External) (On-Chip) Registers and
003F 003F Reserved
005F
0040 0040 0060
On-Chip ROM
On-Chip
(Flash EEPROM)
DARAM B2
(8 x 2K Segments)
3FFF 007F
External 4000 0080

External Reserved

FDFF FDFF 01FF

FE00 On-Chip DARAM B0 FE00 On-Chip DARAM B0 0200
(CNF = 1) (CNF = 1) On-Chip DARAM B0
or or (CNF = 0)
FEFF External (CNF = 0) FEFF External (CNF = 0) or
FF00 FF00 Reserved (CNF = 1)
Reserved 02FF
Reserved
FFFF 0300
FFFF ROM/Flash memory includes On-Chip
DARAM B1
address range 0000h003Fh
03FF
0400
MP/MC = 1 MP/MC = 0 Reserved
Microprocessor Microcomputer 07FF
Mode Mode 0800
Illegal
6FFF
7000
I/O Peripheral Memory-
Mapped Registers
Hex
(System, WD,
0000
ADC, SPI, SCI,
Interrupts, I/O)
73FF
7400
Peripheral
External Memory-Mapped
Registers
(Event Manager)
743F
7440
Reserved
FEFF
77FF
FF00 7800
Reserved Illegal
FF0E 7FFF
Flash Control 8000
FF0F External
Mode Register
FFFF
FF10
Reserved
FFFE

FFFF Wait-state Generator

Control Register

Figure 1. TMS320F240 Memory Map

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

peripheral memory map

The TMS320F240 system and peripheral control register frame contains all the data, status, and control bits
to operate the system and peripheral modules on the device (excluding the event manager).
Hex
0000
Reserved
0003
Interrupt-Mask Register 0004

Hex Global-Memory Allocation

0005
0000 Register
Memory-Mapped Registers
Interrupt Flag Register 0006
and Reserved
005F 0007
0060 Emulation Registers
On-Chip DARAM B2
007F and Reserved
005F
0080

Reserved Illegal 7000700F

System Configuration and

7010701F
01FF Control Registers
0200 On-Chip DARAM
B0 (CNF = 0) Watchdog Timer and
7020702F
PLL Control Registers
Reserved (CNF = 1)
02FF
0300 ADC 7030703F
On-Chip
DARAM B1 SPI 7040704F
03FF
0400 SCI 7050705F
Illegal 7060706F
Reserved
External-Interrupt Registers 7070707F
07FF
0800 Illegal 7080708F
Illegal
6FFF Digital-I/O Control Registers 7090709F
7000 Peripheral Frame 1
73FF Illegal 70A073FF
7400 Peripheral Frame 2
743F
7440 Reserved General-Purpose
77FF 7400740C
Timer Registers
7800
Illegal
7FFF Reserved 740D7410
8000
Compare, PWM, and
Deadband Registers 7411741C

Reserved 741D741F
External
Capture & QEP Registers 74207426
Reserved 7427742B
FFFF Interrupt Mask, Vector and
742C7434
Flag Registers

Reserved 7435743F

Figure 2. Peripheral Memory Map

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

digital I/O and shared pin functions

A total of 28 pins are shared between primary functions and I/Os. These pins are divided into two groups:
D Group1 Primary functions shared with I/Os belonging to dedicated I/O ports, Port A, Port B, and Port C.
D Group2 Primary functions belonging to peripheral modules which also have a built-in I/O feature as a
secondary function (for example, SCI, SPI, external interrupts, and PLL clock modules).
description of group1 shared I/O pins
The control structure for Group1 type shared I/O pins is shown in Figure 3. The only exception to this
configuration is the CLKOUT/IOPC1 pin. In Figure 3, each pin has three bits that define its operation:
D Mux control bit this bit selects between the primary function (1) and I/O function (0) of the pin.
D I/O direction bit if the I/O function is selected for the pin (mux control bit is set to 0), this bit determines
whether the pin is an input (0) or an output (1).
D I/O data bit if the I/O function is selected for the pin (mux control bit is set to 0) and the direction selected
is an input, data is read from this bit; if the direction selected is an output, data is written to this bit.
The mux control bit, I/O direction bit, and I/O data bit are in the I/O control registers.

IOP Data Bit Primary Primary

(Read/Write) Function Function
(Output Section) (Input Section)

In Out

Note: When the MUX control bit = 1,

the primary function is selected
in all cases except for the
IOP DIR Bit
following pins:
0 = Input
1 = Output 1. XF/IOPC2 (0 = Primary Function)
2. BIO/IOPC3 (0 = Primary Function)

0 1 MUX Control Bit

0 = I/O Function
1 = Primary Function
Pullup
or
Pulldown
(Internal)

Primary
Function Pin
or I/O Pin

Figure 3. Shared Pin Configuration

A summary of Group1 pin configurations and associated bits is shown in Table 2.

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description of group1 shared I/O pins (continued)

Table 2. Group1 Shared Pin Configurations

MUX CONTROL PIN FUNCTION SELECTED I/O PORT DATA AND DIRECTION
PIN # REGISTER
(name.bit #) (CRx.n = 1) (CRx.n = 0) REGISTER DATA BIT # DIR BIT #
72 OCRA.0 ADCIN0 IOPA0 PADATDIR 0 8
73 OCRA.1 ADCIN1 IOPA1 PADATDIR 1 9
90 OCRA.2 ADCIN9 IOPA2 PADATDIR 2 10
91 OCRA.3 ADCIN8 IOPA3 PADATDIR 3 11
100 OCRA.8 PWM7/CMP7 IOPB0 PBDATDIR 0 8
101 OCRA.9 PWM8/CMP8 IOPB1 PBDATDIR 1 9
102 OCRA.10 PWM9/CMP9 IOPB2 PBDATDIR 2 10
105 OCRA.11 T1PWM/T1CMP IOPB3 PBDATDIR 3 11
106 OCRA.12 T2PWM/T2CMP IOPB4 PBDATDIR 4 12
107 OCRA.13 T3PWM/T3CMP IOPB5 PBDATDIR 5 13
108 OCRA.14 TMRDIR IOPB6 PBDATDIR 6 14
109 OCRA.15 TMRCLK IOPB7 PBDATDIR 7 15
63 OCRB.0 ADCSOC IOPC0 PCDATDIR 0 8
64 SYSCR.76
00 IOPC1 PCDATDIR 1 9
01 WDCLK
10 SYSCLK
11 CPUCLK
65 OCRB.2 IOPC2 XF PCDATDIR 2 10
66 OCRB.3 IOPC3 BIO PCDATDIR 3 11
67 OCRB.4 CAP1/QEP1 IOPC4 PCDATDIR 4 12
68 OCRB.5 CAP2/QEP2 IOPC5 PCDATDIR 5 13
69 OCRB.6 CAP3 IOPC6 PCDATDIR 6 14
70 OCRB.7 CAP4 IOPC7 PCDATDIR 7 15
Valid only if the I/O function is selected on the pin.

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description of group2 shared I/O pins

Group2 shared pins belong to peripherals that have built-in general-purpose I/O capability. Control and
configuration for these pins are achieved by setting the appropriate bits within the control and configuration
registers of the peripherals. Table 3 lists the Group2 shared pins.

Table 3. Group2 Shared Pin Configurations

PIN # PRIMARY FUNCTION REGISTER ADDRESS PERIPHERAL MODULE
43 SCIRXD SCIPC2 705Eh SCI
44 SCITXD SCIPC2 705Eh SCI
45 SPISIMO SPIPC2 704Eh SPI
48 SPISOMI SPIPC2 704Eh SPI
49 SPICLK SPIPC1 704Dh SPI
51 SPISTE SPIPC1 704Dh SPI
54 XINT2 XINT2CR 7078h External Interrupts
55 XINT3 XINT3CR 707Ah External Interrupts

digital I/O control registers

Table 4 lists the registers available to the digital I/O module. As with other F240 peripherals, the registers are
memory-mapped to the data space.

Table 4. Addresses of Digital I/O Control Registers

ADDRESS REGISTER NAME
7090h OCRA I/O mux control register A
7092h OCRB I/O mux control register B
7098h PADATDIR I/O port A data and direction register
709Ah PBDATDIR I/O port B data and direction register
709Ch PCDATDIR I/O port C data and direction register

device reset and interrupts

The TMS320F240 software-programmable interrupt structure supports flexible on-chip and external interrupt
configurations to meet real-time interrupt-driven application requirements. The F240 recognizes three types of
interrupt sources:
D Reset (hardware- or software-initiated) is unarbitrated by the CPU and takes immediate priority over any
other executing functions. All maskable interrupts are disabled until the reset service routine enables them.
D Hardware-generated interrupts are requested by external pins or by on-chip peripherals. There are two
types:
External interrupts are generated by one of five external pins corresponding to the interrupts XINT1,
XINT2, XINT3, PDPINT, and NMI. The first four can be masked both by dedicated enable bits and by the
CPUs interrupt mask register (IMR), which can mask each maskable interrupt line at the DSP core. NMI,
which is not maskable, takes priority over peripheral interrupts and software-generated interrupts. It can
be locked out only by an already executing NMI or a reset.
Peripheral interrupts are initiated internally by these on-chip peripheral modules: the event manager,
SPI, SCI, watchdog/real-time interrupt (WD/RTI), and ADC. They can be masked both by enable bits for
each event in each peripheral and by the CPUs IMR, which can mask each maskable interrupt line at the
DSP core.

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device reset and interrupts (continued)

D Software-generated interrupts for the F240 device include:
The INTR instruction. This instruction allows initialization of any F240 interrupt with software. Its
operand indicates to which interrupt vector location the CPU branches. This instruction globally
disables maskable interrupts (sets the INTM bit to 1).
The NMI instruction. This instruction forces a branch to interrupt vector location 24h, the same location
used for the nonmaskable hardware interrupt NMI. NMI can be initiated by driving the NMI pin low or by
executing an NMI instruction. This instruction globally disables maskable interrupts.
The TRAP instruction. This instruction forces the CPU to branch to interrupt vector location 22h. The
TRAP instruction does not disable maskable interrupts (INTM is not set to 1); therefore, when the CPU
branches to the interrupt service routine, that routine can be interrupted by the maskable hardware
interrupts.
An emulator trap. This interrupt can be generated with either an INTR instruction or a TRAP instruction.
reset
The reset operation ensures an orderly startup sequence for the device. There are five possible causes of a
reset, as shown in Figure 4. Three of these causes are internally generated; the other two causes, the RS and
PORESET pins, are controlled externally.
To Device

Watchdog Timer Reset Reset

Software-Generated Reset Signal
Illegal Address Reset To Reset Out
Reset (RS) Pin Active
Power-On Reset (PORESET) Pin
Active

Figure 4. Reset Signals

The five possible reset signals are generated as follows:

D Watchdog timer reset. A watchdog-timer-generated reset occurs if the watchdog timer overflows or an
improper value is written to either the watchdog key register or the watchdog control register. (Note that
when the device is powered on, the watchdog timer is automatically active.)
D Software-generated reset. This is implemented with the system control register (SYSCR). Clearing the
RESET0 bit (bit 14) or setting the RESET1 bit (bit 15) causes a system reset.
D Illegal address reset. The system and peripheral module control register frame address map contains
unimplemented address locations in the ranges labeled illegal. Any access to an address located in the
Illegal ranges generate an illegal-address reset.
D Reset pin active. To generate an external reset pulse on the RS pin, a low-level pulse duration of as little
as a few nanoseconds is usually effective; however, pulses of one SYSCLK cycle are necessary to ensure
that the device recognizes the reset signal.
D Power-on reset pin active. To generate a power-on reset pulse on the PORESET pin, a low-level pulse
of one SYSCLK cycle is necessary to ensure that the device recognizes the reset signal.
Once a reset source is activated, the external RS pin is driven (active) low for a minimum of eight SYSCLK
cycles. This allows the TMS320F240 device to reset external system components. Additionally, if a brown-out
condition (VCC < VCCmin for several microseconds causing PORESET to go low) occurs or the RS pin is held
low, then the reset logic holds the device in a reset state for as long as these actions are active.

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reset (continued)
The occurrence of a reset condition causes the TMS320F240 to terminate program execution and affects
various registers and status bits. During a reset, RAM contents remain unchanged, and all control bits that are
affected by a reset are initialized to their reset state. In the case of a power-on reset, the PLL control registers
are initialized to zero. The program needs to recognize power-on resets and configure the PLL for correct
operation.
After a reset, the program can check the power-on reset flag (PORST flag, SYSSR.15), the illegal address flag
(ILLADR flag, SYSSR.12), the software reset flag (SWRST flag, SYSSR.10), and the watchdog reset flag
(WDRST flag, SYSSR.9) to determine the source of the reset. A reset does not clear these flags.
RS and PORESET must be held low until the clock signal is valid and VCC is within the operating range. In
addition, PORESET must be driven low when VCC drops below the minimum operating voltage.
hardware-generated interrupts
All the hardware interrupt lines of the DSP core are given a priority rank from 1 to 10 (1 being highest). When
more than one of these hardware interrupts is pending acknowledgment, the interrupt of highest rank gets
acknowledged first. The others are acknowledged in order after that. Of those ten lines, six are for maskable
interrupt lines (INT1INT6) and one is for the nonmaskable interrupt (NMI) line. INT1INT6 and NMI have the
priorities shown in Table 5.

Table 5. Interrupt Priorities at the Level of the DSP Core

PRIORITY AT THE
INTERRUPT
DSP CORE
RESET 1
TI RESERVED 2
NMI 3
INT1 4
INT2 5
INT3 6
INT4 7
INT5 8
INT6 9
TI RESERVED 10
TI Reserved means that the address space is
reserved for Texas Instruments.

The inputs to these lines are controlled by the system module and the event manager as summarized in Table 6
and shown in Figure 5.

Table 6. Interrupt Lines Controlled by the System Module and Event Manager
PERIPHERAL INTERRUPT LINES
INT1
System Module INT5 NMI
INT6
INT2
Event Manager INT3
INT4

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hardware-generated interrupts (continued)

DSP Core

Address
Lines 51 IACK INT6 INT5 INT4 INT3 INT2 INT1 NMI

NC NC NC

Address IACK INT6 INT5 INT4 INT3 INT2 INT1 NMI INTC INTB INTA
Lines 51

System Module Event Manager

Figure 5. DSP Interrupt Structure

At the level of the system module and the event manager, each of the maskable interrupt lines (INT1INT6) is
connected to multiple maskable interrupt sources. Sources connected to interrupt line INT1 are called Level 1
interrupts; sources connected to interrupt line INT2 are called Level 2 interrupts; and so on. For each interrupt
line, the multiple sources also have a set priority ranking. The source with the highest priority has its interrupt
request responded to by the DSP core first.
Figure 6 shows the sources and priority ranking for the interrupts controlled by the system module. For each
interrupt chain, the interrupt source of highest priority is at the top. Priority decreases from the top of the chain
to the bottom. Figure 7 shows the interrupt sources and priority ranking for the event manager interrupts.

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hardware-generated interrupts (continued)

To DSP INT6 To DSP INT5 NC NC NC To DSP INT1 To DSP NMI

INT6 INT5 INT4 INT3 INT2 INT1 NMI

System Module

IRQ6 IACK6 IRQ5 IACK5 IRQ4 IACK4 IRQ3 IACK3 IRQ2 IACK2 IRQ1 IACK1 IRQ_NMI IACK_NMI

NC NC NC NC NC NC
System-Module
SPI System-Module
Dual ADC External Interrupt
Interrupt External Interrupt
Interrupt XINT1
(low priority) NMI
(high priority)

System-Module SCI System-Module

External Interrupt Receiver External Interrupt
XINT1 Interrupt XINT2
(low priority) (low priority) (high priority)

System-Module SCI System-Module

External Interrupt Transmitter External Interrupt
XINT2 Interrupt XINT3
(low priority) (low priority) (high priority)

System-Module SCI
External Interrupt Transmitter
XINT3 Interrupt
(low priority) (high priority)

SPI
Interrupt
(high priority)

SCI
Receiver
Interrupt
(high priority)

Watchdog
Timer
Interrupt

Legend:
NC = No connection
IACK = interrupt acknowledge
IRQ = interrupt request

Figure 6. System Module Interrupt Structure

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

hardware-generated interrupts (continued)

To DSP INT4 To DSP INT3 To DSP INT2

INTC INTB INTA

Event Manager
IRQC IACKC IRQB IACKB IRQA IACKA

Timer 2 Power-Drive
Capture 1
Period Protection
Interrupt
Interrupt Interrupt

Timer 2
Capture 2 Compare1
Compare
Interrupt Interrupt
Interrupt

Timer 2 Compare 2
Capture 3
Underflow Interrupt
Interrupt
Interrupt

Timer 2
Capture 4 Compare 3
Overflow
Interrupt Interrupt
Interrupt

Timer 3 Simple-
Period Compare 1
Interrupt Interrupt

Legend: Timer 3 Simple-

IACK = Interrupt acknowledge
IRQ = Interrupt request Compare Compare 2
Interrupt Interrupt

Timer 3 Simple-
Underflow Compare 3
Interrupt Interrupt

Timer 3 Timer 1
Overflow Period
Interrupt Interrupt

Timer 1
Compare
Interrupt

Timer 1
Underflow
Interrupt

Timer 1
Overflow
Interrupt

Figure 7. Event-Manager Interrupt Structure

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hardware-generated interrupts (continued)

Each of the interrupt sources has its own control register with a flag bit and an enable bit. When an interrupt
request is received, the flag bit in the corresponding control register is set. If the enable bit is also set, a signal
is sent to arbitration logic, which can simultaneously receive similar signals from one or more of the other control
registers. The arbitration logic compares the priority level of competing interrupt requests, and it passes the
interrupt of highest priority to the CPU. The corresponding flag is set in the interrupt flag register (IFR), indicating
that the interrupt is pending. The CPU then must decide whether to acknowledge the request. Maskable
hardware interrupts are acknowledged only after certain conditions are met:
D Priority is highest. When more than one hardware interrupt is requested at the same time, the F240
services them according to the set priority ranking.
D INTM bit is 0. The interrupt mode (INTM) bit, bit 9 of status register ST0, enables or disables all maskable
interrupts:
When INTM = 0, all unmasked interrupts are enabled.
When INTM = 1, all unmasked interrupts are disabled.
INTM is set to 1 automatically when the CPU acknowledges an interrupt (except when initiated by the TRAP
instruction) and at reset. It can be set and cleared by software.
D IMR mask bit is 1. Each of the maskable interrupt lines has a mask bit in the interrupt mask register (IMR).
To unmask an interrupt line, set its IMR bit to 1.
When the CPU acknowledges a maskable hardware interrupt, it jams the instruction bus with the INTR
instruction. This instruction forces the PC to the appropriate address from which the CPU fetches the software
vector. This vector leads to an interrupt service routine.
Usually, the interrupt service routine reads the peripheral-vector-address offset from the peripheral-vector-
address register (see Table 7) to branch to code that is meant for the specific interrupt source that initiated the
interrupt request. The F240 includes a phantom-interrupt vector offset (0000h), which is a system interrupt
integrity feature that allows a controlled exit from an improper interrupt sequence. If the CPU acknowledges a
request from a peripheral when, in fact, no peripheral has requested an interrupt, the phantom-interrupt vector
is read from the interrupt-vector register.
Table 7 summarizes the interrupt sources, overall priority, vector address/offset, source, and function of each
interrupt available on the TMS320F240.

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hardware-generated interrupts (continued)

Table 7. Interrupt Locations and Priorities

DSP-CORE PERIPHERAL
PERIPHERAL SOURCE
INTERRUPT OVERALL INTERRUPT, VECTOR FUNCTION
VECTOR MASKABLE? PERIPHERAL
NAME PRIORITY AND ADDRESS INTERRUPT
ADDRESS MODULE
ADDRESS OFFSET
1 RS External, system reset
RS N/A N Core, SD
Highest 0000h (RESET)
INT7
RESERVED 2 N/A N/A N DSP Core Emulator trap
0026h
NMI
NMI 3 N/A 0002h N Core, SD External user interrupt
0024h
XINT1 4 0001h
High-priority external user
XINT2 5 0011h Y SD
interrupts
XINT3 6 001Fh
SPIINT 7 INT1 0005h Y SPI High-priority SPI interrupt
0002h SYSIVR SCI receiver interrupt
RXINT 8 (701Eh) 0006h Y SCI
(high priority)
(System)
SCI transmitter interrupt
TXINT 9 0007h Y SCI
(high priority)
WDTINT 10 0010h Y WDT Watchdog timer interrupt
PDPINT 11 0020h Y External Power-drive protection Int.
CMP1INT 12 0021h Y EV.CMP1 Full Compare 1 interrupt
CMP2INT 13 0022h Y EV.CMP2 Full Compare 2 interrupt
CMP3INT 14 0023h Y EV.CMP3 Full Compare 3 interrupt
Simple compare 1
SCMP1INT 15 INT2 0024h Y EV.CMP4
interrupt
0004h
EVIVRA Simple compare 2
SCMP2INT 16 0025h Y EV.CMP5
((Event
e (7432h) interrupt
Manager Simple compare 3
SCMP3INT 17 Group A) 0026h Y EV.CMP6
interrupt
TPINT1 18 0027h Y EV.GPT1 Timer1-period interrupt
TCINT1 19 0028h Y EV.GPT1 Timer1-compare interrupt
TUFINT1 20 0029h Y EV.GPT1 Timer1-underflow interrupt
TOFINT1 21 002Ah Y EV.GPT1 Timer1-overflow interrupt
TPINT2 22 002Bh Y EV.GPT2 Timer2-period interrupt
TCINT2 23 002Ch Y EV.GPT2 Timer2-compare interrupt
TUFINT2 24 INT3 002Dh Y EV.GPT2 Timer2-underflow interrupt
0006h
TOFINT2 25 EVIVRB 002Eh Y EV.GPT2 Timer2-overflow interrupt
TPINT3 26 (
(Event (7433h) 002Fh Y EV.GPT3 Timer3-period interrupt
M
Manager
TCINT3 27 0030h Y EV.GPT3 Timer3-compare interrupt
Group B)
TUFINT3 28 0031h Y EV.GPT3 Timer3-underflow interrupt
TOFINT3 29 0032h Y EV.GPT3 Timer3-overflow interrupt
CAPINT1 30 INT4 0033h Y EV.CAP1 Capture 1 interrupt
CAPINT2 31 0008h EVIVRC 0034h Y EV.CAP2 Capture 2 interrupt
(Event (7434h)
CAPINT3 32 0035h Y EV.CAP3 Capture 3 interrupt
Manager
CAPINT4 33 Group C) 0036h Y EV.CAP4 Capture 4 interrupt

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hardware-generated interrupts (continued)

Table 7. Interrupt Locations and Priorities (Continued)
DSP-CORE PERIPHERAL
PERIPHERAL SOURCE
INTERRUPT OVERALL INTERRUPT, VECTOR FUNCTION
VECTOR MASKABLE? PERIPHERAL
NAME PRIORITY AND ADDRESS INTERRUPT
ADDRESS MODULE
ADDRESS OFFSET
SPIINT 34 INT5 0005h Y SPI Low-priority SPI interrupt
SYSIVR
SCI receiver interrupt
RXINT 35 (701Eh) 0006h Y SCI
000Ah (low priority)
(System) SCI transmitter interrupt
TXINT 36 0007h Y SCI
(low priority)
ADCINT 37 INT6 SYSIVR 0004h Y ADC Analog-to-digital interrupt
XINT1 38 0001h Y
000Ch External Low riority external
Low-priority
XINT2 39 (701Eh) 0011h Y
(System) pins user interrupts
XINT3 40 001Fh Y
RESERVED 41 000Eh N/A Y DSP Core Used for analysis
TRAP N/A 0022h N/A N/A TRAP instruction vector

external interrupts
The F240 has five external interrupts. These interrupts include:
D XINT1. Type A interrupt. The XINT1 control register (at 7070h) provides control and status for this interrupt.
XINT1 can be used as a high-priority (Level 1) or low-priority (Level 6) maskable interrupt or as a
general-purpose input pin. XINT1 can also be programmed to trigger an interrupt on either the rising or the
falling edge.
D NMI. Type A interrupt. The NMI control register (at 7072h) provides control and status for this interrupt. NMI
is a nonmaskable external interrupt or a general-purpose input pin. NMI can also be programmed to trigger
an interrupt on either the rising or the falling edge.
D XINT2. Type C interrupt. The XINT2 control register (at 7078h) provides control and status for this interrupt.
XINT2 can be used as a high-priority (Level 1) or low-priority (Level 6) maskable interrupt or a
general-purpose I/O pin. XINT2 can also be programmed to trigger an interrupt on either the rising or the
falling edge.
D XINT3. Type C interrupt. The XINT3 control register (at 707Ah) provides control and status for this interrupt.
XINT3 can be used as a high-priority (Level 1) or low-priority (Level 6) maskable interrupt or as a
general-purpose I/O pin. XINT3 can also be programmed to trigger an interrupt on either the rising or the
falling edge.
D PDPINT. This interrupt is provided for safe operation of the power converter and motor drive. This maskable
interrupt can put the timers and PWM output pins in the high-impedance state and inform the CPU in case
of motor drive abnormalities such as overvoltage, overcurrent, and excessive temperature rise. PDPINT is
a Level 2 interrupt.

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external interrupts (continued)

Table 8 is a summary of the external interrupt capability of the F240.

Table 8. External Interrupt Types and Functions

CONTROL CONTROL
EXTERNAL INTERRUPT CAN DO DIGITAL
REGISTER REGISTER MASKABLE?
INTERRUPT TYPE NMI? I/O PIN
NAME ADDRESS
Yes
XINT1 XINT1CR 7070h A No Input only
(Level 1 or 6)
NMI NMICR 7072h A Yes Input only No
Yes
XINT2 XINT2CR 7078h C No I/O
(Level 1 or 6)
Yes
XINT3 XINT3CR 707Ah C No I/O
(Level 1 or 6)
Yes
PDPINT EVIMRA 742Ch N/A N/A N/A
(Level 2)

clock generation
The TMS320F240 has an on-chip, PLL-based clock module. This module provides all the necessary clocking
signals for the device, as well as control for low-power mode entry. The only external component necessary for
this module is an external fundamental crystal, or oscillator.
The PLL-based clock module provides two basic modes of operation: oscillator mode and clock-in mode.
D oscillator mode
This mode allows the use of a 4-, 6-, or 8-MHz external reference crystal to provide the time base to the
device. The internal oscillator circuitry is initialized by software to select the desired CPUCLK frequency,
which can be the input clock frequency, the input clock frequency divided by 2 (default), or a clock frequency
determined by the PLL.
D Clock-in mode
This mode allows the internal crystal oscillator circuitry to be bypassed. The device clocks are generated
from an external clock source input on the XTAL1/CLKIN pin. The device can be configured by software
to operate on the input clock frequency, the input clock frequency divided by 2, or a clock frequency
determined by the PLL.
The F240 runs on two clock frequencies: the CPU clock (CPUCLK) frequency, and the system clock (SYSCLK)
frequency. The CPU, memories, external memory interface, and event manager run at the CPUCLK frequency.
All other peripherals run at the SYSCLK frequency. The CPUCLK runs at 2x or 4x the frequency of the SYSCLK;
for example, for 2x, CPUCLK = 20 MHz and SYSCLK = 10 MHz. There is also a clock for the watchdog timer,
WDCLK. This clock has a nominal frequency of 16384 Hz (214 Hz) when XTAL1/CLKIN is a power of two or
a sum of two powers of two; for example, 4194304 Hz (222 Hz), 6291456 (222 + 221 Hz), or 8388608 Hz
(223 Hz).
The clock module includes three external pins:
1. XTAL1/CLKIN clock source/crystal input
2. XTAL2 output to crystal
3. OSCBYP oscillator bypass
For the external pins, if OSCBYP VIH, then the oscillator is enabled and if OSCBYP VIL, then the oscillator
is bypassed and the device is in clock-in mode. In clock-in mode, an external TTL clock must be applied to the
XTAL1/CLKIN pin. The XTAL2 pin can be left unconnected.

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clock generation (continued)

OSCBYP

Div 2

PLL divide-by-2 bit
(CKCR1.3) Synchronizing CPUCLK

Clock Switch
XTAL1/CLKIN

Div 2
XTAL

MUX MUX
OSC Phase VCO

Detector
XTAL2

Clock Mode Bits

(CKCR0.76)

Feedback
Divider

Div 1, 2, 3, 4, 5, PLL multiply ratio
or 9 (CKCR1.20)
PLL

Clock Frequency and PLL Multiply Bits (CKCR1.74)

1-MHz Clock Prescaler
ACLK

Watchdog Clock Prescaler WDCLK

Prescale Bit (CKCR0.0)

SYSCLK Prescaler Div 2 or 4 SYSCLK

Figure 8. PLL Clock Module Block Diagram

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low-power modes
The TMS320F240 has four low-power modes (IDLE 1, IDLE 2, PLL power down, and oscillator power down).
The low-power modes reduce the operating power by reducing or stopping the activity of various modules (by
stopping their clocks). The two PLLPM bits of the clock module control register, CKCR0, select which of the
low-power modes the device enters when executing an IDLE instruction. Reset or an unmasked interrupt from
any source causes the device to exit from IDLE 1 low-power mode. A real-time interrupt from the watchdog timer
module causes the device to exit from all low-power modes except oscillator power down. This is a wake-up
interrupt. When enabled, reset or any of the four external interrupts (NMI, XINT1, XINT2, or XINT3) causes the
device to exit from any of the low-power modes (IDLE 1, IDLE 2, PLL power down, and oscillator power down).
The external interrupts are all wake-up interrupts. The maskable external interrupts (XINT1, XINT2, and XINT3)
must be enabled individually and globally to bring the device out of a low-power mode properly. It is, therefore,
important to ensure that the desired low-power-mode exit path is enabled before entering a low-power mode.
Figure 9 shows the wake-up sequence from a power down. Table 9 summarizes the low-power modes.
Wake-up
Wake-up Signal
Signal
Watchdog Timer to CPU
and
Real-Time Interrupt
Module

NMI

XINT1

XINT2

XINT3
External-Interrupt Logic

Reset
Signal

Reset Logic

System Module

Figure 9. Waking Up the Device From Power Down

Table 9. Low-Power Modes

LOW- PLLPM(x)
CPUCLK SYSCLK WDCLK PLL OSC EXIT TYPICAL
POWER BITS IN
STATUS STATUS STATUS STATUS STATUS CONDITION POWER
MODE CKCR0[2:3]
Run XX On On On On On 80 mA
Any interrupt
Idle 1 00 Off On On On On 50 mA
or reset
Wake-up
Idle 2 01 Off Off On On On interrupt or 7 mA
reset
Wake-up
PLL Power
10 Off Off On Off On interrupt or 1 mA
Down
reset
Wake-up
OSC Power
11 Off Off Off Off Off interrupt or 400 mA
Down
reset

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functional block diagram of the TMS320F240 DSP CPU

Program Bus

IS
DS
PS
MUX
R/W X1
STRB CLKOUT1

Program Bus
READY CLKIN/X2 NPAR

Data Bus
BR
XF

Control
16 PC PAR MSTACK MUX

W/R
RS WE
NMI Stack 8 16

MP/MC
XINT[13]
3

FLASH EEPROM
Program Control
(PCTRL)
16
MUX

A15A0
16 16
16

16
16
MUX

D15D0
16
16 Data Bus

16 16
Data Bus

16
16
3 9 7 16
LSB 16 16
AR0(16) from
AR1(16) DP(9) IR 16
MUX
AR2(16)
MUX 16
ARP(3) AR3(16)
3 9
3 AR4(16)
AR5(16) TREG0(16)
ARB(3) AR6(16)
Multiplier
AR7(16)

3 ISCALE (016) PREG(32)

16
32

PSCALE (6,0,1,4)

32 32

16
MUX

ARAU(16) MUX
32

CALU(32)
32
16 Memory Map
Register
MUX MUX 32
IMR (16)
IFR (16)
Data/Prog Data
Program Bus

C ACCH(16) ACCL(16)
GREG (16) DARAM DARAM
B0 (256 16) B2 (32 16) 32

B1 (256 16)
OSCALE (07)
MUX 16
16 16
16

NOTES: A. Symbol descriptions appear in Table 10.

B. For clarity the data and program buses are shown as single buses although they include address and data bits.

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Table 10. Legend for the F240 Internal Hardware Functional Block Diagram
SYMBOL NAME DESCRIPTION
32-bit register that stores the results and provides input for subsequent CALU operations. Also includes shift
ACC Accumulator
and rotate capabilities
Auxiliary Register An unsigned, 16-bit arithmetic unit used to calculate indirect addresses using the auxiliary registers as inputs
ARAU
Arithmetic Unit and outputs
These 16-bit registers are used as pointers to anywhere within the data space address range. They are
AUX Auxiliary Registers
operated upon by the ARAU and are selected by the auxiliary register pointer (ARP). AR0 can also be used
REGS 07
as an index value for AR updates of more than one and as a compare value to AR.
BR is asserted during access of the external global data memory space. READY is asserted to the device
Bus Request
BR when the global data memory is available for the bus transaction. BR can be used to extend the data memory
Signal
address space by up to 32K words.
Register carry output from CALU. C is fed back into the CALU for extended arithmetic operation. The C bit
C Carry resides in status register 1 (ST1), and can be tested in conditional instructions. C is also used in accumulator
shifts and rotates.
32-bit-wide main arithmetic logic unit for the TMS320C2xx core. The CALU executes 32-bit operations in a
Central Arithmetic
CALU single machine cycle. CALU operates on data coming from ISCALE or PSCALE with data from ACC, and
Logic Unit
provides status results to PCTRL.
If the on-chip RAM configuration control bit (CNF) is set to 0, the reconfigurable data dual-access RAM
(DARAM) block B0 is mapped to data space; otherwise, B0 is mapped to program space. Blocks B1 and B2
DARAM Dual Access RAM
are mapped to data memory space only, at addresses 030003FF and 0060007F, respectively. Blocks 0
and 1 contain 256 words, while Block 2 contains 32 words.
Data Memory The 9-bit DP register is concatenated with the seven LSBs of an instruction word to form a direct memory
DP
Page Pointer address of 16 bits. DP can be modified by the LST and LDP instructions.
Global Memory
GREG Allocation GREG specifies the size of the global data memory space.
Register
Interrupt Mask
IMR IMR individually masks or enables the seven interrupts.
Register
Interrupt Flag The 7-bit IFR indicates that the TMS320C2xx has latched an interrupt from one of the seven maskable
IFR
Register interrupts.
INT# Interrupt Traps A total of 32 interrupts by way of hardware and/or software are available.
Input Data-Scaling 16 to 32-bit barrel left-shifter. ISCALE shifts incoming 16-bit data 0 to16 positions left, relative to the 32-bit
ISCALE
Shifter output within the fetch cycle; therefore, no cycle overhead is required for input scaling operations.
16 16-bit multiplier to a 32-bit product. MPY executes multiplication in a single cycle. MPY operates either
MPY Multiplier
signed or unsigned 2s-complement arithmetic multiply.
MSTACK provides temporary storage for the address of the next instruction to be fetched when program
MSTACK Micro Stack
address-generation logic is used to generate sequential addresses in data space.
MUX Multiplexer Multiplexes buses to a common input
Next Program
NPAR NPAR holds the program address to be driven out on the PAB on the next cycle.
Address Register
Output 16 to 32-bit barrel left-shifter. OSCALE shifts the 32-bit accumulator output 0 to 7 bits left for quantization
OSCALE Data-Scaling management and outputs either the 16-bit high- or low-half of the shifted 32-bit data to the Data-Write Data
Shifter Bus (DWEB).
Program Address PAR holds the address currently being driven on PAB for as many cycles as it takes to complete all memory
PAR
Register operations scheduled for the current bus cycle.
PC increments the value from NPAR to provide sequential addresses for instruction-fetching and sequential
PC Program Counter
data-transfer operations.
Program
PCTRL PCTRL decodes instruction, manages the pipeline, stores status, and decodes conditional operations.
Controller

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Table 10. Legend for the F240 Internal Hardware Functional Block Diagram (Continued)
SYMBOL NAME DESCRIPTION
PREG Product Register 32-bit register holds results of 16 16 multiply.
0-, 1- or 4-bit left shift, or 6-bit right shift of multiplier product. The left-shift options are used to manage the
additional sign bits resulting from the 2s-complement multiply. The right-shift option is used to scale down
Product-Scaling
PSCALE the number to manage overflow of product accumulation in the CALU. PSCALE resides in the path from the
Shifter
32-bit product shifter and from either the CALU or the Data-Write Data Bus (DWEB), and requires no cycle
overhead.
STACK is a block of memory used for storing return addresses for subroutines and interrupt-service
STACK Stack
routines, or for storing data. The C20x stack is 16-bit wide and eight-level deep.
Temporary 16-bit register holds one of the operands for the multiply operations. TREG holds the dynamic shift count
TREG
Register for the LACT, ADDT, and SUBT instructions. TREG holds the dynamic bit position for the BITT instruction.

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F240 DSP core CPU

The TMS320F240 device uses an advanced Harvard-type architecture that maximizes processing power by
maintaining two separate memory bus structures program and data for full-speed execution. This multiple
bus structure allows data and instructions to be read simultaneously. Instructions support data transfers
between program memory and data memory. This architecture permits coefficients that are stored in program
memory to be read in RAM, thereby eliminating the need for a separate coefficient that are ROM. This, coupled
with a four-deep pipeline, allows the F240 device to execute most instructions in a single cycle.
status and control registers
Two status registers, ST0 and ST1, contain the status of various conditions and modes. These registers can
be stored into data memory and loaded from data memory, thereby allowing the status of the machine to be
saved and restored for subroutines.
The load status register (LST) instruction is used to write to ST0 and ST1. The store status register (SST)
instruction is used to read from ST0 and ST1 except for the INTM bit, which is not affected by the LST
instruction. The individual bits of these registers can be set or cleared when using the SETC and CLRC
instructions. Figure 10 shows the organization of status registers ST0 and ST1, indicating all status bits
contained in each. Several bits in the status registers are reserved and are read as logic 1s. Table 11 lists status
register field definitions.

15 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ST0 ARP OV OVM 1 INTM DP

15 13 12 11 10 9 8 7 6 5 4 3 2 1 0
ST1 ARB CNF TC SXM C 1 1 1 1 XF 1 1 PM

Figure 10. Status and Control Register Organization

Table 11. Status Register Field Definitions

FIELD FUNCTION
Auxiliary register pointer buffer. When the ARP is loaded into ST0, the old ARP value is copied to the ARB except during an LST
ARB
instruction. When the ARB is loaded by way of an LST #1 instruction, the same value is also copied to the ARP.
Auxiliary register (AR) pointer. ARP selects the AR to be used in indirect addressing. When the ARP is loaded, the old ARP value
ARP is copied to the ARB register. ARP can be modified by memory-reference instructions when using indirect addressing, and by the
LARP, MAR, and LST instructions. The ARP is also loaded with the same value as ARB when an LST #1 instruction is executed.
Carry bit. C is set to 1 if the result of an addition generates a carry, or reset to 0 if the result of a subtraction generates a borrow.
Otherwise, C is reset after an addition or set after a subtraction, except if the instruction is ADD or SUB with a 16-bit shift. In these
C cases, the ADD can only set and the SUB only reset the carry bit, but cannot affect it otherwise. The single bit shift and rotate
instructions also affect C, as well as the SETC, CLRC, and LST #1 instructions. Branch instructions have been provided to branch
on the status of C. C is set to 1 on a reset.
On-chip RAM configuration control bit. If CNF is set to 0, the reconfigurable data dual-access RAM blocks are mapped to data
CNF space; otherwise, they are mapped to program space. The CNF can be modified by the SETC CNF, CLRC CNF, and LST #1
instructions. RS sets the CNF to 0.
Data memory page pointer. The 9-bit DP register is concatenated with the seven LSBs of an instruction word to form a direct
DP
memory address of 16 bits. DP can be modified by the LST and LDP instructions.
Interrupt mode bit. When INTM is set to 0, all unmasked interrupts are enabled. When set to 1, all maskable interrupts are disabled.
INTM is set and reset by the SETC INTM and CLRC INTM instructions. RS and IACK also set INTM. INTM has no effect on the
INTM
unmaskable RS and NMI interrupts. Note that INTM is unaffected by the LST instruction. This bit is set to 1 by reset. It is also set
to 1 when a maskable interrupt trap is taken.
Overflow flag bit. As a latched overflow signal, OV is set to 1 when overflow occurs in the arithmetic logic unit (ALU). Once an
OV
overflow occurs, the OV remains set until a reset, BCND/D on OV/NOV, or LST instructions clear OV.

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status and control registers (continued)

Table 11. Status Register Field Definitions (Continued)
FIELD FUNCTION
Overflow mode bit. When OVM is set to 0, overflowed results overflow normally in the accumulator. When set to 1, the accumulator
OVM is set to either its most positive or negative value upon encountering an overflow. The SETC and CLRC instructions set and reset
this bit, respectively. LST can also be used to modify the OVM.
Product shift mode. If these two bits are 00, the multipliers 32-bit product is loaded into the ALU with no shift. If PM = 01, the PREG
output is left-shifted one place and loaded into the ALU, with the LSB zero-filled. If PM = 10, PREG output is left-shifted by four
PM bits and loaded into the ALU, with the LSBs zero-filled. PM = 11 produces a right shift of six bits, sign-extended. Note that the PREG
contents remain unchanged. The shift takes place when transferring the contents of the PREG to the ALU. PM is loaded by the
SPM and LST #1 instructions. PM is cleared by RS.
Sign-extension mode bit. SXM = 1 produces sign extension on data as it is passed into the accumulator through the scaling shifter.
SXM = 0 suppresses sign extension. SXM does not affect the definitions of certain instructions; for example, the ADDS instruction
SXM
suppresses sign extension regardless of SXM. SXM is set by the SETC SXM and reset by the CLRC SXM instructions, and can
be loaded by the LST #1. SXM is set to 1 by reset.
Test/control flag bit. TC is affected by the BIT, BITT, CMPR, LST #1, and NORM instructions. TC is set to a 1 if a bit tested by BIT
or BITT is a 1, if a compare condition tested by CMPR exists between AR (ARP) and AR0, if the exclusive-OR function of the two
TC
MSBs of the accumulator is true when tested by a NORM instruction. The conditional branch, call, and return instructions can
execute based on the condition of TC.
XF pin status bit. XF indicates the state of the XF pin, a general-purpose output pin. XF is set by the SETC XF and reset by the
XF
CLRC XF instructions. XF is set to 1 by reset.

central processing unit

The TMS320F240 central processing unit (CPU) contains a 16-bit scaling shifter, a 16 x 16-bit parallel multiplier,
a 32-bit central arithmetic logic unit (CALU), a 32-bit accumulator, and additional shifters at the outputs of both
the accumulator and the multiplier. This section describes the CPU components and their functions. The
functional block diagram shows the components of the CPU.
input scaling shifter
The TMS320F240 provides a scaling shifter with a 16-bit input connected to the data bus and a 32-bit output
connected to the CALU. This shifter operates as part of the path of data coming from program or data space
to the CALU and requires no cycle overhead. It is used to align the 16-bit data coming from memory to the 32-bit
CALU. This is necessary for scaling arithmetic as well as aligning masks for logical operations.
The scaling shifter produces a left shift of 0 to 16 on the input data. The LSBs of the output are filled with zeros;
the MSBs can either be filled with zeros or sign-extended, depending upon the value of the SXM bit
(sign-extension mode) of status register ST1. The shift count is specified by a constant embedded in the
instruction word or by a value in TREG. The shift count in the instruction allows for specific scaling or alignment
operations specific to that point in the code. The TREG base shift allows the scaling factor to be adaptable to
the systems performance.
multiplier
The TMS320F240 device uses a 16 x 16-bit hardware multiplier that is capable of computing a signed or an
unsigned 32-bit product in a single machine cycle. All multiply instructions, except the MPYU (multiply unsigned)
instruction, perform a signed multiply operation. That is, two numbers being multiplied are treated as
2s-complement numbers, and the result is a 32-bit 2s-complement number. Two registers are associated with
the multiplier:
D 16-bit temporary register (TREG) that holds one of the operands for the multiplier
D 32-bit product register (PREG) that holds the product
Four product shift modes (PM) are available at the PREG output (PSCALE). These shift modes are useful for
performing multiply/accumulate operations, performing fractional arithmetic, or justifying fractional products.
The PM field of status register ST1 specifies the PM shift mode, as shown in Table 12.

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multiplier (continued)

Table 12. PSCALE Product Shift Modes

PM SHIFT DESCRIPTION
00 No shift Product feed to CALU or data bus with no shift
01 Left 1 Removes the extra sign bit generated in a 2s-complement multiply to produce a Q31 product
Removes the extra 4 sign bits generated in a 16x13 2s-complement multiply to a produce a Q31 product
10 Left 4
when using the multiply by a 13-bit constant
11 Right 6 Scales the product to allow up to 128 product accumulation without the possibility of accumulator overflow

The product can be shifted one bit to compensate for the extra sign bit gained in multiplying two 16-bit
2s-complement numbers (MPY instruction). A four-bit shift is used in conjunction with the MPY instruction with
a short immediate value (13 bits or less) to eliminate the four extra sign bits gained in multiplying a 16-bit number
by a 13-bit number. Finally, the output of PREG can be right-shifted 6 bits to enable the execution of up to
128 consecutive multiply/accumulates without the possibility of overflow.
The LT (load TREG) instruction normally loads TREG to provide one operand (from the data bus), and the MPY
(multiply) instruction provides the second operand (also from the data bus). A multiplication also can be
performed with a 13-bit immediate operand when using the MPY instruction. Then a product is obtained every
two cycles. When the code is executing multiple multiplies and product sums, the CPU supports the pipelining
of the TREG load operations with CALU operations using the previous product. The pipeline operations that
run in parallel with loading the TREG include: load ACC with PREG (LTP); add PREG to ACC (LTA); add PREG
to ACC and shift TREG input data (DMOV) to next address in data memory (LTD); and subtract PREG from ACC
(LTS).
Two multiply/accumulate instructions (MAC and MACD) fully utilize the computational bandwidth of the
multiplier, allowing both operands to be processed simultaneously. The data for these operations can be
transferred to the multiplier each cycle by way of the program and data buses. This facilitates single-cycle
multiply/accumulates when used with the repeat (RPT) instruction. In these instructions, the coefficient
addresses are generated by program address generation (PAGEN) logic, while the data addresses are
generated by data address generation (DAGEN) logic. This allows the repeated instruction to access the values
from the coefficient table sequentially and step through the data in any of the indirect addressing modes.
The MACD instruction, when repeated, supports filter constructs (weighted running averages) so that as the
sum-of-products is executed, the sample data is shifted in memory to make room for the next sample and to
throw away the oldest sample.
The MPYU instruction performs an unsigned multiplication, which greatly facilitates extended-precision
arithmetic operations. The unsigned contents of TREG are multiplied by the unsigned contents of the addressed
data memory location, with the result placed in PREG. This process allows the operands of greater than 16 bits
to be broken down into 16-bit words and processed separately to generate products of greater than 32 bits. The
SQRA (square/add) and SQRS (square/subtract) instructions pass the same value to both inputs of the
multiplier for squaring a data memory value.
After the multiplication of two 16-bit numbers, the 32-bit product is loaded into the 32-bit product register
(PREG). The product from PREG can be transferred to the CALU or to data memory by way of the SPH (store
product high) and SPL (store product low). Note: the transfer of PREG to either the CALU or data bus passes
through the PSCALE shifter, and therefore is affected by the product shift mode defined by PM. This is important
when saving PREG in an interrupt-service-routine context save as the PSCALE shift effects cannot be modeled
in the restore operation. PREG can be cleared by executing the MPY #0 instruction. The product register can
be restored by loading the saved low half into TREG and executing a MPY #1 instruction. The high half, then,
is loaded using the LPH instruction.

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central arithmetic logic unit

The TMS320F240 central arithmetic logic unit (CALU) implements a wide range of arithmetic and logical
functions, the majority of which execute in a single clock cycle. This ALU is referred to as central to differentiate
it from a second ALU used for indirect-address generation called the auxiliary register arithmetic unit (ARAU).
Once an operation is performed in the CALU, the result is transferred to the accumulator (ACC) where additional
operations, such as shifting, can occur. Data that is input to the CALU can be scaled by ISCALE when coming
from one of the data buses (DRDB or PRDB) or scaled by PSCALE when coming from the multiplier.
The CALU is a general-purpose arithmetic/logic unit that operates on 16-bit words taken from data memory or
derived from immediate instructions. In addition to the usual arithmetic instructions, the CALU can perform
Boolean operations, facilitating the bit manipulation ability required for a high-speed controller. One input to the
CALU is always provided from the accumulator, and the other input can be provided from the product register
(PREG) of the multiplier or the output of the scaling shifter (that has been read from data memory or from the
ACC). After the CALU has performed the arithmetic or logical operation, the result is stored in the accumulator.
The TMS320F240 device supports floating-point operations for applications requiring a large dynamic range.
The NORM (normalization) instruction is used to normalize fixed-point numbers contained in the accumulator
by performing left shifts. The four bits of the TREG define a variable shift through the scaling shifter for the
LACT/ADDT/SUBT (load/add to /subtract from accumulator with shift specified by TREG) instructions. These
instructions are useful in floating-point arithmetic where a number needs to be denormalized that is,
floating-point to fixed-point conversion. They are also useful in execution of an automatic gain control (AGC)
going into a filter. The BITT (bit test) instruction provides testing of a single bit of a word in data memory based
on the value contained in the four LSBs of TREG.
The CALU overflow saturation mode can be enabled/disabled by setting/resetting the OVM bit of ST0. When
the CALU is in the overflow saturation mode and an overflow occurs, the overflow flag is set and the accumulator
is loaded with either the most positive or the most negative value representable in the accumulator, depending
on the direction of the overflow. The value of the accumulator at saturation is 07FFFFFFFh (positive) or
080000000h (negative). If the OVM (overflow mode) status register bit is reset and an overflow occurs, the
overflowed results are loaded into the accumulator with modification. (Logical operations cannot result in
overflow.)
The CALU can execute a variety of branch instructions that depend on the status of the CALU and the
accumulator. These instructions can be executed conditionally based on any meaningful combination of these
status bits. For overflow management, these conditions include the OV (branch on overflow) and EQ (branch
on accumulator equal to zero). In addition, the BACC (branch to address in accumulator) instruction provides
the ability to branch to an address specified by the accumulator (computed goto). Bit test instructions (BIT and
BITT), which do not affect the accumulator, allow the testing of a specified bit of a word in data memory.
The CALU also has an associated carry bit that is set or reset depending on various operations within the device.
The carry bit allows more efficient computation of extended-precision products and additions or subtractions.
It also is useful in overflow management. The carry bit is affected by most arithmetic instructions as well as the
single-bit shift and rotate instructions. It is not affected by loading the accumulator, logical operations, or other
such non-arithmetic or control instructions.
The ADDC (add to accumulator with carry) and SUBB (subtract from accumulator with borrow) instructions use
the previous value of carry in their addition/subtraction operation.
The one exception to the operation of the carry bit is in the use of ADD with a shift count of 16 (add to high
accumulator) and SUB with a shift count of 16 (subtract from high accumulator) instructions. This case of the
ADD instruction can set the carry bit only if a carry is generated, and this case of the SUB instruction can reset
the carry bit only if a borrow is generated; otherwise, neither instruction affects it.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

central arithmetic logic unit (continued)

Two conditional operands, C and NC, are provided for branching, calling, returning, and conditionally executing,
based upon the status of the carry bit. The SETC, CLRC, and LST #1 instructions also can be used to load the
carry bit. The carry bit is set to one on a hardware reset.
accumulator
The 32-bit accumulator is the registered output of the CALU. It can be split into two 16-bit segments for storage
in data memory. Shifters at the output of the accumulator provide a left shift of 0 to 7 places. This shift is
performed while the data is being transferred to the data bus for storage. The contents of the accumulator
remain unchanged. When the post-scaling shifter is used on the high word of the accumulator (bits 1631), the
MSBs are lost and the LSBs are filled with bits shifted in from the low word (bits 015). When the post-scaling
shifter is used on the low word, the LSBs are zero-filled.
The SFL and SFR (in-place one-bit shift to the left/right) instructions and the ROL and ROR (rotate to the
left/right) instructions implement shifting or rotating of the contents of the accumulator through the carry bit. The
SXM bit affects the definition of the SFR (shift accumulator right) instruction. When SXM = 1, SFR performs an
arithmetic right shift, maintaining the sign of the accumulator data. When SXM = 0, SFR performs a logical shift,
shifting out the LSBs and shifting in a zero for the MSB. The SFL (shift accumulator left) instruction is not affected
by the SXM bit and behaves the same in both cases, shifting out the MSB and shifting in a zero. Repeat (RPT)
instructions can be used with the shift and rotate instructions for multiple-bit shifts.
auxiliary registers and auxiliary-register arithmetic unit (ARAU)
The F240 provides a register file containing eight auxiliary registers (AR0AR7). The auxiliary registers are
used for indirect addressing of the data memory or for temporary data storage. Indirect auxiliary-register
addressing allows placement of the data memory address of an instruction operand into one of the auxiliary
registers. These registers are referenced with a 3-bit auxiliary register pointer (ARP) that is loaded with a value
from 0 through 7, designating AR0 through AR7, respectively. The auxiliary registers and the ARP can be loaded
from data memory, the ACC, the product register, or by an immediate operand defined in the instruction. The
contents of these registers also can be stored in data memory or used as inputs to the CALU.
The auxiliary register file (AR0AR7) is connected to the ARAU. The ARAU can autoindex the current auxiliary
register while the data memory location is being addressed. Indexing either by 1 or by the contents of the AR0
register can be performed. As a result, accessing tables of information does not require the CALU for address
manipulation; therefore, the CALU is free for other operations in parallel.
internal memory
The TMS320F240 device is configured with the following memory modules:
D Dual-access random-access memory (DARAM)
D Flash EEPROM
dual-access RAM (DARAM)
There are 544 words 16 bits of DARAM on the F240 device. The F240 DARAM allows writes to and reads
from the RAM in the same cycle. The DARAM is configured in three blocks: block 0 (B0), block 1 (B1), and
block 2 (B2). Block 1 contains 256 words and block 2 contains 32 words, and both blocks are located only in
data memory space. Block 0 contains 256 words, and can be configured to reside in either data or program
memory space.
The SETC CNF (configure B0 as data memory) and CLRC CNF (configure B0 as program memory) instructions
allow dynamic configuration of the memory maps through software. When using block 0 as program memory,
instructions can be downloaded from external program memory into on-chip RAM and then executed. When
using on-chip RAM, or high-speed external memory, the F240 runs at full speed with no wait states. The ability
of the DARAM to allow two accesses to be performed in one cycle coupled with the parallel nature of the F240

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

dual-access RAM (DARAM) (continued)

architecture enables the device to perform three concurrent memory accesses in any given machine cycle.
Externally, the READY line can be used to interface the F240 to slower, less expensive external memory.
Downloading programs from slow off-chip memory to on-chip RAM can speed processing while cutting system
costs.
flash EEPROM
Flash EEPROM provides an attractive alternative to masked program ROM. Like ROM, flash is nonvolatile;
however, it has the advantage of in-target reprogrammability. The TMS320F240 incorporates one 16K 
16-bit flash EEPROM module in program space. This type of memory expands the capabilities of the
TMS320F240 in the areas of prototyping, early field-testing, and single-chip applications.
Unlike most discrete flash memory, the F240 flash does not require a dedicated state machine, because the
algorithms for programming and erasing the flash are executed by the DSP core. This enables several
advantages, including: reduced chip size and sophisticated, adaptive algorithms. For production programming,
the IEEE Standard 1149.1 (JTAG) scan port provides easy access to the on-chip RAM for downloading the
algorithms and flash code. Other key features of the flash include zero-wait-state access rate and single 5-V
power supply.
An erased bit in the TMS320F240 flash is read as a logic 1, and a programmed bit is read as a logic 0. The flash
requires a block-erase of the entire 16K module; however, any combination of bits can be programmed. The
following four algorithms are required for flash operations: clear, erase, flash-write, and program. For an
explanation of these algorithms and a complete description of the flash EEPROM, see the TMS320F20x/F24x
DSP Embedded Flash Memory Technical Reference (literature number SPRU282).
flash serial loader
The on-chip flash is shipped with a serial bootloader code programmed at the following addresses:
0x00000x00FFh. All other flash addresses are in an erased state. The serial bootloader can be used to
program the on-chip Flash memory with users code. During the Flash programming sequence, the on-chip data
RAM is used to load and execute the clear, erase, and program algorithms.
flash control mode register
The flash control mode register is located at I/O address FF0Fh. This register offers two options: register access
mode and array access mode. Register access mode gives access to the four control registers in the memory
space decoded for the flash module. These registers are used to control erasing, programming, and testing of
the flash array. Register access mode is enabled by activating an OUT command with dummy data.
The OUT xxxx, FF0Fh instruction makes the flash registers accessible for reads and/or writes. After
executing OUT xxxx, FF0Fh, the flash control registers are accessed in the memory space decoded for the
flash module and the flash array cannot be accessed. The four registers are repeated every four address
locations within the flash modules decoded range.
After completing all the necessary reads and/or writes to the control registers, an IN xxxx, FF0Fh instruction
(with dummy data) is executed to place the flash array back in array access mode. After executing the
IN xxxx, FF0Fh instruction, the flash array is accessed in the decoded space and the flash registers are
not available. Switching between the register access mode and the array access mode is done by issuing the
IN and OUT instructions. The memory content in these instructions (denoted by xxxx) is not relevant. Refer to
the TMS320F20x/F24x DSP Embedded Flash Memory Technical Reference (literature number SPRU282) for
a detailed description of the flash programming algorithms.

IEEE Standard 1149.11990, IEEE Standard Test-Access Port

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

peripherals
The integrated peripherals of the TMS320F240 are described in the following subsections:
D External memory interface
D Event manager (EV)
D Dual analog-to-digital converter (ADC)
D Serial peripheral interface (SPI)
D Serial communications interface (SCI)
D Watchdog timer (WD)
external memory interface
The TMS320F240 can address up to 64K words 16 bits of memory or registers in each of the program, data,
and I/O spaces. On-chip memory, when enabled, removes some of this off-chip range. In data space, the high
32K words can be mapped dynamically as either local or global using the GREG register. A data-memory
access mapped as global asserts BR low (with timing similar to the address bus).
The CPU of the TMS320F240 schedules a program fetch, data read, and data write on the same machine cycle.
This is because, from on-chip memory, the CPU can execute all three of these operations in the same cycle.
However, the external interface multiplexes the internal buses to one address and one data bus. The external
interface sequences these operations to complete the data write first, then the data read, and finally the program
read.
The F240 supports a wide range of system interfacing requirements. Program, data, and I/O address spaces
provide interface to memory and I/O, maximizing system throughput. The full 16-bit address and data bus, along
with the PS, DS, and IS space-select signals allow addressing of 64K 16-bit words in program and I/O space.
Due to the on-chip peripherals, external data space is addressable to 32K 16-bit words.
I/O design is simplified by having I/O treated the same way as memory. I/O devices are mapped into the I/O
address space using the processors external address and data buses in the same manner as memory-mapped
devices.
The F240 external parallel interface provides control signals to facilitate interfacing to the device. The R/W
output signal is provided to indicate whether the current cycle is a read or a write. The STRB output signal
provides a timing reference for all external cycles.
Interface to memory and I/O devices of varying speeds is accomplished by using the READY input. When
transactions are made with slower devices, the F240 processor waits until the other device completes its
function and signals the processor by way of the READY input. Once a ready indication is provided from the
external device, execution continues. On the F240 device, the READY input must be driven (active high) to
complete reads or writes to internal data I/O-memory-mapped registers and all external addresses.
The bus request (BR) signal is used in conjunction with the other F240 interface signals to arbitrate external
global-memory accesses. Global memory is external data-memory space in which the BR signal is asserted
at the beginning of the access. When an external global-memory device receives the bus request, it responds
by asserting the ready signal after the global-memory access is arbitrated and the global access is completed.
The TMS320F240 supports zero-wait-state reads on the external interface. However, to avoid bus conflicts,
writes take two cycles. This allows the F240 to buffer the transition of the data bus from input to output (or output
to input) by a half cycle. In most systems, TMS320F240 ratio of reads to writes is significantly large to minimize
the overhead of the extra cycle on writes.
Wait states can be generated when accessing slower external resources. The wait states operate on
machine-cycle boundaries and are initiated either by using the ready signal or using the software wait-state
generator. Ready can be used to generate any number of wait states.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

event-manager (EV) module

The event-manager module includes general-purpose (GP) timers, full compare units, capture units, and
quadrature-encoder pulse (QEP) circuits. Figure 11 shows the functions of the event manager.
general-purpose (GP) timers
There are three GP timers on the TMS320F240. The GP timer x (for x = 1, 2, 3) includes:
D A 16-bit timer up-, up/down-counter, TxCNT for reads or writes
D A 16-bit timer-compare register (double-buffered with shadow register), TxCMPR for reads or writes
D A 16-bit timer-period register (double-buffered with shadow register), TxPR for reads or writes
D A 16-bit timer-control register,TxCON for reads or writes
D Selectable internal or external input clocks
D A programmable prescalar for internal or external clock inputs
D Control and interrupt logic for four maskable interrupts: underflow, overflow, timer compare, and period
interrupts
D A timer-compare output pin with configurable active-low and active-high states, as well as forced-low and
forced-high states.
D A selectable direction (TMRDIR) input pin (to count up or down when directional up-/down-count mode is
selected)
The GP timers can be operated independently or synchronized with each other. A 32-bit GP timer also can be
configured using GP timer 2 and 3. The compare register associated with each GP timer can be used for
compare function and PWM-waveform generation. There are two single and three continuous modes of
operation for each GP timer in up- or up/down-counting operations. Internal or external input clocks with
programmable prescaler is used for each GP timer. The state of each GP timer/compare output is configurable
by the general-purpose timer-control register (GPTCON). GP timers also provide the time base for the other
event-manager submodules: GP timer 1 for all the compares and PWM circuits, GP timer 1 or 2 for the simple
compares to generate additional compare or PWMs, GP timer 2 or 3 for the capture units and the
quadrature-pulse counting operations.
Double buffering of the period and compare registers allows programmable change of the timer (PWM) period
and the compare/PWM pulse width as needed.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

DSP core
Data bus ADDR bus RESET INT2, 3, 4

16 16 3
16 2 TMRCLK
EV control registers TMRDIR
and control logic ADC start
Internal clock
16 Output T1PWM/T1CMP
GP timer 1 compare
logic

16
16
GP timer 1

16 16

16 PWM1/CMP1
16 3 SVPWM 3 Dead 3 Output
Full compare units state band logic
machine units PWM6/CMP6

16 3 Output T2PWM/T2CMP
GP timer 2 compare logic

16
GP timer 2

16
16

16 16

MUX

16
PWM7/CMP7
16 3 Output PWM8/CMP8
Simple compare units logic PWM9/CMP9

16 Output T3PWM/T3CMP
GP timer 3 compare logic

16 To Control logic
GP timer 3

Dir Clock
16
16

QEP
circuit
MUX

16 CAP1/QEP1
2 2 CAP2/QEP2
16
Capture units 2 CAP3, 4

16

Figure 11. Event-Manager Block Diagram

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

full compare units

There are three full compare units on TMS320F240. These compare units use GP timer1 as the timebase and
generate six outputs for compare and PWM-waveform generation using programmable deadband circuit. The
state of each of the six outputs is configured independently. The compare registers of the compare units are
double-buffered, allowing programmable change of the compare/PWM pulse widths as needed.
programmable-deadband generator
The deadband generator circuit includes three 8-bit counters and an 8-bit compare register. Desired deadband
value (from 0 to 102 ms) can be programmed into the compare register for the outputs of the three compare units.
The deadband generation can be enabled/disabled for each compare unit output individually. The
deadband-generator circuit produces two outputs (with or without deadband zone) for each compare unit output
signal. The output states of the deadband generator are configurable and changeable as needed by way of the
double-buffered ACTR register.
simple compares
TMS320F240 is equipped with three simple compares that can be used to generate three additional
independent compare or high-precision PWM waveforms. GP timer1 or 2 can be selected as the timebase for
the three simple compares. The states of the outputs of the three simple compares are configurable as
low-active, high-active, forced-low, or forced-high independently. Simple compare registers are
double-buffered, allowing programmable change of the compare/PWM pulse widths as needed. The state of
the simple-compare outputs is configurable and changeable as needed by way of the double-buffered SACTR
register.
compare/PWM waveform generation
Up to 12 compare and/or PWM waveforms (outputs) can be generated simultaneously by TMS320F240: three
independent pairs (six outputs) by the three full compare units with programmable deadbands, three
independent compares or PWMs (three outputs) by the simple compares, and three independent compare and
PWMs (three outputs) by the GP-timer compares.
compare/PWMs characteristics
Characteristics of the compare/PWMs are as follow:
D 16-bit, 50-ns resolutions
D Programmable deadband for the PWM output pairs, from 0 to 102 ms
D Minimum deadband width of 50 ns
D Change of the PWM carrier frequency for PWM frequency wobbling as needed
D Change of the PWM pulse widths within and after each PWM period as needed
D External maskable power and drive-protection interrupts
D Pulse-pattern-generator circuit, for programmable generation of asymmetric, symmetric, and four-space
vector PWM waveforms
D Minimized CPU overhead using auto-reload of the compare and period registers
capture unit
The capture unit provides a logging function for different events or transitions. The values of the GP timer 2
counter and/or GP timer 3 counter are captured and stored in the two-level first-in first-out (FIFO) stacks when
selected transitions are detected on capture input pins, CAPx for x = 1, 2, 3, or 4. The capture unit of the
TMS320F240 consists of four capture circuits.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

capture unit (continued)

D The capture unit includes the following features:
One 16-bit capture-control register, CAPCON, for reads or writes
One 16-bit capture-FIFO status register, CAPFIFO, with eight MSBs for read-only operations, and eight
LSBs for write-only operations
Optional selection of GP timer 2 and/or GP timer 3 through two 16-bit multiplexers (MUXs). One MUX
selects a GP timer for capture circuits 3 and 4, and the other MUX selects a GP timer for capture
circuits 1 and 2.
Four 16 bit x 2 FIFO stack registers, one two-level FIFO stack register per capture circuit. The top
register of each stack is a read-only register, FIFOx, where x = 1, 2, 3, or 4.
Four capture-input pins (CAPx, x = 1 to 4) with one input pin per capture unit
The input pins CAP1 and CAP2 also can be used as inputs to the QEP circuit.
User-specified edge-detection mode at the input pins
Four maskable interrupts/flags, CAPINTx, where x = 1, 2, 3, or 4
quadrature-encoder pulse (QEP) circuit
Two capture inputs (CAP1 and CAP2) can be used to interface the on-chip QEP circuit with a quadrature
encoder pulse. Full synchronization of these inputs is performed on-chip. Direction or leading-quadrature pulse
sequence is detected, and GP timer 2 or 3 is incremented or decremented by the rising and falling edges of the
two input signals (four times the frequency of either input pulse).
analog-to-digital converter (ADC) module
A simplified functional block diagram of the ADC module is shown in Figure 12. The ADC module consists of
two 10-bit ADCs with two built-in sample-and-hold (S/H) circuits. A total of 16 analog input channels is available
on the TMS320F240. Eight analog inputs are provided for each ADC unit by way of an 8-to-1 analog multiplexer.
Minimum total conversion time for each ADC unit is 6.1 ms. Total accuracy for each converter is 1.5 LSB.
Reference voltage for the ADC module needs to be supplied externally through the two reference pins, VREFHI
and VREFLO. The digital result is expressed as:
Input Analog Voltage * V REFLO
Digital Value + 1023
V REFHI * V REFLO

Functions of the ADC module include:

D Two input channels (one for each ADC unit) that can be sampled and converted simultaneously
D Each ADC unit can perform single or continuous S/H and conversion operations.
D Two 2-level-deep FIFO result registers for ADC units 1 and 2
D ADC module (both A/D converters) can start operation by software instruction, external signal transition on
a device pin, or by event-manager events on each of the GP timer/compare output and the
capture 4 pins.
D The ADC control register is double-buffered (with shadow register) and can be written to at any time. A new
conversion of ADC can start immediately or when the previous conversion process is completed according
to the control register bits.
D At the end of each conversion, an interrupt flag is set and an interrupt is generated if it is unmasked/enabled.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

analog-to-digital converter (ADC) module (continued)

Sample-

ADC0/IO
and-
Control Register

ADC1/IO Hold (S/H)
Circuit

ADC2
10-Bit

ADC3 8/1

Internal Bus
MUX A/D

ADC4
Converter

ADC5
(1)

ADC6

ADC7

Sample-

ADC8/IO
and- Control Register

ADC9/IO Hold (S/H)
Circuit

ADC10
10-Bit

ADC11 8/1
MUX A/D

ADC12
Converter

ADC13
(2)

ADC14

ADC15

External (I/O) Start Pin Control Logic

Internal (EV Module) Start Signal Single/Continues/Event Operations

Interrupts Sleep Mode
VREF

VREF Supply Voltage Program Clock Control Register
Prescaler

VREFHI VREFLO VSSA VCCA

Figure 12. Analog-to-Digital Converter Module

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

serial peripheral interface (SPI) module

The TMS320F240 device includes the four-pin serial peripheral interface (SPI) module. The SPI is a high-speed
synchronous serial-I/O port that allows a serial bit stream of programmed length (one to eight bits) to be shifted
into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications
between the DSP controller and external peripherals or another processor. Typical applications include external
I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice
communications are supported by the master/slave operation of the SPI.
The SPI module features include the following:
D Four external pins:
SPISOMI: SPI slave-output/master-input pin, or general-purpose bidirectional I/O pin
SPISIMO: SPI slave-input/master-output pin, or general-purpose bidirectional I/O pin
SPISTE: SPI slave-transmit-enable pin, or general-purpose bidirectional I/O pin
SPICLK: SPI serial-clock pin, or general-purpose bidirectional I/O pin
D Two operational modes: master and slave
D Baud rate: 125 different programmable rates / 2.5 Mbps at 10-MHz SYSCLK
D Data word format: one to eight data bits
D Four clocking schemes controlled by clock polarity and clock-phase bits include:
Falling edge without phase delay: SPICLK active high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
Falling edge with phase delay: SPICLK active high. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
Rising edge without phase delay: SPICLK inactive low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
Rising edge with phase delay: SPICLK inactive low. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
D Simultaneous receive and transmit operations (transmit function can be disabled in software)
D Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
D Ten SPI module control registers: Located in control register frame beginning at address 7040h.
NOTE: All registers in this module are 8-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the register
data is in the lower byte (70), and the upper byte (158) is read as zeros. Writing to the upper byte has no effect.

Figure 13 is a block diagram of the SPI in slave mode.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

serial peripheral Interface (SPI) module (continued)

SPIBUF.70
RECEIVER OVERRUN
OVERRUN INT ENA
SPIBUF SPI Priority
Buffer Register SPISTS.7 0 Level 1
To CPU SPIPRI.6
SPICTL.4 INT
1 Level 6
8 INT
SPI INT
SPI INT FLAG ENA
External
SPISTS.6
Connections
SPICTL.0

M M

SPIDAT SPIPC2.74
S
Data Register S SW1 SPISIMO
M
SPIDAT.70 M

S SPIPC2.30
S SW2 SPISOMI
TALK SPISTE
SPIPC1.5
SPICTL.1 FUNCTION SPIPC1.74
SPISTE

State Control
MASTER/SLAVE

SPI CHAR SPICCR.20 SPICTL.2

S
2 1 0 SW3
CLOCK CLOCK
SPI BIT RATE M S POLARITY PHASE SPIPC1.30
SYSCLK SPIBRR.60 SPICCR.6 SPICTL.3 SPICLK
M
6 5 4 3 2 1 0
The diagram is shown in the slave mode.
The SPISTE pin is shown as being disabled, meaning that data cannot be transmitted in this mode. Note that SW1, SW2, and SW3 are closed
in this configuration.

Figure 13. Four-Pin Serial Peripheral Interface Module Block Diagram

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

serial communications interface (SCI) module

The TMS320F240 device includes a serial communications interface (SCI) module. The SCI module supports
digital communications between the CPU and other asynchronous peripherals that use the standard
non-return-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own
separate enable and interrupt bits. Both can be operated independently or simultaneously in the full-duplex
mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun, and framing
errors. The bit rate (baud) is programmable to over 65000 different speeds through a 16-bit baud-select register.
Features of the SCI module include:
D Two external pins
SCITXD: SCI transmit-output pin or general-purpose bidirectional I/O pin
SCIRXD: SCI receive-input pin or general-purpose bidirectional I/O pin
D Baud rate programmable to 64K different rates
Up to 625 Kbps at 10-MHz SYSCLK
D Data word format
One start bit
Data word length programmable from one to eight bits
Optional even/odd/no parity bit
One or two stop bits
D Four error-detection flags: parity, overrun, framing, and break detection
D Two wake-up multiprocessor modes: idle-line and address bit
D Half- or full-duplex operation
D Double-buffered receive and transmit functions
D Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with
status flags.
Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and
TX EMPTY flag (transmitter-shift register is empty)
Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag
(break condition occurred), and RX ERROR (monitoring four interrupt conditions)
D Separate enable bits for transmitter and receiver interrupts (except BRKDT)
D NRZ (non return-to-zero) format
D Eleven SCI module control registers located in the control register frame beginning at address 7050h
NOTE: All registers in this module are 8-bit registers that are interfaced to the 16-bit peripheral bus. When a register is accessed, the register
data is in the lower byte (70), and the upper byte (158) is read as zeros. Writing to the upper byte has no effect.

Figure 14 shows the SCI module block diagram.

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serial communications interface (SCI) module (continued)

SCI TX Interrupt
TXWAKE SCITXBUF.70
TXRDY TX INT ENA
Frame Format and Mode SCICTL1.3 Transmitter-Data TXINT
SCICTL2.7 External
Buffer Register Connections
1 SCICTL2.0
PARITY TX EMPTY
EVEN/ODD ENABLE 8
SCICTL2.6
SCICCR.6 SCICCR.5 WUT
SCIPC2.74
TXSHF TXENA
SCITXD
Register SCITXD
SCICTL1.1
SCIHBAUD. 158
SCI PRIORITY LEVEL
Baud Rate 1
Register Level 2 Int.
(MSbyte) 0
Level 1 Int.
CLOCK ENA SCI TX
SYSCLK
SCILBAUD. 70 PRIORITY

Baud Rate SCICTL1.4 SCIPRI.6

Register 1
(LSbyte) Level 2 Int.
0
Level 1 Int.
SCI RX
PRIORITY
SCIPRI.5

SCIPC2.30
RXSHF SCIRXD
Register SCIRXD
RXWAKE
SCIRXST.1

RX ERR INT ENA RXENA

SCICTL1.6 SCICTL1.0
8 SCI RX Interrupt
RXRDY RX/BK INT ENA
Receiver-Data
SCIRXST.6
Buffer
RXINT

RX ERROR Register
BRKDT SCICTL2.1

SCIRXST.7 SCIRXST.42 SCIRXBUF.70 SCIRXST.5

RX ERROR FE OE PE

Figure 14. Serial Communications Interface (SCI) Module Block Diagram

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

watchdog (WD) and real-time interrupt (RTI) module

The TMS320F240 device includes a watchdog (WD) timer and a real-time interrupt (RTI) module. The WD
function of this module monitors software and hardware operation by generating a system reset if it is not
periodically serviced by software by having the correct key written. The RTI function provides interrupts at
programmable intervals. See Figure 15 for a block diagram of the WD/RTI module. The WD/RTI module
features include the following:
D WD Timer
Seven different WD overflow rates ranging from 15.63 ms to 1 s
A WD-reset key (WDKEY) register that clears the WD counter when a correct value is written, and
generates a system reset if an incorrect value is written to the register
A WD flag (WD FLAG) that indicates whether the WD timer initiated a system reset
WD check bits that initiate a system reset if an incorrect value is written to the WD control register
(WDCR)
D Automatic activation of the WD timer, once system reset is released
Three WD control registers located in control register frame beginning at address 7020h.
D Real-time interrupt (RTI):
Interrupt generation at a programmable frequency of 1 to 4096 interrupts per second
Interrupt or polled operation
Two RTI control registers located in control register frame beginning at address 7020h.
NOTE: All registers in this module are 8-bit registers that are connected to the 16-bit peripheral bus. When a register is accessed, the register
data is in the lower byte (70), and the upper byte (158) is read as zeros. Writing to the upper byte has no effect.

Figure 15 shows the WD/RTI block diagram.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

watchdog (WD) and real-time interrupt (RTI) module (continued)

RTICNTR.70

Any CLR
Write
8-Bit
Real-Time
/16384
Counter
/2048

/512 111
RTICR.6
CLR 110
/256 101 RTI ENA
INT Request
D Q
100 (Level 1 Only)
RTICR.20 CLR
011
/128 2 1 0 INT Acknowledge
7-Bit 010 RTIPS
Free- /64 RTICR.7
001 Clear
Running /32 RTI Flag
RTI FLAG
16-kHz Counter /16 000
WDCLK /8
D Q RTICR.7 Read
System /4
CLR CLR RTI FLAG RTI Flag
Reset /2

RTICR.7 Clear
RTI FLAG RTI Flag
000
001
010
011
WDCR.20 100
2 1 0 101
WDPS 110
111
WDCNTR.70
WD FLAG
8-Bit Watchdog
WDCR.6 WDCR.7 Reset Flag
Counter One-Cycle
WDDIS Delay PS/257
CLR

WDKEY.70
Bad Key System
Watchdog 55 + AA Reset
Reset Key Good Key WDCHK20 Request
Detector
Register
WDCR.53
Bad WDCR Key
3
3
System Reset
1 0 1
(Constant
Value)
Writing to bits WDCR.53 with anything but the correct pattern (101) generates a system reset.

Figure 15. WD/RTI Module Block Diagram

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

scan-based emulation
TMS320F240 device uses scan-based emulation for code- and hardware-development support. Serial scan
interface is provided by the test-access port. Scan-based emulation allows the emulator to control the processor
in the system without the use of intrusive cables to the full pinout of the device.

TMS320F240 instruction set

The F240 microprocessor implements a comprehensive instruction set that supports both numeric-intensive
signal-processing operations and general-purpose applications, such as multiprocessing and high-speed
control. Source code for the C1x and C2x DSPs is upwardly compatible with the x2xx devices.
For maximum throughput, the next instruction is prefetched while the current one is being executed. Because
the same data lines are used to communicate to external data, program, or I/O space, the number of cycles an
instruction requires to execute varies, depending upon whether the next data operand fetch is from internal or
external memory. Highest throughput is achieved by maintaining data memory on chip and using either internal
or fast external program memory.
addressing modes
The TMS320F240 instruction set provides four basic memory-addressing modes: direct, indirect, immediate,
and register.
In direct addressing, the instruction word contains the lower seven bits of the data memory address. This field
is concatenated with the nine bits of the data memory page pointer (DP) to form the 16-bit data memory address.
Therefore, in the direct-addressing mode, data memory is paged effectively with a total of 512 pages, each page
containing 128 words.
Indirect addressing accesses data memory through the auxiliary registers. In this addressing mode, the address
of the instruction operand is contained in the currently selected auxiliary register. Eight auxiliary registers
(AR0AR7) provide flexible and powerful indirect addressing. To select a specific auxiliary register, the auxiliary
register pointer (ARP) is loaded with a value from 0 to 7 for AR0 through AR7, respectively.
There are seven types of indirect addressing: autoincrement or autodecrement, postindexing by adding or
subtracting the contents of AR0, single-indirect addressing with no increment or decrement, and bit-reversed
addressing [used in Fast Fourier Transforms (FFTs)] with increment or decrement. All operations are performed
on the current auxiliary register in the same cycle as the original instruction, following which the current auxiliary
register and ARP can be modified.
In immediate addressing, the actual operand data is provided in a portion of the instruction word or words. There
are two types of immediate addressing: long and short. In short-immediate addressing, the data is contained
in a portion of the bits in a single-word instruction. In long-immediate addressing, the data is contained in the
second word of a two-word instruction. The immediate-addressing mode is useful for data that does not need
to be stored or used more than once during the course of program execution (for example, initialization values
or constants).
The register-addressing mode uses operands in CPU registers either explicitly, such as with a direct reference
to a specific register, or implicitly, with instructions that intrinsically reference certain registers. In either case,
operand reference is simplified because 16-bit values can be used without specifying a full 16-bit operand
address or immediate value.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

repeat feature
The repeat function can be used with instructions (as defined in Table 14) such as multiply/accumulates (MAC
and MACD), block moves (BLDD and BLPD), I/O transfers (IN/OUT), and table read/writes (TBLR/TBLW).
These instructions, although normally multicycle, are pipelined when the repeat feature is used, and they
effectively become single-cycle instructions. For example, the table-read instruction can take three or more
cycles to execute, but when the instruction is repeated, a table location can be read every cycle.
The repeat counter (RPTC) is loaded with the addressed data-memory location if direct or indirect addressing
is used, and with an 8-bit immediate value if short-immediate addressing is used. The RPTC register is loaded
by the RPT instruction. This results in a maximum of N + 1 executions of a given instruction. RPTC is cleared
by reset. Once a repeat instruction (RPT) is decoded, all interrupts, including NMI (but excluding reset), are
masked until the completion of the repeat loop.
instruction set summary
This section summarizes the operation codes (opcodes) of the instruction set for the F240 digital signal
processors. This instruction set is a superset of the C1x and C2x instruction sets. The instructions are arranged
according to function and are alphabetized by mnemonic within each category. The symbols in Table 13 are
used in the instruction set summary table (Table 14). The TI C2xx assembler accepts C2x instructions.
The number of words that an instruction occupies in program memory is specified in column 3 of Table 14.
Several instructions specify two values separated by a slash mark (/) for the number of words. In these cases,
different forms of the instruction occupy a different number of words. For example, the ADD instruction occupies
one word when the operand is a short-immediate value or two words if the operand is a long-immediate value.
The number of cycles that an instruction requires to execute is also in column 3 of Table 14. All instructions are
assumed to be executed from internal program memory (RAM) and internal data dual-access memory. The
cycle timings are for single-instruction execution, not for repeat mode.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 13. TMS320F240 Opcode Symbols

SYMBOL DESCRIPTION
A Address
ACC Accumulator
ACCB Accumulator buffer
ARx Auxiliary register value (07)
BITx 4-bit field that specifies which bit to test for the BIT instruction
BMAR Block-move address register
DBMR Dynamic bit-manipulation register
I Addressing-mode bit
II...II Immediate operand value
INTM Interrupt-mode flag bit
INTR# Interrupt vector number
K Constant
PREG Product register
PROG Program memory
RPTC Repeat counter
SHF, SHFT 3/4-bit shift value
TC Test-control bit
Two bits used by the conditional execution instructions to represent the conditions TC, NTC, and BIO.
T P Meaning

TP 00 BIO low
01 TC=1
10 TC=0
11 None of the above conditions
TREGn Temporary register n (n = 0, 1, or 2)
4-bit field representing the following conditions:
Z: ACC = 0
L: ACC < 0
V: Overflow
C: Carry
A conditional instruction contains two of these 4-bit fields. The 4-LSB field of the instruction is a 4-bit mask field. A 1 in the
ZLVC
corresponding mask bit indicates that the condition is being tested. The second 4-bit field (bits 47) indicates the state of
the conditions designated by the mask bits as being tested. For example, to test for ACC 0, the Z and L fields are set while
the V and C fields are not set. The next 4-bit field contains the state of the conditions to test. The Z field is set to indicate
testing of the condition ACC = 0, and the L field is reset to indicate testing of the condition ACC 0. The conditions possible
with these 8 bits are shown in the BCND and CC instructions. To determine if the conditions are met, the 4-LSB bit mask
is ANDed with the conditions. If any bits are set, the conditions are met.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 14. TMS320F240 Instruction Set Summary

F240 WORDS/ OPCODE

DESCRIPTION
MNEMONIC CYCLES MSB LSB
ABS Absolute value of accumulator 1/1 1011 1110 0000 0000
Add to accumulator with shift 1/1 0010 SHFT IADD RESS
Add to high accumulator 1/1 0110 0001 IADD RESS
ADD
Add to accumulator short immediate 1/1 1011 1000 KKKK KKKK
Add to accumulator long immediate with shift 2/2 1011 1111 1001 SHFT
ADDC Add to accumulator with carry 1/1 0110 0000 IADD RESS
ADDS Add to low accumulator with sign extension suppressed 1/1 0110 0010 IADD RESS
ADDT Add to accumulator with shift specified by T register 1/1 0110 0011 IADD RESS
ADRK Add to auxiliary register short immediate 1/1 0111 1000 KKKK KKKK
AND with accumulator 1/1 0110 1110 IADD RESS
1011 1111 1011 SHFT
AND immediate with accumulator with shift 2/2
AND 16-Bit Constant
1011 1110 1000 0001
AND immediate with accumulator with shift of 16 2/2
16-Bit Constant
APAC Add P register to accumulator 1/1 1011 1110 0000 0100
0111 1001 IADD RESS
B Branch unconditionally 2/4
Branch Address
BACC Branch to address specified by accumulator 1/4 1011 1110 0010 0000
0111 1011 IADD RESS
BANZ Branch on auxiliary register not zero 2/4/2
Branch Address
1110 0001 0000 0000
Branch if TC bit 0 2/4/2
Branch Address
1110 0010 0000 0000
Branch if TC bit = 0 2/4/2
Branch Address
1110 0011 0001 0001
Branch on carry 2/4/2
Branch Address
1110 0011 1000 1100
Branch if accumulator 0 2/4/2
Branch Address
1110 0011 0000 0100
Branch if accumulator > 0 2/4/2
Branch Address
BCND 1110 0000 0000 0000
Branch on I/O status low 2/4/3
Branch Address
1110 0011 1100 1100
Branch if accumulator 0 2/4/2
Branch Address
1110 0011 0100 0100
Branch if acc m lator < 0
accumulator 2/4/2
Branch Address
1110 0011 0000 0001
Branch on no carry
carr 2/4/2
Branch Address
1110 0011 0000 0010
Branch if no o
overflow
erflo 2/4/2
Branch Address

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 14. TMS320F240 Instruction Set Summary (Continued)

F240 WORDS/ OPCODE

DESCRIPTION
MNEMONIC CYCLES MSB LSB
1110 0011 0000 1000
Branch if acc m lator 0
accumulator 2/4/2
Branch Address
1110 0011 0010 0010
BCND Branch on overflow
o erflo 2/4/2
Branch Address
1110 0011 1000 1000
Branch if accumulator
acc m lator = 0 2/4/2
Branch Address
BIT Test bit 1/1 0100 BITx IADD RESS
BITT Test bit specified by TREG 1/1 0110 1111 IADD RESS
1010 1000 IADD RESS
Block move
mo e from data memory
memor to data memory
memor source
so rce immediate 2/3
Branch Address
BLDD
1010 1001 IADD RESS
Block move
mo e from data memory
memor to data memory
memor destination immediate 2/3
Branch Address
1010 0101 IADD RESS
BLPD Block move from program memory to data memory 2/3
Branch Address
CALA Call subroutine indirect 1/4 1011 1110 0011 0000
0111 1010 IADD RESS
CALL Call subroutine
s bro tine 2/4
Routine Address
1110 10TP ZLVC ZLVC
CC Conditional call subroutine 2/4/2
Routine Address
Configure block as data memory 1/1 1011 1110 0100 0100
Enable interrupt 1/1 1011 1110 0100 0000
Reset carry bit 1/1 1011 1110 0100 1110
CLRC Reset overflow mode 1/1 1011 1110 0100 0010
Reset sign-extension mode 1/1 1011 1110 0100 0110
Reset test/control flag 1/1 1011 1110 0100 1010
Reset external flag 1/1 1011 1110 0100 1100
CMPL Complement accumulator 1/1 1011 1110 0000 0001
CMPR Compare auxiliary register with auxiliary register AR0 1/1 1011 1111 0100 01CM
DMOV Data move in data memory 1/1 0111 0111 IADD RESS
IDLE Idle until interrupt 1/1 1011 1110 0010 0010
1010 1111 IADD RESS
IN Inp t data from port
Input 2/2
16BIT I/O PORT ADRS
INTR Software-interrupt 1/4 1011 1110 011K KKKK
Load accumulator with shift 1/1 0001 SHFT IADD RESS
1011 1111 1000 SHFT
LACC Load acc
accumulator
m lator long immediate with
ith shift 2/2
16-Bit Constant
Zero low accumulator and load high accumulator 1/1 0110 1010 IADD RESS
In x240 devices, the BLDD instruction does not work with memory-mapped registers IMR, IFR, and GREG.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 14. TMS320F240 Instruction Set Summary (Continued)

F240 WORDS/ OPCODE

DESCRIPTION
MNEMONIC CYCLES MSB LSB
Load accumulator immediate short 1/1 1011 1001 KKKK KKKK
Zero accumulator 1/1 1011 1001 0000 0000
LACL
Zero low accumulator and load high accumulator 1/1 0110 1010 IADD RESS
Zero low accumulator and load low accumulator with no sign extension 1/1 0110 1001 IADD RESS
LACT Load accumulator with shift specified by T register 1/1 0110 1011 IADD RESS
Load auxiliary register 1/2 0000 0ARx IADD RESS
Load auxiliary register short immediate 1/2 1011 0ARx KKKK KKKK
LAR
1011 1111 0000 1ARx
Load auxiliary register long immediate 2/2
16-Bit Constant
Load data-memory page pointer 1/2 0000 1101 IADD RESS
LDP
Load data-memory page pointer immediate 1/2 1011 110P AGEP OINT
LPH Load high-P register 1/1 0111 0101 IADD RESS
Load status register ST0 1/2 0000 1110 IADD RESS
LST
Load status register ST1 1/2 0000 1111 IADD RESS
LT Load TREG 1/1 0111 0011 IADD RESS
LTA Load TREG and accumulate previous product 1/1 0111 0000 IADD RESS
LTD Load TREG, accumulate previous product, and move data 1/1 0111 0010 IADD RESS
LTP Load TREG and store P register in accumulator 1/1 0111 0001 IADD RESS
LTS Load TREG and subtract previous product 1/1 0111 0100 IADD RESS
1010 0010 IADD RESS
MAC Multiply and accumulate 2/3
16-Bit Constant
1010 0011 IADD RESS
MACD M ltipl and accumulate
Multiply acc m late with
ith data move
mo e 2/3
16-Bit Constant
Load auxiliary register pointer 1/1 1000 1011 1000 1ARx
MAR
Modify auxiliary register 1/1 1000 1011 IADD RESS
Multiply (with TREG, store product in P register) 1/1 0101 0100 IADD RESS
MPY
Multiply immediate 1/1 110C KKKK KKKK KKKK
MPYA Multiply and accumulate previous product 1/1 0101 0000 IADD RESS
MPYS Multiply and subtract previous product 1/1 0101 0001 IADD RESS
MPYU Multiply unsigned 1/1 0101 0101 IADD RESS
NEG Negate accumulator 1/1 1011 1110 0000 0010
NMI Nonmaskable interrupt 1/4 1011 1110 0101 0010
NOP No operation 1/1 1000 1011 0000 0000
NORM Normalize contents of accumulator 1/1 1010 0000 IADD RESS
OR with accumulator 1/1 0110 1101 IADD RESS
1011 1111 1100 SHFT
OR immediate with
ith acc
accumulator
m lator with
ith shift 2/2
OR 16-Bit Constant
1011 1110 1000 0010
OR immediate with accumulator with shift of 16 2/2
16-Bit Constant
0000 1100 IADD RESS
OUT Output data to port 2/3
16BIT I/O PORT ADRS
PAC Load accumulator with P register 1/1 1011 1110 0000 0011

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 14. TMS320F240 Instruction Set Summary (Continued)

F240 WORDS/ OPCODE

DESCRIPTION
MNEMONIC CYCLES MSB LSB
POP Pop top of stack to low accumulator 1/1 1011 1110 0011 0010
POPD Pop top of stack to data memory 1/1 1000 1010 IADD RESS
PSHD Push data-memory value onto stack 1/1 0111 0110 IADD RESS
PUSH Push low accumulator onto stack 1/1 1011 1110 0011 1100
RET Return from subroutine 1/4 1110 1111 0000 0000
RETC Conditional return from subroutine 1/4/2 1110 11TP ZLVC ZLVC
ROL Rotate accumulator left 1/1 1011 1110 0000 1100
ROR Rotate accumulator right 1/1 1011 1110 0000 1101
Repeat instruction as specified by data-memory value 1/1 0000 1011 IADD RESS
RPT
Repeat instruction as specified by immediate value 1/1 1011 1011 KKKK KKKK
SACH Store high accumulator with shift 1/1 1001 1SHF IADD RESS
SACL Store low accumulator with shift 1/1 1001 0SHF IADD RESS
SAR Store auxiliary register 1/1 1000 0ARx IADD RESS
SBRK Subtract from auxiliary register short immediate 1/1 0111 1100 KKKK KKKK
Set carry bit 1/1 1011 1110 0100 1111
Configure block as program memory 1/1 1011 1110 0100 0101
Disable interrupt 1/1 1011 1110 0100 0001
SETC Set overflow mode 1/1 1011 1110 0100 0011
Set test/control flag 1/1 1011 1110 0100 1011
Set external flag XF 1/1 1011 1110 0100 1101
Set sign-extension mode 1/1 1011 1110 0100 0111
SFL Shift accumulator left 1/1 1011 1110 0000 1001
SFR Shift accumulator right 1/1 1011 1110 0000 1010
SPAC Subtract P register from accumulator 1/1 1011 1110 0000 0101
SPH Store high-P register 1/1 1000 1101 IADD RESS
SPL Store low-P register 1/1 1000 1100 IADD RESS
SPM Set P register output shift mode 1/1 1011 1111 IADD RESS
SQRA Square and accumulate 1/1 0101 0010 IADD RESS
SQRS Square and subtract previous product from accumulator 1/1 0101 0011 IADD RESS
Store status register ST0 1/1 1000 1110 IADD RESS
SST
Store status register ST1 1/1 1000 1111 IADD RESS
1010 1110 IADD RESS
SPLK Store long immediate to data memory
memor 2/2
16-Bit Constant
1011 1111 1010 SHFT
S btract from accumulator
Subtract acc m lator long immediate with
ith shift 2/2
16-Bit Constant
SUB Subtract from accumulator with shift 1/1 0011 SHFT IADD RESS
Subtract from high accumulator 1/1 0110 0101 IADD RESS
Subtract from accumulator short immediate 1/1 1011 1010 KKKK KKKK

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

instruction set summary (continued)

Table 14. TMS320F240 Instruction Set Summary (Continued)

F240 WORDS/ OPCODE

DESCRIPTION
MNEMONIC CYCLES MSB LSB
SUBB Subtract from accumulator with borrow 1/1 0110 0100 IADD RESS
SUBC Conditional subtract 1/1 0000 1010 IADD RESS
SUBS Subtract from low accumulator with sign extension suppressed 1/1 0110 0110 IADD RESS
SUBT Subtract from accumulator with shift specified by TREG 1/1 0110 0111 IADD RESS
TBLR Table read 1/3 1010 0110 IADD RESS
TBLW Table write 1/3 1010 0111 IADD RESS
TRAP Software interrupt 1/4 1011 1110 0101 0001
Exclusive-OR with accumulator 1/1 0110 1100 IADD RESS
1011 1111 1101 SHFT
E cl si e OR immediate with
Exclusive-OR ith accumulator
acc m lator with
ith shift 2/2
XOR 16-Bit Constant
1011 1110 1000 0011
E cl si e OR immediate with
Exclusive-OR ith accumulator
acc m lator with
ith shift of 16 2/2
16-Bit Constant
ZALR Zero low accumulator and load high accumulator with rounding 1/1 0110 1000 IADD RESS

development support
Texas Instruments offers an extensive line of development tools for the x240 generation of DSPs, including tools
to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules.
The following products support development of x240-based applications:
Software Development Tools:
Assembler/Linker
Simulator
Optimizing ANSI C compiler
Application algorithms
C/Assembly debugger and code profiler
Hardware Development Tools:
Emulator XDS510 (supports x240 multiprocessor system debug)
See Table 15 and Table 16 for complete listings of development-support tools for the F240. For information on
pricing and availability, contact the nearest TI field sales office or authorized distributor.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

development support (continued)

Table 15. Development Support Tools

DEVELOPMENT TOOL PLATFORM PART NUMBER
Software Code Generation Tools
Assembler/Linker PC, Windows 95 TMDS3242850-02
C Compiler/Assembler/Linker PC, Windows 95 TMDS3242855-02
Software Emulation Debug Tools
LF2407 eZdsp PC TMDS3P761119
Code Composer 4.12, Code Generation 7.0 PC TMDS324012xx
Hardware Emulation Debug Tools
XDS510XL Board (ISA card), w/JTAG cable PC TMDS00510
XDS510PP Pod (Parallel Port) w/JTAG cable PC TMDS00510PP

Table 16. TMS320F240-Specific Development Tools

DEVELOPMENT TOOL PLATFORM PART NUMBER
Hardware Evaluation/Starter Kits
TMS320LF2407A EVM PC, Windows 95, Windows 98 TMDX3P701016
TMS320F240 EVM PC TMDX326P124X
TMS320F243 EVM PC, Windows 95 TMDS3P604030

device and development-support tool nomenclature

To designate the stages in the product development cycle, Texas Instruments assigns prefixes to the part
numbers of all TMS320 DSP devices and support tools. Each TMS320 member has one of three prefixes:
TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS). This
development flow is defined below.
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final devices electrical
specifications
TMP Final silicon die that conforms to the devices electrical specifications but has not completed
quality and reliability verification
TMS Fully qualified production device

Support tool development evolutionary flow:

TMDX Development support product that has not completed TIs internal qualification testing
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
Developmental product is intended for internal evaluation purposes.

XDS510XL, XDS510PP, and TMS320 are trademarks of Texas Instruments.

PC is a trademark of International Business Machines Corp.
Windows is a registered trademark of Microsoft Corporation.
eZdsp is a trademark of Spectrum Digital, Inc.

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device and development-support tool nomenclature (continued)

TMS devices and TMDS development-support tools have been fully characterized, and the quality and reliability
of the device have been fully demonstrated. TIs standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate is still undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PN, PQ, and PZ) and temperature range (for example, L). Figure 16 provides a legend for reading
the complete device name for any TMS320x2xx family member.
TMS 320 C 240 PQ (L)

PREFIX TEMPERATURE RANGE (DEFAULT: 0C TO 70C)

TMX = Experimental device L = 0C to 70C
TMP = Prototype device A = 40C to 85C
TMS = Qualified device S = 40C to 125C
Q = 40C to 125C, Q 100 Fault Grading
PACKAGE TYPE
DEVICE FAMILY PN = 80-pin plastic TQFP
PQ = 132-pin plastic bumpered QFP
320 = TMS320 Family PZ = 100-pin plastic TQFP

DEVICE
C2xx DSP
209
TECHNOLOGY 203
241
C = ROM 242
F = Flash EEPROM F2xx DSP
206
240
241
243
TQFP = Thin Quad Flat Package

Figure 16. TMS320 Device Nomenclature

documentation support
Extensive documentation supports all of the TMS320 family generations of devices from product announcement
through applications development. The types of documentation available include: data sheets, such as this
document, with design specifications; complete users guides for all devices and development-support tools;
and hardware and software applications. To receive copies of TMS320 literature, contact the Literature
Response Center at 800/477-8924.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support DSP research and
education. The TMS320 newsletter, Details on Signal Processing, is published quarterly and distributed to
update TMS320 customers on product information. The TMS320 DSP bulletinboard service (BBS) provides
access to a wealth of information pertaining to the TMS320 family, including documentation, source code, and
object code for many DSP algorithms and utilities. The BBS can be reached at 281/274-2323.
Updated information on the TMS320 DSP controllers can be found on the worldwide web at: http://www.ti.com.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V
Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V
Operating free-air temperature range, TA: L version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C
A version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to 85C
S, Q versions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to125C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C to 150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.

recommended operating conditions

MIN NOM MAX UNIT
VDD Supply voltage 4.5 5 5.5 V
VSS Supply ground 0 V
XTAL1/CLKIN 3 VDD + 0.3
VIH High-level
g input voltage
g PORESET, NMI, RS, and TRST 2.2 VDD + 0.3 V
All other inputs 2 VDD + 0.3
XTAL1/CLKIN 0.3 0.7
VIL Low level input voltage
Low-level V
All other inputs 0.3 0.8
RS 19
IOH High-level
High level output
out ut current, VOH = 2.4 V See complete listing of pin names 16 mA
All other outputs 23
RS 8
IOL Low-level
Low level output
out ut current, VOL = 0.6 V See complete listing of pin names 7.5 mA
All other outputs 14.5
L version 0 70
TA Operating
g free-air temperature A version 40 85 C
S, Q versions 40 125
TFP Flash programming operating temperature L, A, S, Q versions 40 85 C
JA Thermal resistance, junction-to-ambient 40 C/W
JC Thermal resistance, junction-to-case 9.9 C/W
IOPA[0:3], SCIRXD/IO, SCITXD/IO, XINT2/IO, XINT3/IO, ADCSOC/IOPC0, TMRDIR/IOPB6, TMRCLK/IOPB7 EMU0, EMU1/OFF

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

output current variation with output voltage: SPICE simulation results

Condition: Temperature : 150 C

Voltage : 4.5 V

Table 17. Typical Output Source Current vs. Output Voltage High
24V
2.4 30V
3.0 35V
3.5 40V
4.0
RS 19 mA 16 mA 12 mA 6 mA
See complete listing of pin names 16 mA 13.5 mA 9.5 mA 5.0 mA
All other inputs 23 mA 18.5 mA 13 mA 6.5 mA
IOPA[0:3], SCIRXD/IO, SCITXD/IO, XINT2/IO, XINT3/IO, ADCSOC/IOPC0, TMRDIR/IOPB6, TMRCLK/IOPB7 EMU0, EMU1/OFF

Table 18. Typical Output Sink Current vs. Output Voltage Low
06V
0.6 04V
0.4 02V
0.2
RS 8 mA 6 mA 3 mA
See complete listing of pin names 7.5 mA 5 mA 2.5 mA
All other inputs 14.5 mA 10 mA 5.0 mA
IOPA[0:3], SCIRXD/IO, SCITXD/IO, XINT2/IO, XINT3/IO, ADCSOC/IOPC0, TMRDIR/IOPB6, TMRCLK/IOPB7 EMU0, EMU1/OFF

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage 5-V operation, IOH = MAX 2.4 V
VOL Low-level output voltage 5-V operation, IOL = MAX 0.6 V
TRST pin with internal pulldown 10 500
EMU0, EMU1/OFF, TMS, TCK, and TDI,
II Input current (VI = VSS or VDD) 500 10 A
with internal pullup
All other input pins 10 10
IOZ Output current, high-impedance state (off-state) VO = VDD or 0 V 5 5 A
Supply current, operating mode 5-V operation, tc(CO) = 50 ns 80
Supply current, Idle 1 low-power mode 5-V operation, tc(CO) = 50 ns 50
mA
IDD Supply current, Idle 2 low-power mode 5-V operation, tc(CO) = 50 ns 7
Supply current, PLL power-down mode 5-V operation, tc(CO) = 50 ns 1
Supply current, OSC power-down mode 5-V operation, tc(CO) = 50 ns 400 A
Ci Input capacitance 15 pF
Co Output capacitance 15 pF
IDDP Flash programming supply current 5-V operation, tc(CO) = 50 ns 10 mA

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

IOL

Tester Pin
Electronics

50 Output
VLOAD Under
Test
CT

IOH

Where: IOL = 2 mA (all outputs)

IOH = 300 A (all outputs)
VLOAD = 1.5 V
CT = 110-pF typical load-circuit capacitance

Figure 17. Test Load Circuit

signal transition levels
The data in this section is shown for the 5-V version (C2xx). Note that some of the signals use different reference
voltages, see the recommended operating conditions table. TTL-output levels are driven to a minimum
logic-high level of 2.4 V and to a maximum logic-low level of 0.7 V.

Figure 18 shows the TTL-level outputs.

2.4 V
80%

20%
0.7 V
Figure 18. TTL-Level Outputs

TTL-compatible output transition times are specified as follows:

D For a high-to-low transition, the level at which the output is said to be no longer high is below 80% of the
total voltage range and lower, and the level at which the output is said to be low is 20% of the total voltage
range and lower.
D For a low-to-high transition, the level at which the output is said to be no longer low is 20% of the total voltage
range and higher, and the level at which the output is said to be high is 80% of the total voltage range and
higher.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

Figure 19 shows the TTL-level inputs.

2.0 V
90%

10%
0.7 V

Figure 19. TTL-Level Inputs

TTL-compatible input transition times are specified as follows:

D For a high-to-low transition on an input signal, the level at which the input is said to be no longer high is 90%
of the total voltage range and lower, and the level at which the input is said to be low is 10% of the total
voltage range and lower.
D For a low-to-high transition on an input signal, the level at which the input is said to be no longer low is 10%
of the total voltage range and higher, and the level at which the input is said to be high is 90% of the total
voltage range and higher.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

timing parameter symbology

Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols,
some of the pin names and other related terminology have been abbreviated as follows:

A A[15:0] MS Memory strobe pins IS, DS, or PS

Cl XTAL1/CLKIN R READY
CO CLKOUT/IOPC1 RD Read cycle or W/R
D D[15:0] RS RS or PORESET
INT NMI, XINT1, XINT2/IO, and XINT3/IO W Write cycle or WE

Lowercase subscripts and their meanings: Letters and symbols and their meanings:
a access time H High
c cycle time (period) L Low
d delay time V Valid
f fall time X Unknown, changing, or dont care level
h hold time Z High impedance
r rise time
su setup time
t transition time
v valid time
w pulse duration (width)

general notes on timing parameters

All output signals from the TMS320F240 device (including CLKOUT) are derived from an internal clock such
that all output transitions for a given half-cycle occur with a minimum of skewing relative to each other.
The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles.
For actual cycle examples, see the appropriate cycle description section of this data sheet.

XTAL1/CLKIN XTAL2 XTAL1/CLKIN XTAL2

See Note B

C1 C2 External
NC
(see Note A) Crystal (see Note A) Clock Signal
(toggling 05 V)
NOTES: A. For the values of C1 and C2, see the crystal manufacturers specification.
B. Use this configuration in conjunction with OSCBYP pin pulled low.
C. Texas Instruments recommends that customers have the resonator/crystal vendor characterize the operation of their device with
the DSP chip. The resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The vendor can also advise
the customer regarding the proper tank component values that will ensure start-up and stability over the entire operating range.

Figure 20. Recommended Crystal/Clock Connection

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

CLOCK OPTIONS

clock options
PARAMETER CLKMD[1:0]
Clock-in mode, divide-by-2 00
Clock-in mode, divide-by-1 01
PLL enabled, divide-by-2 before PLL lock 10
PLL enabled, divide-by-1 before PLL lock 11

timings with the PLL circuit disabled

PARAMETER TEST CONDITIONS MIN MAX UNIT
fx Input clock frequency, divide-by-2 mode TA = 40C to 125C 0 40 MHz
fx Input clock frequency, divide-by-1 mode TA = 40C to 125C 0 20 MHz
This device utilizes a fully static design and, therefore, can operate with input clock cycle time [tc(CI)] approaching infinity. The device is
characterized at frequencies approaching 0 Hz.

switching characteristics over recommended operating conditions [H = 0.5 tc(CO)]

(see Note 1 and Figure 21)
PARAMETER CLOCK MODE MIN TYP MAX UNIT
CLKIN divide by 2 2tc(Cl)
tc(CPU) C cle time
Cycle time, CPUCLK ns
CLKIN divide by 1 tc(Cl)
CPUCLK divide by 2 2tc(CPU)
tc(SYS) C cle time,
Cycle time SYSCLK ns
CPUCLK divide by 4 4tc(CPU)
CLKIN divide by 2 2tc(Cl)
tc(CO) C cle time
Cycle time, CLKOUT ns
CLKIN divide by 1 tc(Cl)
td(CIH-CO) Delay time, XTAL1/CLKIN high to CLKOUT high/low 3 18 32 ns
tf(CO) Fall time, CLKOUT 5 ns
tr(CO) Rise time, CLKOUT 5 ns
tw(COL) Pulse duration, CLKOUT low H10 H6 H1 ns
tw(COH) Pulse duration, CLKOUT high H+0 H+4 H+8 ns
This device utilizes a fully static design and, therefore, can operate with input clock cycle time [tc(CI)] approaching infinity. The device is
characterized at frequencies approaching 0 Hz.
SYSCLK is initialized to divide-by-4 mode by any device reset.
NOTE 1: Timings assume CLKOUT is set to output CPUCLK. CLKOUT is initialized to CPUCLK by power-on reset.

timing requirements over recommended operating conditions (see Figure 21)

CLOCK-IN MODE MIN MAX UNIT
Divide by 2 25
tc(Cl) C cle time
Cycle time, XTAL1/CLKIN ns
Divide by 1 50
tf(Cl) Fall time, XTAL1/CLKIN 5 ns
tr(Cl) Rise time, XTAL1/CLKIN 5 ns
tw(CIL) Pulse duration, XTAL1/CLKIN low as a percentage of tc(Cl) 45 55 %
tw(CIH) Pulse duration, XTAL1/CLKIN high as a percentage of tc(Cl) 45 55 %
This device utilizes a fully static design and, therefore, can operate with input clock cycle time [tc(CI)] approaching infinity. The device is
characterized at frequencies approaching 0 Hz.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

CLOCK OPTIONS (CONTINUED)

tr(CI)
tw(CIH) tw(CIL) tf(CI)
tc(CI)
XTAL1/CLKIN
tf(CO)
tc(CO)
tr(CO)
tw(COH)
td(CIHCO) tw(COL)

CLKOUT/IOPC1

Figure 21. External Divide-by-Two Clock Timings

external reference crystal with PLL-circuit-enabled clock option

The internal oscillator is enabled by connecting OSCBYP to VDD and connecting a crystal across XTAL1/CLKIN
and XTAL2 pins as shown in Figure 20. The crystal should be in either fundamental or overtone operation and
parallel resonant, with an effective series resistance of 30 W and a power dissipation of 1 mW; it should be
specified at a load capacitance of 20 pF.

timings with the PLL circuit enabled

EXTERNAL REFERENCE
PARAMETER MIN TYP MAX UNIT
CRYSTAL
4 MHz 4
fx Input
In ut clock frequency 6 MHz 6 MHz
8 MHz 8
C1, C2 Load capacitance 10 pF

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

switching characteristics over recommended operating conditions [H = 0.5 tc(CO)] (see Figure 22)
PARAMETER CLOCK MODE MIN TYP MAX UNIT
before PLL lock,
2tc(Cl)
CLKIN divide by 2
tc(CPU) Cycle time, CPUCLK before PLL lock, ns
tc(Cl)
CLKIN divide by 1
after PLL lock 50
CPUCLK divide by 2 2tc(CPU)
tc(SYS) C cle time,
Cycle time SYSCLK ns
CPUCLK divide by 4 4tc(CPU)
tc(CO) Cycle time, CLKOUT 50 ns
tf(CO) Fall time, CLKOUT 5 ns
tr(CO) Rise time, CLKOUT 5 ns
tw(COL) Pulse duration, CLKOUT low H10 H6 H1 ns
tw(COH) Pulse duration, CLKOUT high H+0 H+4 H+8 ns
before PLL lock,
2000tc(Cl)
Transition time, PLL synchronized after CLKIN divide by 2
tp ns
PLL enabled before PLL lock,
1000tc(Cl)
CLKIN divide by 1
This device utilizes a fully static design and, therefore, can operate with input clock cycle time [tc(CI)] approaching infinity. The device is
characterized at frequencies approaching 0 Hz.
SYSCLK is initialized to divide-by-4 mode by any device reset.

timing requirements over recommended operating conditions (see Note 1 and Figure 22)
EXTERNAL REFERENCE
MIN MAX UNIT
CRYSTAL
4 MHz 250
tc(Cl) Cycle time, XTAL1/CLKIN 6 MHz 167 ns
8 MHz 125
tf(Cl) Fall time, XTAL1/CLKIN 5 ns
tr(Cl) Rise time, XTAL1/CLKIN 5 ns
tw(CIL) Pulse duration, XTAL1/CLKIN low as a percentage of tc(CI) 40 60 %
tw(CIH) Pulse duration, XTAL1/CLKIN high as a percentage of tc(CI) 40 60 %
This device utilizes a fully static design and, therefore, can operate with input clock cycle time [tc(CI)] approaching infinity. The device is
characterized at frequencies approaching 0 Hz.
NOTE 1: Timings assume CLKOUT is set to output CPUCLK. CLKOUT is initialized to CPUCLK by power-on reset.

tc(CI)
tw(CIH)
tf(Cl) tr(Cl)

tw(CIL)
XTAL1/CLKIN

tw(COH)
tr(CO) tf(CO)
tc(CO) tw(COL)

CLKOUT

Figure 22. CLKIN-to-CLKOUT Timings for PLL Oscillator Mode, Multiply-by-5 Option With 4-MHz Crystal

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

low-power mode timings

switching characteristics over recommended operating conditions (see Figure 23, Figure 24,
Figure 25, and Figure 26)
PARAMETER LOW-POWER MODES MIN TYP MAX UNIT

Delay time, CLKOUT switching to Idle 1 and Idle 2 15 X tc(CO)

td(WAKE-A) ns
program execution resume (see Note 1) PLL or OSC power down 15 X tc(CI)
Delay time, Idle instruction executed to Idle 2, PLL power down, OSC
td(IDLE-COH) 500 ns
CLKOUT high (see Note 1) power down
Delay time, CLKOUT switching to PLL
td(WAKE-LOCK) PLL or OSC power down 100 s
synchronized (see Note 1)
Delay time, wakeup interrupt asserted
td(WAKE-OSC) OSC power down 10 ms
to oscillator running
Delay time, Idle instruction executed to
td(IDLE-OSC) OSC power down 60 s
oscillator power off
NOTE 1: Timings assume CLKOUT is set to output CPUCLK. CLKOUT is initialized to CPUCLK by power-on reset.

td(WAKEA)

A0A15

CLKOUT/IOPC1

WAKE INT

Figure 23. IDLE1 Entry and Exit Timings

td(IDLECOH)

A0A15

CLKOUT/IOPC1

WAKE INT
td(WAKEA)

Figure 24. IDLE2 Entry and Exit Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

low-power mode timings (continued)

td(WAKEA)

A0A15

td(IDLECOH) td(WAKELOCK)

CLKOUT/IOPC1

WAKE INT

Figure 25. PLL Power-Down Entry and Exit Timings

td(WAKEA)

A0A15

td(IDLEOSC)

td(WAKELOCK)
td(IDLECOH) td(WAKEOSC)

CLKOUT/IOPC1

WAKE INT

Figure 26. OSC Power-Down Entry and Exit Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

memory and parallel I/O interface read timings

switching characteristics over recommended operating conditions for a memory read @ 5 V

(see Figure 27)
PARAMETER MIN MAX UNIT
td(CO-A)RD Delay time, CLKOUT/IOPC1 low to address valid 17 ns
td(CO-SL)RD Delay time, CLKOUT/IOPC1 low to STRB low 10 ns
td(CO-SH)RD Delay time, CLKOUT/IOPC1 low to STRB high 6 ns

td(CO-ACTL)RD Delay time, CLKOUT/IOPC1 low to PS, DS, IS, and BR low 10 ns

td(CO-ACTH)RD Delay time, CLKOUT/IOPC1 low to PS, DS, IS, and BR high 10 ns

timing requirements over recommended operating conditions for a memory read @ 5 V

[H = 0.5tc(CO)] (see Figure 27)
MIN MAX UNIT
0 wait state 2H 32
ta(A) Access time,
time from address valid
alid to read data ns
1 wait state 4H 32
tsu(D-COL)RD Setup time, data read before CLKOUT/IOPC1 low 15 ns
th(COL-D)RD Hold time, data read after CLKOUT/IOPC1 low 2 ns
All timings with respect to CLKOUT/IOPC1 assume CLKSRC[1:0] bits are set to select CPUCLK for output.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

memory and parallel I/O interface read timings (continued)

CLKOUT/IOPC1

td(COACTH)RD
td(COACTL)RD

PS, DS, IS,

or BR
td(COA)RD
td(COA)RD

A0A15

W/R

tsu(D-COL)RD
WE
ta(A)
th(COL-D)RD

D0D15

td(COSL)RD td(COSH)RD

STRB

READY

Figure 27. Memory Interface Read Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

memory and parallel I/O interface write timings

switching characteristics over recommended operating conditions for a memory write

@ 5 V [H = 0.5tc(CO)] (see Figure 28)
PARAMETER MIN MAX UNIT
td(CO-A)W Delay time, CLKOUT/IOPC1 high to address valid 17 ns
td(CO-D) Delay time, CLKOUT/IOPC1 low to data bus driven 15 ns
th(WH-A) Hold time, address valid after WE high H8 ns
tw(WH) Pulse duration, WE high 2H 11 ns
tw(WL) Pulse duration, WE low 2H 11
td(CO-WL) Delay time, CLKOUT/IOPC1 low to WE low 9 ns
td(CO-WH) Delay time, CLKOUT/IOPC1 low to WE high 9 ns
tsu(D-WH) Setup time, write data valid before WE high 2H 8 ns
thz(WH-D) High-impedance time, WE high to data bus Hi-Z 0 5 ns
td(CO-SL)W Delay time, CLKOUT/IOPC1 low to STRB low 10 ns
td(CO-SH)W Delay time, CLKOUT/IOPC1 low to STRB high 6 ns
td(CO-ACTL)W Delay time, CLKOUT/IOPC1 high to PS, DS, IS, and BR low 10 ns
td(CO-ACTH)W Delay time, CLKOUT/IOPC1 high to PS, DS, IS, and BR high 10 ns
td(CO-RWL) Delay time, CLKOUT/IOPC1 high to R/W low 10 ns
td(CO-RWH) Delay time, CLKOUT/IOPC1 high to R/W high 10 ns
All timings with respect to CLKOUT/IOPC1 assume CLKSRC[1:0] bits are set to select CPUCLK for output.

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

memory and parallel I/O interface write timings (continued)

CLKOUT/IOPC1

td(COACTH)W
td(COACTL)W
PS, DS, IS,
or BR
td(COA)W
th(WH-A)

A0A15

td(CORWL) td(CORWH)

td(COWH)
R/W

W/R

td(COWL)
tw(WH)

WE

td(COD)
thz(WH-D)
tsu(D-WH)
D0D15

td(COSL)W td(COSH)W

STRB

READY

Figure 28. Memory Interface Write Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

I/O timing variation with load capacitance: SPICE simulation results

Condition: Temperature : 40 to 150 C

Capacitance : 5125pF
Voltage : 5.0 V

2.2 V

0.8 V

Figure 29. Rise and Fall Time Diagram

Table 19. Timing Variation With Load Capacitance: [VCC = 5 V, VOH = 2.2 V, VOL = 0.8 V]
40C 27C 150C
RISE FALL RISE FALL RISE FALL
5 pF 2.5 ns 3.6 ns 3.1 ns 4.5 ns 4.3 ns 6.2 ns
25 pF 3.1 ns 4.6 ns 4.0 ns 5.7 ns 5.6 ns 7.8 ns
50 pF 3.9 ns 5.9 ns 5.0 ns 7.3 ns 7.2 ns 9.9 ns
75 pF 4.7 ns 7.3 ns 6.1 ns 8.9 ns 8.8 ns 11.7 ns
100 pF 5.4 ns 8.9 ns 7.2 ns 10.6 ns 10.5 ns 13.8 ns
125 pF 6.2 ns 10.4 ns 8.3 ns 12.2 ns 12.1 ns 15.8 ns

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

READY timings

timing requirements over recommended operating conditions [H = 0.5tc(CO)] (see Figure 30)
MIN MAX UNIT
tsu(R-CO) Setup time, READY low before CLKOUT/IOPC1 high 14 ns
th(CO-R) Hold time, READY low after CLKOUT/IOPC1 high 0 ns
tv(R)ARD Valid time, READY after address valid on read 3H 31 ns
tv(R)AW Valid time, READY after address valid on write 4H 31 ns
The READY timings are based on one software wait state. At full speed operation, the F240 does not allow for single READY-based wait states.

CLKOUT/IOPC1

PS, DS, or IS

A0A15

W/R

WE

D0D15

STRB

tsu(RCO)
tv(R)AW
th(COR)
tv(R)ARD

READY

Figure 30. READY Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

RS and PORESET timings

switching characteristics over recommended operating conditions for a reset [H = 0.5tc(CO)]

(see Figure 31, Figure 32, and Figure 33)
PARAMETER MIN MAX UNIT
tw(RSL1) Pulse duration, RS low 8tc(SYS) ns
td(RS) Delay time, RS low to program address at reset vector 4H ns
td(EX) Delay time, RS high to reset vector executed 32H ns
The parameter tw(RSL1) refers to the time RS is an output.

timing requirements over recommended operating conditions for a reset (see Figure 31, Figure 32,
and Figure 33)
MIN MAX UNIT
tw(RSL) Pulse duration, RS or PORESET low 5 ns
The parameter tw(RSL) refers to the time RS is an input.

VDD

PORESET

RS

txtal
tp

XTAL1# Startup PLL Lock PLL Stable

tHi-Z

I/O Pins Hi-Z

PORESET is required to be driven low during power up to ensure all clock/PLL registers are reset to a known state.
RS is a bidirectional (open-drain output) pin and can be optionally pulled low through an open-drain or open-collector drive circuit, or through
a 2.7-k resistor in series with a totem pole drive circuit. If RS is left undriven, then a 20-k pullup resistor should be used.
The start-up time of the on-chip oscillator depends on the crystal parameters, bypass capacitors, and board layout. Typical start-up time is
about 10 ms.
After PORESET is high and oscillator starts up, it takes few clock edges (typically 48 oscillator cycles) for the I/Os to assume high-impedance
state.
# CLKOUT using on-chip oscillator.

Figure 31. Case With Crystal

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

RS and PORESET timings (continued)

VDD

PORESET

RS

tlock

CLKIN Startup PLL Lock PLL Stable

tHi-Z

I/O Pins Hi-Z

PORESET is required to be driven low during power up to ensure all clock/PLL registers are reset to a known state.
RS is a bidirectional (open-drain output) pin and can be optionally pulled low through an open-drain or open-collector drive circuit, or through
a 2.7-k resistor in series with a totem pole drive circuit. If RS is left undriven, then a 20-k pullup resistor should be used.
If external clock is used, after PORESET is high, it takes few valid clock edges (typically 48 clock-in cycles) for the I/Os to assume
high-impedance state.
CLKOUT using external oscillator.

Figure 32. Case With External Oscillator

tw(RSL)

PORESET

tw(RSL1)

RS

td(RS) td(EX)

A0A15 0000h 0001h

RS is driven low by any device reset, which includes asserting PORESET, RS, access to an illegal address, execution of a software
reset, or a watchdog timer reset.

Figure 33. Power-On Reset Timings

POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443 77




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

XF, BIO, and MP/MC timings

switching characteristics over recommended operating conditions (see Figure 34)

PARAMETER MIN MAX UNIT
td(XF) Delay time, CLKOUT high to XF high/low 11 ns

timing requirements over recommended operating conditions [H = 0.5tc(CO)] (see Figure 34)
MIN MAX UNIT
tw(BIOL) Pulse duration, BIO low 2H + 16 ns
tw(MPMCV) Pulse duration, MP/MC valid 2H + 24 ns
This is the minimum time the MP/MC pin needs to be stable in order to be recognized by internal logic; however, for proper operation, the user
must maintain a valid level for the duration of the entire memory access (or accesses) on- or off-chip.

CLKOUT/IOPC1

td(XF)

XF

tw(MPMCV)

MP/MC Valid

tw(BIOL)

BIO

This is the minimum time the MP/MC pin needs to be stable in order to be recognized by internal logic; however, for proper
operation, the user must maintain a valid level for the duration of the entire memory access (or accesses) on- or off-chip.

Figure 34. XF, BIO, and MP/MC Timings

78 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

TIMING EVENT MANAGER INTERFACE

PWM/CMP timings
PWM refers to PWM1/CMP1, PWM2/CMP2, PWM3/CMP3, PWM4/CMP4, PWM5/CMP5, PWM6/CMP6,
T1PWM/T1CMP, T2PWM/T2CMP, T3PWM/T3CMP, PWM7/CMP7, PWM8/CMP8, and PWM9/CMP9.

switching characteristics over recommended operating conditions for PWM timing (see Figure 35)
PARAMETER MIN MAX UNIT
td(PWM)CO Delay time, CLKOUT high to PWM output switching 12 ns

timing requirements over recommended operating conditions for PWM timing [H = 0.5tc(CO)]
(see Figure 36 and Figure 37)
MIN MAX UNIT
tw(TMRDIR) Pulse duration, TMRDIR low/high 4H + 12 ns
tw(TMRCLKL) Pulse duration, TMRCLK low as a percentage of TMRCLK cycle time 40 60 %
tw(TMRCLKH) Pulse duration, TMRCLK high as a percentage of TMRCLK cycle time 40 60 %
tc(TMRCLK) Cycle time, TMRCLK 4  tc(CPU) ns

CLKOUT/IOPC1

td(PWM)CO

PWM

Figure 35. PWM and Compare Output Timings

tw(TMRCLKL) tw(TMRCLKH)
tc(TMRCLK)

TMRCLK

Figure 36. External Timer Clock Input Timings

tw(TMRDIR)

TMRDIR

Figure 37. External Timer Direction Input Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

capture and QEP timings

CAP refers to CAP1/QEP1/IOPC4, CAP2/QEP2/IOPC5, CAP3/IOPC6, and CAP4/IOPC7.

timing requirements over recommended operating conditions for CAP [H = 0.5tc(CO)]

(see Figure 38)
MIN MAX UNIT
tw(CAP) Pulse duration, CAP input low/high 4H + 12 ns

tw(CAP)

CAP

Figure 38. Capture and QEP Input Timings

80 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

interrupt timings
PWM refers to PWM1/CMP1, PWM2/CMP2, PWM3/CMP3, PWM4/CMP4, PWM5/CMP5, PWM6/CMP6,
T1PWM/T1CMP, T2PWM/T2CMP, T3PWM/T3CMP, PWM7/CMP7, PWM8/CMP8, and PWM9/CMP9.
INT refers to NMI, XINT1, XINT2/IO, and XINT3/IO. PDP refers to PDPINT.

switching characteristics over recommended operating conditions for interrupts (see Figure 40)
PARAMETER MIN MAX UNIT
td(PWM)PDP Delay time, PDPINT low to PWM to high-impedance state 0 15 ns

timing requirements over recommended operating conditions for interrupts [H = 0.5tc(CO)]

(see Figure 39 and Figure 40)
MIN MAX UNIT
tw(INT) Pulse duration, INT input low/high tc(SYS) + 12 ns
tw(PDP) Pulse duration, PDPINT input low 2H + 18 ns
td(INT) Delay time, INT low/high to interrupt-vector fetch 2tc(SYS) + 4tc(CPU) ns

tw(INT)

INT

Figure 39. External Interrupt Timings

tw(PDP)

PDPINT

td(PWM)PDP

PWM

Figure 40. Power-Drive Protection Interrupt Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

general-purpose input/output timings

GPO refers to the digital output function of shared pins IOPA03, IOPB07, IOPC07, XINT2/IO, XINT3/IO.
GPI refers to the digital input function of shared pins IOPA03, IOPB07, IOPC07, XINT2/IO, XINT3/IO.

switching characteristics over recommended operating conditions for a GPI/O (see Figure 41)
PARAMETER MIN MAX UNIT
XINT2/IO, XINT3/IO, IOPB6,
33
td(GPO)CO Delay time, CLKOUT low to GPO low/high IOPB7, and IOPC0 ns
All other GPOs 25

timing requirements over recommended operating conditions for a GPI/O (see Figure 42)
MIN MAX UNIT
tw(GPI) Pulse duration, GPI high/low tc(SYS) + 12 ns

CLKOUT/IOPC1

td(GPO)CO

GPO

Figure 41. General-Purpose Output Timings

tw(GPI)

GPI

Figure 42. General-Purpose Input Timings

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

SERIAL COMMUNICATIONS INTERFACE (SCI) I/O TIMINGS

timing characteristics for SCI (see Note 2 and Figure 43)

(BRR + 1) (BRR + 1)
PARAMETER IS EVEN AND BRR = 0 IS ODD AND BRR 0 UNIT
MIN MAX MIN MAX
tc(SCC) Cycle time, SCICLK 16tc 65536tc 24tc 65535tc ns
tv(TXD) Valid time, SCITXD data tc(SCC)70 tc(SCC)+70 tc(SCC)70 tc(SCC)+70 ns
tv(RXD) Valid time, SCIRXD data 16tc 24tc ns
NOTE 2: tc = system clock cycle time = 1/SYSCLK = tc(SYS)

tv(TXD)

SCITXD Data Valid

tv(RXD)

SCIRXD Data Valid

Figure 43. SCI Timings

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 SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002


+ 
 


SPI MASTER MODE TIMING PARAMETERS
84

SPI master mode timing information is listed in the following tables.

SPI master mode external timing parameters (clock phase = 0) (see Figure 44)
WHEN (SPIBRR + 1) IS EVEN OR WHEN (SPIBRR + 1)
SPIBRR = 0 OR 2 IS ODD AND SPIBRR > 3 UNIT
MIN MAX MIN MAX
tc(SPC)M Cycle time, SPICLK 4tc 128tc 5tc 127tc ns
tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M0.5tc70 0.5tc(SPC)M 0.5tc
ns
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M0.5tc70 0.5tc(SPC)M 0.5tc
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M+0.5tc70 0.5tc(SPC)M + 0.5tc
ns
tw(SPCH)M Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M+0.5tc70 0.5tc(SPC)M + 0.5tc
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443

Delay time, SPICLK high (clock polarity = 0) to

td(SPCH-SIMO)M 10 10 10 10
SPISIMO valid
ns
Delay time, SPICLK low (clock polarity = 1) to
td(SPCL-SIMO)M 10 10 10 10
SPISIMO valid
Valid time, SPISIMO data valid after SPICLK low
tv(SPCL-SIMO)M 0.5tc(SPC)M70 0.5tc(SPC)M+0.5tc70
(clock polarity =0)
ns
Valid time, SPISIMO data valid after SPICLK high
tv(SPCH-SIMO)M 0.5tc(SPC)M70 0.5tc(SPC)M+0.5tc70
(clock polarity =1)
Setup time, SPISOMI before SPICLK low
tsu(SOMI-SPCL)M 0 0
(clock polarity = 0)
ns
Setup time, SPISOMI before SPICLK high
tsu(SOMI-SPCH)M 0 0
(clock polarity = 1)
Valid time, SPISOMI data valid after SPICLK low
tv(SPCL-SOMI)M 0.25tc(SPC)M70 0.5tc(SPC)M 0.5tc70
(clock polarity = 0)
ns
Valid time, SPISOMI data valid after SPICLK high
tv(SPCH-SOMI)M 0.25tc(SPC)M70 0.5tc(SPC)M 0.5tc70
(clock polarity = 1)
The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc = system clock cycle time = 1/SYSCLK = tc(SYS)
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).



 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

tc(SPC)M

tw(SPCH)M tw(SPCL)M
SPICLK
(clock polarity = 0)

tw(SPCL)M tw(SPCH)M

SPICLK
(clock polarity = 1)
td(SPCH-SIMO)M
td(SPCL-SIMO)M

tv(SPCH-SIMO)M
tv(SPCL-SIMO)M

SPISIMO Master Out Data Is Valid

tsu(SOMI-SPCL)M
tsu(SOMI-SPCH)M tv(SPCL-SOMI)M
tv(SPCH-SOMI)M

Master In Data
SPISOMI
Must Be Valid

SPISTE

The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active
until the SPI communication stream is complete.

Figure 44. SPI Master Mode External Timings (Clock Phase = 0)

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 SPI master mode external timing parameters (clock phase = 1) (see Figure 45)

SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002


+ 
 


86

WHEN (SPIBRR + 1) IS EVEN OR WHEN (SPIBRR + 1)

SPIBRR = 0 OR 2 IS ODD AND SPIBRR > 3 UNIT
MIN MAX MIN MAX
tc(SPC)M Cycle time, SPICLK 4tc 128tc 5tc 127tc ns
Pulse duration, SPICLK high
tw(SPCH)M 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M0.5tc70 0.5tc(SPC)M 0.5tc
(clock polarity = 0) ns
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M0.5tc70 0.5tc(SPC)M 0.5tc
tw(SPCL)M Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M+0.5tc70 0.5tc(SPC)M + 0.5tc
Pulse duration, SPICLK high ns
tw(SPCH)M 0.5tc(SPC)M70 0.5tc(SPC)M 0.5tc(SPC)M+0.5tc70 0.5tc(SPC)M + 0.5tc
(clock polarity = 1)
Setup time, SPISIMO data valid before SPICLK high
tsu(SIMO-SPCH)M 0.5tc(SPC)M70 0.5tc(SPC)M 70
(clock polarity = 0)
ns
POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443

Setup time, SPISIMO data valid before SPICLK low

tsu(SIMO-SPCL)M 0.5tc(SPC)M70 0.5tc(SPC)M 70
(clock polarity = 1)
Valid time, SPISIMO data valid after SPICLK high
tv(SPCH-SIMO)M 0.5tc(SPC)M70 0.5tc(SPC)M 70
(clock polarity =0)
ns
Valid time, SPISIMO data valid after SPICLK low
tv(SPCL-SIMO)M 0.5tc(SPC)M70 0.5tc(SPC)M 70
(clock polarity =1)
Setup time, SPISOMI before SPICLK high
tsu(SOMI-SPCH)M 0 0
(clock polarity = 0)
ns
Setup time, SPISOMI before SPICLK low
tsu(SOMI-SPCL)M 0 0
(clock polarity = 1)
Valid time, SPISOMI data valid after SPICLK high
tv(SPCH-SOMI)M 0.25tc(SPC)M70 0.5tc(SPC)M70
(clock polarity = 0)
ns
Valid time, SPISOMI data valid after SPICLK low
tv(SPCL-SOMI)M 0.25tc(SPC)M70 0.5tc(SPC)M70
(clock polarity = 1)
The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.
tc = system clock cycle time = 1/SYSCLK = tc(SYS)
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).



 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

tc(SPC)M

tw(SPCH)M tw(SPCL)M

SPICLK
(clock polarity = 0)

tw(SPCL)M tw(SPCH)M

SPICLK
(clock polarity = 1)
tsu(SIMO-SPCH)M
tsu(SIMO-SPCL)M tv(SPCH-SIMO)M
tv(SPCL-SIMO)M

SPISIMO Master Out Data Is Valid Data Valid

tsu(SOMI-SPCH)M
tsu(SOMI-SPCL)M tv(SPCH-SOMI)M
tv(SPCL-SOMI)M
Master In Data
SPISOMI
Must Be Valid

SPISTE

The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.

Figure 45. SPI Master Mode External Timings (Clock Phase = 1)

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

SPI SLAVE MODE TIMING PARAMETERS

Slave mode timing information is listed in the following tables.

SPI slave mode external timing parameters (clock phase = 0) (see Figure 46)
MIN MAX UNIT
tc(SPC)S Cycle time, SPICLK 8tc ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)S70 0.5tc(SPC)S
ns
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)S70 0.5tc(SPC)S
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)S70 0.5tc(SPC)S
ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)S70 0.5tc(SPC)S
td(SPCH-SOMI)S Delay time, SPICLK high (clock polarity = 0) to SPISOMI valid 0.375tc(SPC)S70
ns
td(SPCL-SOMI)S Delay time, SPICLK low (clock polarity = 1) to SPISOMI valid 0.375tc(SPC)S70
tv(SPCL-SOMI)S Valid time, SPISOMI data valid after SPICLK low (clock polarity =0) 0.75tc(SPC)S
ns
tv(SPCH-SOMI)S Valid time, SPISOMI data valid after SPICLK high (clock polarity =1) 0.75tc(SPC)S
tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 0) 0
ns
tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 1) 0
tv(SPCL-SIMO)S Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0) 0.5tc(SPC)S
ns
tv(SPCH-SIMO)S Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1) 0.5tc(SPC)S
The MASTER/SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc = system clock cycle time = 1/SYSCLK = tc(SYS)
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).

88 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

tc(SPC)S

tw(SPCH)S tw(SPCL)S

SPICLK
(clock polarity = 0)

tw(SPCL)S tw(SPCH)S

SPICLK
(clock polarity = 1)
td(SPCH-SOMI)S
td(SPCL-SOMI)S
tv(SPCL-SOMI)S
tv(SPCH-SOMI)S

SPISOMI SPISOMI Data Is Valid

tsu(SIMO-SPCL)S
tsu(SIMO-SPCH)S tv(SPCL-SIMO)S
tv(SPCH-SIMO)S

SPISIMO Data
SPISIMO
Must Be Valid

SPISTE

The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.

Figure 46. SPI Slave Mode External Timing (Clock Phase = 0)

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

SPI slave mode external timing parameters (clock phase = 1) (see Figure 47)
MIN MAX UNIT
tc(SPC)S Cycle time, SPICLK 8tc ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 0) 0.5tc(SPC)S70 0.5tc(SPC)S
ns
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 1) 0.5tc(SPC)S70 0.5tc(SPC)S
tw(SPCL)S Pulse duration, SPICLK low (clock polarity = 0) 0.5tc(SPC)S70 0.5tc(SPC)S
ns
tw(SPCH)S Pulse duration, SPICLK high (clock polarity = 1) 0.5tc(SPC)S70 0.5tc(SPC)S
tsu(SOMI-SPCH)S Setup time, SPISOMI before SPICLK high (clock polarity = 0) 0.125tc(SPC)S
ns
tsu(SOMI-SPCL)S Setup time, SPISOMI before SPICLK low (clock polarity = 1) 0.125tc(SPC)S
tv(SPCH-SOMI)S Valid time, SPISOMI data valid after SPICLK high (clock polarity =0) 0.75tc(SPC)S
ns
tv(SPCL-SOMI)S Valid time, SPISOMI data valid after SPICLK low (clock polarity =1) 0.75tc(SPC)S
tsu(SIMO-SPCH)S Setup time, SPISIMO before SPICLK high (clock polarity = 0) 0
ns
tsu(SIMO-SPCL)S Setup time, SPISIMO before SPICLK low (clock polarity = 1) 0
tv(SPCH-SIMO)S Valid time, SPISIMO data valid after SPICLK high (clock polarity = 0) 0.5tc(SPC)S
ns
tv(SPCL-SIMO)S Valid time, SPISIMO data valid after SPICLK low (clock polarity = 1) 0.5tc(SPC)S
The MASTER/SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is set.
tc = system clock cycle time = 1/SYSCLK = tc(SYS)
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).

90 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

PARAMETER MEASUREMENT INFORMATION

tc(SPC)S

tw(SPCH)S tw(SPCL)S

SPICLK
(clock polarity = 0)

tw(SPCL)S
tw(SPCH)S

SPICLK
(clock polarity = 1)
tsu(SOMI-SPCH)S
tsu(SOMI-SPCL)S
tv(SPCH-SOMI)S
tv(SPCL-SOMI)S

SPISOMI SPISOMI Data Is Valid Data Valid

tsu(SIMO-SPCH)S
tsu(SIMO-SPCL)S tv(SPCH-SIMO)S
tv(SPCL-SIMO)S

SPISIMO Data
SPISIMO
Must Be Valid

SPISTE

The SPISTE signal must be active before the SPI communication stream starts; the SPISTE signal must remain active until
the SPI communication stream is complete.

Figure 47. SPI Slave Mode External Timing (Clock Phase = 1)

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

10-bit dual analog-to-digital converter (ADC)

The 10-bit dual ADC has a separate power bus for its analog circuitry. These pins are referred to as VCCA and
VSSA. The purpose is to enhance ADC performance by preventing digital switching noise of the logic circuitry
that can be present on VSS and VCC from coupling into the ADC analog stage. All ADC specifications are given
with respect to VSSA unless otherwise noted.
Resolution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-bit (1024 values)
Monotonic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assured
Output conversion mode . . . . . . . . . . . . . . . . . . . . . . . 000h to 3FFh (000h for VI VSSA; 3FFh for VI VCCA)

recommended operating conditions

MIN NOM MAX UNIT
VCCA Analog supply voltage 4.5 5 5.5 V
VSSA Analog ground 0 V
VREFHI Analog supply reference source VREFLO VCCA V
VREFLO Analog ground reference source VSSA VREFHI V
VAI Analog input voltage, ADCIN0ADCIN15 VSSA VCCA V
VREFHI and VREFLO must be stable, within 1/2 LSB of the required resolution, during the entire conversion time.

92 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

operating characteristics over recommended operating condition ranges

PARAMETER DESCRIPTION MIN MAX UNIT
converting 5
VCCA = 5
5.5
5V
non-converting 2
ICCA Analog supply current mA
PLL or OSC power
VCCA = VREFHI = 5.5 V 1
down
Iref Input charge current, VREFHI or VREFLO VCCA = VCCD = VREFHI = 5.5 V, VREFLO = 0 V 5 mA
Typical
Ty ical ca
capacitive
acitive load on non-sampling 6
Cai Analog input capacitance pF
analog input pin sampling 8
Analog input source impedance for conversions to
ZAI Analog input source impedance 9 k
remain within specifications.
Difference between the actual step width and the ideal
EDNL Differential nonlinearity error 1 1.5 LSB
value
Maximum deviation from the best straight line through
EINL Integral nonlinearity error the ADC transfer characteristics, excluding the "1.5 LSB
quantization error
td(PU) Delay time, power-up to ADC valid Time to stabilize analog stage after power-up 10 ms
Absolute resolution = 4.89 mV. At VREFHI = 5 V and VREFLO = 0 V, this is one LSB. As VREFHI decreases, VREFLO increases, or both, the LSB sizes
decrease. Therefore, the absolute accuracy and differential/integral linearity errors in terms of LSBs increase.

The ADC module allows complete freedom in the design of the sources for the analog inputs. The period of the
sample time is independent of the source impedance. The sample-and-hold period occurs in the first ADC clock
after the ADCIMSTART bit or the ADCSOC bit of the ADC control register 1 (ADCTRL1, bits 13 and 0,
respectively) is set to 1. The conversion then occurs during the next six ADC clock cycles. The digital result
registers are updated on the next ADC clock cycle once the conversion is completed.

ADC input pin circuit

One of the most common A/D application errors is inappropriate source impedance. In practice, minimum
source impedance should be used to limit the error as well as minimize the required sampling time; however,
the source impedance must be smaller than ZAI. A typical ADC input pin circuit is shown in Figure 48.

Requiv
R1
VIN VAI (to ADCINx input)

R1 = 9 k typical

Figure 48. Typical ADC Input Pin Circuit

POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443 93




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

ADC timing requirements (see Figure 49)

MIN MAX UNIT
tc(AD) Cycle time, ADC prescaled clock 1 ms
tw(SHC) Pulse duration, total sample/hold and conversion time (see Note 3) 6.1 ms
tw(SH) Pulse duration, sample and hold time tc(AD) ms
tsu(SH) Setup time, analog input stable before sample/hold start 0 ns
th(SH) Hold time, analog input stable after sample/hold complete 0 ns
tw(C) Pulse duration, total conversion time 4.5tc(AD) ms
td(SOC-SH) Delay time, start of conversion to beginning of sample and hold 3tc(SYS) ns
td(EOC-FIFO) Delay time, end of conversion to data loaded into result FIFO 3tc(SYS) ns
Start of conversion is signaled by the ADCIMSTART bit or the ADCSOC bit set in software, the external start signal active (ADCSOC), or internal
EVSOC signal active.
NOTE 3: The total sample/hold and conversion time is determined by the summation of td(SOC-SH), tw(SH), tw(C), and td(EOC-FIFO).
tc(AD)

Bit Converted 9 8 7 6 5 4 3 2 1 0

ADC Clock

Analog Input


tsu(SH) th(SH)

tw(SH)

Sample/Hold

tw(C)

Convert

Internal Start

td(SOCSH)

Start of Convert


td(EOCFIFO)
tw(SHC)

XFR to FIFO
Figure 49. Analog-to-Digital Timing

94 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

flash EEPROM

switching characteristics over recommended operating conditions

PARAMETER MIN TYP MAX UNIT
Program-erase endurance 10K Cycles
Program pulses per word 1 10 150 Pulses
Erase pulses per array 1 20 1000 Pulses
Flash-write pulses per array 1 20 6000 Pulses
These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/F24x DSP
Embedded Flash Memory Technical Reference (literature number SPRU282).

timing requirements over recommended operating conditions

MIN MAX UNIT
td(BUSY) Delay time, after mode deselect to stabilization 10 s
td(RD-VERIFY) Delay time, verify read mode select to stabilization 10 s
These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/F24x DSP
Embedded Flash Memory Technical Reference (literature number SPRU282).

programming operation
PARAMETER MIN NOM MAX UNIT
tw(PGM) Pulse duration, programming algorithm 95 100 105 s
td(PGM-MODE) Delay time, program mode select to stabilization 10 s
These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/F24x DSP
Embedded Flash Memory Technical Reference (literature number SPRU282).

erase operation
PARAMETER MIN NOM MAX UNIT
tw(ERASE) Pulse duration, erase algorithm 6.65 7 7.35 ms
td(ERASE-MODE) Delay time, erase mode select to stabilization 10 s
These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/F24x DSP
Embedded Flash Memory Technical Reference (literature number SPRU282).

flash-write operation
PARAMETER MIN NOM MAX UNIT
tw(FLW) Pulse duration, flash-write algorithm 13.3 14 14.7 ms
td(FLW-MODE) Delay time, flash-write mode select to stabilization 10 s
These parameters are used in the flash programming algorithms. For a detailed description of the algorithms, see the TMS320F20x/F24x DSP
Embedded Flash Memory Technical Reference (literature number SPRU282).
Refer to the recommended operating conditions section for the flash programming operating temperature range when programming flash.

POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443 95




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation

Table 20 is a collection of all the programmable registers of the TMS320F240 (provided for a quick reference).

Table 20. Register File Compilation

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

DATA MEMORY SPACE

CPU STATUS REGISTERS
ARP OV OVM 1 INTM DP(8)
ST0
DP(7) DP(6) DP(5) DP(4) DP(3) DP(2) DP(1) DP(0)
ARB CNF TC SXM C 1
ST1
1 1 1 XF 1 1 PM
GLOBAL MEMORY AND CPU INTERRUPT REGISTERS

00004h IMR
INT6 MASK INT5 MASK INT4 MASK INT3 MASK INT2 MASK INT1 MASK

00005h GREG
Global Data Memory Configuration Bits (70)

00006h IFR
INT6 FLAG INT5 FLAG INT4 FLAG INT3 FLAG INT2 FLAG INT1 FLAG
SYSTEM CONFIGURATION REGISTERS
RESET1 RESET0
07018h SYSCR
CLKSRC1 CLKSRC0
07019h Reserved
PORST ILLADR SWRST WDRST
0701Ah SYSSR
HPO VCCAOR VECRD
0701Bh
to Reserved
0701Dh
0 0 0 0 0 0 0 0
0701Eh SYSIVR
D7 D6 D5 D4 D3 D2 D1 D0
0701Fh Reserved
WD/RTI CONTROL REGISTERS
07020h Reserved
07021h D7 D6 D5 D4 D3 D2 D1 D0 RTICNTR
07022h Reserved
07023h D7 D6 D5 D4 D3 D2 D1 D0 WDCNTR
07024h Reserved
07025h D7 D6 D5 D4 D3 D2 D1 D0 WDKEY
07026h Reserved
07027h RTI FLAG RTI ENA RTIPS2 RTIPS1 RTIPS0 RTICR
07028h Reserved
07029h WD FLAG WDDIS WDCHK2 WDCHK1 WDCHK0 WDPS2 WDPS1 WDPS0 WDCR
PLL CLOCK CONTROL REGISTERS
0702Ah Reserved
0702Bh CLKMD(1) CLKMD(0) PLLOCK(1) PLLOCK(0) PLLPM(1) PLLPM(0) ACLKENA PLLPS CKCR0
0702Ch Reserved

96 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
PLL CLOCK CONTROL REGISTERS (CONTINUED)
0702Dh CKINF(3) CKINF(2) CKINF(1) CKINF(0) PLLDIV(2) PLLFB(2) PLLFB(1) PLLFB(0) CKCR1
0702Eh
to Reserved
07031h
A-to-D MODULE CONTROL REGISTERS
SUSPEND- SUSPEND- ADCIM- ADCCON-
ADC2EN ADC1EN ADCINTEN ADCINTFLAG
07032h SOFT FREE START RUN ADCTRL1
ADCEOC ADC2CHSEL ADC1CHSEL ADCSOC
07033h Reserved
ADCEVSOC ADCEXTSOC
07034h ADCTRL2
ADCFIFO2 ADCFIFO1 ADCPSCALE
07035h Reserved
D9 D8 D7 D6 D5 D4 D3 D2
07036h ADCFIFO1
D1 D0 0 0 0 0 0 0
07037h Reserved
D9 D8 D7 D6 D5 D4 D3 D2
07038h ADCFIFO2
D1 D0 0 0 0 0 0 0
07039h
to Reserved
0703Fh
SERIAL PERIPHERAL INTERFACE (SPI) CONFIGURATION CONTROL REGISTERS
SPI SW CLOCK SPI SPI SPI
07040h SPICCR
RESET POLARITY CHAR2 CHAR1 CHAR0
OVERRUN CLOCK MASTER/ SPI INT
07041h TALK SPICTL
INT ENA PHASE SLAVE ENA
RECEIVER SPI INT
07042h SPISTS
OVERRUN FLAG
07043h Reserved
SPI BIT SPI BIT SPI BIT SPI BIT SPI BIT SPI BIT SPI BIT
07044h SPIBRR
RATE 6 RATE 5 RATE 4 RATE 3 RATE 2 RATE 1 RATE 0
07045h Reserved
07046h ERCVD7 ERCVD6 ERCVD5 ERCVD4 ERCVD3 ERCVD2 ERCVD1 ERCVD0 SPIEMU
07047h RCVD7 RCVD6 RCVD5 RCVD4 RCVD3 RCVD2 RCVD1 RCVD0 SPIBUF
07048h Reserved
07049h SDAT7 SDAT6 SDAT5 SDAT4 SDAT3 SDAT2 SDAT1 SDAT0 SPIDAT
0704Ah
to Reserved
0704Ch
SPISTE SPISTE SPISTE SPISTE SPICLK SPICLK SPICLK SPICLK
0704Dh SPIPC1
DATA IN DATA OUT FUNCTION DATA DIR DATA IN DATA OUT FUNCTION DATA DIR
SPISIMO SPISIMO SPISIMO SPISIMO SPISOMI SPISOMI SPISOMI SPISOMI
0704Eh SPIPC2
DATA IN DATA OUT FUNCTION DATA DIR DATA IN DATA OUT FUNCTION DATA DIR
SPI SPI
0704Fh SPIPRI
PRIORITY ESPEN

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
SERIAL COMMUNICATIONS INTERFACE (SCI) CONFIGURATION CONTROL REGISTERS
STOP EVEN/ODD PARITY ADDR/IDLE SCI SCI SCI
07050h SCI ENA SCICCR
BITS PARITY ENABLE MODE CHAR2 CHAR1 CHAR0
RX ERR
07051h SW RESET CLOCK ENA TXWAKE SLEEP TXENA RXENA SCICTL1
INT ENA
BAUD15
07052h BAUD14 BAUD13 BAUD12 BAUD11 BAUD10 BAUD9 BAUD8 SCIHBAUD
(MSB)
BAUD0
07053h BAUD7 BAUD6 BAUD5 BAUD4 BAUD3 BAUD2 BAUD1 SCILBAUD
(LSB)
RX/BK TX
07054h TXRDY TX EMPTY SCICTL2
INT ENA INT ENA
07055h RX ERROR RXRDY BRKDT FE OE PE RXWAKE SCIRXST
07056h ERXDT7 ERXDT6 ERXDT5 ERXDT4 ERXDT3 ERXDT2 ERXDT1 ERXDT0 SCIRXEMU
07057h RXDT7 RXDT6 RXDT5 RXDT4 RXDT3 RXDT2 RXDT1 RXDT0 SCIRXBUF
07058h Reserved
07059h TXDT7 TXDT6 TXDT5 TXDT4 TXDT3 TXDT2 TXDT1 TXDT0 SCITXBUF
0705Ah
to Reserved
0705Dh
SCITXD SCITXD SCITXD SCITXD SCIRXD SCIRXD SCIRXD SCIRXD
0705Eh SCIPC2
DATA IN DATA OUT FUNCTION DATA DIR DATA IN DATA OUT FUNCTION DATA DIR
SCITX SCIRX SCI
0705Fh SCIPRI
PRIORITY PRIORITY ESPEN
07060h
to Reserved
0706Fh
EXTERNAL INTERRUPT CONTROL REGISTERS
XINT1

FLAG
07070h XINT1CR
XINT1 XINT1 XINT1 XINT1
0
PIN DATA POLARITY PRIORITY ENA
07071h Reserved
NMI

FLAG
07072h NMICR
NMI NMI
1
PIN DATA POLARITY
07073h
to Reserved
07077h
XINT2

FLAG
07078h XINT2CR
XINT2 XINT2 XINT2 XINT2 XINT2 XINT2

PIN DATA DATA DIR DATA OUT POLARITY PRIORITY ENA
07079h Reserved

98 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
EXTERNAL INTERRUPT CONTROL REGISTERS (CONTINUED)
XINT3

FLAG
0707Ah XINT3CR
XINT3 XINT3 XINT3 XINT3 XINT3 XINT3

PIN DATA DATA DIR DATA OUT POLARITY PRIORITY ENA
0707Bh
to Reserved
0708Fh
DIGITAL I/O CONTROL REGISTERS
CRA.15 CRA.14 CRA.13 CRA.12 CRA.11 CRA.10 CRA.9 CRA.8
07090h OCRA
CRA.3 CRA.2 CRA.1 CRA.0
07091h Reserved

07092h OCRB
CRB.7 CRB.6 CRB.5 CRB.4 CRB.3 CRB.2 CRB.1 CRB.0
07093h
to Reserved
07097h
A3DIR A2DIR A1DIR A0DIR
07098h PADATDIR
IOPA3 IOPA2 IOPA1 IOPA0
07099h Reserved
B7DIR B6DIR B5DIR B4DIR B3DIR B2DIR B1DIR B0DIR
0709Ah PBDATDIR
IOPB7 IOPB6 IOPB5 IOPB4 IOPB3 IOPB2 IOPB1 IOPB0
0709Bh Reserved
C7DIR C6DIR C5DIR C4DIR C3DIR C2DIR C1DIR C0DIR
0709Ch PCDATDIR
IOPC7 IOPC6 IOPC5 IOPC4 IOPC3 IOPC2 IOPC1 IOPC0
0709Dh
to Reserved
073FFh
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS
T3STAT T2STAT T1STAT T3TOADC T2TOADC T1TOADC(1)
07400h GPTCON
T1TOADC(0) TCOMPOE T3PIN T2PIN T1PIN
D15 D14 D13 D12 D11 D10 D9 D8
07401h T1CNT
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07402h T1CMPR
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07403h T1PR
D7 D6 D5 D4 D3 D2 D1 D0
FREE SOFT TMODE2 TMODE1 TMODE0 TPS2 TPS1 TPS0
07404h T1CON
TSWT1 TENABLE TCLKS1 TCLKS0 TCLD1 TCLD0 TECMPR SELT1PR
D15 D14 D13 D12 D11 D10 D9 D8
07405h T2CNT
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07406h T2CMPR
D7 D6 D5 D4 D3 D2 D1 D0

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
GENERAL-PURPOSE (GP) TIMER CONFIGURATION CONTROL REGISTERS (CONTINUED)
D15 D14 D13 D12 D11 D10 D9 D8
07407h T2PR
D7 D6 D5 D4 D3 D2 D1 D0
FREE SOFT TMODE2 TMODE1 TMODE0 TPS2 TPS1 TPS0
07408h T2CON
TSWT1 TENABLE TCLKS1 TCLKS0 TCLD1 TCLD0 TECMPR SELT1PR
D15 D14 D13 D12 D11 D10 D9 D8
07409h T3CNT
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
0740Ah T3CMPR
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
0740Bh T3PR
D7 D6 D5 D4 D3 D2 D1 D0
FREE SOFT TMODE2 TMODE1 TMODE0 TPS2 TPS1 TPS0
0740Ch T3CON
TSWT1 TENABLE TCLKS1 TCLKS0 TCLD1 TCLD0 TECMPR SELT1PR
0740Dh
to Reserved
07410h
FULL AND SIMPLE COMPARE UNIT REGISTERS
CENABLE CLD1 CLD0 SVENABLE ACTRLD1 ACTRLD0 FCOMPOE SCOMPOE
07411h COMCON
SELTMR SCLD1 SCLD0 SACTRLD1 SACTRLD0 SELCMP3 SELCMP2 SELCMP1
07412h Reserved
SVRDIR D2 D1 D0 CMP6ACT1 CMP6ACT0 CMP5ACT1 CMP5ACT0
07413h ACTR
CMP4ACT1 CMP4ACT0 CMP3ACT1 CMP3ACT0 CMP2ACT1 CMP2ACT0 CMP1ACT1 CMP1ACT0

07414h SCMP3- SCMP3- SCMP2- SCMP2- SCMP1- SCMP1- SACTR

ACT1 ACT0 ACT1 ACT0 ACT1 ACT0
DBT7 DBT6 DBT5 DBT4 DBT3 DBT2 DBT1 DBT0
07415h DBTCON
EDBT3 EDBT2 EDBT1 DBTPS1 DBTPS0
07416h Reserved
D15 D14 D13 D12 D11 D10 D9 D8
07417h CMPR1
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07418h CMPR2
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07419h CMPR3
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
0741Ah SCMPR1
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
0741Bh SCMPR2
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
0741Ch SCMPR3
D7 D6 D5 D4 D3 D2 D1 D0
0741Dh
to Reserved
0741Fh

100 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443




 
 
SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
CAPTURE UNIT REGISTERS
CAPRES CAPQEPN CAP3EN CAP4EN CAP34TSEL CAP12TSEL CAP4TOADC
07420h CAPCON
CAP1EDGE CAP2EDGE CAP3EDGE CAP4EDGE
07421h Reserved
CAP4FIFO CAP3FIFO CAP2FIFO CAP1FIFO
07422h CAPFIFO
CAPFIFO15 CAPFIFO14 CAPFIFO13 CAPFIFO12 CAPFIFO11 CAPFIFO10 CAPFIFO9 CAPFIFO8
D15 D14 D13 D12 D11 D10 D9 D8
07423h CAP1FIFO
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07424h CAP2FIFO
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07425h CAP3FIFO
D7 D6 D5 D4 D3 D2 D1 D0
D15 D14 D13 D12 D11 D10 D9 D8
07426h CAP4FIFO
D7 D6 D5 D4 D3 D2 D1 D0
07427h
to Reserved
0742Bh
EVENT MANAGER (EV) INTERRUPT CONTROL REGISTERS
T1OFINT T1UFINT T1CINT

ENA ENA ENA
0742Ch EVIMRA
T1PINT SCMP3INT SCMP2INT SCMP1INT CMP3INT CMP2INT CMP1INT PDPINT
ENA ENA ENA ENA ENA ENA ENA ENA

0742Dh T3OFINT T3UFINT T3CINT T3PINT T2OFINT T2UFINT T2CINT T2PINT EVIMRB
ENA ENA ENA ENA ENA ENA ENA ENA

0742Eh CAP4INT CAP3INT CAP2INT CAP1INT EVIMRC

ENA ENA ENA ENA
T1OFINT T1UFINT T1CINT

FLAG FLAG FLAG
0742Fh EVIFRA
T1PINT SCMP3INT SCMP2INT SCMP1INT CMP3INT CMP2INT CMP1INT PDPINT
FLAG FLAG FLAG FLAG FLAG FLAG FLAG FLAG

07430h T3OFINT T3UFINT T3CINT T3PINT T2OFINT T2UFINT T2CINT T2PINT EVIFRB
FLAG FLAG FLAG FLAG FLAG FLAG FLAG FLAG

07431h CAP4INT CAP3INT CAP2INT CAP1INT EVIFRC

FLAG FLAG FLAG FLAG
0 0 0 0 0 0 0 0
07432h EVIVRA
0 0 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 0 0
07433h EVIVRB
0 0 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 0 0
07434h EVIVRC
0 0 D5 D4 D3 D2 D1 D0
07435h
to Reserved
0743Fh

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SPRS042E OCTOBER 1996 REVISED NOVEMBER 2002

register file compilation (continued)

Table 20. Register File Compilation (Continued)

ADDR BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 REG
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
I/O MEMORY SPACE
FLASH CONTROL MODE REGISTER

0FF0Fh FCMR

WAIT-STATE GENERATOR CONTROL REGISTER

0FFFFh WSGR
AVIS ISWS DSWS PSWS

See the flash control mode register section.

102 POST OFFICE BOX 1443 HOUSTON, TEXAS 772511443

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TMS320F240PQ OBSOLETE BQFP PQ 132 TBD Call TI Call TI 0 to 70 TMS320F240PQ

TMS320F240PQG4 OBSOLETE BQFP PQ 132 TBD Call TI Call TI 0 to 70 TMS320F240PQ

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
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PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
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in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
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(5)
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(6)
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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Addendum-Page 2
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Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designers non-
compliance with the terms and provisions of this Notice.

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