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Mobile Phone PCB Components Guide

The document provides an overview of the electronic sections and components of a mobile phone's PCB, detailing the network and power sections along with their sub-sections. It categorizes various components into card level parts, big parts, and small parts, explaining their functions and significance in mobile phone operation. Additionally, it describes specific components such as resistors, capacitors, diodes, and inductors, highlighting their roles in ensuring the smooth functioning of mobile devices.

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0% found this document useful (0 votes)
332 views48 pages

Mobile Phone PCB Components Guide

The document provides an overview of the electronic sections and components of a mobile phone's PCB, detailing the network and power sections along with their sub-sections. It categorizes various components into card level parts, big parts, and small parts, explaining their functions and significance in mobile phone operation. Additionally, it describes specific components such as resistors, capacitors, diodes, and inductors, highlighting their roles in ensuring the smooth functioning of mobile devices.

Uploaded by

brianmose18
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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MOBILE PHONE ELECTRONIC SECTIONS, COMPONENTS AND

THEIR FUNCTIONS ON PCB

Mobile phone PCB (Printed Circuit Board) has two major electronic sections:

1. Network Section
This is a section on PCB where most of the components responsible for network
functions are found. The section has sub-sections which includes:
a) FM (Frequency Modulation) sub-section
b) Wifi sub-section
c) Bluetooth sub-section
d) SIM sub-section
e) GPRS sub-section etc
To identify network section on mobile phone PCB you need to locate key landmarks that are
unique. You need to locate the external antenna socket which can only be found in network
section.

2. Power section
Power section is where most of the components responsible for power are found. The
section has sub-sections which include:
a) Charging sub-section
b) Audio sub-section
c) Camera sub-section
d) Light sub-section
e) Display sub-section
f) Touch sub-section etc
To identify power section on mobile phone PCB you need to locate key landmarks that are
unique. You need to locate the SoC (System on Chip) commonly referred to as CPU chip which
can only be found in power section. The other parts that are unique in this section are Flash IC
and the power IC but not as unique as SoC.
Each of these sections has components which are classified in three parts.
When learning how to repair a mobile cell phone, it is important to identify parts of a mobile
phone. There are hundreds of parts and electronic components in mobile phone. These parts
and components can be classified into different groups such as:
1. card level parts,
2. big parts
3. and small parts.
CARD LEVEL PARTS OF A MOBILE CELL PHONE AND THEIR FUNCTION
We will explain and teach you about card level parts of a mobile phone.
Card level components are found in any section of mobile phone PCB
Most of them are directly connected to CPU
1. Front Facia or Facial

This is the front cover or housing of any mobile phone. These are of different shapes and sizes
depending upon Mobile Phone Brand and model.

It is used to cover the front internal parts of a mobile phone

Mobile Phone Front Facia

2. Back Facia or Facial

This is the Back cover or housing of any mobile phone. These are of different shapes and sizes
depending upon brand and model. Some phones its of glass.

It is used to cover the internal back parts of the mobile phone

Mobile Phone Back Facia


3. Internal Facia or Facial
This is the internal skeleton of a mobile phone. It is the chassis and frame of the phone.

It is where the motherboard, the screen and other card level components are held.

Internal Facia or Skeleton of a Mobile Phone


Note:

Have a look at this diagram

Complete Phone Housing

4. Ringer

Ringer is an audio alert component that alerts by ringing. The phone has no physical ringer. The
ringing sound comes through speaker.
Mobile Phone Ringer

5. Speaker
Speaker is an audio component used to listen to loud sound. Through speaker you can listen to
music.

Mobile Phone Speaker

6. Ear speaker/Earpiece
This is an audio component used to listen to sound during phone call. It is always at the top side
of the phone
Mobile Phone earpiece/ear speaker

7. Microphone/Mouthpieace
It is also called Mic in short. It transmits sound of the speaker during phone call. It also helps to
record sound in a mobile phone. It other words, microphone is a sound input device.
A phone can have more than two mouthpieces. It is mostly found at the bottom side of the
phone.

Mobile Phone Microphone

8. Vibrator

It is also called Vibrator Motor or simply motor. It creates vibration in a cell phone when
vibration mode setting is turned ON. It is an alert component.
Apple have special vibrator called taptic engine
Vibrator of Mobile Phone

9. Charging Connector/Charging Port


It helps to connect the charger to the PCB of a mobile phone to charge or recharge the battery.
The charging port has two parts:

a) Positive (+) terminal


b) Negative (-) terminal

Mobile Phone Charging Connector

10. Headphone Connector/Jack


It is also called Earphone Connector. It helps to connect the headphone to the mobile phone via
jack.
Mobile Phone Headphone Connector

11. USB/Data Cable Connector/Port


It helps to connect the mobile to another device such as a computer, laptop, table etc using a
data cable.

Data Cable Connector of Mobile Phone

12. Battery
It supplies power or DC current to the mobile phone.

Battery of Mobile Phone


13. Battery Connector
It connects the battery to the internal circuit tracks of the PCB of a mobile phone.

It has 3 parts:
a) VBAT
b) GND
c) BSI

Mobile Phone Battery Connector

14. SIM Card


Subscriber Identification Module. This is a small rectangular chip with circuit and information of
user of the card. A SIM card is necessary to make or receive phone calls with a mobile phone.
SIM Card

15. SIM Card Connector/Slot/Reader


It connects the SIM card to the Circuit or PCB of a mobile phone.

SIM Connector

16. SD/Memory Card


It is used to store data like document, music, videos etc. These are available in different
capacities like 1GB, 2GB, 4GB, 8GB, 16GB, 32 GB etc.
Memory Card

17. Memory Card Connector/Slot or MMC Connector


It connects the memory card to the PCB of a mobile phone.

Mobile Phone Memory Card Connector

18. SIM/SD Card Tray


It is used to hold the SIM/SD card before inserting in the card connector.
SIM/SD Card Tray

19. Camera
It is used to capture still images or record videos. Camera of mobile phone are available in
different megapixel.

Camera of Mobile Phone

20. Camera Connector


It connects the camera to the PCB of the mobile phone.
Mobile Phone Camera Connector

21. Keypad Button

It is connected to the keypad carbon to enter numbers to make phone calls and other data ie
used to input data.

Mobile phone has internal and external keypad.

Mobile Phone Keypad


22. Keypad Carbon
It is present in between keypad button and the PCB. It connects the keypad buttons to the PCB
of a mobile phone.

Mobile Phone Keypad Carbon


23. Keypad Connector
It connects the keypad to the PCB of the cell phone.
Mobile Phone Keypad Connector
24. ON / OFF Switch or Power Button

It helps to switch the mobile phone ON or OFF.

Mobile Phone ON-OFF Switch

25. LCD (Liquid Crystal Display)/Display Screen


It is used to display information from mobile phone
Display of Mobile Phone

26. Display Connector


It connects display screen to the PCB of a Mobile Phone.

Mobile Phone Display Connector

27. Display Cable


It is used to connect the screen to PCB

It transfers display information from PCB to LCD


Display Cable

28. Touch/PDA Cable


It connects the touch to PCB
It transfers information from touch to PCB

Mobile Phone Touch/PDA cable

29. Touch/PDA (Personal Digital Assistant)


It is used to input data in the phone
Mobile Phone Touch/PDA

30. Power Cable


It connects the Main motherboard to sub-motherboard
It transfers power and signals to and fro main motherboard and sub-motherboard

Mobile Phone Power Cable

31. Mobile Phone Network/RF Cable

It connects mobile phone network section on main motherboard to network section on sub-
motherboard
It transfers network information/signal
Network/RF Cable

32. Mobile Phone External Antenna Socket


It is used to capture network frequencies

External Antenna Socket

33. Internal Antenna


It helps to capture network frequency.
In the diagram below 1,2 and 3 goldish areas are antenna
Internal Antenna of Mobile Phone

34. Proximity Sensor

It is used to deactivate the mobile phone touch screen during phone call

Proximity Sensor

Activity
In Groups discuss other mobile phone sensors and their function

35. Mobile Phone Home Key/Button

It helps mobile phone user to return to home screen


Mobile Phone Home Key/Button

36. Mobile Phone Back Key/Button


It is used to return to step by step return to previous screen

Mobile Phone Back Key/Button

Activity
In groups discuss other Mobile Phone card level components and the function

SMALL MOBILE PHONE COMPONENTS ON PCB


These are components that work together with big components to ensure smooth flow of
current and signals. They help big components. They include:
a) Resistor
b) Capacitor
c) Inductor (Coil)
d) Diode
e) Transistor
f) Regulator
g) Coupler

a) Resistor
There are different resistors on electronic gadgets PCB. However, we are going to look
for SMD resistors available on mobile phone.
A resistor is a passive two-terminal electrical component that implements electrical
resistance as a circuit element.

Function
Resistors reduces/decreases the current to flow. It means that resistors repel the flow
of the current in opposite direction of the current flowing.
Looking at the function of resistor it means it protects the phone components and
circuit against power surge

Features of a mobile phone SMD Resistor


i It is the smallest component on mobile phone PCB
ii It has two terminals
iii It has no polarity ie no positive or negative side
iv It is found in black, blue, green and white colour
v It is found in any section of mobile phone PCB

Resistor schematic symbol


Resistors
b) Capacitor (C )
A capacitor is a device used to store electrical charge and electrical energy. It consists of
at least two electrical conductors separated by a distance.
Mobile phone has two types of capacitors:
i Simple/Non-polarised capacitor
Simple capacitor has the following features on phone:
a. It is found in any section of mobile phone PCB
b. It has two terminals
c. It has no polarity ie no positive or negative side
d. It is found in black, brown, grey and orange colours
Function- It is used to filter DC current

Simple Capacitors

Schematic Symbol
ii Polarised/Electrolytic capacitor
Polarised capacitor has the following features on phone:
a. It is found in any section of PCB
b. It has two terminals
c. It has polarity ie has positive and negative side
d. It is found in two colours; black with white stripe and orange with brown
stripe. The side with stripe is positive side
e. It can self-charge and self-discharge
Function- It filters and stores current

Schematic Symbol

Polarised/Electrolytic Capacitor

Capacitors just like resistors are passive components that protects the mobile phone
circuit from power surge

c) Inductor (L)
An inductor is a passive electrical component that opposes sudden changes in current.
Inductors are also known as coils or chokes. The electrical symbol for an inductor is L.
Function- Inductors slow down/step down current surges or spikes by temporarily
storing energy in an electro-magnetic field and then releasing it back into the circuit
Mobile phone has a coil which appears in two different shapes as you will see in the
figures below
Coils have copper binding wire around them

Schematic Symbol
Inductors/Coil
Coils play a very important role on mobile phone circuit in the following sub-sections:
light sub-section and charging sub-section.
NOTE: If a phone has light issues coil is among the first component to suspect.

d) Coupler
In telecommunications, an acoustic coupler is an interface device for coupling electrical
signals by acoustical means—usually into and out of a telephone.
This electronic component is found in the Network Section of a mobile phone. It is of
either black or white color and has 6 pins bent inside. Function: It filters network.
NOTE: If couple is faulty the phone will not have network

Coupler

e) Diode
A diode is a semiconductor device that essentially acts as a one-way switch for current.
It allows current to flow easily in one direction, but severely restricts current from
flowing in the opposite direction.
Diodes are also known as rectifiers because they change alternating current (ac) into
pulsating direct current (dc). Diodes are rated according to their type, voltage, and
current capacity.

Diodes have polarity, determined by an anode (positive lead) and cathode (negative
lead). Most diodes allow current to flow only when positive voltage is applied to the
anode. A variety of diode configurations are displayed in this graphic:

Diodes are available in various configurations. From left: metal case, stud mount, plastic
case with band, plastic case with chamfer, glass case.
When a diode allows current flow, it is forward-biased. When a diode is reverse-biased,
it acts as an insulator and does not permit current to flow.

Strange but true: The diode symbol's arrow points against the direction of electron flow.
Reason: Engineers conceived the symbol, and their schematics show current flowing
from the positive (+) side of the voltage source to the negative (-). It's the same
convention used for semiconductor symbols that include arrows—the arrow points in
the permitted direction of "conventional" flow, and against the permitted direction of
electron flow.

Mobile phone has four types of diodes:


i Rectifier diode
A rectifier diode is a two-lead semiconductor that allows current to pass in only
one direction. Generally, the P-N junction diode is formed by joining together n-
type and p-type semiconductor materials. The P-type side is called the anode
and the n-type side is called the cathode. Many types of diodes are used for a
wide range of applications. Rectifier diodes are a vital component in power
supplies where they are used to convert AC voltage to DC voltage.
In Mobile phone rectifier diodes have the following features:
 It is found in any section of PCB
 It has two terminals
 It has polarity
 It is found in black colour

Schematic Symbol

Rectifier Diode
ii Light Emitting Diode (LED)
A light-emitting diode (LED) is a semiconductor device that emits light when an
electric current flows through it. When current passes through an LED, the
electrons recombine with holes emitting light in the process. LEDs allow the
current to flow in the forward direction and blocks the current in the reverse
direction.
Mobile phone LED has the following features:
 It is found in any section of PCB
 It has two terminals
 It has polarity
 It is found in light yellow and white colour
 Function: It is used to generate/emit light

Schematic symbol
Light Emitting Diode (LED)
iii Zener Diode
A Zener Diode, also known as a breakdown diode, is a heavily doped
semiconductor device that is designed to operate in the reverse direction. When
the voltage across the terminals of a Zener diode is reversed and the potential
reaches the Zener Voltage (knee voltage), the junction breaks down and the
current flows in the reverse direction. This effect is known as the Zener Effect.

A Zener diode operates just like a normal diode when it is forward-biased.


However, a small leakage current flows through the diode when connected in
reverse biased mode. As the reverse voltage increases to the predetermined
breakdown voltage (Vz), current starts flowing through the diode. The current
increases to a maximum, which is determined by the series resistor, after which
it stabilizes and remains constant over a wide range of applied voltage.
Mobile phone SMD zener diode has the following feature:
 It is found mostly around charging sub-section of PCB
 It has two terminals
 It is black in colour
 It has polarity
 Function: It is used to regulate voltage and current, it also filters and
decreases current
NOTE: Zener diode in mobile phone plays a big role in mobile phone
battery charging

Schematic symbol
Zener Diode
iv Photo Diode
It is a form of light sensor that converts light energy into electrical energy
(voltage or current). Photo diode is a type of semi conducting device with PN
junction. Between the p (positive) and n (negative) layers, an intrinsic layer is
present. The photo diode accepts light energy as input to generate electric
current.

It is also called as Photodetector, Photo Sensor or Light Detector. Photodiode


operates in reverse bias condition i.e., the p – side of the photodiode is
connected with negative terminal of battery (or the power supply) and n – side
to the positive terminal of battery.
Mobile phone SMD photo diode has the following features:
 It is found in any section of PCB
 It has two terminals
 It has polarity
 It is the smallest diode
 It is black in colour
 Function: It captures infra-red rays

Schematic symbol
Photo Diode
f) Transistor
A transistor is a type of a semiconductor device that can be used to both conduct and
insulate electric current or voltage. A transistor basically acts as a switch and an
amplifier. In simple words, we can say that a transistor is a miniature device that is used
to control or regulate the flow of electronic signals.
Parts of a Transistor
A typical transistor is composed of three layers of semiconductor materials or more
specifically terminals which helps to make a connection to an external circuit and carry
the current. A voltage or current that is applied to any one pair of the terminals of a
transistor controls the current through the other pair of terminals. There are three
terminals for a transistor. They are:
Base: This is used to activate the transistor.
Collector: It is the positive lead of the transistor.
Emitter: It is the negative lead of the transistor.
Mobile phone transistor has the following feature:
 It is found in any part of the PCB
 It has three terminals
 It is black in colour
 It has polarity
 Function: It plays the role of switching signals

Schematic symbol
Transistor

g) Regulator
Surface mount regulators also come in a number of packages, among them include SOT-
89, SOT-223, SOT-23, and TO252-3. SMD linear regulators can have as few as 3 pins but
typically have between 4 and 6.

The extra pins are often used as additional inputs or outputs that enable a higher
current operating alongside the SOT-223, which has considerable output.

Most modern electronics use LDO (low drop output). For example, mobiles take
advantage of LDOs to improve efficiency.
Mobile phone regulator has the following features:
 It is found in any section of PCB
 It is black in colour
 It has 4, 5 or 6 terminals
 It has polarity
 Function: It regulates current and voltage

SMD Regulator
NOTE: Regulators are very important on mobile phone especially in light sub-
section, charging sub-section, network section etc
Activity

In groups discuss what will happen to the phone if each of the components above get damaged
MOBILE PHONE BIG ELECTRONIC COMPONENTS ON PCB

Big components are mostly ICs and crystals. They coordinate other components. They play key
role on mobile phone circuit. They include:
a) SoC (System on Chip)/CPU(Central Processing Unit)
This the IC that houses different processors on PCB.
Is the “brain” of the Smartphone. It receives commands, makes instant calculations,
and sends signals throughout the device.
Is the electronic circuitry that executes instructions compromising a phone programs. It
also performs basic arithmetic, logic, controlling, and input/output (I /o) operation
specified by the instructions in the program.
Note: A core is a tiny processor bit that has work to execute operations, performance
the calculation, and every required information to perform with power. A processor
comes with several cores. Performance of a processor is usually estimated from its core.
NOTE: If the CPU is faulty the phone will not power on i.e. the phone gets dead.

Types of Mobile Processor:

QUALCOMM PROCESSOR
It makes snapdragon processor.
It is known for its high-tech performance SoC chip processor & LTE modems. The reason
to be the most popular processor is hidden in their quality, where it provides a
plenthora of sensors, high-performance GPU, and smooth performance.
Qualcomm develops Adreno GPU (Graphic Processor Unit) which supports
Custom ROM, G-cam, Regular software updates & probably this is the reason this
processor is abit expensive.
Note: Snapdragon is a suite of the system on chip semiconductor products that was
designed by Qualcomm technology for smartphones to give high performance.

Different Generation of Snapdragon Processor.


200 SERIES FAMILY
The chipset was designed to give better performance & powerful connectivity,
moreover with better battery life in low budget smartphone.
200 series CPU clock CPU cores GPU Name
family speed
Snapdragon Up to 1.3GHZ Quad-core Adreno 308
215 cpu
Snapdragon Up to 1.3GHZ Quad-core Adreno 304
212 cpu
Snapdragon Up to 1.1GHZ dual-core Adreno 304
205 cpu

400 SERIES FAMILY


400 series CPU clock CPU cores GPU Name
family speed
Snapdragon 1.8GHZ Octa-core Adreno 506
450 cpu
Snapdragon Up to 2.0GHZ Octa-core Adreno 505
439 cpu
Snapdragon Up to 1.4GHZ Octa-core Adreno 505
435 cpu
Snapdragon Up to 2.0GHZ Quad-core Adreno 504
429 cpu

600 SERIES FAMILY


This chipset was designed to give high performance for high graphics applications and
games. Moreover, it will also improve fast web browsing and better connectivity
between smartphones.
600 series CPU clock Cpu core GPU Name
family speed
Snapdragon Up to 2.0GHZ Octa-core Adreno 612
675 cpu
Snapdragon Up to 2.0GHZ Octa-core Adreno 615
670 cpu
Snapdragon Up to 2.0GHZ Octa-core Adreno 610
665 cpu
Snapdragon 1.95GHZ- Octa-core Adreno 512
660 2.0GHZ cpu
Snapdragon 1.8GHZ- Octa-core Adreno 510
653 1.95GHZ cpu
Snapdragon 1.8GHZ Octa-core Adreno 510
652 cpu
Snapdragon 1.8GHZ Octa-core Adreno 509
636 cpu
Snapdragon 1.8GHZ Octa-core Adreno 506
632 cpu
Snapdragon Up to 2.2GHZ 8x ARM Adreno 508
630 cortex A53
Snapdragon Up to 2.2GHZ Octa-core Adreno 506
626 cpu
800 SERIES FAMILY
Designed to give super-fast apps performance & browsing as compared to its
predecessor, it has high-class graphics. GPU, Multimedia, battery that make it for
flagships range smartphones.

800 series Cpu clock Cpu cores GPU Name


family speed
Snapdragon Octa-core Adreno 730
8 Gen 818 MHZ
1(latest)
Snapdragon Octa-core Adreno 660
888/888 plus
5G
Snapdragon Up to 2.8GHZ Octa-core Adreno 630
845
Snapdragon Up to Octa-core Adreno 540
835 2.45GHZ
Snapdragon Up to Octa-core Adreno 640
855/855 plus 2.96GHZ

APPLE SMARTPHONE PROCESSORS.


The most innovative & high-tech performance device in 21 century. The reason behind
the performance & popularity is hidden in their Iphone operating system (iOs), which
provides seamless performance to devices.
A4 SERIES.
It is based on the ARM processor & contained ARM cortex-A8.
Characteristics:-up to 32GB storage, Dual mic noise suppression, Better battery life.
Apple Semiconductor Cpu devices
processor technology
series
A4 series 45nm 0.8-1.0GHZ Iphone 4 &4s
single core
cortex-A8

A5 SERIES
In March 2011, Apple updated the A5 chipset with an updated cpu could do twice the
work.It contained dual-core AMR cortex-A9.
Apple Semiconductor Cpu devices
processor technology
series
A5 32nmHKMG 0.8- Ipad2,4 &
1.0GHZ(Dual Mini
core)
A5X 45nm 1.0GHZ Dual Ipad(3rd gen)
core
Characteristics: Apple clocked the A5 at 1GHZ, Good battery backup.
A6 SERIES
In 2012 Apple launched the A6 processor with Iphone 5.
Apple Semiconductor Cpu devices
processor technology
series
A6 32nm 1.3GHZ Dual Iphone 5&5c
core
A6X 32nm 1.4GHZ Dual Ipad(4th Gen)
core swift
Characteristics: It gains twice the speed & graphics,
2x graphics, 2x faster cpu, cpu clocked at 1.3GHZ.
A7 SERIES
Launched in 2013 in iphone 5s.
Apple Semiconductor Cpu devices
processor technology
series
A7 28nm 1.3-1.4GHZ Iphone 5s
dual core
cyclone
st
Characteristics: It was the 1 chipset to feature a 64-bit cpu instead of 32-bit.
It could handle more data at once.
A8 SERIES
Another chipset upgrade for iphone 6 & iphone 6+ in 2014.
Apple Semiconductor Cpu devices
processor technology
series
A8 20nm 1.1-1.5GHZ Iphone
6,6plus
A8+ 20nm 1.5GHZ Ipad air 2
Characteristics: 25% more cpu performance & 50% more graphics performance than the
A7.

A9 SERIES
In 2015 Apple A9 chipset was released to gain more high performance.
Apple Semiconductor Cpu devices
processor technology
series
A9 14nm 1.85GHZ dual Iphone 6s &
core 6s plus
A9X 16nm 2.16- Ipad pro
2.26GHZ
core
Characteristics: 70% more performance, 90% more graphics performance compared to
A8.
A9 chipset stands in the market.
A10 SERIES (chipset)
In 2016 the apple A10 fusion chipset was introduced with the iphone 7 & 7 plus.
Apple Semiconductor Cpu devices
processor technology
series
A10 Fusion 16nm 2.34GHZ Iphone 7 &
Quad core 7plus
A10x Fusion 10nm 2.36GHZ Ipad pro
Hexa core
Characteristics: Two high performance cores with two high-efficiency cores.
Save battery life.
A11 Bionic chipset
At the end of 2017, Apple introduced the A11 Bionic chipset which appeared on iphone
8, 8 plus & iphone x.
Apple Semiconductor Cpu devices
processor technology
series
A11 Bionic 10nm 2.39GHZ Iphone 8,8+
Hexa core &X
Characteristics: It had two high-performance cores, four high-efficiency cores.
Faster than the A10 fusion chipset.
A12 Bionic chipset
It is a major update of processor A11, After launching its first appeared in iphone XS,
iphone XS max, & XR which makes apple smartphone to the next level.
Apple Semiconductor Cpu devices
processor technology
series
A12 Bionic 7nm 2.49GHZ Iphone XS,XS
Hexa core Max,XR
A12 X Bionic 7nm 2.49GHZ Ipad pro
Octa core
Characteristics: It comes with 64-bit ARM-based (SOC), 6 cores of cpu with 2 high-
perfomance cores, and 4 energy-efficient.
Having 2.49GHZ max clock speed.
A13 Bionic chipset
A13 processor chip 1st appears in the newly launched iphone 11,iphone pro & max.

Apple Semiconductor Cpu Devices


processor technology
series
A13 Bionic 7nm 2.65GHZ Iphone11,11pro,pro
Hexa max
core(2X
lightning
+4X
thunder)
Characteristics: It comes with up to 2.65GHZ clock speed.
It’s a hexa core cpu (2 high-performance cores with high-efficiency thunder cores)

APPLE A14 Bionic


First appeared in ipad air & iphone 12 series apple A14 bionic chipset is major upgrade
over A13.This is 5nm chipset which is known for best performance.
Apple Semiconductor devices
processor technology
series
A14 Bionic 5nm Iphone 13,13
pro,13 pro
max & 13
mini

APPLE A15 Bionic [latest]


Is the latest iphone processor chipset launched in 2021 & 1st appeared in latest 13 series
iphone. This chipset is much higher in performance than any other smartphone
processor like snapdragon, Exynos & others.
Apple Semiconductor devices
processor technology
series
A15 Bionic 5nm Iphone12,12pro,12pro
max

MEDIA TEK PROCESSORS.


Founded in 1997 with the mission of providing premium technology to mid-range
smartphones.
It is a Chinese semiconductor company that caters high-performance chips in devices at
cheap prices. It is now a massive popular chipset company that provides new high-tech
processor to mobile. It is mostly used in Chinese variant smartphones. Like vivo, Oppo,
LeECO, Xiaomi, Le, Yu.
MEDIA TEK Helio A series
This is the series that comes in most mid-range smartphones to provide a great camera,
better enhancements, good power efficiency with a reasonable price range.
MEDIA TEK Cpu type Cores GPU
Helio A
series

Media Tek ARM Cortex Octa-core IMG POWER


Helio A25 A53(1.5- VR
1.8GHZ)
Media Tek ARM Cortex Quad-core IMG POWER
Helio A22 A53(2.0GHZ) VR
Media Tek ARM Cortex Quad-core IMG POWER
Helio A20 A53(1.8GHZ) VR
MEDIA TEK Helio P series
In the P series processor, Media Tek focused on battery efficiency without
compromising with high-tech performance, P series processor mainly for slim design
smartphones to provide a better experience user experience.
MEDIA TEK Cpu type Cores GPU
Helio P series

Media Tek ARM Octa core Arm Mali-


Helio P10 to A53(2.0GHZ- T860 to IMG
P95 2.2GHZ) power VR
GM

MEDIA TEK Helio X series


It comes to budges the market, with its super high-performance with tons of new
update features that impressively improve the camera, display, gaming & much more.
MEDIA TEK Cpu type Cores GPU
Helio X series

Media Tek ARM Octa to Deca IMG power


Helio X10 to A53(2.0GHZ) VR to IMG
X30 to ARM power VR
7XTP-MT4
cortex
A73(2.6GHZ)

MEDIA TEK Helio G series


It is highly focused on gaming, that ensure to provide high performance & better FPS.
MEDIA TEK Cpu type Cores GPU
Helio G
series

Media Tek ARM cortex Octa ARM Mali-


Helio G70 to A75(2GHZ to G52 to G76
G90 ARM cortex
A76
2.05GHZ)

MEDIA TEK Dimensity 5G series


MEDIA TEK Cpu type Cores GPU
Dimensity 5G
series

Media Tek ARM cortex Octa AMR Mali


Dimensity A76(2GHZ to G57 to ARM
800 to 1000 ARM cortex Mali G77
A77 2.6GHZ)

EXYNOS PROCESSORS
It is manufactured by Samsung smartphones, which is an octa core chipset and used the
ARM Mali graphics processor.
EXYNOS 7 Series processor
EXYNOS 7 Cpu Gpu Semiconductor
Series tech
processor

Exynos 7 Cortex A531 Mali T720 14nm


Dual, Quad, 1.0GHZ Dual MP1 to Mali
Octa to cortex A57 T760 MP8
2.1GHZ

EXYNOS 8 octa processor


EXYNOS 8 Cpu Gpu Semiconductor
octa tech
processor
Exynos octa Custom Mali T880 14nm
2.3GHZ

EXYNOS 9 series processor


EXYNOS 9 Cpu Gpu Semiconductor
series tech
processor

Exynos 9 Cortex A77 Mali G76 to 10nm to 8nm


2.2GHZ to Mali G76
custom cpu MP12
2.9GHZ Quad

KIRIN Processors series


Kirin 600 Cpu Gpu Semiconductor
series tech
processor
Kirin 620 to 8X cortex Mali 450 28 nm to 16
kirin 659 A53 1.2GHZ MP4 to Mali nm
to 4X cortex T830 MP2
A53 1.7GHZ

Kirin 700 series processor


Kirin 700 Cpu Gpu Semiconductor
series tech
processor

Kirin 710 4X Mali G51 12nm


Cortex(2.2GHZ) MP4

Kirin 800 series processor


Kirin 800 series cpu Gpu Semiconductor
processor tech

Kirin 810 2X Mali G52 7nm


cortex(2.27G MP6
HZ)

Kirin 900 series processor


Kirin 930 to 4X Mali T628 28 nm to
Kirin 990 5G cortex(2.0GHZ) MP4 to Mali 7nm +EUV
to 2X cortex G76 MP16
(2.36GHZ)
Mobile phone Soc/CPU is one of the biggest but unique IC on mobile phone PCB.

SoC/CPU

b) EEPROM IC/Flash IC/Memory IC


EEPROM (Electronic Erasable Programmable Read Only Memory) is a non-volatile ROM
chip which used for storing a small amount of data in computers or some other
electronic devices. Through EEPROM, an individual byte of data can erase and
reprogrammed entirety, not selectively by the electrical voltage.
EEPROM is also called EMMC Nand flash IC.
 Mobile phone EEPROM is one of the biggest IC on PCB
 The phone can have more than one EEPROM
 Function: the EEPROM is the phone storage and is also where all installation take
place.
 Fault: If EEPROM is faulty the phone will have software problems

EEPROM IC/Flash IC
c) RAM (Random Access Memory)
Random access memory (RAM) is a computer's short-term memory, where data that the
processor is currently using is stored temporarily. RAM memory can be accessed much
faster than data on a hard disk, SDD, or other long-term storage device, which is why
RAM capacity is so important for system performance.

RAM is short for “random access memory,” and it’s one of the most fundamental
elements of computing. RAM is a temporary memory bank where your computer stores
data it’s currently working on. RAM keeps data easily accessible so that it can be
retrieved quickly, meaning your processor doesn’t have to go into long-term storage to
complete immediate processing tasks.

Every computing device has RAM, whether it’s a desktop computer (running Windows,
MacOS, or Linux), a tablet or smartphone, or even an IoT computing device (like a smart
TV). Nearly all computers have a way of storing information for longer-term access, too.
But the working processes are done in RAM.

RAM is temporary storage that goes away when the power turns off. So what is RAM
used for, then? It’s very fast, which makes it ideal for things the computer is actively
working on, such as applications that are currently running (for example, the web
browser in which you’re reading this article) and the data those applications work on or
with.

It can help to think about RAM with the analogy of a physical desktop. Your working
space — where you scribble on something immediately — is the top of the desk, where
you want everything within arm’s reach and you want no delay in finding anything.
That’s RAM. In contrast, if you want to keep anything to work on later, you put it into a
desk drawer — or store it on a hard disk, either locally or in the cloud.

RAM is used to process information immediately. RAM is significantly faster than a hard
disk — twenty to a hundred times faster, depending on the specific hardware type and
task. When you want to accomplish a specific task, computer operating systems load
data from the hard disk into RAM to process it, such as to sort a spreadsheet or to
display it on screen. When it’s finished actively working with that data, the computer
(sometimes at your instruction) saves it into long term storage.

So, for example, let’s say you want to work with a spreadsheet. When you start Excel,
your computer loads the application into RAM. If you load an existing spreadsheet
(which is stored on your hard disk), the operating system copies that information into
RAM, too. Then you can work with Excel, crunching numbers in your usual fashion. In
most circumstances, the computer responds super-fast, because RAM is fast.
When you’re done with the spreadsheet, you tell Excel to save it — which means that
the data gets copied to the hard disk or other long-term storage. (If you forget to save
and the power fails, all that work is gone, because RAM is temporary storage.) And
when you close the application, the computer operating system takes it out of RAM and
clears the deck so that the space is free for you to work on the next thing.

One extended use of RAM is to help previously-accessed information be available much


more quickly. When you first turn on your computer and launch any application, such as
PowerPoint or Spotify, it takes a while to load. However, if you close a program and then
relaunch it, the software opens almost instantly (unless your PC isn’t optimized for
performance). That’s because the app is loaded out of the significantly faster RAM,
rather than the hard disk.

 Mobile Phone RAM is integrated in Flash IC in most of the phones


 RAM has some capacity eg 1GB, 2GB, 4GB, 8GB etc
 If RAM is faulty the phone will have software problems; it will frequently hang,
freeze, overheat, goes off and sometimes goes dead.

d) ROM (Read Only Memory)


Read-Only Memory (ROM), is a type of electronic storage that comes built in to a device
during manufacturing. You’ll find ROM chips in computers, phones and many other
types of electronic products; VCRs, game consoles, and car radios all use ROM to
complete their functions smoothly. ROM chips come built into an external unit – like
flash drives and other auxiliary memory devices – or installed into the device’s hardware
on a removable chip. Non-volatile memory like ROM remains viable even without a
power supply.

ROM stores “firmware,” which is permanent software that’s hard-wired with integrated
circuits. The manufacturer fits a specifically designed ROM chip into a device during the
building process.

Unlike the non-volatile memory of a hard drive, it’s difficult and time-consuming to
rewrite a ROM chip’s memory. In most cases, it’s impossible to alter integrated circuits,
which may mean you can’t update more basic forms of ROM. You may be able to
reprogram some modern types of ROM, but only at slow speeds and with special
equipment. These hurdles make traditional ROM poorly-suited for functions that require
frequent feature updates or are prone to bugs or security issues.

Conventional ROM is pre-programmed to suit its intended hardware. It often controls


functions that are both integral to the utility of the device and unlikely to need
modification or personalization. One kind of data usually stored in a ROM chip is the
Basic Input-Output System (BIOS). A device’s BIOS controls the way the device responds
to cues from the user at the most fundamental level, such as a computer’s “booting-up”
process that occurs when the system powers on.

Types of ROM
Here’s an overview of the different types of ROM, ranging from the most basic to more
versatile.

ROM: Classic or “mask-programmed” ROM chips contain integrated circuits. A ROM chip
sends a current through a specific input-output pathway determined by the location of
fuses among the rows and columns on the chip. The current can only travel along a fuse-
enabled pathway and thus can only return via the output the manufacturer chooses.
Rewiring is functionally impossible, and so there’s no way to modify these types of ROM
chips. While producing a template for an original ROM chip is laborious, chips made
according to an existing template can be much more affordable.

PROM: Programmable ROM, or PROM, is essentially a blank version of ROM that you
can purchase and program once with the help of a special tool called a programmer. A
blank PROM chip allows current to run through all possible pathways; the programmer
chooses a pathway for the current by sending a high voltage through the unwanted
fuses to “burn” them out. Static electricity can create the same effect by accident, so
PROMs are more vulnerable to damage than conventional ROMs.

EPROM: Erasable Programmable ROM chips allow you to write and rewrite them many
times. These chips feature a quartz window through which a specialized EPROM
programmer emits a specific frequency of ultraviolet light. This light burns out all the
tiny charges in the EPROM to reopen its circuits. This exposure effectively renders the
chip blank again; after which you can reprogram it according to the same process as a
PROM. EPROM chips will eventually wear out, but they frequently have lifetimes of over
1000 erasures.

EEPROM: To modify an Electrically Erasable Programmable ROM chip, apply localized


electrical fields to erase and rewrite the data. EEPROMs have several advantages over
other types of ROM. Unlike the earlier forms, you can rewrite EEPROM without
dedicated equipment, without removing it from the hardware, and in specifically
designated increments. You don’t have to erase and rewrite everything to make a single
edit.
 Mobile phone ROM is integrated in flash IC
 Function: It loads the current mobile phone operating system (OS) or program in
the phone
 Fault: If faulty the phone will have software problem ie it will hang on logo, keep
on restarting, sometimes get dead

e) Power IC/Power management IC


PMU: The Power Management Unit [PMU] is an IC chip responsible for power discharge
to some parts of your phone. Besides its presence in the phone's printed circuit board,
your phone needs it to turn on. More so, this chip is a small fragment, but you can get it
replaced when damaged.

Power IC manages complete power distribution in the motherboard, power IC receives


power from battery and then it distributes power as per the requirement by the
Operating system.

A specific problem to encounter when you have a damaged PMU is that your phone will
not turn on anymore. If you want to repair your phone IC, check your power
management unit to verify the fault. Although the mobile power IC repair cost might be
huge, opt for a power IC chip replacement if the PMU is faulty.
Mobile power IC is surrounded by so many small components and found in power
section of PCB.

Power IC

f) Charging IC
Charging IC makes sure only desired amount of current and voltage pass through it and
charge the device without damage.

Mobile phone charging IC is found in power section around charging sub-section


Fault: If faulty the phone battery will not charge and if short the phone might not power
on.

Charging IC
g) Audio IC
Audio ICs are responsible for regulating your devices audio input and output. It controls
earpiece, speaker and mouthpiece.
If the sound is not coming out of your device properly or not at all, the problem may be
a faulty audio IC.
When this IC is shorted or faulty, the speaker and mic will not work. This is the problem
that makes people scream like those in hell fire when they are not heard at the other
caller’s end thinking their shout will repair the phone…hmmm. This may even cause the
phone to go dead as a result of this IC problem.

Audio IC
h) Logic IC/UI IC
The Logic or user interface (UI) IC found in any part of a mobile phone controls the
operation of internal parts like the phone vibrator, ringer and the LED in a mobile
phone. If the logic IC is bad, there will be problem with the listed parts which it controls.

i) RTC (Real Time Clock)/Simple silicon crystal


Earlier versions of mobile phones had an off chip(separate) RTC with a backup battery.
But most smartphones have an on-chip RTC (inbuilt) to save space. These RTCs do not
have a backup battery but rely on the phone’s battery. But they can run even when the
phone is powered off due to low battery. This is because even when the battery had run
out, it still holds around 3.2V which is enough to run an RTC.

This explains why a smartphone’s time is reset once you remove its battery. RTC is
found in power section of PCB.
RTC controls time and date. If it is faulty the phone will have no time and date and it can
get dead.

RTC
j) Network switch/Antenna switch
This component has both metallic and non-metallic make-up. It can be found in the
network section of a mobile phone near PA. You can identify it by its color which is
either silver or golden.
It usually performs the function of searching network, tuning and then sending forward.
When the antenna switch is faulty, there will be network problem in the mobile phone
even “if you go climb” Safaricom mask to get network.

Antenna Switch

k) PA(Power Amplifier)/PFO(Power Frequency Oscillator)


This component is also found in the network section of a mobile phone near antenna
switch. It is also referred to as the P.A. (Power Amplifier), just like the one used in party
to boost your loudspeaker during a party.

This component is responsible for filtering, amplifying and selecting the country home
network of a mobile phone; e.g. safaricom, airtel, telecom etc.
When the Power amplifier is faulty, a network problem will also surface and calls will be
difficult or impossible due to network problem. When this problem happens, replace
the PA.

Power Amplifier IC

l) Network IC/RF(Radio Frequency) IC


Let me take you now in to the world of the spirit! This “black thing” (RF IC) is also known
as Hagar, “not the concubine of Abraham”, the woman in the Holy Books. RF signal
processor or Network IC as it is called, can be found in the network section on the PCB.

While controlled by the CPU, it works as both transmitter and receiver, I did not say
“transmission, oh sorry sir, I mean” of audio and radio waves (meaning that you are
about to fly now into the spirit) or the world of signals which makes user
communication possible.

When this component is faulty, network will not be stable or strong and can result in
power problem when the IC is shorted.

RF IC

m) Network crystal/26 MHz Crystal Oscillator


It is also known as the network crystal and is found around the PFO in the network
section. You will observe that this component is mostly shinny and has metallic make-
up.

It is this component that creates the frequency that makes an outgoing call possible
when a user is engaged on the order end.

When this component is faulty, one won’t be able to make a call and network also will
not be available and then your phone becomes an MP3 player or iPod. When it is
shorted you can experience a dead phone situation too.

Network Crystal

n) VCO (Voltage Controlled Oscillator)


This is found close to or integrated in the network IC of the network section in mobile
phones. This Chip acts like a gate man that keeps watch of your movement to know if
you are a suspect or that you should be killed immediately.

The VCO controls and regulates the sending of time, date and current voltage to the
radio frequency IC as it receives signals or command from the CPU of the mobile phone.

When this component is faulty, it results in “call end” or “call failed” as you will see in
some phone while you are at this job.

o) RX, TX Filters
The RX filter is also found in the network section of a mobile phone and filters
frequencies during an incoming call.

When this component is faulty, incoming calls will be impossible due to weak or no
network frequency; you can find the RX filter test point on the PCB in the event of a
broken path or so, and is useful when flashing feature or basic phones using miracle box
pinouts.
TX Filter: This is the sibling to RX, it has to do with the outgoing end. This component is
responsible for filtering electronic signals or frequencies during an outgoing call so you
don’t get all that humming bird distortion or stuffs like “oga the line dey break o, abeg
call me back”.

When this component is faulty the network may be noisy or call may not even get
through at all. The test point is a gate way just like the RX test point when flashing
feature or basic phones using the rx, tx cable in software boxes.

Activity

In groups identify the components above on PCB of the phones given

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