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Lecture 1 - Introduction

The document outlines the syllabus for the Analog Integrated Circuits course, covering operational amplifiers, the history of integrated circuits (ICs), and their types based on applications, chip packaging size, and fabrication techniques. It details the evolution of ICs from the late 1950s to present, highlighting key developments and technologies such as SSI, MSI, LSI, VLSI, and ULSI. Additionally, it discusses the advantages of ICs over discrete circuits, temperature ranges for different grades of ICs, and the importance of power supply voltages.
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0% found this document useful (0 votes)
11 views27 pages

Lecture 1 - Introduction

The document outlines the syllabus for the Analog Integrated Circuits course, covering operational amplifiers, the history of integrated circuits (ICs), and their types based on applications, chip packaging size, and fabrication techniques. It details the evolution of ICs from the late 1950s to present, highlighting key developments and technologies such as SSI, MSI, LSI, VLSI, and ULSI. Additionally, it discusses the advantages of ICs over discrete circuits, temperature ranges for different grades of ICs, and the importance of power supply voltages.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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23EEE202 – Analog Integrated Circuits

AY 2025-26 ODD SEMESTER


Syllabus
Unit 1

Operational amplifiers: Equivalent circuit, voltage transfer

curve-Open loop Op-amp configurations –Voltage series,

Voltage shunt feedback amplifiers configurations–inverting and

non-inverting amplifier, closed loop differential amplifiers for

single and differential outputs. AC and DC characteristics of

OPAMP.
What is Integrated Circuit?
An integrated circuit (IC) is a low cost electronic circuit
consisting of active and passive components fabricated
together on a single crystal of silicon.
Integrated Circuits are usually called ICs or chips.

3
History of ICs
In 1958
Jack Kilby at Texas Instruments and Robert
Noyce at Fairchild Semiconductor independently
invented the integrated circuit.
Kilby's version used germanium, while Noyce's
used silicon and planar technology, allowing for
more complex and reliable ICs.
Silicon is the primary semiconductor material
used in integrated circuits, while planar
technology is a fabrication method for creating
these circuits.
4
History of ICs
In 1959
Robert Noyce invented the first monolithic
integrated circuit using silicon.
In 1960
The first planar monolithic IC chip was
demonstrated.
In 1961
Fairchild Semiconductor began commercial
production of integrated circuits, marking the
beginning of the IC era.
5
History of ICs
 Late 1950s-1960s
The development of the MOSFET (Metal-Oxide-Semiconductor
Field-Effect Transistor) at Bell Labs enabled high-density
integrated circuits.

1960s-1970s
Fairchild in 1965 introduced the 1 st generation 709 and in
1968, still popular 2nd generation 741 Op-amps introduced. An
Op-amp IC 741 has become an industry standard.

 1970s-Present
The IC became the foundation of the modern electronics
industry, leading to advancements in computing,
communication, and many other fields.
6
Types of Integrated Circuits
On the basis of applications

On the basis of chip packaging size

On the basis of fabrication techniques used

7
1. ON THE BASIS OF
APPLICATIONS

 Linear or Analog Integrated


Circuits

 Digital Integrated Circuits


Digital Integrated Circuits
 These types of ICs work on the basic digital system i.e. two
defined level which is 0’s and 1’s (in other words, Low and
High or ON and OFF respectively).
 Microprocessor and Micro controller are the example of Digital
ICs.

Analog Integrated Circuits


 Analog ICs work by processing continuous signals i.e. analog
signal.
 OP-AMP (Operational Amplifier), IC 555 Timers and Sensors
are the example of Analog ICs.

9
2.ON THE BASIS OF CHIP
PACKAGING SIZE
SSI (small-scale integration)

MSI (medium-scale integration)

LSI (large-scale integration)

VLSI (very large-scale integration)

ULSI (ultra large-scale integration)


Small Scale Integrated Circuits

Initially, the IC technology from around 1961


to 1965 was termed as Small Scale
Integration (SSI).
In the case of SSI, the integrated circuits had
only 2 to 10 components (usually transistors)
on a single chip.
At present, the integrated circuits having 2 to
100 transistors on a single chip are called
small scale integrated circuits.
Small scale integrated circuit are generally
used to manufacture logic gates ICs and flip-
11
Medium Scale Integrated Circuits

Medium scale integration (MSI) is the


second higher level of manufacturing
integrated circuits.
In the medium scale integrated
circuits typically 100 to 1000 transistors are
to be fabricated on a single semiconductor
chip.
Medium scale integrated circuits were
prominent in the period of 1966 to 1971.
The MSI ICs are generally used to
manufacture digital circuits like decoders,
12
Large Scale Integrated Circuits

The large scale integration


(LSI) technology of IC manufacture was
prominent between 1971 and 1978. LSI was
the next higher level of components
integration on a single chip.
In a large scale integrated circuit, thousands
of transistors, typically ranging from 1000 to
20000 transistors, are fabricated on a single
semiconductor chip.
Large scale integration is primarily used to
manufacture ICs of ROM, RAM, processors,
etc. 13
Very Large Scale Integrated Circuits

The very large scale integration


(VLSI) technology of IC manufacture was
started in the year 1978. In vary large scale
integration, a single chip contains around
20000 to 50000 transistors.
The VLSI technology is mainly used to
manufacture ICs for microprocessors,
microcontrollers, etc.

14
Ultra Large Scale Integrated Circuits

Ultra Large Scale Integration (ULSI) is


the present IC manufacturing technology.
In an IC manufactured in ULSI, typically from
50000 to billions of transistors are integrated
on a single chip.
The ultra large scale integration is used to
fabricate circuits of modern advanced
microprocessors and microcontrollers.

15
3.ON THE BASIS OF
FABRICATION TECHNIQUES

* Thin and Thick Film Integrated


Circuits
* Monolithic Integrated Circuits
* Hybrid or Multichip Integrated
Circuits
Thin and Thick Film Integrated Circuits
When passive circuit components like R, C,
etc. are fabricated on a semiconductor chip,
and diodes and transistors are connected
separately to form a complement electronic
circuit, then it is called thin and thick film
integrated circuit.
Therefore, thin and thick film ICs are the
combinations of discrete and integrated
circuit components.

17
Monolithic Integrated Circuits

When all the active, and passive components


of the circuit are fabricated on a single silicon
crystal, it is called a monolithic integrated
circuit.
Monolithic ICs are the most widely adopted
type of IC.
The manufacturing of monolithic ICs is easy,
also they are highly reliable in operation.

18
Hybrid or Multichip Integrated Circuits

When two or more individual chips are


interconnected in a single package, it is
called hybrid or multichip IC.
In these ICs, the active circuit components such
as diodes, transistors, etc., and the passive
circuit components such as resistors, capacitors,
etc. are fabricated on the semiconductor chip.
These components are then connected together
using metallic connections to form the circuit.
The hybrid ICs are efficient in terms of design
and technology.
19
Difference between discrete and
integrated circuits
Discrete circuits utilize individual, standalone
components like resistors, transistors, and
capacitors, each performing a specific
function.
In contrast, integrated circuits (ICs) combine
numerous components onto a single
semiconductor chip, creating a self-contained
unit that can perform complex tasks.

20
Temperature Ranges
Commercial grade ICs typically operate from
0°C to +70°C, while industrial-grade ICs
extend this range to -40°C to +85°C or even -
40°C to +125°C.
Military-grade ICs are designed for the
widest temperature range, typically -55°C to
+125°C.

21
Manufacturer’s Designation for Linear ICs

22
Advantages of Ics over discrete circuits
Small size
Low cost
High reliability
Easy to use
Reduced power consumption

23
IC chip size & Power supply voltages
At present, smallest dimensions of ICs are in
the order of 10 nanometers.
Most of them require both +ve and –ve
supply for the circuit operation. Usually they
are equal in magnitude (e.g.: +15 V and –15
V). Common point of two power supplies must
be grounded. Otherwise, IC gets damaged.

24
SSI AND MSI

25
LSI & VLSI

26
ULSI

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