EEE 451
Processing and Fabrication Technology
Lecture-10
November 11 2024
Nadim Chowdhury, PhD
nadim@eee.buet.ac.bd
Assistant Professor
Department of Electrical and Electronic Engineering
Bangladesh University of Engineering and Technology
Dhaka-1000
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Metallization
2
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Metallization: Applications
3
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Metallization: Applications
4
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Metallization: Applications
5
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Metallization: Applications
6
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Conducting Thin Films: Polysilicon
7
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Conducting Thin Films: Silicide
8
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Conducting Thin Films: Aluminum
9
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Junction Spike
10
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Junction Spike
• Al is not very soluble in Si − 0.001% at 600°C Also, Si readily diffuses in Al at 𝑇 > 400℃
• But Si is very soluble in Al − 1% at 600°C
11
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Electromigration
12
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Electromigration
Grain Boundary Grain Bounday +
For Aluminum Bulk Diffusion Surface Diffusion
Diffusion Bulk Diffusion
Activation Energy (eV) 1.4 0.28 0.4 − 0.5 0.6
13
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Prevention of Electromigration
http://hparchive.com/Journals/HPJ-1982-08.pdf 14
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Effect of Linewidth and Grain Size on Electromigration
Larger Grain Size (Same Linewidth) Larger Linewidth (Same Grain Size)
15
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Effect of Linewidth and Grain Size on Electromigration
Electromigration is Electromigration is
lower in larger grains lower in wider lines
Highest
Electromigration
https://doi.org/10.1063/1.101054
16
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Effect of Cladding on Electromigration
17
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Conducting Thin Films: Aluminum
18
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Conducting Thin Films: Titanium
19
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Conducting Thin Films: Titanium Nitride
20
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Conducting Thin Films: Titanium Nitride
21
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Conducting Thin Films: Tungsten
22
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Conducting Thin Films: Tungsten
23
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Conducting Thin Films: Copper
24
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Conducting Thin Films: Tantalum and Cobalt
25
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Conducting Thin Films: Cobalt
26
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Metal Thin Film Characteristics
27
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Metal Thin Film Characteristics: Thickness
28
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Metal Thin Film Characteristics: Thickness
29
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Metal Thin Film Characteristics: Thickness
30
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Metal Thin Film Characteristics: Thickness
31
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Metal Thin Film Characteristics: Thickness
32
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Metal Thin Film Characteristics: Thickness
33
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Metal Thin Film Characteristics: Stress
34
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Metal Thin Film Characteristics: Stress
35
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Metal Thin Film Characteristics: Reflectivity
36
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Metal Thin Film Characteristics: Sheet Resistance
37
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Metal Thin Film Characteristics: Sheet Resistance
38
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Metal Thin Film Characteristics: Sheet Resistance
39
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Metal Thin Film Characteristics: Sheet Resistance
40
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Metal CVD: Introduction
41
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Metal CVD: Introduction
42
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Metal CVD: Introduction
43
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Metal CVD: Tungsten
44
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Metal CVD: Tungsten
45
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Metal CVD: Tungsten Silicide
46
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Metal CVD: Tungsten Silicide
47
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Metal CVD: Titanium and Titanium Nitride
48
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Metal CVD: Titanium Nitride
49
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Metal CVD: Aluminum
50
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Metal CVD: Aluminum CVD/PVD
51
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Physical Vapor Deposition (PVD)
52
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PVD Methods: Evaporation
• Idea:
− Evaporate metal by melting it. Vapors then condense on substrate
• Procedure:
− Convert metal from solid to vapor phase by melting and evaporation
− Transport gaseous metal to substrate
− Condense gaseous metal on substrate
• Done in high vacuum (10!" − 10!# Torr)
− To prevent chemical reactions: Oxygen/water may react with hot metal atoms
− If needed, can force a reaction by flowing gas near the crucible
− To get good material efficiency
53
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PVD Methods: Evaporation
54
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PVD Methods: Evaporation
Deposition rate is constant for spherical placement!!! 55
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PVD Methods: Evaporation
Courtesy of Thin-Film Evaporation Processes by Milton Ohring
56
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PVD Methods: Evaporation
57
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PVD Methods: Sputtering
58
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Sputtering Yield
59
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Magnetron Sputtering and Shield
60
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RF Sputtering
61
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Argon in Sputtering Process
62
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Comparison of Sputtering and Evaporation
63
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PVD Vacuum Requirement
64
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PVD Vacuum System and Pumps
65
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Metallization Process: Al-Cu
66
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Metallization Process: Al-Cu
67
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Metallization Process: Al-Cu
68
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Metallization Process: Al-Cu
69
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Metallization Process: Al-Cu
70
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Metallization Process: Al-Cu
71
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Copper Metallization
72
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Copper Metallization
73
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Copper Metallization
74
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Copper Metallization
75
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Copper Metallization
76
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Copper Metallization
77
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Copper Metallization
78
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Summary
79
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Thank you for your attention !!!!
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