Inspur Server NF5280M6

User Manual

Document Version: V1.3

Release Date: Sep 22, 2021
Copyright © 2021 Inspur Electronic Information Industry Co., Ltd. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any

means without prior written consent of Inspur.

Environmental Protection
Please dispose of product packaging by recycling at a local recycling center for a
greener planet.

Trademarks
Inspur and Inspur Logo are the registered trademarks of Inspur.
All the other trademarks or registered trademarks mentioned herein are the property of
their respective holders.

Security Statement
• Inspur is intensely focused on server product safety and has placed a high priority
on this. For better understanding of our server products, carefully read through the
following security risk statements.

• When servers are to be repurposed or retired, it is allowed to restore their firmware

factory settings, delete information and clear logs from BIOS and BMC to protect
data privacy. Meanwhile, it is suggested to wipe the drive data thoroughly and
securely with third-party erasing tools.

• The products, services or features you purchased may obtain or use some personal
data (such as email address for alerts and IP address) during operation or fault
locating. There should be user privacy policies in place with adequate measures
implemented in accordance with the applicable laws to ensure that users' personal
data are fully protected.

• For server open source software statement, please contact Inspur Customer
Service.

• Some interfaces and commands for production, assembly and return-to-depot,

and advanced commands for locating faults, if used improperly, may cause
equipment abnormality or business interruption. This is not described herein.
Please contact Inspur for such information.

• The external interfaces of Inspur servers do not use private protocols for
communication.

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• Inspur has established emergency response procedures and action plans for
security vulnerabilities, so that product safety issues can be dealt with in a timely
manner. Please contact Inspur Customer Service for any safety problems found or
necessary support on security vulnerabilities when using our products.

Inspur shall remain committed to safety of our products and solutions to achieve better
customer satisfaction.

Disclaimer
The purchased products, services and features shall be bound by the contract made
between Inspur and the customer. All or part of the products, services and features
described herein may not be within your purchase or usage scope. Unless otherwise
agreed in the contract, Inspur makes no express or implied statement or warranty on
the contents herein. Images provided herein are for reference only and may contain
information or features that do not apply to your purchased model. This manual is only
used as a guide. Inspur shall not be liable for any damage, including but not limited to
loss of profits, loss of information, interruption of business, personal injury, or any
consequential damage incurred before, during, or after the use of our products. Inspur
assumes you have sufficient knowledge of servers and are well trained in protecting
yourself from personal injury or product damages during operation and maintenance.
The information in this manual is subject to change without notice. Inspur shall not be
liable for technical or editorial errors or omissions contained in this manual.

Technical Support
Technical Service Hotline: 1-844-860-0011/1-760-769-1847

No. 1036 Langchao Road, Jinan, PRC

Address:
Inspur Electronic Information Industry Co., Ltd

Zip Code: 250101

Email: serversupport@inspur.com

ii
 Foreword
Abstract
This manual describes NF5280M6 server's specifications, features, hardware setup,
warranty information and troubleshooting, which will help users to understand how
best to utilize the server and all its functionalities.

Target Audience
This manual is intended for:

• Technical support engineers

• Product maintenance engineers

It is recommended that server installation, configuration, and maintenance is

performed by experienced technicians only.

Safety Precautions
• If your purchases do not include Inspur on-site installation service, make sure that
you inspect the shipping cartons before unpacking the equipment. If a shipping
carton appears severely damaged, water immersed, or the seal or
pressure-sensitive adhesive tape (PSA) is broken, report this based on your
purchase channel. If you purchased from a third-party supplier, contact your
supplier directly; if you purchased through Inspur direct sales stores, call Inspur
service hotline 1-844-860-0011/1-760-769-1847 for technical support.

• For your safety, please do not disassemble the server’s components, extend
configuration or connect other peripherals arbitrarily. You can contact Inspur for
our support and guidance.

• Before disassembling the server’s components, please be sure to disconnect all the
cables connected to the server.

• Please install the product-compatible operating system and use the driver that
comes with the server or provided by Inspur. You can go to our official site, on the
Top Navigator, click on Support > Product Support > Drivers, then find the correct
driver of your product based on the prompt. An incompatible operating system or
a non-Inspur driver may cause compatibility issues and affect the normal use of
the product. Inspur will not assume any responsibility or liability for this.

• BIOS and BMC setup is a significant factor in correctly configuring your server. If

iii
 there are no special requirements, it is suggested to use the Default Values and not
alter the parameter settings arbitrarily. After the first login, please change the BMC
user password in time.

Symbol Conventions
The symbols that may be found in this document are defined as follows.

Symbol Description

A potential for serious injury, or even death if not

properly handled

A potential for minor or moderate injury if not

properly handled

A potential loss of data or damage to equipment if

not properly handled

Operations or information that requires special

attention to ensure successful installation or
configuration

Supplementary description of manual information

Revision History
Version Date Description of Changes

V1.0 2021/03/20 Initial release

1. Added notes for Gen4 PCIe expansion

cards

V1.1 2021/05/20 2. Added troubleshooting for HCA card

installation

3. Updated thermal restrictions

Updated the Inspur logo and corrected a

V1.2 2021/07/01
typo

iv
Version Date Description of Changes

V1.3 2021/09/22 1. Added Erp Lot 9 tables

v
 Table of Contents
1 Safety Instructions ...................................................................................... 1

1.1 Warnings ......................................................................................................... 1

1.2 Precautions ..................................................................................................... 2

2 Product Specifications ................................................................................ 5

2.1 Introduction .................................................................................................... 5

2.1.1 24 × 2.5" Configuration (Full configuration) .......................................... 6

2.1.2 12 × 3.5" Configuration (Full configuration) .......................................... 6

2.1.3 25 × 2.5" Configuration (Full configuration) .......................................... 7

2.2 Features and Specifications ............................................................................ 8

2.3 Power Efficiency ............................................................................................ 10

3 Product Overview ..................................................................................... 14

3.1 Front View ..................................................................................................... 14

3.1.1 24 × 2.5" Drive Bay .............................................................................. 14

3.1.2 25 × 2.5" Drive Bay .............................................................................. 14

3.1.3 12 × 3.5" Drive Bay .............................................................................. 15

3.1.4 Front Panel Buttons and LEDs ............................................................. 15

3.1.5 Drive Tray LEDs ................................................................................... 17

3.1.6 PSU LEDs ............................................................................................. 17

3.2 Rear View ...................................................................................................... 18

3.3 Motherboard View ........................................................................................ 19

3.4 Motherboard Jumper Introduction................................................................. 21

3.5 Layout ........................................................................................................... 22

4 Getting Started ......................................................................................... 24

4.1 Installing Server into the Rack ....................................................................... 24

4.2 Power On/Off ................................................................................................ 24

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 4.3 Pre-Disassembly Instructions ........................................................................ 24

4.4 Disassembly/Reassembly Process ................................................................ 26

4.4.1 Access Panel Replacement ................................................................. 26

4.4.2 Super-Capacitor Replacement ............................................................ 28

4.4.3 Air Duct Replacement ......................................................................... 29

4.4.4 Hot-Swap Fan Module Replacement .................................................. 29

4.4.5 Onboard M.2 Drive Replacement ........................................................ 30

4.4.6 DIMM Replacement ............................................................................. 32

4.4.7 Processor and Heatsink Module (PHM) Replacement ......................... 36

4.4.8 PCIe Card Replacement ...................................................................... 40

4.4.9 Hot-Swap Storage Drive Replacement ............................................... 42

4.4.10 Hot-Swap PSU Replacement ............................................................... 45

4.4.11 OCP Card Replacement ....................................................................... 46

4.4.12 Rear M.2 Drive Replacement ............................................................... 47

4.4.13 E1.S Drive Replacement ...................................................................... 50

4.5 Firmware Update and Configuration............................................................. 51

4.6 Cabling.......................................................................................................... 51

5 Battery Replacement ................................................................................ 54

6 Electrostatic Discharge ............................................................................. 56

6.1 Preventing Electrostatic Discharge ................................................................ 56

6.2 Grounding Methods to Prevent Electrostatic Discharge................................. 56

7 Troubleshooting ....................................................................................... 57

7.1 Hardware Problems ...................................................................................... 57

7.2 Software Problems ........................................................................................ 63

8 Environmental Requirements ................................................................... 66

8.1 Ambient Temperature ................................................................................... 66

8.2 Vibration and Shock Resistance .................................................................... 66

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 8.3 Altitude and Air Pressure ............................................................................... 67

8.4 Alternating Temperature and Humidity ........................................................ 67

8.5 Extended Operation Temperature ................................................................. 67

8.6 Extended Operation Temperature Limits ....................................................... 68

8.7 Thermal Restrictions ...................................................................................... 68

8.8 Operational Requirement.............................................................................. 69

8.9 Electromagnetic Compatibility Requirements ............................................... 72

8.10 Power Supply Requirements ......................................................................... 74

8.10.1 AC Power Supply Requirement ........................................................... 74

8.10.2 DC Power Supply Requirement ........................................................... 75

8.10.3 Recommendations on the AC Power Supply ....................................... 76

8.10.4 HVDC Power Supply ............................................................................ 76

8.10.5 HVDC Power Supply Requirements ..................................................... 76

8.10.6 HVDC Power Supply Suggestions ........................................................ 77

8.10.7 DC Power Supply ................................................................................ 78

9 Warranty .................................................................................................. 79

9.1 Warranty Service ........................................................................................... 79

9.2 Inspur Service SLA ......................................................................................... 81

9.3 Warranty Exclusions ...................................................................................... 81

Appendix ........................................................................................................ 83

A.1 Drive Neodymium Content Reference Table .................................................. 83

A.2 Acronyms and Abbreviations ........................................................................ 84

A.3 Backplane DIP Switch .................................................................................... 91

viii
1 Safety Instructions
1.1 Warnings
Please be advised to follow the instructions below for safety. Failure to do so could
result in potential dangers that may cause property loss, personal injury or death.

• The power supplies in the system may produce high voltages and energy
hazards that may cause personal injury. For your safety, please do not attempt
to remove the cover of the system to dissemble or replace any component on
your own. Unless informed by Inspur, only service technicians trained by Inspur
are authorized to do so.

• Please connect the equipment to an appropriate power supply. Use only the
external power supplies indicated on the rated input label to power the system.
To protect your equipment from damages caused by a momentary spike or
plunge of the voltage, please use voltage stabilizing equipment or
uninterruptible power supplies.

• Do not connect two or more power cords to each other. If a longer power cord
is needed, contact Inspur Customer Service.

• Please be sure to use the power supply components that come with the server,
such as power cords, power socket (if provided with the server) etc. For your
safety and safety of the equipment, please do not replace power cords or
plugs randomly.

• To prevent electric shocks caused by leakage in the system, please make sure
that the power cables of the system and peripherals are correctly connected to
the earthed/grounded outlet. Please connect the three-core power plug to the
three-core AC power outlet that is well earthed and within reach. Be sure to use
the earthing/grounding pin of power cord and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the
earthing/grounding conductors are not installed and it is uncertain whether
there is appropriate earthing/grounding protection, please do not use or
attempt to operate the equipment. You can contact and consult an electrician.

• Please do not push any objects into the openings of the system. Doing so may
cause short circuit of internal components and then lead to fire or electric
shock.

• Please keep the system far away from the heatsink and heat sources, and be
sure not to block the air vents.

• Please be sure not to scatter food or spill liquid into the system or onto other
components. Do not use the product in high humid or dusty environments.

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 • Using an incompatible battery may cause explosion. When battery
replacement is required, please consult the manufacturer first, and choose
batteries of the same or equivalent type suggested by them. Do not
disassemble, crush, puncture the batteries or short circuit the external
connection point, and do not expose them in the environment over 60°C. Never
throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries properly. Do not put waste batteries, circuit
boards or other components that may contain batteries with other wastes. For
battery recycling, please contact the local waste recycling center.

• For independent cabinets, please install front and side stabilizers before
installing the equipment into the cabinet. For cabinets connected with other
cabinets, please install front stabilizers first. Failure to install the
corresponding stabilizers before installing the equipment into the cabinet may
cause the cabinet to tip over, possibly leading to personal injury. Hence, please
do make sure to install stabilizers before installing the equipment into the
cabinet. After installing the equipment and other components into the cabinet,
only one component can be pulled out from the cabinet through its sliding part
at one time. Pulling out several components at the same time may cause the
cabinet to turn over, resulting in serious personal injury.

• Please do not move the cabinet on your own. Considering the height and
weight of the cabinet, the moving of the cabinet should be completed by at
least two people. Moving it without adequate, trained personnel could result in
severe injury or death.

• It is prohibited to directly short-circuit the copper busbar. Please do not touch

the copper busbar when the cabinet is powered on.

• This is a Class A product, and may cause radio interference. In such case, users
may need to take necessary measures to mitigate the interference.

1.2 Precautions
The following considerations may help avoid problems that could damage the
components or cause data loss, etc.

• In the event of the following, please unplug the power plug from the outlet and
contact Inspur Customer Service:

– The power cords or power plugs are damaged.

– The products get wet.

– The products have fallen or have been damaged.

– Other objects have fallen into the products.

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 – The products do not or cannot function normally even when you operate
according to the instructions.

• If the system gets wet or damp, please follow steps below:

a. Power off the equipment, disconnect them with the outlet, wait for 10 to 20
seconds, and then open the access panel.

b. Move the equipment to a well-ventilated place to dry the system for at

least 24 hours and make sure that the system is fully dried.

c. Close the access panel, reconnect the system to the power outlet, and then
power on.

d. In case of operation failure or other abnormal situations, please contact

Inspur for technical support.

• Avoid cabling system cables and power cords in high foot traffic locations. Please
do not place objects on the cables.

• Before removing the access panel or accessing the internal components, please let
the equipment cool down first. To avoid damaging the motherboard, please power
off the system and wait for 5 seconds, and then remove components from the
motherboard or disconnect the peripherals from the system.

• If there are modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:

– In case of lightning, please do not connect or use the modem. Otherwise,

there's risk of lightning stroke.

– Never connect or use the modem in a damp environment.

– Never insert the modem or telephone cables into the socket of network
interface controller (NIC).

– Before unpacking the product package, accessing or installing internal

components, or touching uninsulated cables or jacks of the modem, please
disconnect the modem cables.

• In order to avoid damages of electronic components in the equipment caused by

electrostatic discharge, please pay attention to the followings:

a. Please remove any static electricity on your body before dismounting or

accessing any electronic component in the equipment, to prevent the static
electricity from conducting itself to the sensitive components. You may
remove the static electricity on your body by touching the metal earthing
objects (such as the unpainted metal surface on the rack).

b. Please do not take static sensitive components that are not ready to be
installed or used out of the anti-static packages.

3
 c. During operation, please touch the earthing conductor or the unpainted
metal surface on the cabinet regularly to remove any static electricity from
your body that may damage the internal components.

• When dismounting internal components upon receiving proper authorization from

Inspur, please pay attention to the followings:

a. Power off the system and disconnect the cables, including all connections
of the system. When disconnecting the cables, please hold the connector
of the cables to slowly pull them out. Never pull the cables.

b. Only after the products completely cool down can you dismount the
access panel or access the internal components.

c. Please remove any static electricity on your body by touching metal

earthing objects before dismounting or accessing any electronic
component in the equipment.

d. When dismounting, avoid making large movement to prevent damage to

the components or scratching arms.

e. Handle components and plug-in cards with care. Please do not touch the
components or connectors on the plug-in cards. When handling the
plug-in cards or components, firmly grab the edges of the plug-in cards or
those of components, or their metal retaining brackets.

• During cabinet installation and application, please pay attention to the followings:

a. After the cabinet has been installed, please ensure that the stabilizer feet
have been fixed into the cabinet and supported to ground, and the full
weight of the cabinet is on the ground.

b. Always load from the bottom up, and load the heaviest items first.

c. When pulling out components from the rack, apply slight force to keep the
rack balanced.

d. Please be careful when pressing down the release latch to slide the server
in or out as the rail may hurt your fingers.

e. Do not overload the AC power branch circuits in the cabinet. The total load
of the cabinet should not exceed 80% of the ratings of the branch circuits.

f. Ensure that components in the cabinet are well vented.

g. When repairing components in the cabinet, never step on any other

component.

4
2 Product Specifications
2.1 Introduction
The Inspur NF5280M6 is a high-end 2-socket rack server that features the 3rd
generation Intel® Xeon® scalable processors and is designed for high-end IT
applications such as cloud computing, big data, data mining, deep learning etc. The
server maintains high quality and reliability you have come to expect from Inspur
servers and achieves innovation and breakthrough in compute performance, scalability,
configuration elasticity, intelligent management, etc. Hence, it is perfect for
high-demanding customers in telecommunications, finance, large-scale enterprise,
Internet industry, etc.

● Key features:

• 2 Intel® Xeon® scalable processors, TDP up to 270 W

• 3 channels UPI for 11.2 GT/s

• Up to 32 DIMMs with RDIMMs, LRDIMMs, NVDIMMs (BPS), memory mirroring and

memory hot spare supported

• Up to 24 × 2.5" SAS/SATA/NVMe drive or 12 × 3.5" SAS/SATA drive at the front

• Up to 10 × 2.5" SAS/SATA drive or 4 × 2.5" SAS/SATA/NVMe drive and 4 × 3.5"

SAS/SATA drive at the rear

• Up to 4 × 3.5" internal SAS/SATA drive

• 1 OCP 3.0 SFF expansion card

• 4 onboard Slimline x8 connectors to directly attach NVMe drives from CPU

• Up to 14 onboard direct-attached drives from PCH

• Up to 11 standard PCIe expansion cards, including 5 full-height and 6 half-height

half-length cards

• Up to 4 double-width GPUs

• Motherboard integrated with AST2500 BMC chip with KVM functionality as standard

• Hot-swap LCD module and remote monitoring on mobile devices via BMC

• Intel remote BMC debug

• Modular design of drives, PCI expansion cards, PSUs and fans, enabling free-tool
maintenance

• Hot-swap and redundant CRPS of 80 Plus Platinum or higher rank with PMBus and
NM 4.0 functionality

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• Hot-swap fan/fan cage design; the fan is N+1 redundant and of low noise

2.1.1 24 × 2.5" Configuration (Full configuration)

Up to 24 front 2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.

Figure 2-1 24 × 2.5" Configuration

2.1.2 12 × 3.5" Configuration (Full configuration)

3.5 inch drive trays can accommodate 3.5- or 2.5-inch drives.

Up to 12 front 3.5/2.5-inch SAS/SATA/NVMe drives, as shown in the figure below.

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 Figure 2-2 12 × 3.5" Configuration

2.1.3 25 × 2.5" Configuration (Full configuration)

Up to 25 front 2.5-inch SAS/SATA drives, as shown in the figure below.

Figure 2-3 25 × 2.5" Configuration

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2.2 Features and Specifications
Table 2‑1 Features and Specifications

Manufacturing
2021/4
Time
Processor
The 3rd generation Intel® Xeon® scalable processors
Processor Type
(Up to 2 CPUs with TDP up to 270 W)
Socket Two
Chipset
Chipset Type C621A
Memory
Memory Type RDIMMs, LRDIMMs, NVDIMMs (Barlow Pass)
32 (Refer to DIMM Replacement for DIMM population
Memory Slot Qty
and combination principles)
Total Memory
Up to 4.0 TB (128 GB per memory module)
Capacity
I/O Port
2 rear USB 3.0 ports, 1 front USB 3.0 port and 1 front
USB
USB 2.0 port
1 front VGA port
VGA
1 rear VGA port
Serial Port 1 rear serial port
UID LED 2 UID buttons with LEDs (1 front and 1 rear)
Display
Integrated in the Aspeed 2500 chip, up to 1280 × 1024
Controller Type
resolution
Backplane
Backplane Hot-swap SAS/SATA/NVMe drives
NIC
Standard OCP NIC 3.0 cards or standard PCIe cards and
NIC Controller onboard Intel X710 network supported on the
motherboard
Management
Integrated with 1 independent 1000 Mbps network
Management Chip
port, dedicated for IPMI remote management.
 3 onboard PCI Express Gen-Z 4.0 x16 slots and 1
PCI Express 4.0 x16 slot (16 lanes) for PCIe Riser
cards
PCIe Expansion
 The Riser card supports horizontal-inserted
Slot
full-height or half-height cards
 8 PCIe Cards Configuration: Up to 3 Riser cards
(You can choose left 2 slot Riser or left 3 slot Riser)

8
 – Right 2 slot Riser (PCIe signal routed from
CPU0) is populated with a Riser card with 2 PCI
Express 4.0 x16 slots

– Middle 3 slot Riser (PCIe signal routed from

CPU0/CPU1) is populated with a Riser card
with 2 PCI Express 3.0 x8 slots and 1 PCI
Express 4.0 x16 slot

– Left 2 slot Riser (PCIe signal routed from CPU1)

is populated with a Riser card with 2 PCI
Express 4.0 x16 slots

– Left 3 slot Riser (PCIe signal routed from CPU1)

is populated with 1 Riser card with 1 PCI
Express 3.0 x16 slot and 2 PCI Express 3.0 x16
slots

 11 PCIe Configuration
– Right 5 slot Riser (PCIe signal routed from
CPU0/1) is populated with a Riser card with 1
PCI Express 3.0 x16 slot and 4 PCI Express 3.0
x8 slots
– Left 6 slot Riser (PCIe signal routed from
CPU0/1) is populated with a Riser card with 6
PCI Express 3.0 x8 slots
 4-GPU Configuation
– Left 1 slot Riser (PCIe signal routed from CPU1)
is populated with 1 Riser card with 1 PCI
Express 4.0 x16 slot
• 1 onboard OCP NIC 3.0 SFF slot for OCP NIC 3.0
card

Drive

2.5"/3.5" SAS/SATA/NVMe drives (Actual configuration

Drive Type
may vary depending on the model you purchased)

External Storage Drive

Optical Drive External USB optical drives

T-flash Card Built-in TF card

Power

9
 • Single/dual power supplies with output
power at 550 W/800 W/1300 W/1600 W or
higher
Specification • 1+1 redundancy
• 2 power supply units
• PMBus power and Node Manager 4.0
supported
Please refer to the power input on the nameplate label
Power Input
of the chassis

Physical

Outer Packaging 780-length packaging box: 651 width × 295 height ×

Dimensions 1031 depth (mm)

Chassis
780-length chassis: 478.8 width × 87 height × 811.7
Dimensions (With
depth (mm)
Mounting Ears)

 Full configuration of 12 × 3.5" drive (with 12 drives)

Net weight: 31.2 kg

Gross weight: 41 kg (Chassis + Packaging Box + Rails +

Accessory Box)
Product Weight
 Full configuration of 24 × 2.5" drive (with 24 drives)

Net weight: 25.2 kg

Gross weight: 35 kg (Chassis + Packaging Box + Rails +

Accessory Box)

2.3 Power Efficiency

Table 2‑2 Power Efficiency of Platinum Power Supplies

Rated @20% @50% @100% PF@50%

Power Load Load Load Load

550 W 90% 94% 91% 0.98

800 W 90% 94% 91% 0.98

1300 W 90% 94% 91% 0.98

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 Rated @20% @50% @100% PF@50%
Power Load Load Load Load

1600 W 90% 94% 91% 0.98

2000 W 90% 94% 91% 0.98

Table 2-3 Power Efficiency of Titanium Power Supplies

Rated @10% @20% @50% @100% PF@50%

Power Load Load Load Load Load

800 W 90% 94% 96% 91% 0.98

Table 2-4 Erp Lot 9-1

EU Regulation 2019/424 High-end Low-end

performance performance
Server configurations
configuration configuration

(h) idle state power 187.8 166.4

(i) list of all components for

additional idle power
allowances, if any
(additional PSU, HDDs or
See Table 2-5 See Table 2-5
SSDs, additional memory,
additional buffered DDR
channels, additional I/O
devices);

(j) maximum power, 855.3 580.9

expressed in Watts and
rounded to the first decimal
place;

(k) declared operating A2 A2

condition class;

11
 EU Regulation 2019/424 High-end Low-end
performance performance
Server configurations
configuration configuration

(l) idle state power (Watts) 193.2 168.7

at the higher boundary
temperature of the
declared operating
condition class;

(m) the active state 44 31.4

efficiency and the
performance in active state
of the server;

Table 2-5 Erp Lot 9-2

(i) List of components for additional power High-end Low-end

allowance performance performance
configuration configuration
CPU 1 socket: 10 × Perf CPU W
175.91 93.38
Performance 2 socket: 7 × Perf CPU W
Additional 10 W per PSU
10 10
PSU
HDD or SSD 5,0 W per HDD or SSD 10 10
Additional 0,18 W per GB
183.6 45.36
memory
Additional 4,0 W per buffered DDR
buffered DDR channel 32 32
channel
Additional I/O Installed buffered DDR
devices channels greater than 8 0 0
channels
Idle < 1 Gb/s: No Allowance 38 38
Calculated = 1 Gb/s: 2,0 W/Active Port
Watts > 1 Gb/s and < 10 Gb/s: 4,0
W/Active Port
≥ 10 Gb/s and < 25Gb/s: 15,0
W/Active Port
≥ 25 Gb/s and < 50Gb/s: 20,0
W/Active Port

12
(i) List of components for additional power High-end Low-end
allowance performance performance
configuration configuration
≥ 50 Gb/s 26,0 W/Active Port

Total power 449.51 228.74

13
3 Product Overview
3.1 Front View
3.1.1 24 × 2.5" Drive Bay
Figure 3-1 Front Panel of 24 × 2.5" Configuration

# Item

1 Power Button

2 LEDs

3 UID/BMC RST Button

4 Drive Bay × 24

5 VGA Port
6 USB 3.0 Port
7 USB 2.0/LCD Port
8 Quick Release Lever

3.1.2 25 × 2.5" Drive Bay

Figure 3-2 Front Panel of 25 × 2.5" Configuration

# Item

1 Power Button

2 LEDs

3 UID/BMC RST button

4 Drive Bay × 25

14
 # Item

5 VGA Port
6 USB 3.0 Port
7 USB 2.0/LCD port
8 Quick Release Lever

3.1.3 12 × 3.5" Drive Bay

Figure 3-3 Front Panel of 12 × 3.5" Configuration

# Item

1 Power Button

2 LEDs

3 UID/BMC RST button

4 Drive Bay × 12

5 VGA Port
6 USB 3.0 Port
7 USB 2.0/LCD port
8 Quick Release Lever

3.1.4 Front Panel Buttons and LEDs

Table 3‑1 Front Panel Buttons and LEDs

# Icon Item Description

1
 Solid green = Power on state

 Solid orange = Standby state

Power Button
 Long press 4s to force a
shutdown

15
# Icon Item Description

2
 Off = Normal

 Solid red = A failure occurs

System Status LED
 Flashing red = A warning
occurs

3
 Off = Normal

 Solid red = A failure occurs

Memory Status LED
 Flashing red = A warning
occurs

4
 Off = Normal

 Solid red = Fail to read the fan

Fan Status LED speed

 Flashing red = Speed reading is

abnormal

5
 Off = Normal

 Solid red = A power failure

Power Status LED occurs

 Flashing red = Power state is

abnormal

6
 Off = Normal
System Overheat
LED  Solid red = CPU/Memory
overheats

7
 Solid/Flashing green =
Network connected
Network Status  Off = No network connection
LED
Note: It only indicates the working
status of LOM (LAN on
Motherboard).
8
 Solid blue = UID is turned on
UID/BMC RST manually or in the OS
Button
 Flashing blue = KVM has been
launched or firmware update

16
 # Icon Item Description

in process

 Long press 6 seconds to force

BMC to be reset

3.1.5 Drive Tray LEDs

Figure 3-4 Drive Tray LEDs

# Item Description

 Solid green = Normal

1 Activity Status LED  Flashing green = Read/write
activities

 Solid red = Drive error or failed

2 Drive Fault LED  Solid blue = Drive is being located

 Flashing pink = RAID rebuilding

3.1.6 PSU LEDs

Table 3‑2 PSU LEDs

# PSU LED Status Description

1 Solid green Normal
2 Off No AC power to PSU
3 Solid amber A shutdown has occurred due to a
PSU critical event
4 Flashing amber at 1 Hz PSU continues operating after a
warning event has occurred
5 Flashing green at 1 Hz PSU removed from the power bay
with AC input
6 Flashing green at 0.33 Hz (on for PSU operates in cold redundant
2 seconds and off for 1 second) and sleep mode
7 Flashing green at 2 Hz PSU operates in firmware updating

17
 mode

3.2 Rear View

Figure 3-5 Rear Panel

# Item # Item

PCIe_Riser2 Slot (Left

1 10 PSU0
Riser Slot)

PCIe_Riser1 Slot (Middle

2 11 PSU1
Riser Slot)

PCIe_Riser0 Slot (Right

3 12 Rear 2.5" Drive Bays
Riser Slot)

4 Rear M.2 Module 13 UID Button with LED

18
# Item # Item

5 OCP NIC 3.0 14 System/BMC Serial Port

6 Intel X710 SFP+ Port 15 PCIe_Riser1 Slot (Left Riser Slot)

PCIe_Riser0 Slot (Right Riser

7 USB 3.0 Port × 2 16
Slot)

PCIe_Riser1 Slot
8 BMC Management Port 17
(Vertically-Mounted)

9 VGA Port 18 Rear 2.5” Drive Bays

3.3 Motherboard View

Figure 3-6 Motherboard Connectors

FAN7

FAN6

FAN5

FAN4

FAN3

FAN2

# Item # Item

19
# Item # Item

Power Connector
1 OCP 3.0 NIC Card Slot 27
(B_M.2&3BP&GPU_RISER3)

2 TPM Slot 28 Plate Capacitor Connector

3 Mini_SAS Connector (3) 29 PSU1 Connector

GPU_RISER0 Power
4 30 GPU Power Connector
Connector

5 CLR_CMOS Jumper Cap 31 VROC Key Connector

Power Connector
6 32 I2C Connector
(GPU0&MID_PCIe)

Mid-Backplane Power
7 33 PSU0 Connector
Connector

Rear Backplane Power

8 34 BMC TF Card Slot
Connector (4)

Power Connector
9 35 PCIe0_CPU0 Slot
(GPU0_RISER1&MID_PCIe)

10 I2C Connector (4) 36 PCIe0_CPU0 Power Connector

11 CLK Connector (2) 37 NCSI Connector

12 VPP Connector 38 OCPA Slot (CPU0)

13 SGPIO Connector 39 VGA Port

14 Sensor Connector 40 BMC Management Port

Front Backplane Power

15 41 USB 3.0 Port
Connector (3)

16 I2C Connector (2) 42 SFP+ Port

17 Slimline Connector (CPU1) 43 PCIe1_CPU1 Slot

20
# Item # Item

18 Slimline Connector (CPU1) 44 Leakage Detect Connector (2)

19 Left Control Panel Connector 45 Power Button/LED

20 I2C Connector (2) 46 System/BMC Serial Port

21 Intrusion Switch Connector 47 UID Button with LED

22 Slimline Connector (CPU0) 48 PCIe1_CPU1 Power Connector

23 Slimline Connector (CPU0) 49 PCIe0_CPU1 slot

24 SYS_TF Card Button 50 Right Control Panel Connector

25 Debug Connector 51 I2C Connector

26 SATA Connector (2) 52 I2C Connector

3.4 Motherboard Jumper Introduction

It is required to shut down the system and disconnect the power supply during
CMOS clearing.

See Motherboard View for the jumper location.

Table 3‑3 CMOS Jumper Cap

Item Description Function

J122 CMOS clear jumper Short-circuit pins 1-2 to restore to

(CLR_CMOS) normal status; short-circuit pins
2-3 to clear the CMOS setting.

To reset/clear the CMOS setting via a jumper:

1. Power down the server and unplug the power cable from the electrical outlet.

2. Wait for 5 seconds.

21
3. Locate the CMOS clear jumper on the motherboard.

4. Move the jumper cap from the default pins 1-2 to pins 2-3.

5. Plug in the power cable and power on the server, and then wait for 10 seconds
for the CMOS to clear.

6. Power down the server, unplug the power cable, and then wait for 5 seconds
again.

7. Move the jumper cap back to the default pins 1-2.

8. Reconnect the power cable and power on the server.

3.5 Layout
Figure 3-7 System Layout

# Item # Item

1 Front Drive Bays 13 Plate Capacitor

2 Internal Drive Bays 14 Rear 3.5-inch Drive Bays

3 Fan Modules 15 Processor Heatsink Modules

(PHMs)
4 Air Duct 16 Rear 2.5-inch Drive Bays

5 Access Panel 17 Rear M.2 Modules

6 Rear 2.5-inch Drive Bays 18 Rear E1.S Modules

7 Right Riser Card Module 19 DIMMs

(8-Card Configuration)
8 Middle Riser Card Module 20 Motherboard

22
# Item # Item

(8-Card Configuration)

9 Left Riser Card Module (8-Card 21 Right Riser Card Module

Configuration) (11-Card Configuration)
10 GPU Modules (4-GPU 22 Left Riser Card Module
Configuration) (11-Card Configuration)
11 PSUs 23 Chassis

12 Riser Card Module (4-GPU 24 Front Drive Backplane

Configuration)

23
4 Getting Started
4.1 Installing Server into the Rack
For detailed information on installing the server into the rack with rails supplied by
Inspur, see Rack-Mounted Server Installation Guide.

If you would like to use non-Inspur rails, please contact Inspur Customer Service
first to ensure the server can be installed to the rack safely and properly. The
loading-bearing capacity of non-Inspur rails must be higher than 100 kg. If not,
you MUST use Inspur-supplied rails as using these non-Inspur rails may cause
such risks as installation failure. Inspur will not assume any responsibility or
liability for any damage or injury caused by this.

To reduce the risk of personal injury or damage to the equipment, DO secure the
mounting ears to the posts firmly to prevent server from moving or sliding out
from the cabinet.

4.2 Power On/Off

To power on and off the server, press the power button.

To completely shut down the server, press the power button and disconnect the
power cable from the server.

To reduce the risk of personal injury, electric shock, or damage to the equipment,
remove the power cord to disconnect power from the server. The Power button
does not shut off the system power completely. Portions of the power supply and
some internal circuitry remain active until the AC power is removed.

4.3 Pre-Disassembly Instructions

Read the installation instructions for all the hardware operations before
disassembling or re-assembling the components. All prerequisites must be
completed prior to starting installation or maintenance.

24
To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching.

To prevent damage to electrical components, properly ground the server before

installation. Improper grounding can cause electrostatic discharge.

Do the following prior to installation or maintenance:

1. Shut down the server

2. Remove all cables from the system

• To reduce the risk of personal injury or equipment damage, be sure that the
rack is adequately stabilized before you extend a component from the rack.
• To reduce the risk of personal injury, be careful when sliding the server into
the rack. The sliding rails could pinch your fingers.

3. Open the quick release levers on the front panel of the server, and then loosen
the two captive screws securing the server in place.

4. Gently slide and remove the server out of the rack.

25
 Figure 4-1 Removing the Server from the Rack

5. After performing installation or maintenance, slide the server all the way back
into the rack and secure it in place.

4.4 Disassembly/Reassembly Process

• Before installation or removal of any hardware, always ensure all data is

backed up properly.

• Disconnect the server and all attached devices from their electrical
outlets.

• There is no need to remove power from the server when replacing

hot-swap components.

• If more than one option is to be installed, read the installation

instructions for all the hardware options and identify similar steps to
streamline the installation process.

Item appearance may be different on actual models.

4.4.1 Access Panel Replacement

26
To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching.

For proper cooling, do not operate the server without the access panel, air duct,
or fan installed. If the server supports hot-swap components, minimize the
amount of time the access panel is open.

To remove the access panel:

1. Loosen the screw on the hood latch anticlockwise to the unlocked position with
a Phillips screwdriver

2. Lift up the hood latch handle to the unlocked position until the access panel
slides back and the tabs on the access panel disengage from the guide slots on
the chassis.

3. Hold the access panel on both sides and remove it.

Figure 4-2 Removing the Access Panel

To install the access panel:

1. Align the standoffs on the access panel with the J-slots on the server and lower
down the access panel with the hood latch open.

27
 2. Press down the hood latch until it locks into place. Make sure the access panel
snaps into place.

3. Tighten the screw on the hood latch clockwise to the locked position with a
Phillips screwdriver.

4.4.2 Super-Capacitor Replacement

To remove the super-capacitor:

1. Remove the access panel (Refer to Access Panel Replacement).

2. Disconnect the cable of the super-capacitor.

3. Undo the velcro of the super-capacitor.

4. Remove and put the super-capacitor into an antistatic bag.

Figure 4-3 Removing the Super-Capacitor

To install the super-capacitor:

1. Take the new super-capacitor out from the antistatic bag and position it in
place.

2. Secure the super-capacitor with velcro.

Figure 4-4 Installing the Super-Capacitor

28
 3. Connect the cable of the super-capacitor.

4. Install the access panel.

4.4.3 Air Duct Replacement

For proper cooling, do not operate the server without the access panel, air ducts,
expansion slot blanks, or other blanks installed. If the server supports hot-swap
components, minimize the amount of time the access panel is open.

To remove the air duct:

1. Remove the access panel (Refer to the Access Panel Replacement).

2. Remove the super-capacitor on the air duct (Refer to Super-Capacitor

Replacement).

3. Remove the air duct with both hands to remove it.

Figure 4-5 Removing the Air Duct

To install the air duct:

1. Lower down the air duct into the chassis until it snaps into place.

2. Install the super-capacitor.

3. Install the access panel.

4.4.4 Hot-Swap Fan Module Replacement

To remove the fan module:

29
 1. Remove the access panel (Refer to Access Panel Replacement).

2. Hold and press the release tab on one side of the fan module, and lift up the
fan module slowly out of the fan bay.

3. Put the fan module into an antistatic bag.

Figure 4-6 Removing the Fan Module

To install the fan module:

1. Take the new fan module out from the antistatic bag.

2. Align the fan power connector with the power connector on the motherboard,
and install the fan module vertically to the motherboard.

Figure 4-7 Installing the Fan Module

3. Install the access panel.

Verify that the fan status LED is off after powering on the server.

4.4.5 Onboard M.2 Drive Replacement

To remove the M.2 drive:

30
1. Remove the access panel (Refer to Access Panel Replacement).

2. Disconnect the cable of the super-capacitor.

3. Remove the air duct.

4. Pull out the plug of M.2 clip. One side of the M.2 drive pops up.

Figure 4-8 Pulling Out the Plug of M.2 Clip

5. Tilt to pull the M.2 drive out from the drive slot on the motherboard, and put it
into an antistatic bag.

Figure 4-9 Removing the M.2 Drive

To install the M.2 drive:

1. Take the new M.2 drive out from the antistatic bag.

2. Tilt the M.2 drive to insert it into the drive slot on the motherboard.

Figure 4-10 Installing the M.2 Drive

3. Insert the plug into the M.2 clip base to secure the M.2 drive in place.

31
 Figure 4-11 Inserting the Plug

4. Install the air duct.

5. Connect the cable of the super-capacitor.

6. Install the access panel.

4.4.6 DIMM Replacement

• Mixing use of RDIMMs and LRDIMMs is not allowed.

• Mixing use of BPS is not allowed.
• Mixing use of BPS with RDIMMs or LRDIMMs is allowed.

To remove the DIMM:

1. Remove the access panel (Refer to Access Panel Replacement).

2. Disconnect the cable of the super-capacitor.

3. Remove the air duct (Refer to Air Duct Replacement).

4. Locate the DIMM you want to replace.

5. Push the release tabs on both ends of the DIMM slot outward to unlock it.

6. Gently lift and remove the DIMM from the slot.

32
Figure 4-12 Removing the DIMM

7. Put the DIMM into the memory box.

To install the DIMM:

Make sure the release tabs on both ends of the DIMM slot are fully opened.

1. Take the new DIMM out from the memory box.

2. Align the bottom notch with the receptive point on the slot. Use two thumbs
together to press both ends of the DIMM straight down into the slot until it
snaps into place.

Figure 4-13 Installing the DIMM

3. Install the air duct.

33
4. Connect the cable of the super-capacitor.

5. Install the access panel.

Figure 4-14 DIMM Slot Layout

CPU1_C1D0
CPU1_C1D1
CPU1_C0D0
CPU1_C0D1
CPU1_C3D0
CPU1_C3D1
CPU1_C2D0
CPU1_C2D1

CPU1

CPU1_C6D1
CPU1_C6D0
CPU1_C7D1
CPU1_C7D0
CPU1_C4D1
CPU1_C4D0
CPU1_C5D1
CPU1_C5D0
CPU0_C1D0
CPU0_C1D1
CPU0_C0D0
CPU0_C0D1
CPU0_C3D0
CPU0_C3D1
CPU0_C2D0
CPU0_C2D1

CPU0

CPU0_C6D1
CPU0_C6D0
CPU0_C7D1
CPU0_C7D0
CPU0_C4D1
CPU0_C4D0
CPU0_C5D1
CPU0_C5D0

Detailed DIMM population and combination principles are as follows:

DDR4 Population Sequence under Single-CPU

Configuration
Table 4‑1 DDR4 Population Sequence under Single-CPU Configuration
CPU0
DDR4
C0 C1 C2 C3 C4 C5 C6 C7
Qty
D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1
1 v
2 v v
4 v v v v
6 v v v v v v
8 v v v v v v v v
12 v v v v v v v v v v v v
16 v v v v v v v v v v v v v v v v

34
DDR4 Population Sequence under Dual-CPU Configuration
Table 4‑2 DDR4 Population Sequence under Dual-CPU Configuration
CPU0 CPU1
DDR4
C0 C1 C2 C3 C4 C5 C6 C7 C0 C1 C2 C3 C4 C5 C6 C7
Qty
D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1
1 v
2 v v
3 v v v
4 v v v v
8 v v v v v v v v
12 v v v v v v v v v v v v
16 v v v v v v v v v v v v v v v v
24 v v v v v v v v v v v v v v v v v v v v v v v v
32 v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v v

BPS need to be used with DDR4. In the following images, “D” stands for DDR4,
and B for BPS.

Mixing Population Sequence of DDR4s and BPS under

Single-CPU Configuration
Table 4‑3 Mixing Population Sequence of DDR4s and BPS under Single-CPU
Configuration
CPU0
DDR4 BPS
C0 C1 C2 C3 C4 C5 C6 C7
Qty Qty
D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1
4 4 D B D B D B D B
6 1 D D D B D D D
8 1 D B D D D D D D D
8 4 D B D D B D D B D D B D
8 8 D B D B D B D B D B D B D B D B
12 2 D D B D D D D D D B D D D D

Mixing Population Sequence of DDR4s and BPS under

Dual-CPU Configuration
Table 4‑4 Mixing Population Sequence of DDR4s and BPS under Dual-CPU
Configuration
CPU0 CPU1
DDR4 BPS
C0 C1 C2 C3 C4 C5 C6 C7 C0 C1 C2 C3 C4 C5 C6 C7
Qty Qty
D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1 D0 D1
8 8 D B D B D B D B D B D B D B D B
12 2 D D D B D D D D D D B D D D
16 2 D B D D D D D D D D B D D D D D D D
16 8 D B D D B D D B D D B D D B D D B D D B D D B D
16 16 D B D B D B D B D B D B D B D B D B D B D B D B D B D B D B D B
24 4 D D B D D D D D D B D D D D D D B D D D D D D B D D D D

35
4.4.7 Processor and Heatsink Module (PHM)
Replacement
The server supports single- or dual-processor configuration depending on the model
you purchased.

• To help avoid damage to the processor and motherboard, do not install the
processor without using the processor installation tool.
• To prevent possible server malfunction and damage to the equipment,
multiprocessor configurations must contain processors with the same part
number.

To remove the PHM:

The heatsink may be hot after the system has been powered down. Allow the
heatsink to cool down for a few minutes before removing it.

1. Remove the access panel (Refer to Access Panel Replacement).

2. Disconnect the cable of the super-capacitor.

3. Remove the air duct (Refer to Air Duct Replacement).

4. Use a T30 Torx Screwdriver to loosen the four screws securing the Processor
Heatsink Module (PHM) to the CPU socket anticlockwise in the sequence as
shown on the heatsink label.

5. Press the lock-in wires inward with both hands to open positions.

6. Gently remove the PHM module from the CPU socket.

36
Figure 4-15 Removing the PHM

• Use a protective cover to protect the CPU socket to avoid damaging socket
pins after removing the PHM.
• The gold pins on the CPU are fragile and can be easily damaged if touched.
During removal and installation, always keep the gold pins up and DO NOT
touch the pins when processor dedicated insertion/removal tool (CPU tray)
is unavailable.

7. Lift up the lever on the Clip to the open position. Pry the three tabs securing the
CPU to the Clip. Gently remove the CPU from the Clip, and put it into an
antistatic bag.

37
Figure 4-16 Removing the CPU

8. Gently pry the two tabs on one side of the Clip open.

9. Remove the Clip from the heatsink.

10. Lock the lever on the Clip.

Figure 4-17 Removing CPU Clip

38
• Use a clean and lint-free cloth to wipe off the old thermal grease first if the
heatsink is to be reused.
• Coat thermal grease evenly onto the heatsink before reusing the heatsink.

To install the CPU:

The gold pins on the CPU are fragile and can be easily damaged if touched.
During removal and installation, always keep the gold pins up and DO NOT
touch the pins when processor dedicated insertion/removal tool (CPU tray) is
unavailable.

1. With the heatsink thermal grease side up, align the triangle mark on the Carrier
Clip with the number ① on the heatsink label, and then press the Clip straight
down onto the heatsink until the four retaining tabs of the Clip snap into place.

Figure 4-18 Installing the CPU Clip

2. Apply thermal grease evenly across the heatsink in the size of the CPU surface
area.

39
 3. With the gold pins up, align the triangle mark on the CPU with that on the Clip.
Grasp CPU by its two edges, and install it into the Clip. Make sure the notches of
the CPU are aligned with the tabs of the Clip and the CPU is secured in place by
the tabs on the four sides of the Clip.

Figure 4-19 Installing the CPU

4. Remove the protective cover if present.

5. With the gold pins down, align the triangle mark on the CPU with that on the
heatsink to attach the PHM onto the CPU socket.

6. Press the four lock-in wires outward with both hands simultaneously.

7. Tighten the four screws securing the PHM to the CPU socket clockwise in the
sequence as shown on the heatsink label with a T30 Torx screwdriver.

8. Install the air duct.

9. Connect the cable of the super-capacitor.

10. Install the access panel.

4.4.8 PCIe Card Replacement

• To prevent damage to the server or expansion cards, power down the server
and remove all power cables before removing or installing the PCIe card.
• To prevent damage to the PCIe slot pins, be sure to apply even force and

40
 pull and insert the PCIe card vertically.
• If the Riser card (the Riser card under 4-GPU configuration excluded) is
marked with silkscreen "IV", then it supports Gen4 PCIe expansion cards by
default; otherwise, it doesn't support Gen4 PCIe expansion cards by default.
• The Riser card under 4-GPU configuration supports Gen4 PCIe GPU by
default.

To remove the PCIe card:

1. Remove the access panel (Refer to Access Panel Replacement).

2. Disconnect the power cables and clock cables (if available) on the Riser card.

3. Lift up the blue latch on the PCIe Riser cage. Rotate the latch 180° anticlockwise
to unlock it.

4. Gently lift and remove the PCIe Riser-card assembly with both hands.

Figure 4-20 Removing PCIe Riser-Card Assembly

5. Disconnect the cables of the Riser card. Take a picture of the cables to avoid
wrong cabling when installing.

6. Press down on the latch of the cover plate to unlock it.

7. Pull out the PCIe card from the PCIe Riser slot.

41
 Figure 4-21 Removing the PCIe Card

To install the PCIe card:

1. Take the new PCIe card from the antistatic bag.

2. Align and insert the PCIe card to the Riser card slot.

3. Close the cover plate.

4. Connect the cables of the Riser card. Be sure to connect the cables properly.

5. Align and insert the Riser card to the slot on the motherboard.

6. Press and rotate the latch 180° clockwise to secure the PCIe Riser cage in place.

7. Connect the power cables and clock cables (if available).

8. Install the access panel.

4.4.9 Hot-Swap Storage Drive Replacement

For proper cooling, do not operate the server without the access panel, air ducts,
expansion slot blanks, or other blanks installed. If the server supports hot-swap
components, minimize the amount of time the access panel is open.

To remove the drive:

1. Press the release button to release the lever.

42
Figure 4-22 Pressing the Release Button

2. The lever will pop up automatically. Hold the lever and pull the drive module
out of the drive bay.

Figure 4-23 Pulling Out the Drive Module

3. Remove the drive from the drive tray and put it into an antistatic bag.

– For normal drive tray: Remove the four screws securing the drive to the
drive tray anticlockwise with a Phillips screwdriver.

43
 Figure 4-24 Removing Screws Securing the Drive

– For tool-less drive tray, pull the two release tabs on one side of the tray,
and remove the drive away from the drive tray.

Figure 4-25 Removing the Drive from the Toolest Drive Tray

To install the drive:

1. Take the new drive out from the antistatic bag.

2. Install the drive into the drive tray:

– For normal drive tray:

a. Orient the drive into the drive tray with the connector end of the drive
toward the back of the drive tray.

b. Tighten the four screws securing the drive to the drive tray clockwise
with a Phillips screwdriver.

– For tool-less drive tray:

Align the hole on one side of the drive with the locating post in the drive
tray, pull the release tabs and press the drive into place.

44
 Figure 4-26 Installing the Drive

3. Open the release lever, and insert the drive module into the drive bay.

4. Close the release lever to lock the drive module in place.

Verify that the activity status LED on the drive tray is green after powering on the
server.

4.4.10 Hot-Swap PSU Replacement

To reduce the risk of personal injury from hot surfaces, allow the power supply or
power supply blank to cool before touching.

To prevent improper cooling and thermal damage, do not operate the server
unless all bays are populated with either a component or a blank.

To remove the PSU:

1. Grasp the handle, and press the blue release tab to release the PSU.

45
 Figure 4-27 Removing the PSU

2. Pull the PSU out of the power bay and put it into an antistatic bag.

To install the PSU:

1. Take the new PSU out from the antistatic bag.

2. Make sure the blue release tab is on the right of the PSU. Grasp the handle and
push the PSU into the power bay until it snaps into place.

4.4.11 OCP Card Replacement

To prevent damage to the server or expansion cards, power down the server and
remove all power cables before removing or installing the OCP card.

To remove the OCP card:

1. Loosen the thumbscrew securing the OCP card to the server anticlockwise.

Figure 4-28 Loosening the Thumbscrew

2. Pull out the OCP card from the server.

46
 Figure 4-29 Pulling Out the OCP Card

3. Put the OCP card into an antistatic bag.

To install the OCP card:

1. Take the new OCP card out from the antistatic bag.

2. Insert the OCP card into the card slot until it snaps into place.

3. Tighten the thumbscrew securing the OCP card to the server clockwise.

4.4.12 Rear M.2 Drive Replacement

M.2 drives are not hot-swappable. Power down the server and remove all power
cables before removing or installing M.2 drive.

To remove the rear M.2 drive:

1. Press the release button to release the lever.

Figure 4-30 Pressing Release Button

47
2. The lever will pop up automatically. Hold the lever and pull the drive module
out of the drive bay.

Figure 4-31 Pulling Out the M.2 Drive Module

3. Remove the screw avoiding the M.2 drive from moving with a Phillips
screwdriver.

4. Loosen the four captive screws securing the top and bottom heatsink and the
M.2 drive to the drive tray with a Phillips screwdrive, and remove the top and
bottom heatsink and the M.2 drive away from the drive tray.

5. Remove the top heatsink away from the M.2 drive.

6. Remove the M.2 drive.

Figure 4-32 Removing M.2 Drive

48
7. Put it into an antistatic bag.
To install the rear M.2 drive:

It is recommended to replace the thermal grease on the top and bottom heatsink
to ensure good performance.

1. Take the new M.2 drive out from the antistatic bag.

2. Position the M.2 drive on the drive tray.

3. Install the top heatsink, and tighten the four captive screws.

4. Install and tighten the screw avoiding the M.2 drive from moving.

Figure 4-33 Installing M.2 to the Drive Tray

5. Open the release lever, and insert the drive module into the drive bay.

6. Close the release lever to lock the drive module in place.

49
4.4.13 E1.S Drive Replacement
To remove E1.S drive:

1. Press the release button to release the lever.

Figure 4-34 Pressing the Release Button

2. The lever will pop up automatically. Hold the lever and pull the drive module
out of the drive bay.

Figure 4-35 Pulling out the E1.S Module

3. Remove the four screws on the corners of E1.S

4. Remove the E1.S and put it into an antistatic bag.

50
Figure 4-36 Removing E1.S

To install E1.S:

1. Align and install the four screws securing the E1.S onto the drive tray.

2. Open the release lever, and insert the drive module into the drive bay.

3. Close the release lever to lock the drive module in place.

4.5 Firmware Update and Configuration

For firmware update and configuration, refer to:

• BMC Update Manual

• BMC Configuration Manual

• BMC User Manual

• BIOS Update Manual

• BIOS User Manual

4.6 Cabling
Blue indicates the data cable routing between the backplane and SAS/RAID card;

Red indicates the drive power cable routing between the backplane and the
motherboard.

• To prevent damage to electrical components, properly ground the server

51
 before installation. Improper grounding can cause electrostatic discharge.
• Please route the cables based on the actual machine configuration.

Figure 4-37 Cable Routing of 12 × 3.5” Configuration

Figure 4-38 Cable Routing of 25 × 2.5” Configuration

52
Figure 4-39 Cable Routing of 24 × 2.5” Configuration

53
5 Battery Replacement

The server CMOS contains an internal lithium cell. A risk of fire and burns
exists if the battery is not properly handled. To reduce the risk of personal
injury:

• DO NOT recharge the battery.

• DO NOT expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose

of the battery in fire or water.

• Replace only with the spare designated for this product.

• After replacing the battery, you must reconfigure the server and reset
the system date and time.

To remove the battery:

1. Power down the server and disconnect the power cables from the server.

2. Gently slide and remove the server out of the rack.

3. Remove the access panel (Refer to Access Panel Replacement).

4. Disconnect the cable of the super-capacitor.

5. Remove the air duct (Refer to Air Duct Replacement).

6. Locate the battery on the motherboard.

7. Gently press the clip on the battery socket until the battery pops up from the
socket. Remove the battery.

• DO NOT pry or press the battery using excessive force.

• Failing to remove the battery properly might damage the socket on the
motherboard.

54
The drawings shown below are for illustration only. The location and orientation of
the cell may differ depending on the model you purchased.

Figure 5-1 Removing the Battery

8. Dispose of the battery as required by local ordinances or regulations.

To install the battery:

1. Take the new battery out from the anti-static package.

2. Place the new battery into the socket, being careful to observe the correct
polarity. Snap the battery into place. Make sure the battery is secured by the
clip within the socket.

3. Install the air duct.

4. Connect the cable of the super-capacitor.

5. Install the access panel.

55
 6 Electrostatic Discharge
6.1 Preventing Electrostatic Discharge
To prevent damage to the system, be aware of the precautions you need to follow
when setting up the system or handling parts. A discharge of static electricity from a
finger or other conductor may damage system boards or other static-sensitive devices.
This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers before they arrive at static-free

workstations.

• Place parts on a grounded surface before taking them out from their packages.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or

assembly.

6.2 Grounding Methods to Prevent

Electrostatic Discharge
Several methods are used for grounding. Use one or more of the following methods
when handling or installing electrostatic-sensitive parts:

• Use a wrist strap connected by a ground cord to a grounded workstation or computer

chassis. Wrist straps are flexible straps with a minimum of 1 megohm ±10 percent
resistance in the ground cords. To provide proper ground, wear the strap snug against
the skin.

• Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on
both feet when standing on conductive floors or dissipating floor mats.

• Use conductive field service tools.

• Use a portable field service kit with a folding static-dissipating work mat.

If you do not have any of the suggested equipment for proper grounding, have an
authorized reseller install the part.

For more information on static electricity or assistance with product installation, contact
Inspur Customer Service.

56
 7 Troubleshooting
7.1 Hardware Problems
• Power-On Failure

Symptoms:
After pressing the power button, the power LED on the power button is orange and the
drive activity status LED is off. Meanwhile, there is no output on the monitor, and server
fans do not rotate.
Solutions:
Check the status of the PSU LEDs on the rear panel.

1) The PSU LEDs are off or amber

1.1) If the PSU LEDs are off or amber, it indicates abnormal power supply. Check if

the outlet can function, if the power cords are plugged properly and if the power
cables of the faulty PSU can work;

1.2) If all yes: the PSU LEDs are still off or amber, maybe the PSUs are faulty. Please

replace the faulty PSUs with PSUs of the same server model and of the same
specifications to test whether the PSUs have failed; the PSU LEDs turn green, but
the power LED on the power button is still orange, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.

2) All the PSU LEDs are green

2.1) If all the PSU LEDs are green, disconnect the power cables, remove and

re-insert all the PSUs. Connect the power cables and power on again to test if the
problem can be solved;

2.2) If re-inserting the PSUs won't work, please replace the PSUs with PSUs of the

same server model and of the same specifications to test whether the PSUs have
failed;

2.3) If the instructions above do not resolve the problem, please call Inspur

Customer Service Hotline (1-844-860-0011/1-760-769-1847) or email to

serversupport@inspur.com.

• No Display

Symptoms:
After pressing the power button, the power LED on the power button changes from

57
 orange to green, the system fans work normally, but there's no output on the monitor.
Solutions:

1) Check whether the monitor is powered up normally;

2) If yes, but there is still no output on the monitor, check whether the monitor is
connected properly to the server's VGA port;

3) If yes, but there is still no output on the monitor, please replace with another monitor;

4) If the problem still persists, maybe the VGA port is abnormal. Please log into the BMC
Web interface. Launch the BMC remote KVM (For detailed reference document, please
see Firmware Update and Configuration) to see if KVM can be displayed normally: If
yes, maybe the VGA port on the motherboard is abnormal, please contact Inspur
Customer Service; if no, please record the detailed warning information;

5) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com, and inform us of the detailed warning information and
failure.

• Abnormal LED on the Front Panel

Symptoms:
The status LED on front panel illuminates red.
Solutions:
Identify the abnormal LED based on Front Panel LEDs

1) If the system status LED illuminates red, check whether the server is under normal
operation: If yes, log into the BMC Web interface to view the BMC logs (For detailed
reference document, please see Firmware Update and Configuration) to check whether
there are warnings. If yes, please record the detailed warning information;

2) If the power status LED is abnormal, please check if the PSU LEDs on the rear panel are
abnormal (amber or off): If the PSU LEDs are normal, please log into the BMC Web
interface to check the BMC logs (For detailed reference document, please see Firmware
Update and Configuration) to see if there are warnings. If yes, please record the
detailed warning information; if all the PSU LEDs are abnormal, please refer to All the
PSU LEDs are green; if one PSU LED is abnormal, please refer to PSU LED Off or
Illuminates Amber;

3) If other status LEDs are abnormal, log into the BMC Web interface to check the BMC logs
to see if there are warnings; if yes, please record the detailed warning information;

4) If the instructions above do not locate or resolve the problem, please call Inspur

58
 Customer Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com, and inform us of the detailed warning information and
failure.

• Stuck in POST Interface or Other Interface

Symptoms:
After pressing the power button, the server gets stuck in the POST interface or other
interface and cannot enter the OS.
Solutions:

1) If the server gets stuck in the media test failure interface, please confirm if OS is
installed successfully and OS boot order is set to first;

2) If the stuck interface includes directional error information of hardware, such as

self-test errors of memory and RAID, record the detailed errors;

3) If the stuck interface is the POST interface and there are errors reported in the interface,
please record the detailed errors;

4) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com, and inform us of the detailed errors.

• PSU LED Off or Illuminates Amber

Symptoms:
A certain PSU LED on the rear panel is off or illuminates amber when the server is under
normal operation.
Solutions:

1) Check if there is normal external power supply. Inspect the server for any abnormal
appearance such as burning or vulcanization;

2) Check whether the power cord is plugged in firmly. Re-connect the power cable again.

3) If the fault still exists, remove the power and insert the PSU again.

4) Shut down the server (if shutdown is allowed), switch the positions of the PSUs and
cross-check whether the PSU is faulty.

5) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.

• Abnormal Drive Status LED

59
 Symptoms:
The drive activity status LED is off or the drive fault LED illuminates red when the server
is under normal operation.
Solutions:

1) Check if the drives are installed properly;

2) Check whether the drivers are removed and inserted or if there are other manual
operations. If yes, restore the array through RAID configuration to ensure the drives are
configured properly;

3) If no, run command under the OS to see if all the drives are identified. If the server is
configured with an RAID card, you can also choose to log into the RAID management
interface to check whether there is a drive failure;

4) If there is a drive failure or the instructions above do not resolve the problem, please
call Inspur Customer Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.

 Hot-swap storage drive allows users to remove or replace the drive without
shutting down or powering off the system, which improves the system
disaster recovery capability, scalability and flexibility. It only means that the
hot-swap storage drive can be plugged in and out online without damage.

 Depending on the RAID level, hot-swapping a storage drive in the RAID may
cause RAID degradation or failure. When installing a new drive, different
RAID cards have different policies. You may need to log into the RAID
management interface for recovery.

 Remove the drive until the drive motor stops completely in order to prevent
damage to the motor.

• Loud System Fan Noise

Symptoms:
System fans make excessive noise when the server is under normal operation.
Solutions:

1) Check the fan status LED or other status LEDs on the front panel for any warnings.
Meanwhile, ensure that the access panel is closed properly and the air duct has not
been moved;

2) Check the server temperature by hand or the sensor temperature in the BMC Web

60
 interface for over-temperature;

3) If the temperature of the chassis is too high, check the temperature of the server room.
If it is too high, adjust the air conditioner to cool the room;

4) If the temperature of the server room isn't high, check whether the front bezel or
chassis interior is jammed with dust. If yes, clean with a soft and dry cloth, or a
specialized brush. The environment of the server room needs to be improved to avoid
over-temperature running of the server caused by too much dust;

5) Check if the server is operating under heavy load. Log into the BMC Web interface to
see if all the fans are identified and if the fan mode is automatic;

6) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.

• Alarm Sound from the Server

Symptoms:
There is an alarm sound during server startup or operation.
Solutions:
Find the source of the alarm sound:

1) If the alarm sound comes from the PSUs, check the status of the PSU LEDs on the rear
panel. If the PSU LEDs are abnormal, refer to PSU LED Off or Illuminates Amber to
handle it.

2) If the alarm sound comes from the chassis interior, remove the access panel to find the
specific source;

3) If the alarm sound comes from the RAID card, check the drive fault LED for any warning
or log into the RAID management interface for any drive warning and record the
detailed warning information if any.

4) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com, and inform us of the alarm source and detailed warning
information.

• Keyboard and Mouse Failure

Symptoms:
Neither keyboard nor mouse can function.
Solutions:

61
1) Make sure the keyboard and mouse have been connected properly and firmly.

2) Connect the keyboard and mouse to a laptop or a server to test if they can function or
not;

3) Power cycle the server and retest;

4) Restart the server and enter BIOS or RAID management interface to test if the keyboard
and mouse can function: If the keyboard and mouse can function in non-OS
environment, maybe there is something wrong with the USB driver of the OS; if the
keyboard and mouse cannot function in non-OS environment, then maybe the
connector on the motherboard is faulty. Please call Inspur Customer Service Hotline
(1-844-860-0011/1-760-769-1847) or email to serversupport@inspur.com.

• USB Port Problem

Symptoms:
Unable to use devices with a USB port.
Solutions:

1) Make sure the OS of the server supports USB devices;

2) Make sure the server has been installed with the correct USB driver, and try installing
the USB driver again;

3) Connect the USB device to another server to test if the device can function;

4) If the USB device cannot function, please replace with a known working USB device;

5) Power cycle the server and retest;

6) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.

• HCA Card Driver Installation Problem

Symptoms:
For the configuration with HCA cards, the system will reboot when installing Chipset
driver under Windows OS
Solutions:

1) Delete the driver that comes with Windows first, and then install the Chipset driver.
Or install the IB driver from Mellanox official site (Go to
https://www.mellanox.com/products/adapter-software/ethernet/windows/winof

62
 -2, click on WinOF-2 and choose the corresponding OS version), and then install
the Chipset driver.

Figure 7-1 Downloading the Driver from Mellanox Official Site

2) If the instructions above do not resolve the problem, please contact Inspur
Customer Service.

7.2 Software Problems

• OS Installation Problems
Symptoms:
Unable to load the RAID driver or create partitions larger than 2 T during OS installation;
C disk usage is too high after OS installation, etc.
Solutions:

1) If it fails to load the driver during OS installation, check the RAID driver version. Go to
Inspur website https://en.inspur.com to download the correct RAID driver. Some RAID
drivers need to be loaded several times.

2) If it fails to create partitions larger than 2 T during OS installation, select

Advanced>CSM Configuration>Boot option filter>UEFI only (For detailed reference
document, please see Firmware Update and Configuration) in BIOS, save and exit BIOS
interface. Choose UEFI to boot the OS. The server will restart automatically. It needs to
enter the CMD command line to change the drive format to GPT, and then partitions
larger than 2 T can be created;

3) If the C disk usage is too high after installing the Windows OS, turn down the virtual

63
 memory or allocate the virtual memory to other partitions;

4) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.
• PXE Boot Failure
Symptoms:
Unable to install OS via PXE.
Solutions:

1) Check if the PXE server can be used to install OS for another server;

2) Check whether there is network link via the network port LED to check if there is a fault
in external network;

3) Check whether the NIC can be identified under BMC Web, BIOS or Shell;

4) Check if PXE Function is enabled and if the boot sequence is set to first in BIOS;

5) Check if the target drive for the OS or RAID array can be identified and if there is
enough space;

6) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.
• Abnormal Memory Capacity
Symptoms:
The memory capacity displayed in the OS and the physical memory capacity are
inconsistent.
Solutions:

1) Check the OS version. The supported memory capacity varies with the version of
Windows OS. Enter BIOS Setup to view the memory capacity. If the memory is identified
completely, the OS may be unable to access all the installed memories. For example,
Windows server 2008 x86 supports up to 4 G memory;

2) If the memory is not identified completely in BIOS Setup, confirm that the
corresponding slots have been populated with memories of correct type;

3) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com.
• Abnormal Network
Symptoms:

64
 The network is disconnected, or the rate is lower than the actual rate of the network
port under the server OS.
Solutions:

1) Check whether the network cable is connected properly and whether the network port
LED flashes normally to ensure that the network is configured correctly;

2) Unplug and plug the network cable back to see if the problem can be solved. If not,
connect the server with a laptop via a known working network cable: If the network is
normal, check the network cable or the switch port; if the network is faulty, go to Inspur
Website https://en.inspur.com to download the latest NIC driver;

3) Check whether the NIC can be identified under BMC Web, BIOS or Shell and whether the
MAC address is correct;

4) If the instructions above do not resolve the problem, please call Inspur Customer
Service Hotline (1-844-860-0011/1-760-769-1847) or email to
serversupport@inspur.com, and inform us of the detailed warning information and
failure.

65
8 Environmental Requirements
8.1 Ambient Temperature
Table 8-1 Ambient Temperature

Parameter Condition Requirement

Operating continuously 5°C - 35°C

Transportation (Storage) -40°C - 70°C

Temperature
Maximum temperature
gradient (Operation and 20°C/h (36°F/h)
storage)

Relative humidity is 5% to
Operations
90%
Humidity
Relative humidity is 5% to
Transportation (Storage)
95%

8.2 Vibration and Shock Resistance

Table 8-2 Vibration and Shock Resistance

Parameter Condition Requirement

5 - 500 Hz: 0.21 Grms (X, Y and Z axis

Operating
and every direction for 15 minutes)
Vibration
Transportation 1 - 200 HZ: 0.82 Grms (X. Y and Z axis
(Storage) and every direction for 30 minutes)

On negative and positive X, Y and Z

axis direction, each axis can withstand
Operating
100 continuous 2 G shock pulses for up
to 11 ms
Shock

On X, Y and Z axis direction, each axis

Transportation
can withstand 1000 continuous 40 G
(Storage)
shock pulses for up to 6 ms

66
 8.3 Altitude and Air Pressure
Table 8-3 Altitude and Air Pressure

Parameter Condition Requirement

Operating 0 to 3,048 m (0 to 10,000 feet)

Altitude
Transportation 0 to 12,192 m (0 to 40,000 feet)
(Storage)

8.4 Alternating Temperature and Humidity

Table 8-4 Alternating Temperature and Humidity

Parameter Condition Requirement

Operating Relative humidity is 5% to 90%

Humidity
Transportation Relative humidity is 5% to 95%
(Storage)

8.5 Extended Operation Temperature

1. The system performance will be impacted when the temperature is not within
the specification range;

2. Ignore alarm sound of ambient temperature when the temperature is not

within the specification range.

Table 8-5 Extended Operation Temperature

Temperature Specification Note

5℃-40℃ (5%-85%RH)1 Continuous running is possible

-5℃ - 45℃ (5% - 90%RH)2 Running time ≤1% per year

67
 8.6 Extended Operation Temperature Limits
• Powering on under 5℃ is not allowed;
• The altitude cannot be higher than 3,000 m (9,843 feet);

• Only specified PCIe cards are supported;

8.7 Thermal Restrictions

Table 8-6 Thermal Restrictions

Max. Max. Max. Max.

Operating Operating Operating Operating
Configuration
Temperat Temperature Temperature Temperature
ure at 30°C at 35°C at 40°C at 45°C

 Passive-cooli
ng GPUs not
supported
 CPUs with
TDP higher  Rear drives
than 205 W not
not supported
supported  CPUs with
All configurations (When GPUs
8 × 2.5-inch drives are equipped, CPU power  Passive-cooli TDP higher
consumption should be ≤ 205W) ng GPUs not than 165 W
supported not
supported
 BPS DIMMs
not  DIMMs
supported (including
BPS) higher
than 8 W not
supported

All
12 × 3.5-inch EXP 8 or less  Passive-cooli
configurations 
drives drives and ng GPUs not
(When GPUs
12 × 3.5-inch are equipped, CPUs with supported
pass-through there are TDP at 205 W Not supported
 Rear drives
drives restrictions on or lower
not
drive numbers supported
supported
and CPU when
power equipped  CPUs with

68
 Max. Max. Max. Max.
Operating Operating Operating Operating
Configuration
Temperat Temperature Temperature Temperature
ure at 30°C at 35°C at 40°C at 45°C

consumption) with GPUs TDP higher

than 165 W
 Passive-cooli
not
ng DIMMs
supported
(including
BPS) higher  DIMMs
than 8 W not (including
supported BPS) higher
than 6 W not
supported

 Passive-cooli
12 × 3.5-inch
 Passive-cooli ng GPUs not
NVMe drives  8 or less ng GPUs not supported
drives and supported
24 × 2.5-inch CPUs with  Rear drives
All
pass-through TDP at 205 W  CPUs with not
configurations
drives or lower TDP higher supported
(When GPUs
supported than 205 W
are equipped,  CPUs with
when not
there are TDP higher
equipped supported
restrictions on than 165 W
drive numbers with GPUs  DIMMs
not
(including
and CPU  DIMMs supported
24 × 2.5-inch BPS) higher
power (including
NVMe drives than 8 W
consumption)  DIMMs
BPS) higher not
supported (including
than 8 W not
BPS) higher
supported
than 6 W not
supported

8.8 Operational Requirement

This section specifies the requirements of temperature, humidity, organisms,
chemical materials and mechanically active materials in the server room when the
server is operating.

1. Temperature and humidity

The temperature, dew point and relative humidity in the server room should meet

69
 the requirements for operating the server. For specified requirements, see the
detailed description in the product documentations.

2. Organisms

Plants and animals are not allowed in the server room. Take strict precautions
against damage by rats and ants.

To meet these requirements, take the following measures in the server room:

• Ensure safety if there are humidification devices in the server room.

• All the structures and construction gaps of doors, windows, walls, ground
(floors) must be sealed.

• If there are water supply and drainage pipes in the server room, anti-leakage
and anti-condensation measures should be taken.

• If there is water equipment in the main server room, measures to prevent

water overflow and leakage should be taken.

• Block cable holes and antenna holes.

• Clean and sterilize the server room periodically.

3. Corrosive Airborne Contaminants

Generally, a small amount of common corrosive gas pollutants exist in indoor and
outdoor atmospheric environments. Chemical reactions may occur due to
long-term contact between these mixed corrosive gas pollutants or pollutants of
one single corrosive gas and other environmental factors (such as temperature or
relative humidity), which may pose a risk of IT equipment failure from corrosion
and damage circuit boards of IT equipment and system component units with weak
oxidation resistance. This article specifies the limitation on corrosive airborne
contaminants with an aim to avoid such risks.

The concentration level of corrosive airborne contaminants in a data center shall

meet the requirements listed in the white paper entitled Gaseous and Particulate
Contamination Guidelines for Data Centers published in 2011 by American Society
of Heating Refrigerating and Air-conditioning Engineers (ASHRAE) Technical
Committee (TC) 9.9. According to the Guidelines, corrosive airborne contaminants
in a data center shall meet the following requirements:

• Copper coupon corrosion rate less than 300 Å/month per ANSI/ISA-71.04-2013
severity level G1

• Silver corrosion rate less than 200 Å/month per ANSI/ISA-71.04-2013 severity
level G1

• According to ANSI/ISA-71.04-2013 Environmental Conditions for Process

Measurement and Control Systems: Airborne Contaminants, the gaseous

70
 corrosively levels are G1 (mild), G2 (moderate), G3 (harsh), and GX (severe), as
described in the table below.

Table 8-7 Gaseous Corrosively Levels per ANSI/ISA-71.04-2013

Severity Copper Silver Reactivity Description

Level Reactivity Level
Level
G1 (mild) < 300 Å/month < 200 Å/month An environment sufficiently
well-controlled such that
corrosion is not a factor in
determining equipment
reliability.
G2 < 1000 < 1000 Å/month An environment in which
(moderate) Å/month the effects of corrosion are
measurable and may be a
factor in determining
equipment reliability.
G3 (harsh) < 2000 < 2000 Å/month An environment in which
Å/month there is high probability that
corrosive attack will occur.
GX (severe) ≥ 2000 ≥ 2000 Å/month An environment in which
Å/month only specially designed and
packaged equipment would
be expected to survive.

See the table below for the requirements on the copper and silver corrosion rates.

Table 8-8 Concentration Limitation on Corrosive Airborne Contaminants in

a Data Center

Group Gas Unit Concentration

H2S ppba <3

SO2 ppb <10

Group A
Cl2 ppb <1

NO2 ppb <50

HF ppb <1
Group B NH3 ppb <500

O3 ppb <2
a: Part per billion (ppb) is the number of units of mass of a contaminant per 1000
million units of total mass.

71
Group A and group B are common gas groups in a data center. Group A's or group
B's concentration limitation values correspond to copper and silver reactivity level
G1.

Corrosion is not determined by a single factor, but by comprehensive

environmental factors such as temperature, relative humidity and corrosive
airborne contaminants. Any change of the environmental factors may affect the
gaseous corrosively level. Therefore, the concentration limitation values specified
in the previous table are for reference only. If the actual mixed gas concentration is
not listed in the table, refer to chemically active substance level in IEC-60721-3-3 or
GB/T 4798.3-2007 to choose the concentration range.

4. Mechanically Active Materials

The server room should be free from explosive, conductive, magnetism-permeable,

and corrosive dust. Table 8-10 lists the requirements for concentration of the
mechanically active materials in the server room

Table 8-9 Requirements for Concentration of Mechanically Active Materials

Mechanically Active Materials Unit Concentration

Sand mg/m3 ≤30

Suspending dust mg/m3 ≤0.2
Dust deposit mg/(m2h) ≤1.5

To meet these requirements, take the following measures in the server room:

• Use dustproof materials on the ground, wall, and ceiling of the server room.

• Adopt few or no windows design in the server room, and use dustproof
materials for outer windows.

• Clean the server room, especially the air filters periodically.

• Wear shoe covers and ESD clothing before entering the server room.

8.9 Electromagnetic Compatibility

Requirements
1. As per GB/T 17626.3 (IEC 61000-4-3) & GB/T 17626.6(IEC 61000-4-6) & GB/T
17626.8 (IEC 61000-4-8), the recommended electromagnetic environment is as
follows:

Table 8-10 Electromagnetic Environment

Electromagnetic Phenomenon Specifications

72
 Electromagnetic Phenomenon Specifications

Power frequency Frequency (Hz) 50

magnetic field
A/m (rms) ≤1

RF Frequency (MHz) 80 - 1000

electromagnetic
field amplitude V/m (rms, ≤3
modulation unmodulated)

%AM (1kHz) 80

RF continuous Frequency (MHz) 0.15 - 80

wave conduction
V (rms, unmodulated) ≤3

%AM (1kHz) 80

Meanwhile, we recommend you to take the following measures to suppress

interfering signals:

• Take effective measures against power grid interference to the power supply
system.

• Keep away from electrical equipment such as medical magnetic resonance

device, helium arc welder, radio frequency electric heater, etc.

• Try to avoid the impact of nearby areas with high power emissions (broadcast,
radar, mobile communication transmitters), electrified railways, industrial
radiation, substations, and high-voltage transmission lines.

• The interference effect of other equipment in the server room must comply with
relevant standards and regulations.

• Take measures to shield and isolate natural noise such as atmospheric noise
and solar radio noise when necessary.

To avoid damage to the system, take ESD protection measures. For more
information on electrostatic protection methods, refer to Electrostatic Discharge.

2. As per the requirements of Appendix F.5 of IEC62368, the server is pasted with
safety protection logos. The logos and interpretations are as follows:

1) Fan blade safety protection:

73
 Figure 8-1 Fan Blade Safety Protection

Caution: Keep body parts away from fan blades

2) Multi-power safety protection:

Figure 8-2 Multi-power Safety Protection

Caution: Shock Hazard! Disconnect all power supply cords before servicing.

8.10 Power Supply Requirements

8.10.1 AC Power Supply Requirement
An AC power supply that consists of mains supply, uninterruptible power supply
(UPS), and self-supplied electric generator set can be used as an integrated power
supply. The AC power supply must feature simple connection line, safe operation,
flexible scheduling, and easy maintenance in addition to meeting the requirements
of site load. Low voltage power supply should adopt three-phase five-wire mode
or monophase three-wire mode.

AC power supply system should work under nominal voltage and rated frequency.

Table 8-11 Nominal Voltage and Rated Frequency

Nominal Voltage Rated Frequency

110 V, 208 V 60 Hz

220 V, 380 V 50 Hz

A UPS is typically used as an AC potential power of network products. A UPS should

be in the same phase as the mains supply. The time used for switching between the

74
 UPS and the mains supply should be less than 8 ms. Otherwise, the server will
reboot or reset.

8.10.2 DC Power Supply Requirement

DC power supply system should work under nominal voltage of -48 V, 240 V and
380 V.

When determining the AC distribution capacity in the server room, consider the
working current and fault current. An independent device must have an
independent AC distribution protection apparatus. The maximum capacity of the
current over the configuration protection switch should be greater than the
maximum capacity of the current over the protection switch of each device. When
designing the capacity of an AC power supply system, consider the maximum load
of the system in dynamic mode and static mode and reserve a certain margin. The
cabling on the power distribution panel must be figured out based on the
maximum power supply load. This helps you determine the type and size of the
conducting wire.

Voltages of an AC-powered server and power equipment should meet the

following requirements:

• For an AC-powered server, the voltage fluctuates from -10% of the rated
voltage to +10% of the rated voltage.

• For AC-powered power equipment and important buildings, the voltage

fluctuates from -10% of the rated voltage to +10% of the rated voltage.

• The AC frequency fluctuates from -4% to 4%. The sinusoidal distortion rate of
the voltage waveform is smaller than or equal to 5%.

The server room should be equipped with a self-supplied electric generator set.
The electric generator set should perform automatic power-on/off, automatic
recruitment, remote communication, remote control, and remote detection, and
provide standard interfaces that comply with communication protocols.

The power cable used for AC/DC power distribution should meet the following
requirements:

• The conductor in the neutral wire must have the same cross-sectional area as
the conductor in the live wire.

• The power feeder should be selected based on the long-term load. If the
cross-sectional area exceeds 95 mm2, a hard bus cable should be used. If there
is a great difference between the short-term load and the long-term load,
cables can be routed by stage.

• AC/DC conducting wires should be flame-retardant and be routed according to

the Code for fire protection design of tall buildings (GB50045).

75
8.10.3 Recommendations on the AC Power Supply
Recommendations on the AC power supply are as follows:

• Use a voltage stabilizer or voltage-regulator to respond to unstable voltages.

Use a voltage-regulator in the following situations:

– The server is directly powered by the mains supply, and the power supply
voltage exceeds the rated voltage by -10% to +10% or the voltage range
allowed for the server.

– The server is not directly powered by the mains supply, and the mains voltage
exceeds the rated voltage by -10% to +10% or the AC input voltage range
allowed for the DC power equipment.

• To prevent interruption or surge of AC power supply, use the UPS or inverter.

• The data center should be equipped with self-supplied generator set in case of
mains failure to ensure proper function of important load and important power
load. All electrical equipment such as IT equipment and refrigeration
equipment shall be considered. Check the start-up shock to ensure that the
generator can start reliably. The generator performance should meet the
requirements of Code for Design of Data Centers (GB50174).

• Connect two storage battery strings in parallel. A second UPS is needed as

redundant backup.

8.10.4 HVDC Power Supply

The high-voltage direct current (HVDC) system can eliminate the problems existing
in conventional AC and low-voltage DC power supplies. At present, 240 V HVDC
standards and 336 V HVDC standards are the mainstream HVDC standards used in
China.

8.10.5 HVDC Power Supply Requirements

• The requirements for HVDC power supply are as follows:

– Operating range: 0℃ - 45℃

– Storage and transportation range: -40℃ - 85℃

• Relative Humidity:

– Operating range: ≤ 90% RH (40 ± 2℃)

– Storage and transportation range: ≤ 95% RH (40 ± 2℃)

• Vibration performance: ability to withstand sinusoidal frequencies between 10

Hz to 55 Hz and amplitude of 0.35 mm.

76
 • Battery capacity configuration: ensure continuous operation of servers at full
loads when the power supplies are unavailable. The battery backup time
should be 15 minutes when a diesel generator is available as backup power
source.

• Determination of cell voltage and pack number: Depending on the system

capacity and backup time, the cell voltage can be selected from 2 V, 6 V or 12 V.

• The insulation monitoring device acts properly if a ground fault occurs or the
insulation resistance is 28 kΩ lower than the set value. The HVDC system is
protected against overcurrent and short circuits and can be manually or
automatically restored after overcurrent or short circuits are rectified.

• Over- and under-voltage protection for AC power supplies: The power supply
system can monitor the input voltage changes. When detecting that the AC
input voltage is higher or lower than the specified threshold, which may pose
safety risk on the operation of the power supply system, the system
automatically shuts down. The system automatically restores when the input
voltage is normal.

• The site is free from explosive materials, conductive media and hazardous
gases that erode metals and affect insulation, and mold.

• Protection against high temperature: When the temperature in the power

supply system reaches the specified threshold, the power supply system
automatically reduces the power or shuts down the power amplifier. When the
temperature falls below the threshold, the power supply system restores the
normal power output.

• The system provides alarm records and query, and the alarm display can be
updated on a real-time basis. The alarm information is protected against loss
when the system is out of power.

8.10.6 HVDC Power Supply Suggestions

• Terminal equipment can be connected to power sockets or wiring terminals.
Wiring terminals are recommended.

• Do not use a shunt circuit breaker to connect to or control multiple power

modules through a multi-purpose power socket.

• Choose DC circuit breakers based on the rated current of the equipment. The 10
A or 16 A DC breakers are recommended.

• Recommended standards for equipment power wiring: Connect the DC output

positive pole to terminal N of the equipment power cable. Connect the DC
output negative pole to terminal L of the equipment power cable. DC system is
strictly forbidden to be grounded.

77
 • The upstream input terminal of the power supply system is equipped with a
surge protection device to protect the system against a minimal voltage surge
of 10/700 us, 5 kV and a minimal current surge of 8/20 us, 20 kA.

• All cables in the power distribution frame (PDF) comply with YD/T 1173
specifications, and the diameters of all power cables meet the requirements for
wire ampacity.

8.10.7 DC Power Supply

The DC power supply should be stable and reliable. The power equipment should
be deployed near the server. The standard DC voltage is -48 VDC with a fluctuation
range of server power between -40 V to –72 V.

78
9 Warranty
Inspur warrants that all Inspur-branded hardware products shall be free from
material malfunctioning and material defects under conditions of normal use for a
period of three (3) years from the Date of Invoice.

Service offerings may vary by geographic region. Please contact your Inspur
representative to identify service levels and needs for your regions.

9.1 Warranty Service

Remote Technical Support
Inspur warranty service includes 24/7 remote technical support and 3 years parts
replacement throughout the warranty period. Warranty Service are Advance
Replacement Service in the first year and Standard Replacement Service in the
second and third years.

Table 9-1 Warranty Service Type and Duration

Type Duration

Remote Technical Support 3 years

RMA Services 3 years

The 24/7 remote technical support can be obtained through hotline, e-mail, and
Service Portal*1. Through hotline and e-mail support, Inspur engineers help
customers diagnose the cause of malfunction and provide solution. Service Portal*1
provides access to firmware, customized update files, and related manuals for
Inspur products. Customer may also access the Service Portal*1 to submit Return
Material Authorization (RMA) for parts replacement or repair.

Information needed when requesting for support:

• Contact name, phone number, e-mail address

• System Serial Number, Part Number, Model and location (address) of the product
needing service

• Detailed description of problem, logs (sel and blackbox, and any other related logs
from OS), screenshot of issue, pictures of damaged/questions parts, etc.

79
 Table 9-2 Support Contact Information

Type Description Support

Window

Global Global: 1-844-860-0011/1-760-769-1847 24 × 7 ×

Hotline (English) 365
China: 400-860-0011 (Chinese)

Email Global: serversupport@inspur.com 24 × 7 ×

365
China: lckf@inspur.com

US**: serversupportusa@inspur.com Local

business
Korea: serversupport_kr@inspur.com
hours 9AM
Japan: serversupport_jp@inspur.com
to 6PM
Monday to
Friday

**US: PST
(GMT -8)

Service US**: Local

Portal* 1
http://service.inspursystems.com/login.htm business
EU: http://eurportal.inspur.com/ hours 9AM
to 6PM
Monday to
Friday

**US: PST
(GMT -8)

RMA Services

Inspur may, at its discretion, repair or replace the defective parts. Repair or
Replacement parts may be new, used, or equivalent to new in performance and
reliability. Repaired or replaced parts are warranted to be free of defects in
material or workmanship for ninety (90) calendar days or for the remainder of the
warranty period of the product, whichever is longer.

Advance Replacement: Under the terms of Advance Replacement Service, if a

problem with customer product cannot be resolved via hotline and e-mail support
and a replacement part is required, Inspur will ship out replacement part(s) in
advance within one (1) business day. Customer should return defective part(s)

80
 within five (5) business days after receiving the replacement(s). Inspur will cover
one-way shipment via ground.

Standard Replacement: When a hardware failure happens, customer may submit

RMA request to Inspur via e-mail or Service Portal*1. Inspur will review and approve
RMA submission, and provide an RMA number and return information that
customer may use to return for RMA service. Inspur will ship out replacement
part(s) within one (1) business day after receiving the defective part(s) and cover
one-way shipment via ground.

9.2 Inspur Service SLA

Inspur offers a variety of Service Level Agreements (SLA)*2 to meet customer
requirements with different service components and service level targets.

• Base Warranty Services

• Advance Replacement

• 9 × 5 NBD Onsite Service

• 24 × 7 × 4 Onsite Service

• Onsite Deployment Service

• Data Media Retention

• Global Service

• Customized Service

9.3 Warranty Exclusions

Inspur does not guarantee that there will be no interruptions or mistakes during the
use of the products. Inspur will not undertake any responsibility for the losses
arising from any operation not conducted according to Inspur Hardware Products.

The Warranty Terms & Conditions do not apply to consumable parts, as well as any
products that the serial number missed, damaged or obscured for the following
reasons:

• Accident, misuse, abuse, defiling, improper maintenance or calibration or other

external causes

• Operating beyond the parameters as stipulated in the user documentation

• Use of the software, interface, parts or supplies not provided by Inspur

• Improper staging, usage, or maintenance

• Virus infection

• Loss or damage in transit which is not arranged by Inspur

81
• The product has been modified or serviced by non-authorized personnel

• Any damage to or loss of any personal data, programs, or removable storage

media

• The restoration or reinstallation of any data or programs except the software

installed by Inspur when the product is manufactured

• Any consumable parts, such as, but not limited to, battery or protective coating
that is diminished over time, unless the failure has occurred during DOA period,
such failure caused by Inspur’s material or workmanship

• Any cosmetic damage, such as, but not limited to, scratches, dents, broken plastics,
metal corrosion, or mechanical damage, unless the failure has occurred during
DOA period due to defect in Inspur’s material or workmanship

• Any engineering sample, evaluation unit, or non-mass production product is not

covered under warranty service

• Any solid-state drive (SSD) with the usages of which has reached its write
endurance limit

In no event will Inspur be liable for any direct loss of use, interruption of business,
lost profits, lost data, or indirect, special, incidental or consequential damages of
any kind regardless of the form of action, whether in contract, tort (including
negligence), strict liability or otherwise, even if Inspur has been advised of the
possibility of such damage, and whether or not any remedy provided should fail of
its essential purpose.

*1 Service Portal availability is subject to customer type and customer location. Please
contact your Inspur representative to learn more.

*2 Not all SLA offerings are available at all customer locations. Some SLA offerings may be
limited to geolocation and/or customer type. Please contact your Inspur representative to
learn more.

82
Appendix
A.1 Drive Neodymium Content Reference
Table
Table A.1-1 Seagate Drive Neodymium Content Reference

Neodymium Content Range

Product Series Name
<5g 5 g - 25 g > 25 g

Cimarron (2T/4T) √

Cimarron (6T/8T) √

Evans √

Kestrel √

MakaraBP √

MakaraPLUS √

Mobula √

MobulaBP √

Skybolt √

Tatsu √

Table A.1-2 WD Drive Neodymium Content Reference Range

Neodymium Content Range

Product Series Name <5
5 g - 25 g > 25 g
g
Rainier √
Libra He10 √
Leo A √

Vela-A √

Vela-AP √

Hs14 √

Leo-B √

83
Table A.1-3 Toshiba Drive Neodymium Content Reference Range

Neodymium Content Range

Product Series Name
<5g 5 g - 25 g > 25 g

AL14SE-Lite √

AL15SE √

AL14SX √

MG04 Tomcat-R SAS √

MG04 Tomcat-R SATA √

MG04 Tomcat SATA √

MG06 SAS √

MG06 SATA √

MG07 SAS √

MG07 SATA √

A.2 Acronyms and Abbreviations

A

AC Alternating Current

ACPI Advanced Configuration and Power Management Interface

AES Advanced Encryption Standard New Instruction Set

AI Artificial Intelligence

AOC Active Optical Cables

API Application Program Interface

ARP Address Resolution Protocol

BIOS Basic Input Output System

84
 BMC Baseboard Management Controller

CE Conformite Europeenne

CLI Command-Line Interface

CMOS Complementary Metal-Oxide-Semiconductor Transistor

CPLD Complex Programming Logic Device

CPU Central Processing Unit

CRPS Common Redundant Power Supplies

CRU Customer-Replaceable Unit

CSA Canadian Standards Association

CSM Compatibility Support Module

DC Direct Current

DDR4 Double Date Rate 4

DHCP Dynamic Host Configuration Protocol

DIMM Dual-Inline-Memory-Modules

DNS Domain Name System

DVD Digital Video Disc

85
F

FMA Failure Mode Analysis

FRU Field-Replaceable Unit

FTP File Transfer Protocol

FW Firmware

GPU Graphics Processing Unit

GUI Graphical User Interface

HBA Host Bus Adapter

HCA Host Channel Adapter

HDD Hard Disk Drive

HTML Hyper Text Markup Language

HWRAID Hardware Redundant Arrays of Independent Drives

I/O Input/Output

IEC International Electrotechnical Commission

IOPS Input/Output Operations Per Second

IP Internet Protocol

IPMB Intelligent Platform Management Bus

86
 IPMI Intelligent Platform Management Interface

iSCSI Internet Small Computer System Interface

JTAG Joint Test Action Group

KVM Keyboard Video Mouse

LAN Local Area Network

LCD Liquid Crystal Display

LED Light Emitting Diode

LRDIMM Load Reduced Dual In-Lane Memory Module

MLAN Music Local Area Network

NCSI National Communication System Instructions

NEMA National Electrical Manufacturers Association

NFPA National Fire Protection Association

NIC Network Interface Controller

87
 NM Node Manager

NPU Network Processing Unit

NTP Network Time Protocol

NVDIMM Non-Volatile Dual In-Line Memory Module

NVMe Non-Volatile Memory Express

OCP Open Compute Project

OS Operating System

PCH Platform Controller Hub

PCI Peripheral Component Interconnect

PCIe Peripheral Component Interconnect express

PDU Power Distribution Unit

PFR Platform Firmware Resilience

PHM Processor Heatsink Module

PHY Physical

PMBus Power Management Bus

POST Power On Self Test

PSU Power Supply Unit

PXE Pre-boot Execution Environment

88
R

RAM Random-Access Memory

RAID Redundant Arrays of Independent Drives

RDIMM Registered Dual In-line Memory Module

RH Relative Humidity

ROM Read-Only Memory

RTA Real Time Clock

SAS Serial Attached Small Computer System Interface

SATA Serial Advanced Technology Attachment

SFP Small Form-factor Pluggable

SIC Smart Interface Card

SKU Stock Keeping Unit

SMTP Simple Mail Transfer Protocol

SNMP Simple Network Management Protocol

SOL Serial Over LAN

SSD Solid State Disk

SSH Secure Shell

SWRAID Software Redundant Arrays of Independent Drives

89
T

TCG Trusted Computing Group

TCM Trusted Cryptography Module

TCO Total Cost of Ownership

TDP Thermal Design Power

TPCM Trusted Platform Control Module

TPM Trusted Platform Module

UEFI Unified Extensible Firmware Interface

UID User Identification

UPI Ultra Path Interconnect

UPS Uninterruptible Power Supply

USB Universal Serial Bus

VGA Video Graphics Array

VLAN Virtual Local Area Network

XDP eXtend Debug Port

90
A.3 Backplane DIP Switch
Table A.3-1 Backplane DIP Switch

Type Location Value Condition

Backplane 1 Front-cascaded 12-port backplane

4678
(on the right YZBB-01962-101/YZBB-01955-101
side, away 4628 Cascaded 25-port backplane
from the side
panel of the 5671 Others
chassis)
YZBB-01918-101
RAID card connector or RAID card
Backplane 2 adapter, onboard sSATA2, 3-level
(on the left 5628
cascaded
side, near the YZBB-01962-101/YZBB-01955-101
side panel of
4621 Cascaded 25-port backplane
the chassis)
4671 Others

Backplane 1 Front-cascaded 12-port backplane

4678
(in the YZBB-01962-101/YZBB-01955-101
middle) 5671 Others

YZBB-02515-101 Backplane 2 RAID card connector or RAID card

5628
(on the right adapter
side, near the
side panel of 4671 Cascaded 12-port backplane
the chassis)

5671 Onboard configuration

RAID card, RAID card adapter

configuration or front-cascaded
YZBB-01379-103 Backplane 5628
12-port backplane
YZBB-01962-102/YZBB-01955-102

5328 Front-cascaded 25-port backplane

91