Wave Soldering

Troubleshooting Guide

AIM’s Practical Solutions

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at every stage of the professional relationship. In fact, we consider our commitment to providing
top-notch technical service to be just as important as our goal of producing market-leading
materials.

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with unmatched quality, consistency and value throughout the entire process, with products and
services delivered locally, and yet still inspired by a global, environmentally-focused view.

We believe that our focus on creating excellence every step of the way is what sets AIM apart,
and allows us to meet those challenges. We thank you for the confidence and trust that you have
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goals.

Yours truly,

Rick Black
President, AIM
Types of Wave
Soldering Defects
 Types of Defects

Non-Wetting Icycling

Dewetting Bridging

Pin Holes Excess Solder

Webbing Dull/Grainy Joints

White Haze Cold/Disturbed Joints

Solder Balls
 Non-Wetting
Recognized by pull back of solder to expose
the surface that was to be soldered
 Non-Wetting
Possible Causes:
Grease, oil or dirt on the pre-soldered surface
Bleeding or misregistered solder mask
Low temperature solder
Contaminated solder
Surfaces too heavily oxidized for flux being
used
Contaminated flux
Poor application of flux
Remedy:
Investigate each possible cause and correct
suspected discrepancies one at a time until
solderability is restored
 Dewetting
Recognized by metal wetting initially, then
pulling back to form droplets of solder on
the surface
 Dewetting
Possible Causes:
Contamination of surface by abrasives
Poor plating
Poor hot air solder leveling during PCB
manufacturing

Remedy:
Restore solderability of the surface
 Pin Holes
Recognized by small holes or eruptions in
the solder fillet
 Pin Holes
Possible Causes:
Moisture or plating solution in the PCB laminate
Inadequate preheat to evaporate flux solvent
Flux has absorbed water
Physical blockage due to foreign body in hole
Top of plated through hole prematurely
solidifying
Remedy:
Increase preheat to see if it eliminates problem
Put in new flux to see if it eliminates problem
Increase topside preheat and/or solder temperature
to correct premature topside plated through hole
freezing
If all of these fail, have the PCB’s baked and cross
sectioned
 Webbing
Recognized by a spider web like extension
of solder across the nonconductive portion of
the PCB
 Webbing
Possible Causes:
Improper curing of the laminate or solder
mask
Inadequate flux (when accompanied by
bridging or icycling)
Dross in the solder wave

Remedy:
Baking the PCB will sometimes correct the
improperly cured mask or laminate condition
Substituting a more viscous flux or
increasing the quantity of flux put on the
PCB
Correcting the drossing problem in the wave
White Haze on Solder Mask
Recognized by a white haze on the
nonconductive portion of the PCB that
cannot be removed by washing.
White Haze on Solder Mask
Possible Causes:
Improper curing of the laminate or solder
mask

Remedy:
Baking the PCB will sometimes correct the
improperly cured mask or laminate condition
 Solder Balls
Recognized by tiny spherical shapes of
solder dispersed over the surface of the PCB
 Solder Balls
Possible Causes:
Insufficient preheat
Plated through hole conditions that create pin
holes, resulting in Solder Balls
High Humidity in the manufacturing area
Moisture in the flux

Remedy:
Investigate each possible cause and correct
suspected discrepancies one at a time until
problem is corrected
 Icycling
Recognized by conical or flag shaped
extension of the solder fillet
 Icycling
Possible Causes:
Any condition that causes the solder to
solidify while in the process of draining, such
as:
Inadequate flux to promote quick drainage
Pot temperature too low
Soldering surface unusually heat absorbent
Leads picking up dross in the wave
Wrong plated through hole to wire ratio

Remedy:
Investigate each possible cause and correct
suspected discrepancies one at a time until
problem is corrected
 Bridging
Recognized by solder extending from one
lead to an adjacent lead, causing a short
circuit
 Bridging
Possible Causes:
Component leads that are bent or too closely
spaced
Excess solder
Inadequate flux remains to promote drainage
Board immersed too deep in the wave
Leads picking up dross in the wave
Contaminated solder
Poor component solderability
Remedy:
Investigate each possible cause and correct
suspected discrepancies one at a time until
problem is corrected
 Excess Solder
Recognized by:
Bulbous appearance of fillet
Unable to see contours of lead and land
 Excess Solder
Possible Causes:
Any condition that contributes to poor
drainage of the solder
Low temperature of solder or preheat
Contamination of solder
Insufficient flux to promote drainage
Incorrect wave exit angle or speed

Remedy:
Investigate each possible cause and correct
suspected discrepancies one at a time until
problem is corrected
 Dull or Grainy Joints
Recognized by dark, non reflective, rough
surfaces from an alloy that is normally bright
and shiny
 Dull or Grainy Joints
Remedies:
Determine if the alloy typically has a shiny
surface finish
Examine a recent pot analysis or have one
completed
Conduct electrical and mechanical evaluation
to see if rework is necessary
If solder meets J-STD-006 purity standards
and joints are mechanically sound, there is no
reason for rejection or touch up
If solder does not meet standard, it is a cold
joint and should be replaced
 Cold or Disturbed Joints
Recognized by rough and dull finish on the
fillets in conjunction with unacceptable
mechanical strength of the joint
 Cold or Disturbed Joints
Possible Causes:
Movement while joint is still molten caused
by:
Conveyor mechanism erratic
Solder temperature too high

Remedy:
Look for causes of vibration being
transmitted to the PCB and correct them
Ensure that solder reaches solidus
temperature immediately after joint is
completed
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Thank You

Revision A