MEM 679 Surface Science and Engineering
Pre-request MEM 680, MEM 678.
Introduction to surface Science and Engineering
Fundamentals of thin film growth, adhesions and interfacial effects.
Fundamentals of paint.
Surface treatment techniques:- carburizing and nitriding, galvanizing,
CVD process, PVD techniques.
Surface analytical techniques:-
High temperature surface engineering.
Mechanical testing of coatings.
New developments in wear resistant coatings.
Each material surface is exposed to
various environmental influences. The
surface of a solid body is subjected to
corrosion and wear and interacts with
light and electromagnetic fields.
is a key component of a variety of technologies across a
number of sectors.
Topics considered in the field of Surface Science
include surface structure, composi on, reac vity, and
func on.
Surface processes are crucial in material degrada on
and failure, for instance in the case of corrosion
Surface engineering is a highly significant discipline that is
primarily employed to enhance the proper es of surfaces and
render them suitable for various func ons, while also
improving their appearance, reliability, and durability. In order
to accomplish this, a comprehensive understanding and
manipula on of surface forces such as adhesion, fric on,
lubrica on, we ng, grinding, wear, and corrosion is
absolutely crucial. These forces are collec vely referred to as
the nine surface-force levels, and they play a vital role in
determining the behavior and characteris cs of surfaces.
The desired properties or characteristics of surface-
engineered components include:
• Improved corrosion resistance through barrier or sacrificial
protection • Improved oxidation and/or sulfidation resistance
• Improved wear resistance
• Reduced frictional energy losses
• Improved mechanical properties, for example, enhanced
fatigue or toughness
• Improved electronic or electrical properties
• Improved thermal insulation
• Improved aesthetic appearance
In the beginning the following definitions may be useful:
Substrate: Base material on of a film.
Film, Coating: Solid (or liquid) body, The properties of the
film or coating have to differ significantly from the bulk.
Distinction: "Thin" Film - "Thick" Film: The limit
between "thin" and "thick" films cannot generally be
defined, some mes gives an arbitrary value of 1 µm.
Basically, a film can be considered as "thin" when its
proper es are significantly different from the bulk.
Surface and Interface: In general, each border between well
discernible phases is termed as "Interface". This can be the interface
between a substrate and a film or between a coating and the
environment.
Film Deposition and Film Formation: The deposi on process of a
film can be divided into three basic phases:
1. Prepara on of the film forming par cles (atoms, molecules,
cluster).
2. Transport of the par cles from the source to the substrate.
3. Adsorp on of the par cles on the substrate and film growth
Surface engineering options and property benefits
Changing the surface metallurgy
• Localized surface hardening (flame, induction, laser, Improved
wear resistance through the development of a hard martensitic
surface and electron-beam hardening)
• Laser melting Improved wear resistance through grain
refinement and the formation of fine dispersions of precipitates
• Shot peening Improved fatigue strength due to compressive
stresses induced on the exposed surface, also relieves tensile
stresses that contribute to stress-corrosion cracking
Changing the surface chemistry
• Carburizing Used primarily for steels for increased resistance to
wear, bending fatigue, and rolling-contact fatigue.
• Nitriding Used primarily for steels for improved wear resistance,
increased fatigue resistance, and improved corrosion resistance
(except stainless steels).
• Ion implantation Improved friction and wear resistance for a
variety of substrates
• Laser alloying Improved wear resistance
Adding a surface layer or coating
• Chemical vapor deposition (CVD) Improved wear (e.g., tools
and dies), erosion, and corrosion resistance; also used for
epitaxial growth of semiconductors.
• Physical vapor deposition (PVD) Improved wear (e.g., tools and
dies) and corrosion resistance, improved optical and electronic
properties, and decorative applications.
• Organic coatings (paints and polymeric or
elastomericcoatings and linings) Improved corrosion resistance,
wear resistance, and aesthetic appearance
• Ceramic coatings (glass linings, cement linings, and porcelain
enamels) Improved corrosion resistance
So That the Material Properties can be
enhanced Metallurgically, Mechanically,
Chemically, or by adding a coating.
The bulk of the material or substrate
cannot be considered totally independent of
the surface treatment
The Surface treatments that improve Surface
performance may considered as an alternative to
more costly material that by metallurgists, chemists,
mechanical engineers, and design engineers.
The desired mechanical, optical, chemical or
electronic properties are often opposed to the bulk
properties which may be high mechanical stability,
easy manufacturing or low material cost.
~1940: Industrial manufacturing of coatings for optical, electronical and
mechanical applications (mostly military).
~1965: Thin film technology develops to an integral part of the mass
manufacturing processes in semiconductor and optical industry.
~1990: Thin films of High Tc-Superconductors.
~1995: Thin film processing allows for the tailoring of microstructures of atomic
and mesoscopic dimensions („Quantum-Dots“ by PVD, „Cu-technology“ by
electrochemistry applied to integrated circuits).
~2000: Manufacturing of nanocrystalline materials with defined composition and
structure for applications as protective coatings and in tribology. Deposition of
highly ordered two and three dimensional objects with sizes in the nm range.
~2006: Investigation of organic coatings leads to the emergence of organic
electronics (organic light-emitting diode, OLED, printable circuits).
~~2015: Generation of heterostructures made from 2d materials. Approaches to
manufacture flexible electronic devices consisting of ultrathin materials.