Data Sheet

January 2002

DiskOnChip 2000 DIP

MD2200/2/3

Features
ƒ Single-chip plug-n-play flash disk
ƒ Low power, single 3.3V or 5V power
supply
ƒ 16MB to 576MB capacity (1GB in 2002)
ƒ Pinout and structure compatible with
DiskOnChip Millennium DIP 8MB
ƒ Simple, easy-to-integrate interface
ƒ 32-pin DIP, JEDEC standard,
EEPROM-compatible pinout
ƒ 8KB sized memory window Applications
ƒ Boot OS capability ƒ Embedded systems

ƒ Embedded TrueFFS software provides: ƒ Internet access devices
— Full hard disk read/write emulation ƒ Internet set-top boxes/ITV, Web browsers
— Third-generation wear leveling ƒ WBT, thin clients, network computers
— Automatic block management ƒ Routers, networking
ƒ Operates with DiskOnChip SDK in ƒ Web phones, car PCs, DVD, HPC
OS-less environments, ANSI-C source
ƒ Point of sale, industrial PCs
code kit
ƒ Telecom, medical
ƒ Error Detection and Correction
(EDC/ECC) for higher data reliability
ƒ Low power consumption – Static
Operation
ƒ Broad OS support: DOS, Windows
NT4.0/5.0, Windows CE, BE, pSOS+,
QNX, VxWorks, and others
ƒ Compatible with major processors: x86,
MediaGX, Geode SCxxxx, PowerPC, 68K,
MIPS, SHx, StrongARM, and others

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Table of Contents
1 General Description................................................................................................................... 4
2 Detailed Feature List.................................................................................................................. 5
TrueFFS Technology............................................................................................................................ 5
Low Power Consumption ..................................................................................................................... 5
Temperature Range ............................................................................................................................. 5
Easy to Integrate .................................................................................................................................. 6
Robust Error Correction ....................................................................................................................... 6
High Reliability...................................................................................................................................... 6
High Speed........................................................................................................................................... 6
Compatibility with 8MB DiskOnChip Millennium Series ....................................................................... 6
Broad Support for Operating Systems and Processors ....................................................................... 6
Portable Solution – Shorter Time to Market ......................................................................................... 7
Complete Solution ................................................................................................................................ 7

3 Package Description and Pin List ............................................................................................ 8

4 Designing with the DiskOnChip 2000 Flash Disk ................................................................... 9
4.1 Hardware.............................................................................................................................. 9
4.2 Software ............................................................................................................................... 9
4.3 Designing DiskOnChip 2000 into PC Architecture ............................................................... 9
5 Disk Capacities and Contents ................................................................................................ 11
5.1 Low-Profile ......................................................................................................................... 11
5.2 High-Profile......................................................................................................................... 11
5.3 Media Contents .................................................................................................................. 11
6 Theory of Operation................................................................................................................. 12
6.1 Error Detection and Correction (EDC/ECC) ....................................................................... 12
7 Specifications .......................................................................................................................... 13
7.1 Absolute Maximum Ratings................................................................................................ 13
7.2 Capacitance ....................................................................................................................... 13
7.3 Temperature Ranges ......................................................................................................... 13
7.4 DiskOnChip Assembly........................................................................................................ 13
7.5 Humidity ............................................................................................................................. 13
7.6 EDC/ECC ........................................................................................................................... 13
7.7 DC Electrical Characteristics over Operating Range.......................................................... 14
7.7.1 Vcc = 5V Characteristics...........................................................................................................14
7.7.2 Vcc = 3.3V Characteristics........................................................................................................15

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7.8 AC Operating Conditions.................................................................................................... 15

7.9 Timing Specifications ......................................................................................................... 16
7.9.1 Read Cycle Timing....................................................................................................................16
7.9.2 Write Cycle Timing ....................................................................................................................17

8 Mechanical Dimensions .......................................................................................................... 18

9 Shock and Vibration ................................................................................................................ 19
10 Ordering Information ............................................................................................................... 19
11 Additional Information............................................................................................................. 20
How to Contact Us .......................................................................................................................... 21

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1 General Description
The DiskOnChip 2000 product line is the second-generation of M-Systems’ DiskOnChip series of
products. The 2000 series provides a small, single-chip, solid-state flash disk in a standard 32-pin
DIP package. Combining a disk controller with flash memory on a single chip, DiskOnChip 2000 is
the solution where minimal weight, space, and power consumption are essential. In consequence, the
2000 series finds use today in a wide range of products, such as information appliances, set-top
boxes, thin clients, thin servers, network computers, and embedded, portable computers.
By placing DiskOnChip 2000 in a standard socket, physical space requirements are reduced. Unlike
standard IDE drives, no cables or extra space are required. DiskOnChip 2000 has no moving parts,
resulting in significantly decreased power consumption and increased reliability. It is easy to use and
reduces integration overhead. DiskOnChip 2000 is therefore a very attractive alternative to
conventional hard and floppy disk drives.
Using TrueFFS technology, DiskOnChip 2000 delivers full hard disk emulation. As such, the design
and integration stages can be considerably reduced, thereby enabling very fast time-to-market and
ease of production. Combined with its very attractive cost structure, DiskOnChip 2000 is a superior
alternative to resident flash array (RFA).
DiskOnChip 2000 products are available in capacities ranging from 16MB to 576MB. In addition,
they are 100% pinout and software compatible with the DiskOnChip Millennium DIP 8MB package.
In future versions, the capacity will be dramatically increased (up to 1GB during 2002). Since the
same pinout will be retained, the socket on the target platform will not have to be changed to
accommodate the larger capacities.
DiskOnChip technology provides broad support for all major operating systems and processors in the
market, enabling it to be readily integrated with any architecture.
DiskOnChip 2000 is shipped as a plug-and-play device that is fully tested and formatted, and
programmed with a DOS driver. Future driver, software or content upgrades, or formatting, can be
made on-board or off-board using DiskOnChip utilities and accessories provided by M-Systems.

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2 Detailed Feature List

TrueFFS Technology
For a flash disk to emulate a hard disk, a software management layer is required. TrueFFS is
M-Systems’ patented flash file system management technology that allows flash components to fully
emulate hard disks, so they can be written to and read from like any other hard disk.
TrueFFS software simplifies and enhances flash memories by:
• Using third-generation wear leveling, which ensures that all blocks are erased an equal number of
times. This increases the life of the flash media by orders of magnitude.
• Using virtual blocking of the flash device to make erasure of large blocks transparent to the
operator.
• Automatic block mapping.
• Implementing a robust power-loss recovery mechanism to guarantee absolute protection of data.
• Providing conventional address support for various architecture configurations.
• The TrueFFS driver supports 8-bit, 16-bit, and 32-bit bus architectures. Support for the 16-bit and
32-bit bus architectures, typically used in RISC processors, can be achieved by using the LSB of
the data bus as follows:
ƒ For 16-bit address boundary shifts, shift the address lines by one, so that the host address line
A1 connects to DiskOnChip 2000 address line A0, the host address line A2 connects to
DiskOnChip 2000 line A1, and so on.
ƒ For 32-bit address boundary shifts, shift the address lines by two, so that the host address line
A2 connects to DiskOnChip 2000 address line A0, the host address line A3 connects to
DiskOnChip 2000 line A1, and so on.
Refer to Application Note AP-DOC-030 for more details.

Low Power Consumption

The internal functions are synchronized with the CPU’s read and write strobes. This innovation
eliminates the need for an external clock and dramatically reduces power consumption.
DiskOnChip 2000 requires only a single 3.3V or 5V power supply, which helps simplify integration.
These features make DiskOnChip 2000 the best cost/performance solution for computers that require
minimal weight, space, and power consumption, providing a very attractive alternative to
conventional hard and floppy disk drives.

Temperature Range
DiskOnChip 2000 is available in both commercial (0 ºC to +70 ºC) and extended (-40 ºC to +85 ºC)
temperature ranges.
* DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.

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Easy to Integrate
Fast integration is ensured by the following DiskOnChip 2000 features:
• Compatibility with standard EEPROM DIP pinout
• Support for local bus and ISA bus interface
• Small memory map window size – only 8KB
• Static operation – no clock required
• 16mA output drive (18mA at 3.3V)

Robust Error Correction

The DiskOnChip family utilizes a Reed-Solomon Error Detection Code (EDC) and Error Correction
Code (ECC), providing the following error immunity for each 512-byte block of data:
• Corrects up to two 10-bit symbols, including two random bit errors
• Corrects single bursts of up to 11 bits
• Detects single bursts of up to 31 bits, and double bursts of up to 11 bits
• Detects up to 4 random bit errors

High Reliability
DiskOnChip 2000 can be inserted into standard DIP sockets, eliminating the need for mechanical
disk drives, bulky ribbon cables and connectors. The design of DiskOnChip 2000 ensures high
reliability even when subjected to levels of shock, vibration, and temperature changes that would
destroy a conventional magnetic disk drive.

High Speed
DiskOnChip 2000 implements an integrated architecture for data transfers, which eliminates
bottlenecks typical in this area. Additionally, it doubles read performance and significantly improves
write performance, in comparison to competitive alternatives. DiskOnChip 2000 can sustain system
write speeds of over 550KB per second, read speeds of more than 1.4MB per second (measured in
ISA no wait state environment) and read/write burst transfer rates of nearly 5MB per second.

Compatibility with 8MB DiskOnChip Millennium Series

DiskOnChip 2000 is a 32-pin Dual Inline Package (DIP) that provides 100% pinout compatibility
with M-Systems' DiskOnChip Millennium DIP (8MB). DiskOnChip 2000 is fully software
compatible with M-Systems' DiskOnChip Millennium DIP (8MB), for version 1.21 and higher.

Broad Support for Operating Systems and Processors

The DiskOnChip family of products, supplied with TrueFFS firmware, supports a wide range of
operating systems (OS), including DOS, Windows 2000, Windows CE, Windows NT,
Windows Embedded NT, BE, QNX, VxWorks, pSOS, Linux, FreeBSD, PharLap ETS, VRTX and
more.

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In addition, leading operating systems such as Windows CE and Tornado, offer native support for the
DiskOnChip family of products for easy integration.
For OS-less applications and customized solutions, M-Systems offers its DiskOnChip TrueFFS SDK,
an ANSI-C source code kit designed specifically to support these environments.
The DiskOnChip family of products is compatible with all major processors, supporting popular
processors such as x86, 68K, MediaGx, Geode SCxxxx, PowerPC, MIPS, SHx, StrongARM, and
many others.

Portable Solution – Shorter Time to Market

The development and integration time for implementing a flash disk is greatly reduced by
DiskOnChip’s standard software interface, which provides portability to other operating systems and
processors and thereby shortens your time to market.

Complete Solution
The DiskOnChip 2000 series offers a full flash disk solution that includes different voltage and
temperature options, software drivers tailored to your operating system, data sheets, application
support and online email support.
Using DiskOnChip evaluation boards (EVB), you can develop your software before the target
hardware is ready.
The DiskOnChip GANG Programmer reduces your production time, and facilitates fast response
time to application software changes during production stages.
In all, DiskOnChip offers a complete set of tools for delivering a complete solution whenever your
application can use a flash disk.

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3 Package Description and Pin List

Figure 1: Package Description and Pinout

Pin Name Description Pin Number Direction

A0 - A12 Address bus 4 to 12, 23, 25 to 27 Input
D0 – D7 Data bus 13 to 15, 17 to 21 I/O
CE# Chip Enable, active low 22 Input
OE# Output Enable, active low 24 Input
WE# Write Enable, active low 31 Input
NC Not Connected. These pins may be left 1, 2, 3, 28, 29, 30
floating, tied to Vcc, GND or logic
levels. Absolute Maximum Ratings
must be observed.
VCC Power 32
GND Ground 16

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4 Designing with the DiskOnChip 2000 Flash Disk

4.1 Hardware
DiskOnChip 2000 should be connected as a standard memory device, using standard memory
interface signals. Typically, DiskOnChip 2000 can be mapped to any free 8KB memory space. In PC
architectures, if the memory window allocated to DiskOnChip 2000 is larger than 8KB, an automatic
anti-aliasing mechanism prevents the firmware from being loaded more than once. Figure 1
illustrates a typical interface between DiskOnChip 2000 and a system.

A[12:0]

D[7:0]

OE# DiskOnChip 2000

Any Capacity
WE#

CE#

Figure 2: Simplified I/O Diagram

4.2 Software
DiskOnChip 2000, under control of TrueFFS, is accessed using standard file system calls like any
other block device. Applications can write to and read from any sector on DiskOnChip 2000, which
is compatible with all diagnostic utilities, applications and file systems.
The flash memory within DiskOnChip 2000 is accessed by TrueFFS through an 8KB window in the
CPU’s memory space. TrueFFS handles the paging of this window in the flash array, as well as
providing flash disk emulation that includes flash table management, wear leveling, mapping out bad
blocks, and background space reclamation of unused flash blocks.
The same 8KB address space will be retained in future versions of DiskOnChip 2000 that offer
greater capacities.

4.3 Designing DiskOnChip 2000 into PC Architecture

When used in PC-compatible architectures, DiskOnChip 2000 is allocated an 8KB memory window
in the BIOS expansion memory range, which is usually located between 0C8000h and 0EFFFFh.
Figure 3 illustrates the DiskOnChip 2000 memory window in relation to the PC memory map.

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Extended
Memory
0FFFFFh 1MB
BIOS
0F0000h
DiskOnChip 8KB

0C8000h
Display
0A0000h 640KB

RAM

Figure 3: PC Memory Map

After reset, the BIOS executes the POST (Power On Self-Test), and then searches for all expansion
ROM devices. When DiskOnChip 2000 is found, the BIOS executes the Initial Program Loader
(IPL) code located in the boot-block area of DiskOnChip 2000. This code loads the TrueFFS driver
into system memory, installs DiskOnChip 2000 as a disk in the system, and then returns control back
to the BIOS code. The operating system subsequently attempts to identify disks that are available and
the DiskOnChip 2000 software (TrueFFS) responds by emulating a hard disk.
From this point onward, DiskOnChip 2000 is identified by the system as a standard disk drive. It is
assigned a drive letter and it can be used by any software application. No BIOS setup modifications,
autoexec.bat/config.sys modifications or external software are required.
• DiskOnChip 2000 can be used as the only disk in the system, in which case it will be accessed as
drive [C:].
• DiskOnChip 2000 can operate with or without a floppy drive, or with additional hard disks. When
working with a hard disk, DiskOnChip 2000 can be configured as the last drive (the default
configuration). In this case, the hard disk will be drive [C:] and DiskOnChip 2000 will be drive
[D:].
• DiskOnChip 2000 can also be configured as the first drive. In this case, the hard disk will be drive
[D:] and DiskOnChip 2000 will be drive [C:].
• DiskOnChip 2000 can be used as the boot device when configured as drive [C:]. In this
configuration, you must format DiskOnChip 2000 as a bootable device by copying the OS files
onto the disk. When running DOS, use the SYS command for this purpose.

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5 Disk Capacities and Contents

The capacities for the various models are detailed in the following two tables.

5.1 Low-Profile
Model Formatted Sectors Formatted Capacity Sectors under DOS
Capacity under DOS 6.22 6.22
(bytes) (bytes)
MD2202-D16 16,375,808 31,984 16,324,608 31,884
MD2200-D24 24,592,384 48,032 24,516,608 47,884
MD2202-D32 32,800,768 64,064 32,724,992 63,916
MD2202-D48 49,233,920 96,160 49,092,608 95,884
MD2202-D64 65,683,456 128,288 65,525,760 127,980
MD2202-D96 98,566,144 192,512 98,390,016 192,168
MD2202-D192 197,279,744 381,300 103,829,024 385,280

5.2 High-Profile
Model Formatted Sectors Formatted Capacity Sectors under DOS
Capacity under DOS 6.22 6.22
(bytes) (bytes)
MD2203-D80 82,116,608 160,384 81, 989, 632 160,136
MD2203-D112 114,999,296 224,608 114, 786, 304 224,192
MD2203-D144 147,881,984 288,832 147, 578, 880 288,240
MD2203-D160 164,331,520 320,960 164, 151, 296 320,608
MD2203-D192 197,214,208 385,184 196, 980, 736 384,728
MD2203-D224 230, 031, 360 449, 280 229, 584, 896 448, 408
MD2203-D256 262, 930, 432 513, 536 262, 647, 808 512, 984
MD2203-D288 295, 796, 736 577,728 295, 624, 704 577,392
MD2203-D576 591, 790, 080 1,142,970 311, 427, 072 1,155,776

5.3 Media Contents

DiskOnChip 2000 products are shipped from M-Systems fully tested, already formatted, and come
with a DOS driver.

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6 Theory of Operation

VCC

GND

CE#

WE#
System Flash
OE# Interface Control
Flash
D[0:7]

A[0:12]

Boot Block EDC/ECC

(IPL ROM)

Figure 4: DiskOnChip 2000 Simplified Block Diagram

DiskOnChip 2000 appears to the system’s hardware as a standard EEPROM, via the System
Interface block. The host cycles are passed to the Flash Control block, to be written to or read from
the flash device.
To ensure the highest level of reliability, each cycle is monitored by the EDC/ECC (Error Detection
and Correction) block. In write cycles, the EDC/ECC block generates a syndrome for every sector
that contains data, which is stored in the flash together with the sector. When the sector is read, the
syndrome is regenerated for the data and compared with the original syndrome. When a mismatch is
detected, it is repaired.
The boot block is responsible for answering the BIOS expansion search in PC architectures. After the
BIOS identifies DiskOnChip 2000 as a valid BIOS expansion device, it executes the code stored in
the boot block. The BIOS then loads the TrueFFS software from the flash memory into the host
memory, delivering full disk capabilities to the operating system. This code is identical for all
DiskOnChip 2000 capacities, since TrueFFS automatically detects the memory capacity of
DiskOnChip 2000.

6.1 Error Detection and Correction (EDC/ECC)

DiskOnChip 2000 uses the Reed-Solomon EDC/ECC algorithm to ensure high data reliability. Each
time a block of data is written to the flash, a 6-byte checksum is also written. Each time the data is
read back from the flash, a new 6-byte code is computed. TrueFFS uses these checksums for error
detection and, if necessary, error correction.

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7 Specifications
7.1 Absolute Maximum Ratings
Parameter Symbol 3.3V Model Rating1 5V Model Rating1 Units Notes
DC supply VCCS -0.5 to 4.6 -0.3 to 6.0 V
voltage
Input pin VIN -0.5 to VCC + 0.3 -0.3 to VCC + 0.3 V
voltage2
Input pin IIN Not Specified -10 to 10 mA +25 °C
current

Note 1: Permanent device damage may occur if absolute maximum ratings are exceeded. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

Note 2: The voltage on any pin may undershoot to -2.0V or overshoot to Vcc+2.0V for periods <20ns.

7.2 Capacitance
Symbol Parameter Conditions 3.3V Model Rating 5V Model Rating Unit
CI/O Input/Output MD2200/2, VIN = 0V 12 15 pF
Capacitance MD2203, VIN = 0V 36 45 pF

Note: Capacitance is not 100% tested.

7.3 Temperature Ranges

Commercial operating temperature: 0 ºC to +70 ºC*
Extended operating temperature: -40 ºC to +85 ºC
Storage temperature: -50 ºC to +85 ºC
*DiskOnChip 2000 192MB and 576MB capacities are available only for commercial temperature ranges.

7.4 DiskOnChip Assembly

The DiskOnChip 2000 DIP device is not hermetically sealed. Therefore, it must be assembled after
the PCB goes through its final rinse. Assembling DiskOnChip 2000 prior to the rinse phase may
cause it to absorb moisture. Failure to adhere to the above assembly instruction can lead to device
failures not covered by M-Systems' warranty.
Note: DiskOnChip 2000 DIP requires a DIP socket on the target platform. Due to its plastic shell and molding material, it
cannot be soldered directly to the platform.

7.5 Humidity
10% - 90% relative, non-condensing

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7.6 EDC/ECC
Enhanced Reed-Solomon:
• Corrects up to two 10-bit symbols, including two random bit errors.
• Corrects single bursts of up to 11 bits.
• Detects single bursts of up to 31 bits and double bursts of up to 11 bits.
• Detects up to 4 random bit errors.

7.7 DC Electrical Characteristics over Operating Range

7.7.1 Vcc = 5V Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VCCS System Supply Voltage 4.5 5.0 5.5 V
VIH High-level Input Voltage 2.0 V
VIL Low-level Input Voltage 0.8 V
VOH High-level Output Voltage IOH = -16mA 2.4 V
VOL Low-level Output Voltage IOL = 16mA 0.4 V
IIL Input Leakage Current MD2200, MD2202 ±10 µA

MD2203 ±30 µA

IOZ Output Leakage Current MD2200, MD2202 ±10 µA

MD2203 ±30 µA

IVCC Supply Current 200ns Cycle Time, Outputs open 40 60 mA

ISTDBY Standby Current MD2200, MD2202 60 400 µA
MD2203 240 1200 µA

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7.7.2 Vcc = 3.3V Characteristics

Symbol Parameter Conditions Min Typ Max Unit

VCCS System Supply Voltage 3.0 3.3 3.6 V
VIH High-level Input Voltage 2.7 V
VIL Low-level Input Voltage 0.6 V
VHYS Input Voltage Hysteresis 1.1 1.5 V
IOH = -18mA 2.4 V
VOH High-level Output Voltage
IOH = 0mA Vcc-0.1 V
IOL = 18mA 0.4 V
VOL Low-level Output Voltage
IOL = 0mA 0.1 V
MD2200, MD2202 ±10 µA
IIL Input Leakage Current
MD2203 ±30 µA
MD2200, MD2202 ±10 µA
IOZ Output Leakage Current
MD2203 ±30 µA
IVCC Supply Current 150ns Cycle Time, Outputs open 30 60 mA
MD2200, MD2202 70 400 µA
ISTDBY Standby Current
MD2203 300 1350 µA

7.8 AC Operating Conditions

Timing specifications are based on the following conditions:

Parameter 3.3V Model 5V Model

Supply Voltage VCC = 3.3V ±0.3V VCC = 5V ±0.5V
Input Pulse Levels 0.2V to 2.9V 0.4V to 2.6V
Input Rise and Fall Times 1ns 5ns
Input and Output Timing Levels 1.5V 0.8V and 2.0V
Output Load 100 pF 50 pF

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7.9 Timing Specifications

7.9.1 Read Cycle Timing

TSU(A)

A[0..12]

CE#
THO(CE1) TSU(CE0) TSU(CE1)
THO(CE0)
OE#
TACC TREC

WE#
TEN(D) TDIS(D)

D[0..7]

Figure 5: Read Cycle

Symbol Description 3.3V 5V Notes

Min (ns) Max (ns) Min (ns) Max (ns)
TSU(A) Address to OE# È setup 2 10
THO(A) OE#È to Address hold 35 56
TSU(CE0) CE# È to OE# È setup 0 0 1
THO(CE0) OE#Ç to CE# = 0 hold 0 0 2
THO(CE1) OE# or WE#Ç to CE# = 1 hold 8 42
TSU(CE1) CE#Ç to WE# or OE#È setup time 8 42
TREC OE#Ç to start of next cycle 20 59
TACC Read access time 110 130
TEN(D) OE#È to D active delay 15 75 7 91
TDIS(D) OE#Ç to D Hi-Z delay 13 44

Note 1: CE# may be asserted any time before or after OE# is asserted. If CE# is asserted after OE#, all timing relative to
OE# asserted will be referenced instead to the time CE# was asserted.

Note 2: CE# may be negated any time before or after OE# is negated. If CE# is negated before OE#, all timing relative to
OE# negated will be referenced instead to the time CE# was negated.

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7.9.2 Write Cycle Timing

TSU(A) THO(A)

A[0..12]
THO(CE1)

CE#
THO(CE0) TSU(CE1)
THO(CE0)
OE#
TW (WE) TREC

WE#
TSU(D) THO(D)

D[0..7]

Figure 6: Write Cycle

Symbol Description 3.3V 5V Notes

Min (ns) Max (ns) Min (ns) Max (ns)
TSU(A) Address to WE#È setup time 0 10
THO(A) WE#È to Address hold time 35 56
TW(WE) WE# asserted width 62 98
TSU(CE0) CE#È to WE#È setup time 0 0 1
THO(CE0) WE#Ç to CE# = 0 hold time 0 0 2
THO(CE1) OE# or WE#Ç to CE# = 1 hold time 8 42
TSU(CE1) CE#Ç to WE# or OE#È setup time 8 42
TREC WE#Ç to start of next cycle 22 59
TSU(D) D to WE#Ç setup time 50 48
THO(D) WE#Ç to D hold time 0 40

Note 1: CE# may be asserted any time before or after WE# is asserted. If CE# is asserted after WE#, all timing relative to
WE# asserted will be referenced instead to the time CE# was asserted.

Note 2: CE# may be negated any time before or after WE# is negated. If CE# is negated before WE#, all timing relative
to WE# negated will be referenced instead to the time CE# was negated.

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8 Mechanical Dimensions

Figure 7: MD220x Mechanical Dimensions

Low-Profile
MD2200 MD2202
Millimeters (max.) Millimeters (max.)
A 41.9 43.95
B 18.05 18.3
C 2.54 2.54
D 15.24 15.24
E 5.7 6.0
F 4.0 4.0
G 0.51 0.51
H 38.2 38.2

High-Profile
MD2203
Millimeters (max.)
A 45.6
B 18.8
C 2.54
D 15.24
E 13.5
F 4.0
G 0.51
H 38.2

Note: The above dimensions are maximum values.

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9 Shock and Vibration

Reliability Test Test Conditions Reference Standard
Vibration 100Hz~2000Hz, 15G peak, 3 cycles per axis (1hr.), 3 axes STD-202F,
Method 204D
Mechanical Half sine shock 50G, 11msec, +/-3 shock per axis, 3 axes STD-202F,
Shock Method 213B

10 Ordering Information
MD2200-DCC-V-T (Low-Profile)
CC: Capacity (MB) 24
V: Supply Voltage Blank 5V
V3 3.3V
T: Temperature Range (optional) Blank Commercial: 0 °C to +70 °C
X Extended: -40 °C to +85 °C
MD2202-DCCC-V-T (Low-Profile)
CC: Capacity (MB) 16, 32, 48, 64, 96, 192*
V: Supply Voltage Blank 5V
V3 3.3V
T: Temperature Range (optional) Blank Commercial: 0 °C to +70 °C
X Extended: -40 °C to +85 °C
MD2203-DCCC-V-T (High-Profile)
CCC: Capacity (MB) 80, 112, 144, 160, 192, 224, 256, 288, 576*
V: Supply Voltage Blank 5V
V3 3.3V
T: Temperature Range (optional) Blank Commercial: 0 °C to +70 °C
X Extended: -40 °C to +85 °C

* DiskOnChip 2000 DIP 192MB and 576MB capacities are available only for commercial temperature ranges.

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 DiskOnChip 2000 DIP

11 Additional Information
Document/Tool Description
DiskOnChip Utilities DiskOnChip Utilities User Manual
DiskOnChip Quick Installation DiskOnChip Quick Installation Guide
Guide
AP-DOC-010 Application Note: Designing with DiskOnChip DIP
AP-DOC-016 Application Note: Using DiskOnChip with QNX
AP-DOC-020 Application Note: DiskOnChip Boot Developers Kit
AP-DOC-030 Application Note: Designing DiskOnChip Millennium in
RISC Environment
AP-DOC-031 Application Note: Designing with DiskOnChip
Millennium in a PC Environment
AP-DOC-039 Application Note: Onboard Programming of the
DiskOnChip Millennium
AP-DOC-047 Application Note: Designing DiskOnChip as a Flash
Disk & Boot Device Replacement
IM-DOC-017 Installation Manual: Using DiskOnChip with Windows
CE
IM-DOC-021 Installation Manual: Using DiskOnChip with Linux O/S
IM-DOC-022 Installation Manual: Using DiskOnChip with VxWorks
DiskOnChip TrueFFS SDK Product DiskOnChip TrueFFS SDK Product Brief
Brief
DiskOnChip DIP EVB DiskOnChip DIP Evaluation Board
DiskOnChip GANG Programmer DiskOnChip 1+8 DIP GANG Programmer

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 DiskOnChip 2000 DIP

How to Contact Us
http://www.m-sys.com
Internet:
info@m-sys.com
E-mail:

USA Office: China Office:

M-Systems Inc. 25A International Business Commercial Bldg.
8371 Central Ave, Suite A Nanhu Rd., Lou Hu District
Newark CA 94560 Shenzhen, China 518001
Phone: +1-510-494-2090 Phone: +86-755-519-4732
Fax: +1-510-494-5545 Fax: +86-755-519-4729
Europe and Israel Office:
Taiwan Office: M-Systems Ltd.
Room B, 13 F, No. 133 Sec. 3 7 Atir Yeda St.
Min Sheng East Road Kfar Saba 44425, Israel
Taipei, Taiwan Tel: +972-9-764-5000
R.O.C. Fax: +972-3-548-8666
Tel: +886-2-8770-6226
Fax: +886-2-8770-6295

Japan Office:
M-Systems Japan Inc.
Arakyu Bldg., 5F
2-19-2 Nishi-Gotanda Shinagawa-ku
Tokyo 141-0031
Phone: +81-3-5437-5739
Fax: +81-3-5437-5759
M-Systems assumes no responsibility for the use of the material described in this document.
Information contained herein supersedes previously published specifications on this device from
M-Systems. M-Systems reserves the right to change this document without notice.

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