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What Is QFN (MLP, MLF) : Taping & Dispensing & Screen Printing | PDF | Microtechnology | Industrial Processes
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What Is QFN (MLP, MLF) : Taping & Dispensing & Screen Printing

QFN (MLP, MLF) refers to Quad Flat No-Lead Package, Micro Lead Frame Package, and Micro Lead Frame Package. It is a surface mount package that uses lead frame half etching technology where I/O connections are made on the bottom land of the package instead of lead frames. The fabrication process involves die sawing, attaching the die to the lead frame using die attach material, wire bonding, molding, and singulation. The lead frame is insulated using either liquid resin or polyimide tape and then assembled into the final package. Key specifications include a body size of 7.0x7.0mm, thickness of 1.2mm, ball pitch of 0.8mm, and

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77 views7 pages

What Is QFN (MLP, MLF) : Taping & Dispensing & Screen Printing

QFN (MLP, MLF) refers to Quad Flat No-Lead Package, Micro Lead Frame Package, and Micro Lead Frame Package. It is a surface mount package that uses lead frame half etching technology where I/O connections are made on the bottom land of the package instead of lead frames. The fabrication process involves die sawing, attaching the die to the lead frame using die attach material, wire bonding, molding, and singulation. The lead frame is insulated using either liquid resin or polyimide tape and then assembled into the final package. Key specifications include a body size of 7.0x7.0mm, thickness of 1.2mm, ball pitch of 0.8mm, and

Uploaded by

zbhp z
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PDF, TXT or read online on Scribd
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What is QFN (MLP, MLF)

• QFN : Quad Flat None-leaded Package

• MLP, MLF : Micro Lead Frame Package

• Package by Lead Frame Half Etching Technology

• I/O With Package Bottom Land Instead of Lead Frame Out Lead

• Package by Lead Frame Insulating Technology

– Taping & Dispensing & screen Printing


Process Flow of QFN (MLP, MLF)

Die sawing

Lead frame Taping Die attach Wire bonding

Molding

Singulation De-taping
Fabrication of QFN (MLP, MLF)

F
l
o
w
c
h
a
r
t
Fabrication Remark

1 Low Material * Cr 0.254mm

2 Half Etching * H'E 0.127mm

3 Plating * Ag 2.543 µm Plating


* PPF Ni/Pd

* Tape 20 µm min
4 Insulation * Resin 20 µm min

5 Ass'y * PKG Thk. 1.2mm


Insulation of QFN (MLP, MLF)

F lo w C h a rt L iq u id Ty p e Ta p e Ty p e

S ta tu s U n d e r D e v e lo p in g Av a ia b le

In su la tin g M a te ria l L iq u id R e s in P o ly im id e Ta p e

M a te ria l C o s t Low H ig h

P ro c e s s C o n tro l D iffic u lt E asy

S n a p C u re N eed No
Liquid : adhesive Tape : base film/adhesive
(thk. 20~30µm) (thk. 20~30µm)

S tru c tu re
Bottom View of QFN (MLP, MLF)

ITEM SPEC
◐ BODY 7.0x7.0mm

◐ PKG thickness 1.2mm

◐ Ball pitch 0.8mm

◐ Ball land size 0.35mm

◐ L/F pad Exposed

◐ L/F Plating Ag spot / PPF


Top View of QFN (MLP, MLF)

ITEM SPEC
◐ Frame material OLIN7025 0.254mm

◐ Strip length 209.3 ±0.10mm


◐ Units / Strip 58.42 ±0.05mm
◐ Ball land size 0.260 ±0.025mm
Liquid Type
◐ Frame Insulation
Tape Type
Siver min 2.54µm
◐ Frame plating
Ni / Pd (2layer)
Structure of Frame

G Insulator Ag Epoxy
o
l
d
W
i
r
e
Chip Molding Compound

Ball Land PPF(Ni/Pd)


Die Pad Solder Ball

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