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SLAM Training Guide

The document is a training guide for using the Slam Tool with 130nm technology, detailing setup instructions for Linux and Windows, key commands, and guidelines for VLSI design processes. It covers essential tasks such as LVS and DRC verification, as well as design rules and layout considerations for PMOS and NMOS devices. Additionally, it includes a list of commands for various functions within the tool and outlines the training theory class topics related to VLSI fabrication.

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0% found this document useful (0 votes)
36 views34 pages

SLAM Training Guide

The document is a training guide for using the Slam Tool with 130nm technology, detailing setup instructions for Linux and Windows, key commands, and guidelines for VLSI design processes. It covers essential tasks such as LVS and DRC verification, as well as design rules and layout considerations for PMOS and NMOS devices. Additionally, it includes a list of commands for various functions within the tool and outlines the training theory class topics related to VLSI fabrication.

Uploaded by

20341a04b4
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 34

Slam Tool 130nm

technology

Training Guide

Confidential
WARNING

This material has been reproduced and communicated to you by or


on behalf of ARF Design Pvt Ltd of the copyright act 1968. The
material in this communication may be subject to copyright
under the act.

Any further reproduction or communication of this material by you


may be subject of copyright protection under the act.

Do not remove this notice


SERIAL No Heading
1 How to start slam tool on Linux/Windows
2 Bind-keys
3 Task
4 Golden guidelines
5 LVS
6 DRC
7 Steps follow to go ahead
8 Name of Cells
9 Basic concept on some terminologies
10 FEOL/BEOL
11
12
13
14
Open the Terminal
Run The command “ ssh –X arf1@192.168.1.107 ” and
put password:- arfdesign

The server address may change


After Putting password click “enter” and run
“ virtuoso & ” command to open virtuoso
Go to Admin then click on Configure and just tick √ mark the menus on graphic
window and apply it.
Go to Modify Configuration Provide details on popup window
And click on Replace cfg and click on done.

2 3
To create Library Go to Admin and create library , select the with cfg option as
shown below, Provide details to the pop-up window on create library.

1
2
Open this application on your WINDOW System/laptop

Run Ximing app to connect VPN server


You will get this dialog window by
opening the Putty app.

Now provide the details as same as it


has filled.

After filling all data , click on + mark


of SSH
Now You will gate X11 option , click
on it and then tick mark on
Enable X11 forwarding then click
Open

“terminal” will get open

In the terminal :-

Please follow the same steps


How to open in Linux
environment page.
Now All setting is done to start working on
SLAM tool

Go Ahead Now

Thank you
Serial no Commands Description
1 P Path Drawing
2 R Rectangular Drawing
3 A To Select the component
4 Ctrl+A All Select
5 Shift+A Area wise select
6 D De-select
7 Ctrl+D All De-select
8 Shift+D Area wise De-select
9 C Copy
10 S Stretch
11 M Move
12 K Scale
13 Shift+K Remove Scale
14 Q Edit Properties
Serial no Commands Description
15 I To Instance cell
16 O Contact/via/Pcon/Dcon
17 F Fit To Screen
18 N Straight Path
19 Shift+Z Zoom Out
20 Ctrl+Z Zoom In
21 C+F3 Multiple copy
22 Shift+U Redo
23 F2 / Ctrl+W Save
24 Shift+C Chop
25 Shift+T Rotation
26 Ctrl+I Create TLG (PMOS/NMOS Device)
27 Shift+X Highlight
28 Shift+S Line Stretch
29 Ctrl +S Split/bend
30 Shift+J Drawing
Serial no Commands Description
31 Shift+Q Close cellview
32 U Undo
Serial No Commands Description
1 E Expand the schematic hierarchy
2 Shift+E Go back from the schematic hierarchy
3
4
5
6
7
8
9
10
 Drawing of Metals with different orientation.
 Execute each and every commands on each
components.
 Attaching Vias with different Metals.
 Layers Identifications of PMOS and NMOS.
 Draw each layers of PMOS and NMOS.
 Know difference between PMOS and NMOS.

.
Training Theory Class will be taken By Trainer after
completion of TASK assignment.

Subject of the class will be

ALL ABOUT VLSI FABRICATION PROCESS


 VLSI Industry Network.
 Time To Market.
 Different types of ICs.
 Introduction to wafer .
 Introduction to Layout.
 Introduction to each layer of Layout.
 Even Metal orientation Must be parallel to X-axis(horizontal).
 Odd Metal orientation Must be parallel to Y-axis(vertical).
 All standard cell height must be same.
 Power/Ground line must be connected by M2.
 All Layer must be placed by following “half drc” rule.
 Never Draw Diffusion(OD) layer to fix DRC.
 Must use 2 or more than 2 Vias
 Height of Standard cell must be decided by keeping the components at minimum
DRC spacing.
 Device should be placed at 1st quadrant.
 Add dummy in schematic if you added in the layout.
 Name the device by text layer to identify the device.
 Add pr-boundary for every cell.
 Add N-TAP for PMOS and P-TAP for NMOS.
 Keep PMOS at TOP side and NMOS at BOTTOM side in the Layout.
 Poly orientation must be vertical.
For the design of layout and to get exact in terms of
manufacturing process of the Chip (ICs), we must
go-ahead through a verification process.
There are Two verification process are there

1. LVS
2. DRC
 What is LVS ?

LVS stands for Layout vs. Schematic, Basically it is comparison between


components given in the schematic and designed in the Layout.

Layout Versus Schematic (LVS) checking compares the extracted net-list from the
layout to the original schematic net-list to determine if they match means LVS
is clean.

The comparison check is considered clean if all the devices and nets of the
schematic match the devices and the nets of the layout. The device properties
can also be compared to determine if they match within a certain tolerance.
When properties are compared, all the properties must match as well to get a
clean comparison.
To Fire LVS Run Go to Verification and click on FLVS II , then a pop-up window will
come, Please see next slide
On this Pop-up window Please fill for
physical cell info :

Library name :- Your library name


Library path :- /home/arf1/workarea
Cell name :- Your cell name
View name :- lay

Logical cell info :

Cell name :- Your cell name


View :- sch (by-default it is hd1)

Inside LVS DECK please choose


option t013m9.flvs
Click Ok and then go to virtuoso to
get to know your LVS result
 What is DRC ?

DRC stands for Design Rule check. The process technology has defined some
design rule for each layers which are valid in the layout for that technology to
get manufactured of the ICs, that rule has to meet to get DRC clean.
DRC check ensure the manufacture of chip will not result failure.
To Run DRC go to Verification option on virtuoso and click on DRC and then
click on FDRC II, will open a pop-up window
Provide the Library and cell name and press Ok

Then go to virtuoso to get to know your DRC results


 Floor plan/Placement/Dumping of the device
 Clean Base DRC
 Routing
 Clean Metal DRC
 LVS
 INVERTER • OR_X1
 BUFFX1 • OR_X2
 BUFFX2 • XOR_X1
 BUFFX4 • XNOR2_X1
 BUFFX8 • XNOR2_X2
 NANDX1 • MUX
 NANDX4 • MUX_4X1
 NANDX8 • MUX_4X2
 NOR • TIE-LO
 NOR2X • TIE-HI
 NOR3X
 ORGATE2X
 ANDX1
 ANDX2
 Half adder  OSC_25KHz
 Full adder  DLY_4X1
 Biasgen  MUX_TELEMETRY
 OpAmp  Input Pair
 Cascode  Current Mirror
 GPIO MUX
 Vreg_amp
 OVPFETDR
 LVSHIFT2X
 LVLSHIFT4X
 Half DRC Rule
 Half Cell
 Full Cell
 Unit Cell
 Matching Concept
 Floor plan/Placement
 Routing
 Std cell vs. Custom Std cell
FEOL Layer BEOL Layer
Front End Of Line Back End Of Line
 NW  M1 VIA1
 PP  M2 VIA2
 NP  M3 VIA3
 OD/Diff/RX  M4 VIA4
 Poly  M5 VIA5
 DCON  M6 VIA6
 PCON  M7 VIA7
 M8 VIA8
 M9

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