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PCB Etch Back Process: A Comprehensive Overview
Printed circuit board etch-back is a technique used to maintain optimal
transmitting signals between many layers in PCBs. It is specifically used
with PTH procedures, where producers add a copper coating to the
interior sides of the via. PTH enhances conductivity by linking the circuits
in multilayer printed circuit boards.
Table of Contents
Understanding PCB Etch Back Processes
PCB etch-back is a crucial process to maintain optimal routing signals
between multiple layers within printed circuit boards. It involves removing
the epoxy glue from the edges of the drilled via to allow electroplating and
maintain the high link between layers. This process is especially important
in high-reliability appliances. It is subject to standards set by an IPC-6013,
which dictate that etch-back must expose a minimum of 0.003 mm and
0.08 mm of copper as specified in the Procurement records.
To improve the adhesion via plating, micro-etch procedures are used,
which involve submerging the base laminate & drilling PTH into a
multilayer printed circuit board. The dielectric debris and excess smears
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from a plated sidewall are then removeable using a plasma etch in the
process known as de-smearing.
Moreover, PCB manufacturers utilize PCB etch-back in conjunction with
de-smearing processes. PCB etch-back removes material from a via hole
and extends copper layers to improve the electrical conductivity of the
printed circuit board. This process allows producers to plate 3 edges of
a copper layer & promotes the sustainability of the PCB design.
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Creating PCB Etch Back
Two common processes in flexible circuit production, micro-etch & plasma
etch, can impact etch-back. To enhance Coating adherence, the laminate
substrate is often treated through a micro-scale etching, where a small
copper is removed by submerging or spraying the substrate. After
laminating the circuit layers together and drilling through holes, a plasma
etch is performed to remove any organic resins or debris, also known as
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desmearing. It ensures the surface of copper in the via hole is lead-free.
The plasma etching is carefully controlled to remove a specified amount of
dielectric, revealing the copper coatings.
Causes of Epoxy Resin Smears
When the temperature of a drilling process surpasses the glass transition
temperature of a substrate, it can melt the dielectric resin and its
dispersion on the copper texture of interior layers, causing smears. This
melted resin may obstruct the terminals of inner layers, leading to a
decrease in the effectiveness of electrical connectivity.
Type of PCB Etch Back Processes
Two primary types of printed circuit board etch-back exist, namely
negative & positive, and they yield various appearances & outcomes.
· Negative PCB Etchback
In negative printed circuit board etch-back, the inner copper coatings
gradually recede from the walls of the via hole to varying degrees
depending on the configuration of the PCB.
Negative etch-back is less aggressive and is more suitable for the
production of high-durability & long-term installations.
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Polished copper cylinder walls by negative etchbacks, which do not have
stress points within the inner plane. But if we use these processes too
much, it can cause gaps between layers because of dirt and air bubbles.
· Positive PCB Etchback
On the other hand, positive PCB etch-back results in copper pads sticking
out from the intersecting edges of the via hole, which provides a sturdy
Tri-terminal connection. This type of etch-back is commonly useful in
highly reliable multilayer printed circuit boards, particularly in the
aerospace, medical & military fields.
Positive etch-back is also useful to remove smears of dielectric substance
aggressively. However, one significant disadvantage of this method is the
potential formation of Pth barrels & foil cracks by strain accumulation on a
fabric. Despite this drawback, positive etchback is still available.
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PCB Etch Back Techniques
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PCB manufacturers have several options for etch-back techniques, each
utilizing different solutions and yielding varied outcomes depending on
environmental conditions. These options include chemical and plasma
etch technologies.
· Chemical Etch
Chemical etch processes typically use a basic etching solution of
potassium permanganate, usually removed via plating. Another option is
sulfuric acid, which removes water from the air and has a limited period,
changing resin-reducing rates based on purity.
Another chemical etch option is chromic acid. It gives a uniform resin
removal rate but comes with water pollution hazards.
· Plasma Etch
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Plasma etch-back is an expensive technique useful in PCB manufacturing
that offers fast and effective stain removal. The process involves creating
volatile radicals that corrode epoxy glue buildup, making gases that
producers eliminate at the last step of the procedure. However, plasma
etch-back can increase the total price of PCB production due to reduced
manufacturing throughput and longer processing time. Additionally, after
the plasma etch-back, you still require a chemical desmear procedure to
get the glass to etch & remove any fiberglass.
Difference between Chemical & Plasma PCB Etch Back
Processes
Etching is the process of removing copper & unprotected areas, leaving
the intended board behind. There are two main methods of etching:
chemical etching and plasma etching. Although both techniques serve the
same purpose, they differ in several ways. The following are some of the
differences between chemical etching and plasma etching.
· Efficiency
The most significant difference between chemical etching and plasma
etching is their efficiency. Chemical etching, which removes unprotected
areas by dissolving them, is effective, however inefficient, similar to
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digging a ditch. In contrast, plasma etching has set new standards by
greatly improving efficiency.
· Etch-back
Another difference between chemical etching and plasma etching is the
occurrence of etch-back. During the chemical etching procedure,
etch-back or undercutting always occurs, which requires increased trace
widths. The thickness of the copper also affects the etching time required
to eliminate copper, which is present between the pads. On the other
hand, the new procedure of plasma etching eliminates the occurrence of
etch-back. Therefore, the occurrence of etch-back is another
distinguishing factor between chemical etching and plasma etching.
· Etch factor
Plasma etching is crucial as it reduces imaging errors by utilizing an
imaging process that transfers the layer to the substance/material,
thereby eliminating an etching factor. But the chemical etching procedure
is the traditional method that results in a distorted side of the pad. With
chemical etching, there is a certain slope amount for every wire height
increase.
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Plasma Etching: A Safer, More Reliable Solution
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Strip film etching line
Unlike chemical etching, plasma etching does not use a hot chemical
solution like a manganate (VII) solution. It is a dry technique that is
eco-friendly and has been proven effective in completely removing any
leftover epoxy resin from the printed circuit board drilling process.
Compared to permanganate solutions, which rely on wet chemistry &
chemicals that lose effectiveness over time, plasma ashing is a cleaner and
more consistent process. It does not generate any hazardous liquid
chemical waste. Additionally, the equipment needed takes up less area on
the fabrication floor. Additionally, the plasma treatment tool is easy to
operate and does not require highly-skilled personnel.
Wrap Up!
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The terms “de-smearing” and “etch-back” may be used interchangeably by
some manufacturers, but these two processes are slightly different. In
particular, it is possible to perform de-smearing without requiring resin
etchbacks.
De-smearing, or smear removal, removes resin from the via hole wall side
to ensure proper interior layer electrical connectivity. Etchback, on the
other hand, improves conductivity by extending or etching the copper
layers. While some manufacturers may use the terms interchangeably,
there are slight differences between the two processes. Etchback is more
effective in multilayer printed circuit board configurations, while you
cannot use it for PCBs with double sides.
Furthermore, chemical etch-back strategies are generally more
cost-effective than plasma methods. Still, they are less efficient & involve
caustic chemicals that may pose hazards during handling. On the other
hand, plasma cleaning treatments offer greater precision, allowing for
better customization and fine-tuning of the drilling process.
PCB manufacturers can opt for plasma processes as a safe & eco-friendly
alternative to chemical etch-back methods. Plasma processes produce
by-products that discard without gathering hazardous waste. By
partnering with a specialized printed circuit board etch-back professional,
manufacturers can achieve higher adaptability, optimized repeatability &
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precision for even the most complex fabrication processes. It leads to
more reliable, more sustainable printed circuit boards, reduces waste &
improves reliability. Although plasma etching eliminates the need for
additional time to rebuild boards, resulting in low cost.
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