VI-200 / VI-J00 Family

Design Guide & Applications Manual

DC-DC Converters and

Configurable Power Supplies
 Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Table of Contents
VI-/MI-200 and VI-/MI-J00 DC-DC Converters
1. Zero-Current Switching 2
2. DC-DC Converter Pinouts 3
3. Module Dos and Don’ts 4
4. Overcurrent Protection 7
5. Output Voltage Trimming 8
6. Multiple GATE IN Connections 11
7. Application Circuits / Converter Array
Design Considerations 12
8. Using Boosters and Parallel Arrays 14
9. EMC Considerations 18
10. Optional Output Filters 29

Filter & Front-End Modules

11. Battery Charger (BatMod™) 30
12. AC Input Module (AIM™ / MI-AIM™) 33
13. Harmonic Attenuator Module (HAM™) 37
14. Input Attenuator Module (IAM™ / MI-IAM™) 43
15. Ripple Attenuator Module (RAM™ / MI-RAM™) 47
16. Offline Front End 48
17. DC Input Power System
(ComPAC™ / MI-ComPAC™ Family) 52
18. AC Input Power System (FlatPAC™ Family) 55
19. AC Input Power System (PFC FlatPAC™) 58

General
20. Thermal and Module Mounting Considerations 60
21. Thermal Curves 68
22. Lead-Free Pins (RoHS) 78
23. Tin-Lead Pins 83
24. Module Packaging Options
(SlimMod™, FinMod™, BusMod
and MegaMod™ Families) 88
25. Product Weights 89
26. Glossary of Technical Terms 90

NOTE: This Design Guide and Applications Manual does not address Vicor Maxi, Mini and Micro DC-DC converters.
For more information on these products go to vicorpower.com.

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1. Zero-Current Switching Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview Lossless Energy Transfer

Vicor offers RoHS compliant modules. These modules have a “VE” Referring to Figure and Table 1.1 below, turn-on of the MOSFET
prefix. The information presented herein applies to both versions, switch transfers a quantized energy packet from the input source
and “VI” will be the default designation. to an LC “tank” circuit, composed of inherent transformer leakage
inductance of T1 and a capacitive element, C, in the secondary.
The heart of the Vicor VI-/MI-200 and VI-/MI-J00 module Simultaneously, an approximately half-sinusoidal current flows
technology, zero-current-switching, allows Vicor converters to through the switch, resulting in switch turn-on at zero current
operate at frequencies in excess of 1MHz, with high efficiency and turn-off when current returns to zero. Resonance, or
and power density. Depending on input voltage and load, the bidirectional energy flow, cannot occur because D1 will only permit
converters operate at frequencies ranging from the low hundreds unidirectional energy transfer. A low-pass filter (Lo, Co) following
of kilohertz (light load, high line) to approximately one megahertz the capacitor produces a low ripple DC output. The result is a
(full load, low line). Another aspect of the Vicor topology is that virtually lossless energy transfer from input to output with greatly
two or more power trains driven at the same frequency will reduced levels of conducted and radiated noise.
inherently load-share if their outputs are tied together. Load
sharing is dynamic and is within 5%. The VI-200 and MI-200
product line offer both Driver and Booster modules: IP: Primary current
V P: Primary voltage
nnDrivers and Boosters must have identical power trains.
V S: Secondary voltage
nnDrivers close the voltage loop internally, Boosters do not.
OVP: Overvoltage protection (output)
nnBoosters may be childed to a Driver, allowing configurations
OTS: Overtemperature shutdown
of multi-kilowatt arrays, which exhibit dynamic current sharing
between modules. OC1, OC2: Opto-coupler
nnOnly a single control connection is needed between modules E/A: Error amplifie
with all module’s power inputs and outputs, connected together REF: Bandgap reference
— no trimming, adjustments, or external components are
C/L: Current limit amplifier
required to achieve load sharing.
Table 1.1

Output Filter IP
Integrator
Input VP
Filter T1 Vin
Lo
D1 VS +VOUT
+VIN
Reset C D2 Co Load
Control
IP –VOUT
MOSFET
-VIN VP + – Vs
OVP[a] C/L
OC1[a]
OTS[a] VOUT
GATE
IN
Logic – +S
GATE Control Referenced
OC2
OUT + 2.5V to –VIN
REF. TRIM
E/A Gate
–S Out

[a] Not in VI-J00 Series

Figure 1.1 — VI-/MI-200 and VI-/MI-J00 series zero-current-switching block diagram

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2. DC-DC Converter Pinouts Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

GATE IN: The GATE IN pin on a Driver module may be used as a

logic Enable / Disable input. When GATE IN is pulled low (<0.65V
at 6mA, referenced to –VIN), the module is turned off; when
GATE IN is floating (open collector), the module is turned on. The
open circuit voltage of the GATE IN pin is less than 10V.
–IN –OUT –IN –OUT
–OUT, +OUT: DC output pins. See the Table 2.3 and 2.4 below
GATE GATE
OUT
–S
OUT
–S
for output voltages and power levels of VI-/MI-200 and VI-/MI-J00
GATE
T
GATE
T
Family converter modules.
+S +S
IN IN
+IN +OUT +IN +OUT
VI-200, VI-J00 Standard Output Voltages
Designator Output Designator Output
Z 2V 2 15V
Y 3.3V N 18.5V
O 5V 3 24V
Figure 2.1 — VI-/MI-200, VI-/MI-J00
X 5.2 L 28V
–IN, +IN: DC voltage inputs. See Tables 2.1 and 2.2 for nominal W 5.5V J 36V
input voltages and ranges for the VI-/MI-200 and VI-/MI-J00 Family V 5.8V K 40V
converter modules (data sheets contain Low Line, 75% Max. Power
T 6.5V 4 48V
and Transient ratings).
R 7.5V H 52V
VI-200, VI-J00 Input Voltage Ranges M 10V F 72V
Designator Low Nominal High 1 12V D 85V
0 10V 12V 20V P 13.8V B 95V
V 10V 12/24V 36V Table 2.3 — VI-200, VI-J00 output voltage designators
1 21V 24V 32V
W 18V 24V 36V Output Power Level Power Level
2 21V 36V 56V Voltage VI-200 VI-J00 High MI-J00
3 42V 48V 60V <5VDC 10 – 40A 5 – 20A 10 – 30A 5 – 10A
N 36V 48V 76V ≥5VDC 50 – 200W 25 – 100W 50 – 100W 10 – 50W
4 55V 72V 100V Table 2.4 — Output voltage vs. power level
T 66V 110V 160V
5 100V 150V 200V Special output voltages from 1 – 95V; consult factory.
6 200V 300V 400V
T (TRIM): Provides fixed or variable adjustment of
7 100V 150/300V 375V the module output.
Table 2.1 — VI-200, VI-J00 input voltage ranges Trimming Down: Allows output voltage of the module to be
trimmed down, with a decrease in efficiency. Ripple as a percent of
MI-200, MI-J00 Input Voltage Ranges output voltage goes up and input range widens since input voltage
dropout (loss of regulation) moves down.
Designator Low Nominal High
2 18V 28V 50V
Trimming Up: Reverses the above effects.

5 100V 155V 210V –S, +S (–SENSE, +SENSE): Provides for locating the point of optimal
voltage regulation external to the converter. Output OVP in
6 125V 270V 400V
VI-/MI-200 will trip if remote sense compensates output voltage
7 100V 165V 310V measured at output pins above 110% of nominal. Discrete wire
Table 2.2 — MI-200, MI-J00 input voltage ranges used for sense must be tightly twisted pair. Do not exceed 0.25V
drop in negative return; if the voltage drop exceeds 0.25V in the
negative return path, the current limit set point will increase.
GATE OUT: The pulsed signal at the GATE OUT pin of a regulating Connect +SENSE to +OUT and –SENSE to –OUT at the module if
Driver module is used to synchronously drive the GATE IN pin of remote sensing is not desired (Figure 7.4).
a companion Booster module to effect power sharing between
the Driver and the Booster. Daisy-chaining additional Boosters
(connecting GATE OUT of one unit to GATE IN of a succeeding
unit) leads to a virtually unlimited power expansion capability.

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3. Module Dos and Don’ts Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Electrical Considerations GATE IN and GATE OUT Pins Input Source Impedance: The converter should be connected
to an input source that exhibits low AC impedance. A small
Logic Disable: When power is applied to the input pins, the
electrolytic capacitor should be mounted close to the module’s
GATE IN pin of a Driver can be pulled low with respect to the –IN
input pins. (C3, Figure 3.1) This will restore low AC impedance,
thus turning off the output while power is still applied to the
while avoiding the potential resonance associated with “high-Q”
input. (Figure 7.1)
film capacitors. The minimum value of the capacitor, in microfarads,
Caution: With offline applications –IN is not earth ground. should be C(µF) = 400 ÷ VIN minimum. Example: VIN, minimum, for
In Logic Disable mode, the GATE IN pin should be driven from a VI-260-CV is 200V. The minimum capacitance would be
either an “open collector” or electromechanical switch that can 400 ÷ 200 = 2µF. For applications involving long input lines or high
sink 6mA when on (GATE IN voltage less than 0.65V). If driven inductance, additional capacitance will be required.
from an electromechanical switch or relay, a 1µF capacitor should The impedance of the source feeding the input of the module
be connected from GATE IN to –IN to eliminate the effects directly affects both the stability and transient response of the
of switch “bounce”. The 1µF capacitor may be required in all module. In general, the source impedance should be lower
applications to provide a “soft start” if the unit is disabled and than the input impedance of the module by a factor of ten,
enabled quickly. Do not exceed a repetitive on / off rate of 1Hz to from DC to 50kHz.
the GATE IN or input voltage pins.
To calculate the required source impedance, use the
High Power Arrays: The pulsed signal at the GATE OUT pin of a following formula:
regulating Driver module is used to synchronously drive the
GATE IN pin of a companion Booster module to effect power Z = 0.1(VLL)2 / PIN
sharing between the Driver and the Booster. (Figure 7.5) Where: Z is required input impedance
Daisy‑chaining additional Boosters (i.e., connecting GATE OUT to VLL is the low line input voltage
GATE IN of a succeeding unit) leads to a virtually unlimited power PIN is the input power of the module
expansion capability. VI-/MI-200 series modules of the same family
and power level can be paralleled (i.e., Driver, VI-260-CU with Filters, which precede the module, should be well damped to
Booster, VI-B60-CU). prevent ringing when the input voltage is applied or the load on
the output of the module is abruptly changed.
In general:
Input Transients: Don’t exceed the transient input voltage rating
nn Don’t drive the GATE IN pin from an “analog” voltage source. of the converter. Input Attenuator Modules or surge suppressors
nn Don’t leave GATE IN pins of Booster modules unterminated. in combination with appropriate filtering, should be used in offline
applications or in applications where source transients may be
nn Don’t overload GATE OUT; limit load to a single Vicor module
induced by load changes, blown fuses, etc. For applications where
GATE IN connection, or 1kΩ, minimum, in parallel with 100pF,
the input voltage may go below low line it is recommended that
maximum.
an undervoltage lockout circuit be used to pull GATE IN low to
nn Don’t skimp on traces that interconnect module –IN pins in disable the converter module. The undervoltage lockout circuit
high power arrays. GATE IN and GATE OUT are referenced should induce a delay of at least one second before restarting
to –IN; heavy, properly laid out traces will minimize parasitic the converter module. Longer delays will be required if external
impedances that could interfere with proper operation. capacitance is added at the output to insure the internal soft start
nn Do use a decoupling capacitor across each module’s input (see is re-initialized.
Input Source Impedance that follows). NOTE: Do not allow the rate of change of the input voltage to exceed
nn Do use an EMI suppression capacitor from +/– input and output 10V/µs for any input voltage deviation.
pins to the baseplate. The level of transient suppression required will depend on the
nn Do use a fuse on each module’s + input to prevent fire in severity of the transients. A Zener diode, TRANSZORB™ or MOV
the event of module failure. See safety agency conditions of will provide suppression of transients under 100µs and act as a
acceptability for the latest information on fusing. Please see the voltage clipper for DC input transients. It may be necessary to
Vicor website for Safety Approvals. incorporate an LC filter for larger energy transients. This LC filter
will integrate the transient energy while the Zener clips the peak
voltages. The Q of this filter should be kept low to avoid potential
resonance problems. See Section 14, Input Attenuator Module
(IAM / MI-IAM) for additional information on transient suppression.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Output OVP: The VI-/MI-200, with the exception of VI-/MI-J00s, Thermal and Voltage Hazards
has an internal overvoltage protection circuit that monitors the Vicor component power products are intended to be used within
voltage across the output power pins. It is designed to latch the protective enclosures. Vicor DC-DC converters work effectively
converter off at 115 – 135% of rated output voltage. It is not a at baseplate temperatures, which could be harmful if contacted
crowbar circuit, and if a module is trimmed above 110% of rated directly. Voltages and high currents (energy hazard) present
output voltage, OVP may be activated. Do not backdrive the at the pins and circuitry connected to them may pose a safety
output of the converter module to test the OVP circuit. hazard if contacted or if stray current paths develop. Systems
Caution: When trimming up VI-/MI-J00 modules, additional care should be with removable circuit cards or covers which may expose the
taken as an improper component selection could result in module failure. converter(s) or circuitry connected to the converters, should have
Improper connection of the sense leads on VI-/MI-J00 modules can also proper guarding to avoid hazardous conditions.
result in an excessive overvoltage condition and module failure.
Input Reverse Voltage Protection: The module may be EMC Considerations
protected against reverse input voltages by the addition of a diode All applications utilizing DC-DC converters must be properly
in series with the positive input, or a reverse shunt diode with a bypassed, even if no EMC standards need to be met. Bypass IN
fuse in series with the positive input. See Section 14, the Input and OUT pins to each module baseplate as shown in Figure 3.1.
Attenuator Module (IAM / MI-IAM) provides input reverse voltage Lead length should be as short as possible. Recommended values
protection when used with a current limiting device (fuse). vary depending on the front end, if any, that is used with the
modules, and are indicated on the appropriate data sheet. In most
Thermal / Mechanical Considerations applications, C1a – C1b is a 4,700pF Y-capacitor
Baseplate. Operating temperature of the baseplate, as measured (Vicor Part # 01000) carrying the appropriate safety agency
at the center mounting slot on the –IN, –OUT side, can not exceed approval; C2a – C2b is a 4,700pF Y-capacitor (Vicor Part # 01000)
rated maximum. ThermMate or thermal compound should be used or a 0.01µF ceramic capacitor rated at 500V. In PCB mount
when mounting the module baseplate to a chassis or heat sink. applications, each of these components is typically small enough to
All six mounting holes should be used. Number six (#6) machine fit under the module baseplate flange.
screws should be torqued to 5 – 7in.lbs, and use of Belville washers
is recommended.
The module pins are intended for PCB mounting either by wave
soldering to a PCB or by insertion into one of the recommended
PCB socket solutions. C1a C2a
CAUTION: Use of discrete wires soldered directly to the pins may cause
intermittent or permanent damage to the module; therefore, it is not +IN +OUT
Zero Current
recommended as a reliable interconnection scheme for production as a C3 Switching
final released product. See Section 21 for packaging options designed for Converter
discrete wire connections (BusMod, MegaMod). –IN –OUT
In addition, modules that have been soldered into printed circuit
boards and have subsequently been removed should not be reused. C1b C2b

Figure 3.1 — IN and OUT pins bypassed to the module

baseplate and input cap for low AC impedance

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3. Module Dos and Don’ts Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Safety Considerations Safety agency conditions of acceptability require module

input fusing. The VI-x7x, VI-x6x and VI-x5x require the use
Shock Hazard: Agency compliance requires that the
of a Buss PC-Tron fuse or other DC-rated fuse. See below for
baseplate be grounded.
suggested fuse ratings.
Fusing: Internal fusing is not provided in Vicor DC-DC converters.
The safety approvals section of the Vicor website should
To meet safety agency conditions, a fuse is required. This fuse
always be checked for the latest fusing and conditions of
should be placed in the positive input lead, not the negative input
acceptability information for all DC-DC converters including the
lead, as opening of the negative input lead will cause the
MegaMod family.
GATE IN and GATE OUT to rise to the potential of the +IN lead,
causing possible damage to other modules or circuits that share
common GATE IN or GATE OUT connections.

Acceptable Fuse Types and Current Rating for the VI-200 and VI-J00 Family of Converters
Package Size Required Fuse Package Size Required Fuse
VI-27x-xx PC-Tron 2.5A VI-J7x-xx PC-Tron 2.5A
VI-26x-xx PC-Tron 3A VI-J6x-xx PC-Tron 3A
VI-25x-xx PC-Tron 5A VI-J5x-xx PC-Tron 5A
VI-2Tx-xx PC-Tron 5A VI-JTx-xx PC-Tron 5A
VI-24x-xx 6A / 125V VI-J4x-xx PC-Tron 5A
VI-2Nx-xx 8A / 125V VI-JNx-xx PC-Tron 5A
VI-23x-xx 8A /125V VI-J3x-xx PC-Tron 5A
VI-22x-xx 8A / 60V VI-J2x-xx PC-Tron 5A
VI-2Wx-xx 12A / 50V VI-JWx-xx 8A / 60V
VI-21x-xx 12A / 32V VI-J1x-xx 8A / 60V
VI-2Vx-xx 12A / 32V VI-J0x-xx 8A / 60V
VI-20x-xx 12A / 32V

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4. Overcurrent Protection Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Foldback Current Limiting Straight Line Current Limiting

The VI-/MI-200 modules with output voltages of 5V or 3.3V The VI-/MI-200 modules with output voltages greater than 5V,
incorporate foldback current limiting. (Figure 4.1) In this mode, 2V (VI-/MI-200 only) and all VI-/MI-J00 modules incorporate a
the output voltage remains constant up to the current knee, (IC), straight‑line type current limit. (Figure 4.2) As output current is
which is 5 – 25% greater than full-rated current, (IMAX). Beyond increased beyond IMAX, the output voltage remains constant and
IC, the output voltage falls along the vertical line IC–IFB until within its specified limits up to a point, IC, which is 5 – 25% greater
approximately 2V. At ≤2V, the voltage and current folds back to than rated current, (IMAX). Beyond Ic, the output voltage falls along
short circuit current point (20 – 80% of Imax). Typically, modules the vertical line to ISC. Typically, modules will automatically recover
will automatically recover when overcurrent is removed. after overcurrent is removed.
When bench testing modules with foldback current limiting, use
a constant resistance load as opposed to a constant current load.
Some constant current loads have the ability to pull full current
at near zero volts. This may cause a latchup condition. Also when
performing a short circuit test it is recommended to use a mercury
wetted relay to induce the output short as other methods may
induce switch bounce that could potentially damage the converter.

IC IMAX IC
V VOUT
OUT

2V IFB

IOUT IOUT
ISHORT CIRCUIT IMAX ISHORT CIRCUIT

Figure 4.1 — Foldback current limiting Figure 4.2 — Straight-line current limiting

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5. Output Voltage Trimming Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview Resistive Adjustment Procedure

Specifications such as efficiency, ripple and input voltage range To achieve a variable trim range, an external resistor network must
are a function of output voltage settings. As the output voltage is be added. (Figure 5.1)
trimmed down, efficiency goes down; ripple as a percent of VOUT
Example 1: For trimming –10% to +10% with a standard
goes up and the input voltage range widens since input voltage
off-the-shelf 10kΩ potentiometer (R7), values for resistors R6 and
dropout (loss of regulation) moves down. As the units are trimmed
R8 need to be calculated.
up, the reverse of the above effects occurs.
Resistor R6 limits the trim down range. For a given percentage,
All converters have a fixed current limit. The overvoltage protection
its value is independent of output voltage. Refer to Table 5.1, for
setpoint is also fixed; trimming the output voltage does not alter
limiting resistor values.
its setting. As the output voltage is trimmed down, the current
limit setpoint remains constant. Therefore, in terms of output
power, if the unit is trimmed down, available output power
drops accordingly. +OUT
R1 47Ω Typ.
The output voltage of most Vicor converters can be trimmed Error Amp
+SENSE
R2 R8
+10%, –50%. Certain modules have restricted trim ranges. Consult – TRIM R6
the latest datasheet for details. + R7 Load
R5 10kΩ[a] R3 C1
–SENSE
Do not attempt to trim the module output voltage more than
2.5V[a] R4 27Ω Typ.
+10%, as overvoltage shut down may occur. Do not exceed –OUT
maximum rated output power when the module is trimmed up.
Caution: When trimming up VI-/MI-J00 converter modules, additional care [a]
For VOUT < 3.3V, R5 = 3.88kΩ and internal reference = 0.97V.
should be taken as an improper component selection could result in module
failure. Improper connection of the sense leads on VI-/MI-J00 converter Figure 5.1 — External resistive network for variable trimming
modules can also result in an excessive overvoltage condition
and module failure.
The following procedures describe methods for output voltage Trimming Down –10%
adjustment (–10 to +10% of nominal) of the VI-/MI-200, A 10% drop of the 2.5V reference at the trim pin is needed to
VI-/MI-J00, ComPAC/MI-ComPAC, FlatPAC and effect a 10% drop in the output voltage. (Figure 5.2)
MegaMod/MI-MegaMod families.
Modules with nominal 3.3V outputs and above have the
+OUT
2.5V precision reference and 10kΩ internal resistor. For trim
resistor calculations on modules with 2.0V outputs use 0.97V +SENSE
in place of the 2.5V reference and substitute 3.88kΩ for the R5 10kΩ [a]
(internal)
R8
TRIM R6
internal 10kΩ resistor. 2.5V[a]
R7 10kΩ POT
reference V1 IR6
Resistors are 0.25W. When trimming down any module, always (internal) –SENSE

maintain a minimum preload of at least 1% of rated output power –OUT

and in some cases up to 10% may be required. For more specific
information on trimming down a specific module, please consult
the Vicor Applications Engineering Department at (800) 927-9474. [a]
For VOUT <3.3V, R5 = 3.88kΩ and internal reference = 0.97V.

Figure 5.2 — Circuit diagram “Trim Down”

V1 = 2.5V – 10% = 2.25V

Therefore:
(2.5V – 2.25V)
IR5 = = 25µa
10kΩ
Since IR5 = IR6 = 25µA:
2.25V
R6 = = 90kΩ
25µa
This value will limit the trim down range to –10% of
nominal output voltage.

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5. Output Voltage Trimming Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Trimming Up +10% Fixed Trim

To trim 10% above the nominal output voltage, the following Converters can be trimmed up or down with the addition of
calculations are needed to determine the value of R8. This one external resistor, either RU for programming up or RD for
calculation is dependent on the output voltage of the module. A programming down. (Figure 5.4)
12V output will be used as an example. (Figure 5.3)
Example 2: Fixed Trim Up (12V to 12.6V).
It is necessary for the voltage at the trim pin to be 10% greater To determine RU, the following calculation must be made:
than the 2.5V reference. This offset will cause the error amplifier to
adjust the output voltage up 10% to 13.2V.
2.5V + 5% = 2.625V
VR5 = VTRIM – VREF
VR5 = 2.625 – 2.5 = 0.125V
+ OUT
+ SENSE
R5 10kΩ[a] R8
Knowing this voltage, the current through R5 can be found:
(internal) IR8
R6 90kΩ V2
2.5V[a]
TRIM
R7 10kΩ POT VR5 0.125
reference V1
– SENSE 25µA 500µA IR5 = = = 12.5µa
(internal) R5 10kΩ
– OUT
VRu = 12.6V – 2.625V = 9.975V
[a]
For VOUT < 3.3V, R5 = 3.88kΩ and internal reference = 0.97V.
9.975
Figure 5.3 — Circuit diagram “Trim Up” Ru = = 798kΩ
12.5µa

V1 = 2.5V + 10% = 2.75V

(2.5V – 2.25V) + OUT

IR5 = = 25µa + SENSE
10kΩ R5 10kΩ[a] Trim Resistor for UP
(internal) RU Programming
TRIM
Since IR5 = IR6, 2.5V[a] or
the voltage drop across R6 = (90kΩ) (25µA) = 2.25V. reference Trim Resistor for DOWN
(internal) – SENSE RD Programming
Therefore, V2 = 2.75V + 2.25V = 5V. The current through – OUT
R7 (10kΩ pot) is:

V2 5
[a]
For VOUT < 3.3V, R5 = 3.88kΩ and internal reference = 0.97V.

IR7 = = = 500µa
R7 10kΩ Figure 5.4 — Fixed trimming

Using Kirchoff’s current law: Connect RU from the trim pin to the +SENSE. Be sure to connect
the resistor to the +SENSE, not the +OUT, or drops in the positive
IR8 = IR7 + IR6 = 525μA output lead as a function of load will cause apparent load
regulation problems.
Thus, knowing the current and voltage, R8 can be determined: Example 3: –25% Fixed Trim Down (24V to 18V).
The trim down methodology is identical to that used in Example 2,
VR8 = (VOUT + 10%) – V2 = 13.2V – 5V = 8.2V except that it is utilized to trim the output of a 24V module down
25% to 18V. The voltage on the trim pin must be reduced 25%
(8.2V) from its nominal setting of 2.5V. This is accomplished by adding a
R8 = = 15.6kΩ
525µa resistor from the trim pin to –SENSE.

This resistor configuration allows a 12V output module to be

2.5V – 25% = 1.875V
trimmed up to 13.2V and down to 10.8V. Follow this procedure to VR5 = VBANDGAP – VTRIM
determine resistor values for other output voltages.
= 2.5V – 1.875V = 0.625V

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5. Output Voltage Trimming Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Knowing this voltage, the current through R5 can be found: Dynamic Adjustment Procedure
VR5 0.625 Output voltage can also be dynamically programmed by driving the
IR5 = = = 62.5µa TRIM pin from a voltage or current source; programmable power
R5 10kΩ supplies and power amplifier applications can be addressed in this
The voltage across the resistor, RD, and the current flowing way. For dynamic programming, drive the TRIM pin from a source
through it are known: referenced to the negative sense lead, and keep the drive voltage
in the range of 1.25 – 2.75V. Applying 1.25 – 2.5V on the TRIM pin
(2.5V – 0.625V)
RD = = 30kΩ corresponds to 50 – 100% of nominal output voltage. For example,
62.5µa an application requires a +10, 0% (nominal), and a –15% output
voltage adjustment for a 48V output converter. Referring to the
Connect RD (Figure 5.4) from the TRIM pin to the –SENSE of the table below, the voltage that should be applied to the trim pin
module. Be sure to connect the resistor to the SENSE, not the would be as follows:
–OUT, or drops in the negative output lead as a function of load
will cause apparent load regulation problems.
V TRIM VOUT Change from Nominal
Values for Trim Down by Percentage 2.125 40.8 –15%
Percent Resistance 2.5 48 0
–5% 190kΩ 2.75 52.8 +105
–10% 90kΩ
–15% 56.7kΩ The actual voltage range is further restricted by the allowable trim
range of the converter. Voltages in excess of 2.75V
–20% 40kΩ
(+10% over nominal) may cause overvoltage protection to be
–25% 30kΩ activated. For applications where the module will be programmed
–30% 23.3kΩ on a continuous basis the slew rate should be limited to
30Hz sinusoidal.
–35% 18.6kΩ
–40% 15kΩ Trimming on the Web (vicorpower.com)
–45% 12.2kΩ Trim values are calculated automatically. Design Calculators are
–50% 10kΩ available on the Vicor website in the PowerBench™ section at:
Table 5.1 — Values for trim down by percentage (Refer to product www.vicorpower.com/powerbench.
data sheet for allowable trim ranges at vicorpower.com) Resistor values can be easily determined for fixed trim up, fixed trim
down and for variable trimming applications.
Fixed Trim Down In addition to trimming information, the website also includes
VNOM V (Desired) Trim Resister [a] design tips, applications circuits, EMC suggestions, thermal design
5V 4.5V 90.9kΩ guidelines and PDF data sheets for all available Vicor products.
3.3V 19.6kΩ
2.5V 10.0kΩ
15V 13.8V 115kΩ
24V 20V 49.9kΩ
48V 40V 49.9kΩ
36V 30.1kΩ
Table 5.2a — Values for fixed trim down by voltage

Fixed Trim Up
VNOM V (Desired) Trim Resister [a]
5.2V 261kΩ
5V
5.5V 110kΩ
12.5V 953kΩ
12V
13.2V 422kΩ
15.5V 1.62MΩ
15V
16.5V 562kΩ
24V 25V 2.24MΩ
48V 50V 4.74MΩ
Table 5.2b — Values for fixed trim up by voltage
[a] Values listed in the tables are the closest standard 1% resistor values.

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6. Multiple GATE IN Connections Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview C2 will also lengthen turn-on time. SW1 is a mechanical or solid

state switch that is used to disable both Driver modules. C3 is
A number of GATE IN pins may be connected for remote shut
used to minimize the effects of “switch bounce” associated with
down and logic disable. (Figure 6.1) Diodes D1 and D2 provide
mechanical devices.
isolation and prevent multiple failures if the GATE IN of a module
becomes shorted to the +IN. The Zener diodes Z1, Z2 and NOTE: GATE IN voltage needs to be <0.65 V referenced to –IN to ensure
capacitors C1, C2 attenuate transient voltage spikes caused by modules are disabled.
differential inductance in the negative lead. Capacitors C1 and

C1, C2, C3 = 1µF

Z1, Z2 = 15V (1N5245B) F1
+IN +O
D1, D2 = Small signal diode (1N4148)[a]
D1 GATE
IN Vicor
DC-DC Converter T
Z1 GATE
[a]
For bus voltages greater than 75V, C1 OUT
a 1N4006 diode should be used. C3 –IN –O
DISABLE
SW1 F2
+IN +O
D2 GATE
IN Vicor
DC-DC Converter T
GATE
Z2 C2 OUT
–IN –O

NOTES:
The –IN to –IN input lead should be kept as short as possible to minimize differential inductance.
Heavy lines indicate power connections. Use suitably-sized conductors.
Opto-couplers or relays should be used to isolate GATE IN connections if the converters are on separate boards or the negative-input
lead’s impedance is high.

Figure 6.1 — Protection for multiple GATE IN connections

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Logic Disable: (Figure 7.1) The GATE IN pin of the module may be Negative Inputs (with positive ground): (Figure 7.3) Vicor
used to turn the module on or off. When GATE IN is pulled low modules have isolated inputs and outputs making negative
(<0.65V at 6mA, referenced to –VIN), the module is turned off. input configurations easy. Fusing should always be placed in
When GATE IN is floating (open collector), the module is turned on. the positive lead.
The open circuit voltage of the GATE IN pin is less than 10V. This
Remote Sensing: (Figure 7.4) Output voltage between +OUT
applies to VI-/MI-200, VI-/MI-J00 and MegaMod / MI-MegaMod
and –OUT must be maintained below 110% of nominal. Do not
Family modules.
exceed 0.25V drop in negative return as the current limit setpoint
Output Voltage Programming: (Figure 7.2) Consult the Vicor is moved out proportionately. The sense should be closed at the
Applications Engineering Department before attempting large module if remote sensing is not desired. Applies to VI-/MI-200,
signal applications at high repetition rates due to ripple current VI-/MI-J00, ComPAC / MI-ComPAC, FlatPAC and MegaMod /
considerations with the internal output capacitors. This applies MI-MegaMod Family modules. Excessively long sense leads and /
to VI-/MI-200, VI-/MI-J00, ComPAC / MI-ComPAC, FlatPAC and or excessive external capacitance at the load may result in module
MegaMod / MI-MegaMod Family modules. instability. Please consult Vicor Applications Engineering for
compensation methods.
VTRIM • VNOM
VOUT =
2.5

+IN +OUT +IN +OUT

GATE +S GATE Zero Current +S
IN Zero Current + IN
+ Switching Switching +
– TRIM Load – TRIM – Load
1µF GATE Converter GATE Converter
Driver –S Driver –S
Opto-Coupler OUT OUT
–IN –OUT –IN –OUT

Figure 7.1 — Logic disable Figure 7.2 — Output voltage programming

+IN +OUT +IN +OUT •••

GATE Zero Current +S GATE Zero Current +S •••
+ IN Switching + IN Switching
– TRIM Load – TRIM Load
GATE Converter Converter
Driver –S GATE Driver –S •••
OUT OUT
–IN –OUT –IN –OUT •••

Figure 7.3 — Negative inputs (with positive ground) Figure 7.4 — Remote sensing

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Parallel Boost: (Figure 7.5) U.S. Patent #4,648,020 – other patents NOTE: When using a VI-J00 module, the TRIM pin voltage should be
pending. To retain accurate power sharing between a Driver and clamped to 2.75V to avoid damage to the module. This corresponds to the
(n) number of Boosters, provide adequate input and output power maximum trim up voltage. This circuit or functional equivalent must be used
bussing. This applies to VI-/ MI-200 and MegaMod / MI-MegaMod when charging batteries. Do not exceed the nominal current ratings of the
converter. Example:
Family modules. See Module Dos and Don’ts for recommended
external components. (Section 3) POUT
Programmable Current Source: (Figure 7.6) Module output VNOMINAL
voltage should not exceed the rated voltage of the operational
amplifier. This applies to VI-/MI-200, VI-/MI-J00, Dual Output Voltages: (Figure 7.7) Vicor modules have isolated
ComPAC / MI-ComPAC, FlatPAC and MegaMod / MI-MegaMod outputs so they can easily be referenced to a common node
Family modules. creating positive and / or negative rails.

+IN +OUT
+IN +OUT
Zero Current GATE
GATE Switching Zero Current +S
+S + IN Switching Load requiring
IN Converter – TRIM
Converter positive output
#1 TRIM GATE
GATE Driver –S
Driver –S OUT
OUT
–IN –OUT
–IN VI-2xx-xx –OUT

+ Load
–
+IN +OUT +IN +OUT
GATE Zero Current
IN Switching +S GATE
Converter Zero Current +S
TRIM + IN Switching Load requiring
GATE #n – TRIM negative output
Booster –S GATE Converter
OUT Driver –S
OUT
–IN VI-Bxx-xx –OUT –IN –OUT

Figure 7.5 — Parallel boost. U.S. Patent #4,648,020; Figure 7.7 — Dual output
Dual voltages
voltage output
other patents pending

I
+IN +OUT
GATE Zero Current +S –
+ IN Switching 1kΩ OP
– TRIM AMP 0.01 Load
Converter 1kΩ
GATE Driver -S +
OUT 10µF
1kΩ 1kΩ
–IN –OUT
0.05Ω
V Control
0.1V/A

Figure 7.6 — Programmable current source

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview the output current of each module and forces all of the currents to
be equal by feedback control.
The VI-/MI-200 Family of DC-DC converters are available as Driver
or Booster modules. The Driver can be used as a stand-alone Synchronous current sharing offers an alternative to analog
module or in multi-kilowatt arrays by adding parallel Boosters. techniques. In a synchronous scheme, there is no need for a
Booster modules do not contain feedback or control circuitry, so it current-sensing or current-measuring device on each module. Nor
is necessary to connect the Booster GATE IN pin to the preceding is there a need to artificially increase output impedance, which
Driver or Booster GATE OUT, to synchronize operation. Drivers and compromises load regulation.
Boosters have identical powertrains, although Drivers close the
voltage loop internally while Boosters do not. There are advantages and disadvantages associated with each
approach to current sharing. In choosing the best approach for a
The concept behind Driver / Booster operation is that two or more given application, designers should be aware of the tradeoffs as
ZCS powertrains driven at the same frequency will inherently load well as tips for implementing a successful design.
share if their inputs and outputs are tied together. Childed modules
require only one connection between units when their outputs Most paralleled power components, such as transistors, rectifiers,
are connected together; no trimming, adjustments or external power conversion modules and offline power supplies, will not
components are required to achieve load sharing. The load sharing inherently share the load. With power converters, one or more of
is dynamic and typically within 5%. the converters will try to assume a disproportionate or excessive
fraction of the load unless forced current-sharing control is
For additional information, refer to Electrical Considerations – High designed into the system.
Power Arrays in Module Dos and Don’ts. (Section 3)
One converter, typically the one with the highest output voltage,
IMPORTANT: It is important to remember that when using Boosters, may deliver current up to its current limit setting, which is beyond
the input voltage, output voltage and output power of the Boosters its rated maximum. Then, the voltage will drop to the point where
must be the same as the Driver.
another converter in the array – the one with the next highest
Whenever power supplies or converters are operated in a parallel voltage – will begin to deliver current. All of the converters in
configuration – for higher output power, fault tolerance or both – an array may deliver some current, but the load will be shared
current sharing is an important consideration. Most current‑sharing unequally. With built-in current limiting, one or more of the
schemes employed with power converters involve analog converters will deliver current up to the current limit (generally
approaches. One analog method artificially increases the output 15 or 20% above the module’s rated maximum), while other
impedance of the converter modules, while another actually senses converters in the array supply just a fraction of load.

+ +IN +OUT
GATE Zero-Current-
IN Switching +S
INPUT Driver TRIM LOAD
GATE
OUT –S
– –IN VI-2xx-xx
–OUT

+IN +OUT
GATE Zero-Current-
IN +S
Switching
GATE Booster TRIM
OUT –S
–IN VI-Bxx-xx –OUT

+IN +OUT
GATE Zero-Current-
IN Switching +S
Booster TRIM
GATE
OUT –S
VI-Bxx-xx
–IN –OUT

Figure 8.1 — Parallel array

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Consider a situation where one module in a two-module array is resistance increases, negating its value as a stable current-sensing
providing all of the load. If it fails, the load on the second module device. Second, there are oxidation and corrosion issues, which
must go from no load to full load. During that time, the output also cause parametric changes. Consequently, a high-precision
voltage is likely to droop temporarily. This could result in system current‑sensing device, such as a precision resistor, is a must.
problems, including shut down or reset.
The resistor values typically range from a few mΩ up to about
On the other hand, if both modules were sharing the load and one 100mΩ, depending on the power level or current range of
failed, the surviving module would experience a much less severe operation. Selecting the right value requires a tradeoff between
transient (one-half to full load). Also, the output voltage would power dissipation and sensitivity (signal-to-noise ratio or noise
be likely to experience no more than a slight momentary droop. immunity). The larger the resistor value, the better the noise
The dynamic response characteristic of all forward converters, immunity – and the greater the power dissipation.
resonant or pulse-width modulated, is degraded when the load
Determining the size of the resistor needed to generate a signal
is stepped from zero (no load) where the output-inductor current
above the noise can be a bit tricky. Another potential pitfall with
is discontinuous.
this (or, for that matter, any other) approach is the need for good
In the same two-module array example, the module carrying electrical and mechanical design and layout. This requires adequate
all of the load also is generating all of the heat. That results in trace widths, minimized trace lengths and decoupling to reduce
a much lower mean time between failure for that module. An noise. An experienced designer should have no difficulty with this,
often‑quoted rule of thumb says that for each 10°C increase in but it is an area rich with opportunities for error.
operating temperature, average component life is cut in half.
The droop-share method artificially increases the output impedance
In a current-sharing system, the converters or supplies all run at to force the currents to be equal. It’s accomplished by injecting
the same temperature. This temperature is lower than that of the an error signal into the control loop of the converter, causing
hot-running (heavily-loaded) modules in a system without current the output voltage to vary as a function of load current. As load
sharing. Furthermore, same-temperature operation means that all current increases, output voltage decreases. All of the modules will
of the modules in a current-sharing arrangement age equally. deliver approximately the same current because they are all being
summed into one node.
Current sharing, then, is important because it improves system
performance. It optimizes transient and dynamic response and If one supply is delivering more current than another supply,
minimizes thermal problems, which improves reliability and helps its output voltage will be slightly forced down so that it will be
extend the lifetimes of all of the modules in an array. Current delivering equal current for an equal voltage at the summing
sharing is an essential ingredient in most systems that use multiple node. A simple implementation of the droop-share scheme uses
power supplies or converters to achieve higher-output power or the voltage dropped across an ORing diode, which is proportional
fault tolerance. to current, to adjust the output voltage of the associated
converter. (Figure 8.2)
When parallel supplies or converters are used to increase power,
current sharing is achieved through a number of approaches. One
scheme simply adds resistance in series with the load. A more
practical variant of that is the “droop-share” method, which
actively causes the output voltage to drop in response to increasing
load. Nevertheless, the two most commonly used approaches to
paralleling converters for power expansion are Driver / Booster
arrays and analog current-sharing control. They appear to be
similar, but the implementation of each is quite different.
Driver / Booster arrays usually contain one intelligent module or
Driver and one or more powertrain-only modules or Boosters.
Analog current-sharing control involves paralleling two or more
identical modules, each containing intelligence.
One of the common methods of forcing load sharing in an array of
parallel converters is to sense the output current of each converter
and compare it to the average current. Then, the output of a
given converter is adjusted so that its contribution is equal to the
average. This is usually accomplished by current-sense resistors in
series with the load, a sensing amplifier for each converter module,
and a summing amplifier. Load sharing is accomplished by actively
trimming the output voltage using trim or sense pins.
Occasionally, a designer is tempted to avoid the expense of
a current-sense resistor by using the IR drops in the wire as a
means of sensing the current. Unfortunately, there are a number
of negative issues associated with that idea. First of all, there’s
the temperature coefficient of copper. As the wire heats up, its

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Droop share has advantages and disadvantages. One of the modules require only one connection between units when their
advantages is that it can work with any topology. It’s also fairly outputs are connected. No trimming, adjustments or external
simple and inexpensive to implement. Though, a major drawback components are required to achieve load sharing. The load sharing
is that it requires that the current be sensed. A current-sensing is dynamic and usually guaranteed within 5%. It’s important to
device is needed in each of the converters or power supplies. remember that when using Boosters, the input and output voltage
Additionally, a small penalty is paid in load regulation, though in and output power specifications of the Boosters must be the
many applications this isn’t an issue. same as the Driver.
In general, mixing and matching converters isn’t recommended – Driver / Booster arrays have two advantages. They have only a
especially those with incompatible current-sharing schemes. The single control loop, so there are no loop-within-a-loop stability
droop-share method, however, is more forgiving in this regard than issues. And, they have excellent transient response. However, this
any of the other techniques. With a little external circuitry, current arrangement isn’t fault tolerant. If the Driver module fails, the array
sharing can be achieved using arrays constructed from different won’t maintain its output voltage.
converter models or even from different suppliers.
Analog current-sharing control involves paralleling two or more
Most systems can employ the Driver / Booster identical modules, each containing intelligence. The circuit actively
(or parent / child) array for increased power. (Figure 8.3) The Driver adjusts the output voltage of each supply so the multiple supplies
is used to set and control output voltage, while Booster modules, deliver equal currents. This method, though, has a number of
as children to the parent, are used to extend output power to meet disadvantages. Each converter in the array has its own voltage
system requirements. regulation loop and each requires a current-sensing device and
current-control loop.
Driver / Booster arrays of quasi-resonant converters with identical
powertrains inherently current share because the per-pulse energy Analog current-sharing control does support a level of
of each converter is the same. If the inputs and outputs are tied redundancy. But it’s susceptible to single-point failures within the
together and the units operate at the same frequency, all modules current‑sharing bus that at best can defeat current sharing and at
will deliver equal current (within component tolerances). worst can destroy every module in the array. The major reason for
this is the single-wire galvanic connection between modules.
The single intelligent module in the array determines the transient
response, which does not change as modules are added. Childed

+VIN +IN +OUT

GATE Zero Current
Switching +S
IN
Converter TRIM +VOUT
GATE #1 –S
OUT Driver
–IN –OUT

+IN +OUT
GATE Zero Current
–VIN +S
IN Switching
Converter TRIM
GATE Return
#n –S
OUT Driver
–IN –OUT

Figure 8.2 — Droop-share current sharing artificially increases converter output impedance to force the currents to be equal;
diodes on the output of each converter provide current sensing and fault protection

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Current sharing is an essential element in fault-tolerant arrays. Yet 200W full-size modules could be used to provide a 400W output
regardless of the approach, there is an inherent cost incurred by with an additional 200W module for 2+1 redundancy (a total of
the addition of at least one redundant converter or supply. 600W in a volume of about 16.5in3).
Incidentally, most applications today that require fault tolerance Alternatively, four 100W half-size modules might be used with
or redundancy also require Hot-Swap capability to ensure a fifth 100W module to provide 4+1 redundancy (a total of
continuous system operation. Hot-swappable cards must be 500W and 14in3). Although the second solution uses less space,
designed so the operator won’t come in contact with dangerous it increases the accumulated failure rate because it employs
potentials and currents. more converters, more ORing diodes, more monitoring circuitry
and more assembly.
It’s also essential that when a module fails, the failure is detected
and identified by an alarm or notice to provide service. A Hot‑Swap ORing diodes may be inserted in series with the output of each
system must ensure that during swap-out, there is minimal module in an N+1 array to provide output fault tolerance.
disturbance of the power bus. Specifically, the affected voltage bus (Figure 8.2) They’re important in a redundant power system to
must not drop enough to cause errors in the system, either on the maintain fault isolation. Without them, a short-circuit failure in the
input bus or the output bus. output of one converter could bring down the entire array.
A power-supply failure can cripple an entire system, so the addition But ORing diodes add losses to the power system, reducing overall
of a redundant converter or supply is often justified by the need efficiency and decreasing reliability. To ameliorate the negative
to keep the system operating. Adding an extra module (N+1) to effect on efficiency, ORing diodes should run hot, thereby reducing
a group of paralleled modules will significantly increase reliability forward voltage drop and increasing efficiency. Reverse-leakage
with only a modest increase in cost. current will be an issue only if the output of a converter shorts and
the diode is reverse biased. This is an important consideration with
The implementation of redundant converters is determined in part regard to operating temperature.
by the available space and cost requirements. For example, two

+VIN +IN +OUT

GATE
IN + Sense
INPUT Zero-Current- Trim LOAD
GATE Switching Driver
OUT –Sense
-VIN –IN –OUT

+IN +OUT
GATE
IN +Sense
Zero-Current- Trim
GATE Switching Booster
OUT –Sense
–IN –OUT

+IN +OUT
GATE +Sense
IN
Zero-Current- Trim
GATE Switching Booster
–Sense
OUT
–IN –OUT

Figure 8.3 — Most converters can use the Driver / Booster array to increase output power. Driver / Booster arrays usually contain one
intelligent module or Driver and one or more powertrain-only modules or Boosters

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Conducted Noise Common-Mode Noise with No Additional Filtering: Common

mode conducted-noise current is the unidirectional (in phase)
Conducted noise is the AC current flowing between the source
component in both the +IN and –IN pins to the module. This
voltage and the power supply. It includes both common-mode and
current circulates from the converter via the power input leads
differential-mode noise. Vicor zero-current-switching converters
to the DC source and returns to the converter via the grounded
are 20 – 40dB lower in conducted noise than a traditional
baseplate or output lead connections. This represents a potentially
board-mounted PWM converter; however, if a specific EMC
large-loop cross-sectional area which, if not effectively controlled,
specification such as FCC or VDE must be met, additional filtering
can generate magnetic fields. Common-mode noise is a function
may be required.
of the dV/dt across the main switch in the converter and the
Since the noise generated is ten to a hundred times lower than effective input to baseplate and input to output capacitance
fixed-frequency converters, an existing filter should provide equal of the converter.
or better performance when the conditions in the Module Dos and
The most effective means to reduce common-mode current is to
Don’ts section are followed. (Section 3)
bypass both input leads to the baseplate with Y-capacitors (C2),
In the event the system does not contain an existing filter, keeping the leads short to reduce parasitic inductance. Additionally,
the following will provide valuable information relative to the a common-mode choke (L1) is usually required to meet
attainment of system conducted noise objectives. System FCC/VDE A or B. (Figure 9.2)
requirements, such as Tempest (military) or UL544/ EN60601
NOTE: Acoustic Noise. Audible noise may be emitted from the module
(medical), require a somewhat different approach. Medical under no load, light-load or dynamic-loading conditions. This is considered
requirements vary as a function of the application and country – normal operation of the module.
please contact Vicor Applications Engineering for additional details.

Typical Vicor Module 48V Input, 5V Output (VI-230-CV)

C2 C3

+IN +OUT Conditions:

GATE +S C1 = 100µF Light Load = 3A
IN TRIM C2 = 4,700pF Nominal Line = 48V Nominal Load = 15A
C1
GATE C3 = 0.01µF Full Load = 30A
OUT –S
–IN –OUT

C2 C3

Conducted Noise vs. Load

3A Load 15A Load 30A Load

Figure 9.1 — Conducted input noise, no additional filtering

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Common-Mode Noise with Common-Mode Choke: There are Note: In most cases, a fixed-frequency converter generates more input
no special precautions that must be exercised in the design of input conducted noise with a filter than Vicor zero-current-switching converter
filters for Vicor converters. In fact, if the system contains an EMC without a filter. Also note that fixed-frequency converters using a
filter designed for typical fixed-frequency converters, it should be construction technique involving control circuitry on the same metal plate as
power processing components will generate significantly more input noise
sufficient as is (although not optimal in terms of size), as zero-
than shown.
current-switching converters inherently generate significantly less
conducted noise.
The plots in Figure 9.2 are representative of fixed frequency
converters with input filtering.

Typical Fixed Frequency Converter (PWM) 48V Input, 5V Output

C3 C4

Conditions:
L1
C1 = 2.2µF Light Load = 3A
CM C2 = 100µF Nominal Line = 48V Nominal Load = 15A
C1 C2
C3 = Internal Full Load = 30A
+IN –OUT C4 = Internal
L1 = 3mH
–IN
+OUT

C3 C4

Conducted Noise vs. Load

3A Load 15A Load 30A Load

Figure 9.2 — Conducted input noise, typical fixed frequency converter with filter

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Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

Three common-mode chokes are offered as standard accessories:

Part Inductance Maximum Resistance

+IN +OUT
L1
Number Each Winding DC Current Each Winding
GATE +S
C4 CM C1 IN TRIM 31743 1,000µH 12 Amperes 6.5mΩ
GATE
OUT –S
31742 3,000µH 7 Amperes 18mΩ
–IN –OUT
31943 2,163µH 1 Ampere 42mΩ

NOTE: Common-mode filters may be common to one or more

C2b C3b modules, but only one should be used with modules interconnected
C1 = 100µF via GATE IN’s or, GATE OUT to GATE IN. As an example, Driver / Booster
C2a – C2b = 4,700pF (Vicor Part # 01000) Conditions arrays or Drivers with GATE IN’s tied together to provide a common
C3a – C3b = 0.01µF (Vicor Part # 04872) Light Load = 3A disable function.
C4 = 2.2µF Nominal Load = 15A
L1 = 3,000µH (Vicor Part # 31742) Full Load = 30A

Conducted Noise vs. Load

3A Load 15A Load 30A Load

Figure 9.3 — Conducted input noise, with common-mode choke

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Differential and Common-Mode Filter with More than One will need to reflect the increased input current. Shown below
Module: No special precautions are needed when using two or is the input-conducted noise for two modules sharing a
more modules. The filter required will have the same characteristics common-input source.
as a single-module filter, however the wire size on the magnetics

Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

L2
Three common-mode chokes are offered as standard accessories:
+IN +OUT
L1
GATE +S
C4
CM
C1a IN T Load 1 Part Inductance Maximum Resistance
GATE
OUT –S Number Each Winding DC Current Each Winding
–IN –OUT
31743 1,000µH 12 Amperes 6.5mΩ
C2b C3b 31742 3,000µH 7 Amperes 18mΩ
31943 2,163µH 1 Ampere 42mΩ
C2c C3c

+IN +OUT
NOTE: Common-mode filters may be common to one or more
GATE +S modules, but only one should be used with modules interconnected
C1b IN T Load 2 via GATE IN’s or, GATE OUT to GATE IN. As an example, Driver / Booster
GATE
OUT –S arrays or Drivers with GATE IN’s tied together to provide a common
–IN –OUT disable function.

C2d C3d
C1a – C1b = 47µF
C2a – C2d = 4,700pF (Vicor Part # 01000) Conditions
C3a – C3d = 0.01µF (Vicor Part # 04872) Light Load = 3A
C4 = 2.2µF Nominal Load = 15A
L1 = 3,000µH (Vicor Part # 31742) Full Load = 30A
L2 = 20µH

Conducted Noise vs. Load

3A / 3A Load 3A / 6A Load 3A / 30A Load

15A / 15A Load 15A / 30A Load 30A / 30A Load

Figure 9.4 — Conducted noise, multiple zero-current-switching converters

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Differential-Mode Noise Filter: Differential-mode conducted C2abe taken to reduce the loop cross-sectional area of
Care should
noise current is the component of current, at the input power pin, differential-mode current flowing between the source and C1.
which is opposite in direction or phase with respect to the other Since differential-mode input current is by definition opposite
input power pin. in phase, twisting the input leads causes noise cancellation.
PCB power planes can reduce radiated noise if the traces are
All Vicor converters have an internal differential-mode LC filter on opposite sides of the PCB directly over one another. If
which, in conjunction with a small external capacitor differential-mode inductance is used, it may be common to one
C1 (minimum value in µF) = 400 / VIN, or more modules.

reduces differential-mode conducted noise. The external

capacitor should be placed close to the module to reduce loop
cross-sectional area.

Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

L1 C1 = 100µF
+IN +OUT
C2a – C2b = 4,700pF (Vicor Part # 01000)
GATE +S
IN C3a – C3b = 0.01µF (Vicor Part # 04872) Conditions
C4 C1 TRIM
GATE C4 = 2.2µF Light Load = 3A
OUT –S
L1 = 20µH Nominal Load = 15A
–IN –OUT
L2 L2 = 20µH Full Load = 30A

C2b C3b

Conducted Noise vs. Load

3A Load 15A Load 30A Load

Figure 9.5 — Conducted noise, differential-mode filtering

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Radiated Noise
VS
Radiated noise may be either electric field or magnetic field.
L
Magnetic radiation is caused by high di/dt and is generally what
+IN + OUT
is measured by FCC, VDE or MIL-STD-461. Vicor converters utilize
zero-current-switching, with the advantage over PWM non-zero-
current-switching being that zero-current-switching topologies
contain minimal discontinuities in the switched-current waveforms, C

resulting in lower di/dt’s. Electric-field radiation (caused by dv/dt) is VP IP

“near-field,” i.e., it decays rapidly as a function of distance and as a –OUT
result does not typically affect radiated measurements.
Radiation can be minimized by proper board layout. Keep all leads
with AC current short, twisted or routed as overlapping planes to –IN

minimize loop cross-sectional area.

Figure 9.6 — Basic zero-current-switching converter topology
Also keep in mind the effects of capacitive coupling – even when
not expected. Do not put an unshielded filter on the opposite side (VI-200 / VI-J00)
of the PCB from the module. Conducted noise can be capacitively Since the energy in every pulse is related to the square of
coupled around the filter. Do not route input and output leads in the applied voltage (CV2), the pulse repetition rate varies as
the same cable bundle. Again, no special precautions, just good approximately the square of the line voltage. For example, a 300V
design practice. input unit can vary from 200 – 400V, or a factor of two, therefore
it follows that the repetition rate must vary by approximately a
Noise Considerations factor of four to regulate the output. As previously established,
All switchmode power supplies generate a certain amount of the current in the primary is a half-wave rectified sine wave, but
“noise”, yet it remains one of the least understood parameters in the voltage on the primary is a square wave. Since this voltage is a
power conversion. square wave, it contains harmonics of the fundamental switching
frequency. It also includes frequencies, that extend to 70MHz.
VI-200s and VI-J00s both use the same topology, so their operation
is very similar. These products are zero-current-switching converters These frequencies can be of interest in the following circumstances.
– i.e., the current is zero when the main switch is turned on or Rapidly changing voltages (high dv/dt) can generate E-fields
off. While the switch is on, the current through the switch or (primarily near-field) which do not usually cause system noise
the primary of the transformer is a half-wave rectified sine wave. problems since they significantly decrease as a function of distance.
Similar in operation to a resonant converter, these products For this reason, E-fields are not measured by agencies such as the
are commonly referred to as quasi-resonant converters. The LC FCC or VDE. These agencies do, however, measure the magnetic
resonant frequency is fixed so the on-time of the switch is about radiation caused by high-frequency currents in a conductor. The
500ns. When the switch turns on, energy builds up in the leakage half-wave rectified sine wave in the transformer is an example
inductance of the transformer (L) and then “transferred” into the of this, but since there are minimal discontinuities in the current
capacitor on the secondary side of the module. (C, Figure 9.6) The waveform and the loop cross-sectional area is very small, the
energy processed in each pulse is fixed and is ultimately the energy resultant E-field is very small. E-fields can be a problem if sensitive
stored in this capacitor, 1/2 CV2. Since the energy in every pulse is circuitry is located near the module. In this case, a shield can be
fixed, the repetition rate of the pulse train is varied as a function positioned under the label side of the module as a discrete element
of load to regulate the output voltage. Maximum-repetition rate or as a ground plane on the PCB. The other effect that occurs
occurs at minimum line, full load and is approximately twice the LC as a result of the 50 – 70MHz component on the main switch is
time period or 1µs. If the load drops by 50%, then the repetition common-mode noise. (Figure 9.7)
rate is approximately one-half of maximum (since the energy in
every pulse is fixed). Therefore the pulse-repetition rate varies Parasitic
Capacitance
linearly with load, to a first-order approximation.
FET Rectifier
Shield Shield
Ceramic Ceramic

Baseplate

Figure 9.7 — The shield layer serves to reduce the capacitance

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The dV/dt of the switch (FET) is a noise generator. This FET

is mounted on a two-layer insulating and shielding assembly Insert probe into female receptacle To Scope
(cinch 129-0701-201) for proper output
which is attached to the baseplate. Since ceramic is a dielectric, differential noise measurement technique.
there is capacitance from the FET to the baseplate. (Figure 9.7) Note: check diameter of your probe to
ensure compatibility.
The output rectifiers are also tied to the baseplate with ceramic
insulators, adding additional capacitance. The dV/dt of the FET is
differentiated by these two series capacitors, resulting in a spike of
noise current at 50 – 70MHz that flows from primary to secondary.
(Figure 9.8) This noise current is common-mode as opposed to
Ground Ring on Probe
differential and therefore should not affect the operation of the
system. It should be noted, however, that oscilloscopes have a or

finite ability to reject common-mode signals and these signals can To Scope
be abnormally emphasized by the use of long ground leads on
the scope probe.

Primary Baseplate Secondary

Figure 9.9 — Output ripple measurement technique
CFET CRECTIFIER

A capacitor from +/–VOUT to the baseplate, is required since the

output rectifier has a changing voltage on it and, like the FET,
can generate common-mode noise. This capacitor is similarly
VP VP
recommended for high-output voltage units (48V).
ICM
ICM
Common-mode noise is not differential with respect to the output.
It does, however, flow in both input and output leads of the power
CFET CRECTIFIER
supply and is a noise parameter that is measured by the FCC or
VDE. It can cause power systems to fail radiated emission tests, so
it must be dealt with. Bypass capacitors to the baseplate with a
IDM common-mode filter on the input of the module or the main input
VP of the power supply is required.
The common-mode filter is typically placed on the input as
CEXTERNAL CEXTERNAL
YCAPS YCAPS
opposed to the output. Theoretically, since this current flows from
primary to secondary, the choke could be placed in either the input
Figure 9.8 — Noise coupling model or the output, but is preferably placed in the input leads for the
following reasons:

Measuring Output Noise 1. input currents are smaller since the input voltage is
usually higher;
Long ground leads adversely impact the common-mode rejection
capability of oscilloscopes because the ground lead has inductance 2. line regulation of the module can correct for voltage drops
not present on the signal lead. These differing impedances take across the choke; and
common-mode signals and convert them to differential signals that
3. if the choke is on the output and the senses are connected to
show up on the trace. To check for common-mode noise, place the
the other side of it, the stability of the loop may be impacted.
oscilloscope probe on the ground lead connection of the probe
while the ground lead is tied to output return. (Figure 9.9) If the Differential output noise is the AC component of the output
noise is common-mode, there will still be “noise” observed at the voltage that is not common to both outputs. The noise is
same test point. comprised of both low-frequency, line-related noise (typically
Note: The output return must be at the same relative potential as the earth
120Hz) and high-frequency switching noise.
ground of the oscilloscope or damaging current may flow through the
oscilloscope ground lead.
Capacitors are required from the +/–IN to the baseplate thereby
shunting common-mode current, thus reducing noise current on
the input power lines. The capacitor must have very short leads
since the frequency is high. It must also be a good capacitor (i.e.,
ceramic or other material that has a low ESR / ESL). This type of
capacitor is most important on high-input-voltage units since the
“dV” is larger, but is required for all units. For off-line applications
this capacitor must have the appropriate safety agency approvals.

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High-Frequency Switching Noise: Peak-to-peak output voltage Line-Related Output Noise: Line-related output noise can
ripple is typically 2% or less (1% for 12V outputs and above). Hence be determined from the converter specification –Input Ripple
additional output filtering is generally not required. Digital systems Rejection. As an example, a VI-260-CV
rarely need additional filtering. However some analog systems,
such as ultrasound systems, will probably require additional output
filtering. See additional output filter choices in Table 9.1.

Output Filter Option 5V Outputs 12 – 15V Outputs 24 – 48V Outputs

No Additional Filter 2% P-P (Typical) 1% P-P (Typical) 0.2% P-P (Typical)
Low ESR Output Cap. 1% P-P (Typical) 0.5% P-P (Typical) 0.1% P-P (Typical)
LC Output Filter 0.4% P-P (Typical) 0.2% P-P (Typical) 0.05% P-P (Typical)
RAM Filter (VI-200) <3mVP-P (Maximum) <3mVP-P (Maximum) <3mVP-P (Maximum)
RAM Filter (VI-J00) <10mV (Maximum) <10mV (Maximum) <10mV (Maximum)
Table 9.1 — Output filter options and output voltage and ripple

Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

+IN +OUT
Conditions
GATE +S
OUT C1 = 100µF Light Load = 3A
C1 TRIM
GATE C2a – C2b = 4,700pF (Vicor Part # 01000) Nominal Load = 15A
IN –S
C3a – C3b = 0.01µF (Vicor Part # 04872) Full Load = 30A
–IN –OUT

C2b C3b

Conducted Noise vs. Load

3A Load 15A Load 30A Load

Figure 9.10 — Output noise, no additional output filtering

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Addition of Output Capacitor Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

+IN +OUT
C1 = 100µF Conditions
GATE +S
IN C2a – C2b = 4,700pF (Vicor Part # 01000) Light Load = 3A
C1 TRIM C4
GATE C3a – C3b = 0.01µF (Vicor Part # 04872) Nominal Load = 15A
OUT –S
C4 = 270µF (Tant.) Full Load = 30A
–IN –OUT

C2b C3b
NOTE:
A low-ESR capacitor should be used on the output, preferably tantalum.

Output Ripple vs. Load

3A Load 15A Load 30A Load

Figure 9.11 — Output noise, additional output capacitance

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LC Output Filter Typical Vicor Module (VI-230-CV) 48V Input, 5V Output

C2a C3a

L1
+IN +OUT C1 = 100µF
GATE +S C2a – C2b = 4,700pF (Vicor Part # 01000) Conditions
IN C4
C1 TRIM C3a – C3b = 0.01µF (Vicor Part # 04872) Light Load = 3A
GATE
OUT –S C4 = 270µF (Tant.) Nominal Load = 15A
–IN –OUT L1 = 200nH (Vicor Part # 30268) Full Load = 30A

C2b C3b

Output Ripple vs. Load

3A Load 15A Load 30A Load

Figure 9.12 — Output noise, additional output inductor and capacitor (L-C Filter)

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(300VIN to 5VOUT ) has a rejection specification at 120Hz of 30 + The RAM does not contain any common-mode filtering, so
20 Log (VIN / VOUT ). VIN = 300 and VOUT = 5, hence its rejection whatever common-mode noise is present is passed through. It only
is 30 + 35.56 = 65.56dB, which provides an attenuation factor provides differential filtering of noise that is present on one output
of 1.89k. Therefore, if the input to the converter has 30VP-P of pin relative to the other.
ripple, the output p-p ripple would be 15.8mV. It is not practical to
The use of the RAM / MI-RAM is very straightforward, but a couple
attenuate this component further with passive filtering due to its
of precautions should be noted. The LC filter is in the positive-
low frequency, hence active filtering is required. The RAM contains
output lead, so if that lead is shorted then the high‑frequency
both a passive filter for high-frequency noise and an active filter for
attenuation is compromised. The active circuit is in the negative-
low-frequency noise.
output lead, so if that lead is shorted the low‑frequency
attenuation is compromised. The RAM must be used with a
RAM / MI-RAM Operation
common-mode choke at the input of the converter.
The RAM/MI-RAM attenuates output noise in two ways. First,
an LC filter in the RAM / MI-RAM attenuates high-frequency The RAM is intended to be used with the Vicor VI-200 / VI-J00,
components associated with the switching frequency. Secondly, and the MI-RAM is intended to be used with Vicor MI-200 / MI-J00
the RAM / MI-RAM contains an active filter that attenuates low- Family of DC-DC converter modules. It is also available in a chassis-
frequency components associated with the input to the converter. mounted version as VI-LRAM-xx (MegaMod package) or VI-RAM-
These frequencies are on the order of 60 – 120Hz and harmonics xx-B1 (BusMod package).
would require very large output LC if a passive approach were to NOTE: Do not use if load is inductive as instability may result. The addition
be used. Essentially, the active circuit looks at the output ripple of the RAM will increase the converter’s current-limit setpoint
from the converter, multiplies it by –1 (inverts) and adds it to the by ~ 14%.
output. This effectively cancels out the low frequency components.

RAM Output Filter Typical Vicor Module (VI-230-CV) 48V Input, 5V Output with VI-RAM-C2

C2a C3a

+ +IN +OUT +IN +OUT

L1 GATE +S +S IN +S
CM IN RAM
C1 TRIM
GATE
OUT –S –S IN –S
C4 +
– –IN –OUT –IN –OUT

C1 = 100µF Conditions
C2b C3b C2a – C2b = 4,700pF (Vicor Part # 01000) Light Load = 3A
C3a – C3b = 0.01µF Y2, 300VAC Full Load = 15A
Vishay BFC233860103 Overload Condition = 30A
C4 ≠= 220µF (Electrolytic)

Output Ripple vs. Load

30A Load
3A Load 15A Load
(Overload Condition)

Figure 9.13 — Output noise, with Ripple Attenuator Module (RAM)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview Filter Components for 5V Output

The LC filter design below is a comparatively simple solution for L1 — Vicor P/N 30268 or Micrometals #T38-26/90 core with 2T
nn
reducing ripple on the outputs of the Vicor VI-200 and #14 wire (200nH)
VI-J00 Family converter modules. These components are small and C1, C2 — Vicor P/N 30800, 270µF / 10V, solid tantalum, ESR
nn
provide significant peak-to-peak noise attenuation. Since an output 90mΩ typical
filter capacitor is already present in the DC-DC converter, adding
an inductor and capacitor to the output creates a pi filter. It is Typical data at high line input: With full load, ripple ~ 11mVP-P
nn
important that the inductor wire be of a size sufficient to carry the With 50% load, ripple ~ 8mVP-P
load current, including a safety factor and that the core does not
saturate. LC filters are generally needed only where very accurate Filter Components for 12V and 15V Outputs
analog signals are involved. L1 — Vicor P/N 30268 or Micrometals #T38-26/90 core with 2T
nn
#14 wire (200nH)
The RAM / MI-RAM (Ripple Attenuator Module) should be used if
greater attenuation of output ripple is required or where additional C1, C2 — Vicor P/N 30506, 120µF / 20V, solid tantalum, ESR
nn
AC power line-ripple frequency rejection is required. 90mΩ typical
All standard outputs will function with either remote sense or local Typical data at high line input: With full load, ripple ~ 5mVP-P
nn
sense, with the recommended capacitance. Lower ESR is achieved With 10% load, ripple ~ 15mVP-P
with capacitors in parallel. Ripple data measured at 20MHz
bandwidth limit. Filter Components for 24V and 28V Outputs

Adding excessive amounts of external filtering may compromise the L1 — Vicor P/N 30268 or Micrometals #T38-26/90 core with 2T
nn
#14 wire (200nH)
stability of the converter and result in oscillation.
C1, C2 — 68µF / 30V, solid tantalum, ESR 160mΩ typical
nn
Typical data at high line input: With full load, ripple ~ 6mVP-P
nn
With 10% load, ripple ~ 18mVP-P
L1
+IN +OUT
GATE
IN +S
TRIM
GATE C1 C2
OUT –S

–IN –OUT

Figure 10.1 — Recommended LC output filter

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11. Battery Charger (BatMod™) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview For DC input / current source applications (Figure 11.1),

the BatMod has a similar wide range input rating as the VI-200
The BatMod is a programmable current-source module that
Family of voltage converters for 48 and 300V inputs. BatMods can
is intended for battery charging or simular current-source
be used for higher-current source applications with a
applications. It can be controlled externally to meet a wide range of
Driver / Booster approach. (Figure 11.2)
charging parameters: voltage, current, charge rate and charge time.
NOTE: Inductance to the load should be limited to 20µH to avoid possible
The BatMod is comparable to the VI-200 voltage-source module loop instabilities.
but with a variable current limit. It has three output pins that differ
from the VI-200 converters: Current Control (ITRIM), Voltage Adjust
(V TRIM) and Current Monitor (IMON). All of these pins are referenced
to the –OUT pin.
Although the BatMod is primarily intended for battery-charge
+IN +OUT
applications, it can be used as a programmable-current source for +
GATE VTRIM External
resistive loads or CW laser diodes. The BatMod will not function DC Input
IN ITRIM Control
GATE BatMod Load
properly at zero- output voltage and current simultaneously. It IMON Functions
OUT
follows therefore, that the current can not be adjusted to zero –IN –OUT –

with a resistive load. Refer to Safe Operating Area Curves on the

BatMod data sheet, which can be found at vicorpower.com.

Pinout Description
Current Control (ITRIM): An input which can receive an analog Figure 11.1 — DC input single module
control voltage from 1 – 5V for adjustment of the sourced current
from zero to maximum rating of the BatMod.

5VDC 100% of Rating +IN +OUT +

Enable/ GATE VTRIM
= DC Input
Disable
IN
BatMod ITRIM
External
Control Load
GATE Functions
OUT IMON
1VDC 0A –IN –OUT –

Voltage Adjust (V TRIM): An input for controlling or setting the +IN +OUT
GATE
output setpoint, this is similar to the trim function on the VI-200. IN
GATE BatMod
(Section 5) A maximum voltage can be set by a fixed resistor OUT Booster
or adjusted with an external voltage source. A source voltage –IN –OUT
referenced to –OUT adjusted from 1.25 – 2.5V will program a
50 – 100% of rated voltage setting. +IN +OUT
GATE
IN BatMod
2.5VDC Max. VOUT GATE
OUT
Booster

–IN –OUT
=
1.25VDC 50% of VOUT
Figure 11.2 — DC input high power array
It is important to note the nominal output voltage for each BatMod
type untrimmed.
12VOUT Part # = 15V actual
24VOUT Part # = 30V actual
48VOUT Part # = 60V actual
Current Monitor (IMON): An output that indicates the amount of
current being sourced. It is a linear voltage / current relationship
where one volt corresponds to 0% of sourced current and 5V
corresponds to 100% of sourced current.

5VDC 100% of Rating

=
1VDC 0A

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Designing a Battery Charger Setting the Charge Current: The charge current can be
programmed from 0 to maximum (14.5A) by applying
The Vicor BatMod (current-source module) enables designers to
1 – 5V to the ITRIM pin. To determine the voltage required to
easily build a compact, lightweight battery-charging system with
produce a particular charge current, 10A for example, use the
commonly available parts. The BatMod provides programmable
following formula:

( )
output current and output voltage capability. Since the BatMod
allows the output voltage and the charge current to be set
independently, the system design is greatly simplified. Desired Charge Current
4 + 1 = ITRIM Voltage
Basic Battery Charger: Figure 11.3, shows a basic charging circuit Maximum Output Current

( )
with a BatMod for the following system requirements:
Battery voltage: 12V 10A
Float voltage: 13.8V 4 + 1 = 3.76V
14.5A
Charge current: Adjustable 0 – 14.5A
Setting the Float Voltage: Since the open circuit output of a 12V To set the input voltage at ITRIM to 3.76V, adjust the potentiometer
BatMod (VI-2x1-CU-BM) is 15V, a trim resistor (R3) is necessary to (R2) appropriately.
set the float voltage of 13.8V.
In Figure 11.3 the configuration will charge the battery at a
Steps to determine the value of R3: maximum of 10A with a 13.8V float voltage. Other charge rates
Solve for V TRIM: and float voltages may be similarly calculated. If a fixed-charge

( )
current is desired, the potentiometer can be replaced with two
VFLOAT fixed resistors. In applications requiring tight control over the
VREF = VTRIM charging current, D1 can be replaced with a precision reference.
VNOM
Advanced Battery Charger: Many new battery technologies

( )
require sophisticated charging and monitoring systems to
13.8V preserve their high performance and to extend their life. The
2.5V = 2.3V Bat­Mod serves as an ideal building block for constructing
15V
an advanced battery-management system, which typically
incorporates a microprocessor-based control circuit that is easily
Solve for VR5: adapted for a variety of battery chemis­tries and monitoring
functions. (Figure 11.4)
VREF – VTRIM = VR5 To maintain the optimum charge on the battery, the control circuit
2.5V – 2.3V = 0.2V independently adjusts the float voltage and charge current in
response to conditions during the charge: the battery’s voltage,
Solve for IR5: current, temperature and pressure and other pertinent parameters.
It can also relay battery status information such as capacity, charge
VR5 0.2V and discharge history and cause of failure.
IR5 = = = 20μA
R5 10kΩ Note: A redundant control or monitoring circuit must be included if failure
of the BatMod or its control circuit will result in uncontrolled charging of the
battery. Many new battery types are sensitive to these conditions and may
Solve for R3:
result in fire or explosion.
VTRIM With its wide range of outputs, the BatMod offers designers
= R3 a simple, cost-effective solution to battery charging for all
IR5
major battery types.

2.3V
= 115kΩ
20µA

A 13.8V output requires a 115kΩ resistor.

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11. Battery Charger (BatMod™) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

+IN BatMod VI-2x1-CU-BM +OUT 10mA R1

To Front End: 820Ω
AIM, GATE VTRIM
Error
HAM, IN R2
Amp ITRIM D1 12V
IAM, or R3 5kΩ
GATE R5 RITRIM IMON 5.1V
Off-Line OUT 10kΩ ≈ 50kΩ 115kΩ 1mA Zener
Front End –IN –OUT
REF
2.5V

Figure 11.3 — Basic charging circuit using a current source module (BatMod)

+OUT

VTRIM Control Circuitry

• Voltage
ITRIM • Battery Temp.
IMON • Ambient Temp.
• Other
–OUT
System
Status

Figure 11.4 — The BatMod in an advanced battery

charging system

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12. AC Input Module (AIM™ / MI-AIM™) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview The GATE OUT of the AIM must be connected to the GATE OUT of
only one DC-DC converter. This input signal to the AIM controls a
In combination with VI-200 and VI-J00 Family of DC-DC
charge pump (D1, D2, C2) that biases the gate of Q1, 10V above its
converter modules, the Alternating Input Module (AIM) provides
source, which turns on Q1 to shunt out a PTC thermistor that limits
a high‑density, low-profile, universal AC input off-line switching
inrush. Multiple DC-DC converters operating from an AIM may
power supply for systems requiring up to 200W of total output
make it difficult to guarantee a 10% load on the DC-DC converter
power. The AIM accepts 85 – 264VAC, with a DC output voltage
that provides the GATE OUT signal to the AIM. In this instance,
proportional to the peak value of the AC line. The input voltage
other DC-DC converters can charge pump the FET through the
required for the AIM to start operating is between 82V and 90VRMS
parallel pin, with the addition of two diodes and a capacitor to
(non-distorted sinusoid).
each Driver module. (Figure 12.4)
The DC output of the AIM is the peak rectified line
(VAC RMS X√ 2), thus, 85VAC corresponds to 120VDC and 264VAC
corresponds to 373VDC. Since the DC output range is wide, a “7”
(100 – 375V) designator for input voltage in the part number of
L1 +OUT
the DC-DC converter is required. However, the “5” (100 – 200V) Q1 D2 C2
designator for the DC-DC converter part number is available for GATE OUT
10V
VREF 1 D1
domestic AC inputs only and the “6” (200 – 400V) designator U2 PARALLEL
EMI OV
for European AC inputs only, potentially reducing the number Filter
VREF
2
of modules required in some applications, based on output OC
Level
Shift Q2
GATE IN

power capability. U1
L2/N –OUT

Summary of Compatible Downstream DC-DC Converters

Use VI-x7x for inputs of 85 – 264VAC; VI-x6x for inputs of
170 – 264VAC; or VI-x5x for inputs of 85 – 135VAC. EMC filtering Figure 12.1 — Block diagram, AIM / MI-AIM
specifications of FCC Level A are met by adding a 0.47µF “X-type”
0.47µF X2 310VAC capacitor (Vishay F1772-447-2000 or equivalent)
to the input of the AIM; “Y-type” bypass capacitors must also
be added from the +/– inputs of the DC-DC converters to their
respective baseplates, which are grounded (Vicor Part #01000,
4,700pF). To select the hold-up capacitor appropriate for your 0.47µF PIM POM
application, (refer to Selecting Capacitors for AIM Modules L1 +OUT +IN +OUT
section that follows).
AC IN VI-AIM C1[a] DC-DC CONVERTER LOAD
The output ripple of the AIM is a function of output load. It is
L2/N –OUT –IN –OUT
necessary to keep the ripple less than 20VP-P to ensure the
under / overvoltage protection circuits will not trigger. A fully
loaded AIM (200W of module output power) requires a minimum
[a]
C1 is a hold-up capacitor necessary for proper operation of the AIM.
Hold-up capacitors are available at vicorpower.com.
of 680µF of capacitance; hold-up requirements can be met with
this capacitor and maximum total capacitance should not exceed
1,200µF (refer to Selecting Capacitors for AIM Modules section
that follows). The voltage rating of this capacitor will be determined
by the input operating voltage. Figure 12.2 — System block diagram
(supervisory connections not shown)
It is necessary to connect all “Driver” DC-DC converter
GATE IN pins to the GATE IN pin of the AIM. This GATE IN to
GATE IN connection is used to disable the converters at turn-on to
allow proper start up of the AIM. The DC-DC converters are then
enabled through the GATE IN pin when the output bus voltage is in
the range of 113 – 123VDC.
Input overvoltage conditions cause the GATE IN pin of the AIM to
disable the converters when the output bus voltage is in the range
of 406 – 423VDC. Input undervoltage conditions cause the GATE IN
to disable the converters when the output bus voltage drops within
the range of 68 – 89VDC.
CAUTION: The AIM is not isolated. Do not place scope probes on input and
output of AIM simultaneously. Do not connect the output of the AIM to
earth ground.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Selecting Capacitors for AIM Modules The basic equations involved in calculating hold-up time are:
Hold-up Time: For maximum flexibility, an external capacitor
1 1
(Figure 12.2, C1) is used to set the system’s hold-up requirements. • C1 • VP2 – • C1 • VDO2 = PIM • (T5 – T3) (1)
Hold-up time, for purposes of this application note, is defined 2 2
as the time interval from loss of AC power to the time a DC-DC
converter begins to drop out of regulation (Figure 12.3, T4 to T5). solving for C1:
Hold-up time is a function of line voltage, hold-up capacitance,
output load and that point on the AC waveform where the line PIM • (T5 – T3)
drops out. For example, if the AC line fails just after the hold-up C1 = 2 • (2)
capacitors were recharged, hold-up time will be much greater VP2 – VDO2
(Figure 12.3, T3 to T5) than if the AC line fails just prior to another
recharge (Figure 12.3, T4 to T5).
Where PIM is power delivered from the AIM:

RECTIFIED
AC Module Output Power POM
PIM = = (3)
Module Efficiency Eff. % / 100
VP
VV
VDO The energy (Joules) delivered from the AIM from the time power is
lost (T4), until loss of an output (Figure 12.2, T5):

Energy (joules) = PIM • (T5 – T4) (watt-seconds) (4)

T0 T1 T2 T3 T4 T5
TIME Where:
POM = Output power from all the modules
Figure 12.3 — AC waveforms PIM = Input power to the modules
(output power from the AIM)
Eff = Weighted average efficiency of all modules
The input power to the converter(s) during normal operation
is supplied from the AC line during the conduction time of the
rectifiers (T2 to T3) internal to the AIM and by the energy stored
in C1 when the rectifiers in the AIM are reverse biased (T1 to T2).
In the event of an AC failure (T4), C1 must continue to provide
energy to the converters until either AC returns or the converter
drops out (T5).
The energy stored in C1 at the peak of the AC is:

1
• C1 • VP2 = joules (5)
2

The energy stored in C1 when the converter drops out

of regulation is:

1
• C1 • VDO2 = joules (6)
2

The energy delivered by C1 to the converters during

normal operation is:

PIM • (T2 – T1) = joules (7)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Choosing Appropriate Values for AIM Modules

Sample calculation: The following values are calculated in a similar manner.
Converter output power (POM) = 100W
Module(s) 60Hz 50Hz
Line frequency = 60Hz
Delivered Power 90VAC 105VAC 90VAC 105VAC
Line range = 105 – 264VAC
50W 270µF 135µF 300µF 150µF
Efficiency = 82%
75W 400µF 200µF 440µF 230µF
Desired hold-up time = 5ms (minimum)
100W 525µF 270µF 600µF 300µF
Therefore: 150W 800µF 400µF 890µF 455µF

PIM = 100 = 122W 200W 1,000µF 540µF 1,180µF 600µF

0.82 Table 12.1 — Hold-up capacitor values for use with VI-270/VI-J70
T5 – T3 = 5ms + 8.3ms = 13.3ms and the VI-250/VI-J50 DC-DC converters
(minimum hold-up time plus half cycle)
C1 values as a function of line voltage, frequency and delivered
VP = 105 • 2 = 148V power, for use with the “7” input designator DC-DC converters
(AIM input of 90 – 264VAC) or “5” input designator (AIM input of
VDO = 100V 90 – 132VAC) DC-DC converters.
NOTE: With “7” input DC-DC converters operated from the AIM input
and:
range of 90 – 264VAC, 400V capacitors must be used. With “5” input

C1 = 2 • 1222 • 0.0133
DC-DC converters used over the AIM input range of 90 – 132VAC, 200V
capacitors may be used.
148 – 100 2
C1 = 270μF Module(s) 60Hz 50Hz
Delivered Power 180VAC 210VAC 180VAC 210VAC
Where:
50W 66µF 34µF 74µF 38µF
VP = The peak of the rectified AC line or 2 • VAC_IN. For 75W 100µF 50µF 110µF 60µF
an input range of 85 – 264VAC, this voltage will vary
100W 130µF 67µF 150µF 75µF
from 120 to 373V.
150W 200µF 100µF 220µF 115µF
V V = The low point of the rectified AC line under
200W 262µF 135µF 300µF 150µF
normal operating conditions. This “valley” voltage
is a function of C1, PIM and line frequency. The Table 12.2 — Hold-up capacitor values for use with VI-260/VI-J60
peak‑to‑peak ripple across C1 is VP – V V and DC-DC converters
determines the ripple current in C1.
NOTE: It is important to verify the RMS ripple current in C1 with a C1 values as a function of line voltage, frequency and delivered
current probe. power, for use with the “6” input designator DC-DC converters
(AIM input of 180 – 264VAC).
VDO = Voltage at which the DC-DC converter(s) begin(s)
to drop out of regulation. This voltage is from the NOTE: With “6” input DC-DC converters operated from the AIM input
data sheet of the appropriate module, which for the range of 180 – 264VAC, 400V capacitors must be used (Vicor Part #30240).
VI‑270 Family is 100VDC. Under normal operating
conditions, V V must exceed VDO.
T1 = The peak of the rectified AC line or the point at
which C1 is fully charged. For an input range of
85 – 264VAC, this voltage will vary from 120 to 373V.
T2 = The low point of the rectified AC line under normal
operating conditions and the point at which C1
is about to be “recharged”. This is the point of
lowest energy in C1.
T4 = The low point of the rectified AC line; the point of
lowest energy in C1; the point at which if the AC line
fails, hold-up time is shortest, i.e., “worst case”.
T5 = The time at which the converter(s) drop
out of regulation.
T5 – T4 = Minimum hold-up time. Actual hold-up time may vary
up to a maximum of T5 – T3.
(T3 – T1) • 2 = One line cycle.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Bussman Fuses,
PC Tron
L1 +OUT +IN +OUT
D3 GATE
NC GATE IN +S
Universal C1[a] IN
AC IN PAR Driver TRIM
NC GATE
GATE OUT OUT –S
L2/N –OUT –IN –OUT
0.47μF

AIM
+IN +OUT
D2 D3 GATE
IN +S
D1 C2 Driver TRIM
D1, D2: 1N4148 GATE
OUT –S
C2: 470pf / 500V
–IN –OUT
D3: 1N4006

+IN +OUT
[a]
Refer to Selecting Capacitors for D3
D2 GATE
AIM Modules in the begining of this IN +S
Section. Refer to Typical application D1 C2 Driver TRIM
GATE
for Vicor converter with AIM, OUT –S
Figure 12.5, for recommended –IN –OUT
external components.

Y-capacitors not shown for clarity

Figure 12.4 — AIM connection diagram, multiple-driver DC-DC converters

0.01 µF (Two 4,700 pF)

Y-Rated Capacitors

Universal
AC In F1 F2 0.01 µF Ceramic
L1 +OUT +IN +OUT
NC GATE IN GATE +S
0.47 µF Z1 [a] IN VI-200/J00 TRIM Load
PAR C1
GATE Driver
NC GATE OUT –S
OUT
L2/N –OUT –IN –OUT
0.01 µF Ceramic

AIM

0.01 µF (Two 4,700 pF)

Y-Rated Capacitors

[a]
Consult factory or refer to Selecting Capacitors for AIM Modules at the begining of this section.
Z1: MOV Part #30076
Fuse 1: 6.3A/250V (IEC 5X20 mm) Buss GDB-6.3 or 7 A / 250 V (3AG 1/4" x 1 1/4") Littlefuse 314-007
Fuse 2: For VI-X7X-XX — Buss PC-Tron 2.5 A (250 V)
For VI-X6X-XX — Buss PC-Tron 3 A (250 V)
For VI-X5X-XX — Buss PC-Tron 5 A

Figure 12.5 — Typical application for Vicor converter with AIM

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13. Harmonic Attenuator Module (HAM™) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

The Harmonic Attenuator Module

Compatible with VI-26x and VI-J6x Families
The Harmonic Attenuation Module (HAM) consists of a full-wave
rectifier, a high-frequency zero-current-switching (ZCS) boost
converter, active inrush current limiting, short-circuit protection,
control, and housekeeping circuitry (Figure 13.1). The incoming AC
line is rectified and fed to the boost converter. The control circuitry
varies the operating frequency of the boost converter to regulate
and maintain the output voltage of the HAM above the peak of
the incoming line, while forcing the input current to follow the
waveshape and phase of the line voltage. A power factor better
than 0.99 is achieved (Figure 13.2). Operating efficiency of the
boost converter is optimized at any incoming line voltage by an
adaptive output voltage control scheme. Figure 13.2 — Input voltage and current wave forms, without and
The output voltage of the HAM varies as a function of incoming with power factor correction
AC line voltage (Figure 13.3). On a nominal 120VAC line the output
voltage of the HAM is 260VDC — well within the input operating
voltage range of Vicor VI-26x and VI-J6x converters. As input 425

line increases, so does the HAM output voltage; at 220VAC the 700 400
delivered voltage will be about 350V. For any given input line

Output Voltage (VDC)

650 375
voltage, the HAM maintains enough headroom between the

Output Power (W)

output voltage and peak input voltage to ensure high quality 600 350

active power factor correction without unnecessarily sacrificing 550

derate output power 11W/V for VIN <110VAC
325
operating efficiency.
500 300
The HAMD version does not contain an internal bridge rectifier
450 275
and is intended for configuring higher power arrays with Booster
versions, referred to as the VI-BAMD (Figure 13.5). 400 250
85 95 105 115 125 135 145 155 165 175 185 195 205 215 225 235 245 255 265

110 Input Voltage Rated Output Power

VRMS Output Voltage

Inrush +
AC Recti- ZCS & Short DC
Line fier Boost Circuit OUT
Converter Protection – Figure 13.3 — Output voltage and power rating vs. input voltage
Current
Sense
High-Frequency Note: L1 and L2/N (HAM) Pin: An appropriate line filter is required to
Non-Isolated
Voltage
Control
Output limit conducted emissions and ensure reliable operation of the
Waveform Control Output Voltage HAM, see page 40. Connect single phase AC mains to the input
& House- Module Enable of the line filter via a 10A, 250V fuse. Connect the output of the
keeping Power OK
Circuitry filter to L1 and L2/N of the HAM. Do not put an X-capacitor across
the input of the HAM or use a line filter with an X-capacitor on its
Gate IN
Aux. Supply output as power factor correction may be impacted.
Gate OUT
+IN, –IN (HAMD, BAMD) Pin: These pins are connected to
NOTE: No input-to-output isolation. the output of the external bridge rectifier in HAMD / BAMD
configurations (Figure 13.5).
Figure 13.1 — HAM block diagram (HAMD version has the
GATE IN (HAM) Pin: The user should not make any
rectifier block deleted)
connection to this pin.
GATE IN (HAMD) Pin: This pin provides line voltage envelope and
phase information for power factor correction. This connection
must be made through the synchronization diodes between the
line filter and bridge rectifier (Figure 13.5).

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

GATE IN (BAMD) Pin: The GATE IN pin is an interface pin to the Safety Notes
GATE OUT pin of a HAMD or BAMD depending on configuration. Each HAM, HAMD or BAMD module must be preceded by a safety
The user should not make any other connection to this pin. agency recognized fast-blow 10A 3AG fuse.
GATE OUT Pin: The GATE OUT pin is a synchronization pin The HAM is not isolated from the line – either input or output;
for HAMD/BAMD arrays; the user should not make any other a line isolation transformer must be used when making scope
connection to this pin. measurements. HAMs do not provide input to output isolation.
+OUT and –OUT Pin: Connect the +OUT of the HAM to the +IN Differential probes should be used when probing the input and
of the respective Vicor DC-DC converters with the recommended output simultaneously to avoid destructive ground loops.
fuse. Connect the –OUT of the HAM to the –IN of the converters.
In addition, an external hold-up capacitor of 1,000µF with a Protective Features
minimum voltage rating of 450VDC, is required (across the output Overtemperature Shut Down: The HAM is designed to
of the HAM) for 16ms ride through time at full power (500µF shut down when the temperature of the baseplate exceeds
for half power, etc). This capacitor must be in close proximity to 90°C. Do not operate the HAM above its maximum operating
the HAM. Do not exceed 3,000µF of total output capacitance. temperature of 85°C.
Lower values of capacitance may be used for reduced hold up
requirements, but not less than 500µF. Lower capacitance values Short Circuit Protection: The HAM contains output short
may degrade power factor specifications. circuit protection. Operation of this function does not clear the
input fuse and the output will resume normal operation after
Auxiliary Supply (A/S) Pin: The HAM provides a low voltage non removal of the fault.
isolated output Auxiliary Supply (A/S) that may be used to power A short period of time may be required to allow for cooling of an
primary side control and monitoring circuitry. This output is 19 – internal temperature sensor.
23VDC, referenced to –OUT, at 3mA max. Do not overload or short
this output as the HAM will fail. A typical use for A/S is to power Output Overvoltage Protection: The HAM contains output
an optical coupler that isolates the Power OK signal (Figure 13.6). over voltage protection. In the event the output voltage exceeds
approximately 420VDC, the boost will decrease to maintain 420VDC
Enable Output (E/O) Pin: The Enable Output (E/O) is used to on the output. When the peak of the AC line exceeds 420V
inhibit the DC-DC converters at start up until the hold up capacitors (approximately 293VAC) the boost will have been reduced to zero
are charged, at which time Enable is asserted high (open state, and the E/O line will be pulled low shutting down the converters.
Figure 13.8). If the AC line fails, E/O goes low when the DC output Beyond this the protection circuit will be enabled and the output
of the HAM drops below 195VDC. voltage will decrease.
E/O must be connected to the Gate Input of all VI-26x and VI-J6x
drivers (Figure 13.4); failure to do so may cause the converters to
toggle on and off. It is not necessary to connect this pin to boosters
as they are controlled by their respective driver. If an external load
is connected directly to the output of the HAM, do not apply the
load until the output hold up capacitor(s) are fully charged.
The E/O pin ancillary circuitry illustrated in Figures 13.4 and 13.5
provides transient immunity. The illustrated circuitry is the minimum
required, see Figures 13.4 and 13.5.
Power OK (P/OK) Pin: Power OK is a monitor signal that indicates
the status of the AC mains and the DC output voltage of the HAM.
P/OK is asserted (active low) when the output bus voltage is within
normal operating range 20 – 25ms after DC-DC converters are
enabled by the E/O signal of the HAM. This provides sufficient time
for the converters to turn on and their output(s) to stabilize prior to
P/OK being asserted (Figure 13.9). For momentary interruptions of
AC power, the HAM will provide at least 16ms of ride through or
hold up time (with 1,000µF output capacitor). On loss of power or
brownout, (when the HAM output voltage drops below 230VDC)
the P/OK signal will go to an open circuit state (see Figure 13.7),
signaling an impending loss of input power to the converter
modules. P/OK will provide power fail warning at least 1ms prior to
converter shut down. When the HAM output voltage drops below
195 VDC the converters are disabled via Enable Output (E/O).
NOTE: Acoustic Noise. Audible noise may be emitted from the module
under no-load, light-load, or dynamic-loading conditions. This is considered
normal operation of the module.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

F3 VI-26x or VI-J6x DC-DC Converters

Input V1 C5
F1

L1 L1 + OUT +IN
L1
Vicor GATE IN P/OK D2
Line Filter R1 G ATE IN
GND VI-HAM-xM E/O Driver
P/N 30205 GATE OUT G ATE OUT
6.3 A A/S C1 C2
D1 D4 C9
L2/N L2/N L2/N – OUT -IN

LINE LOAD C6 Y-Capacitor

Component Description Vicor

Designation Part Number
C1 0.1µF ceramic, 50V
C7
C2, C3 0.01µF ceramic, 50V
C4 Hold up capacitor, Available as a HUB F2
+IN
500 to 3,000µF from Vicor (see
D3
adjoining table) G ATE IN
R1 50kΩ C4 D5 Driver
R4* C3 G ATE OUT
C9, C10 0.2µF to 500V C10
R4* 100kΩ, 2W -IN
D1 1N4691 zener, 6.2V
D2, D3 1N4006 diode C8 Y-Capacitor
D4, D5 1N5817 diode
V1 275V MOV 30076 Hold up Box (HUB)
C5–C8 4,700pF Y2 cap. 01000
F1, F2 Use recommended fusing for specific
µ
DC-DC Converters
µ
µ
F3 10A, 250V

Figure 13.4 — Connection diagram HAM / DC-DC converter

VI-26x or VI-J6x DC-DC Converters

C5
10 A F1
+IN +OUT +IN
GATE IN P/OK R1 D2 C9
Bridge GATE IN
Rectifier VI-HAMD-xM E/O Driver
GATE OUT A/S C1
GATE OUT
F3 600V, 35A D1
C2 D4
L1 L1 -IN -IN
-OUT
JMK Filter 1N4006 Z1
Input P/N 1319-13 Z2
V1 GND
12.6 A * C6
1N4006 Z3 C7
L2/N L2/N 10 A F2
+IN +OUT +IN

GATE IN GATE IN
Component Description Vicor VI-BAMD-xM C4 Booster (N)
R4 ** C10
Designation Part Number GATE OUT GATE OUT
C1 0.1µF ceramic, 50V -IN -OUT -IN
C2, C3 0.01µF ceramic, 50V
C4 Hold up capacitor, Available as a HUB C8
1000 to 6,000µF from Vicor (see
adjoining table)
C5–C8 4,700pF Y2 cap. 01000
C9,C10 0.2µF, 500V Film or Ceramic
D1 1N4691 zener, 6.2V
* Consult Vicor's Applications Engineering for specific
D2, D3 1N4006 diode
HAMD / BAMD filtering information.
D4, D5 1N5817 diode ** A 100kΩ, 2W resistor is used for every 1,000µF
F1, F2 Use recommended fusing for specific of hold up capacitance.
DC-DC Converters
F3 20A, 250V
R1 50kΩ
R4** 100kΩ, 2W
V1 275V MOV 30076
Hold up Box (HUB)
Z1, Z2 130V Transorb 1.5KE130CA
2000µF HUB1000-P 1200W
Z3 150V Transorb 1.5KE150CA

Figure 13.5 — Connection Diagram, HAMD / BAMD / VI-26x or VI-J6x DC-DC Converters
HAMD-CM Driver HAM: no internal bridge rectifier or synchronization diodes;
BAMD-CM Booster HAM: companion module to HAMD-CM used for additional output power; no internal bridge rectifier

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

+OUT DO NOT OVERLOAD

or directly connect a capacitor
P/OK to the A/S terminal.

E/O IAS ≤ 3mA

+ A/S +OUT
19 – 23V
– –OUT D
"Power OK" Status
P/OK
Low = OK E/O
G
LOGIC S A/S
+OUT

P/OK
–OUT
E/O 18kΩ, 1/4W
A/S

–OUT

Figure 13.6 — Auxiliary Supply (A/S) Figure 13.7 — Power OK (P/OK)

AC Mains
120VRMS

Boost Voltage
DC Output 240VDC
+OUT of HAM 230VDC
195VDC
Rectified Line

P/OK
Enable Output (E/O) Off at 195VDC
E/O
D
A/S
LOGIC S
25ms
Off at 230VDC
G –OUT Power OK (P/OK)

Outputs 10ms
DC-DC Converter(s) Off below 195VDC

Figure 13.8 — Enable Output (E/O) Figure 13.9 — Start-up / shut-down timing diagram

Line Filter for High-Boost HAM

A line filter is required to provide attenuation of conducted
emissions generated by the HAM module and to protect it from MOV*
Cy D1
LINE

LOAD
DM CM
R Cx D2
line transients. It also presents a well defined high frequency P/N 30076
Cy D3
AC line impedance to the input of the HAM. To meet the listed
specifications, Vicor P/N 30205 line filter/transient suppressor or HAM Filter P/N 30205
equivalent must be used (Figure 13.10). The addition of a MOV Cx = 1.5µF(x2)SH C y = 0.01µF, Y2 type LC = 6.9mH LD = 0.72mH
external to this filter is required to meet normal mode transient R = 235kΩ D1,2 = 1.5KE130CA D3 = 1.5KE150CA
surge requirements. *MOV required external to filter to meet normal mode transient surge requirements

For applications using HAMD + BAMD or where the user desires

to construct a custom HAM filter, the filter should be designed
following Figure 13.10, the schematic of the Vicor P/N 30205 filter. Figure 13.10 — Recommended HAM filter
The current carrying capability of the inductors must be scaled
proportionally to the number of HAM modules used. Inductance
values must be selected according to Table 13.1. These limits are
to ensure proper operation of the HAM and do not guarantee a Parameter Min Typ Max Unit
system will meet conducted emissions specifications. Differential Mode Inductance (LD) 0.2 0.35 0.75
mH
For applications requiring magnetic field shielding, do not place a Common-Mode Inductance (LC) 3 6
ferrous EMI shield over the plastic cover of the HAM module. This
Table 13.1 — HAM filter inductance range
can cause thermal problems due to induction heating effects.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

RATED CURRENT VS AMBIENT TEMPERATURE

90
4-40 INSERT
0.25 DP 4 PL

OPERATING TEMP (°C)

4.60 ±0.02 80
2.50 ø0.080 PIN 0.060
1.200 6 PLACES
70
FACE MAY BE
BOWED 0.04 MAX
60

LOAD
LINE

2.40±0.02 2.00 1.800

0.100 0.900

0.30 ±0.02
50
0.13 ±0.02
1.00
40
0.500 0.500 MAX
1.45 2.800
±0.02
1.0 2.0 3.0 4.0 5.0 6.0 7.0
CURRENT (AMPS)
'0'

4.000 2 PL
2.500 2 PL
1.200 2 PL

Figure 13.11 — HAM filter mechanical diagram Figure 13.12 — HAM filter’s current rating vs. temperature

4.410
3.500
.310

.700

2.260 A A
90 2.000 2 PL
1.900 2 PL
ø.102 TPH
6 PL
.060 80 1.000 2 PL
SEE
NOTE 1 70
INSERTION LOSS (db)

A
DM '0' .100 2 PL A '0'
60 .260
NOTES ø.136 REPRESENTS WORST
'0' 4 PL
50TOP OF PLASTIC WASHER.
1. TOP OF INSERTS TO BE FLUSH TO .010
ABOVE MKED 'A'
CASE LOCATION FOR
EDGE OF FILTER
2. FILTER MUST HAVE VICOR AGENCY LABEL
40# 08094-01 CSA, TUV, UL).
(PART RECOMMENDED CUSTOMER
CM MOUNTING
30
20
10
0
0.01 0.04 0.1 0.4 1 4 10 40 100
0.02 0.07 0.2 0.7 2 7 20 70
FREQUENCY (MHz)

Figure 13.13 — HAM filter insertion loss vs. frequency

Parameter Min Typ Max Unit

Operating Voltage 85 250 VAC

Operating Temperature
–20 50 °C
(see Figure 13.12)
Leakage Current at 264VAC, 63Hz
1.2 mA
(Either Line or Earth)
Operating Current 6.3 A
Dielectric Withstand (Line – Case) 1500 VAC
Residual Voltage after 1s 34 V
Operating Frequency 50 60 Hz
Table 13.2 — HAM filter part #30205 specifications

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HAM Dos and Don’ts Power factor is 0.997 at 120VAC and 0.995 at 240VAC. Harmonic
nn
content at 240VAC is therefore somewhat higher than at 120VAC.
The following cautions should be observed before applying
Remember that harmonic content measured cannot be any lower
power to the HAM.
than the harmonic content of the AC mains. A precision AC
It is important that the output of the HAM not be loaded until
nn source is required for accurate power factor measurements.
the input voltage has exceeded 85VAC and the output has begun The input voltage range of the HAM is 85 – 264VAC; however
nn
to boost to 260VDC. This means that if the load on the HAM it may not start boosting until the AC mains has exceeded
is a Vicor converter, the Enable Output of the HAM must be 87VAC. Once the HAM has started, it will operate down to
connected to the GATE IN of all Driver modules. The HAM will 85VAC. The HAM contains 2.5 – 6V of input hysteresis, therefore
then disable the module output until the input exceeds 85VAC if the AC line impedance is high, i.e., when using a variable
and the output has been boosted to 260VDC. If an external load autotransformer, the HAM may start, but the AC line may then
is connected directly to the output of the HAM, do not apply the fall enough to drop below undervoltage lockout. When this
load until the output of the HAM is stabilized in boost mode. happens the AC line will go up, the HAM starts and the cycle
Although the efficiency of the HAM is quite high, it still dissipates
nn repeats. Therefore avoid soft AC lines at or near low line.
significantly more power than a VI-26x DC-DC converter.
Care should be taken to cool it. Do not rely on the internal
overtemperature shut down to take the place of adequate
planning relative to the cooling of the HAM. Thermal compound
should be used between the heat sink and baseplate of the
HAM, HAMD and BAMD.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview EMC
The IAM is a component-level, DC input front-end filter that EMC performance is guaranteed when the IAM is used in
when used in conjunction with the Vx-200 and Vx-J00 Family conjunction with the recommended Vicor converters within the
of DC-DC converters provides a highly efficient, high density permissible power rating and in accordance with the recommended
power system with outputs from 1 – 95VDC and power expansion installation procedure. (Figure 14.3) The capacitor shown across
from 25 – 800W. the input of the converter and bypass capacitors shown on the –IN
and +IN of the DC-DC converters to ground are required to meet
There are five input attenuator modules available for the EMC specifications. The capacitors should be Y-rated (interference
commercial market that comply with telecommunication and suppression). Y capacitors have high voltage breakdown ratings to
industrial control EMC specifications: Refer to data sheets for meet the isolation characteristics of the module’s input to baseplate
applicable standards at vicorpower.com. specification, self-healing properties, and safety agency approvals.
Input Maximum Output Power [a]
Model Input Reverse Polarity Protection
Voltage Range of Converter Combinations
VI-A11-xU 24V (21 – 32V) 200W A Zener diode in the EMC filter provides reverse polarity protection
when used with a properly rated fuse external to the IAM. The
VI-AWW-xU 24V “W” (18 – 36V) 200W characteristics of the recommended input line fuses permit normal
VI-A33-xQ 48V (42 – 60V) 400W full load operation with protection in the event of a reverse polarity
by clearing of the fuse. (Table 4.3).
VI-ANN-xQ 48V “N” (36 – 76V) 400W
VI-A66-xQ 300V (200 – 400V) 400W Input Transient Protection
Table 14.1 — Output power capability A Zener diode, inductor and capacitor in the EMC filter protect
[a] Based on DC-DC converters with 5V outputs or higher.
against short term transients. Transient voltages that persist beyond
these limits are dropped across an N-channel enhancement FET,
There are two input attenuator modules available for the defense Q1. It is necessary that the FET be kept in saturation mode during
market that comply with military EMC specifications, transient normal operation. Thus it is necessary to connect the DC-DC
specifications and spike specifications. Refer to product data sheet converters’ GATE OUT to the IAM’s GATE OUT to charge pump the
for applicable standards at vicorpower.com.

Input Maximum Output Power

Model
Voltage Range of Converter Combinations
MI-A22-xU 28V (16 – 50V) 200W
MI-A66-xU 270V (125 – 400V) 200W
Table 14.2 — Output power capability

+IN +OUT
Q1 D1
C2
+IN GATE OUT
VREF 1
D2 10V
U2 PARALLEL
EMI Filter OV
VREF
2 GATE IN
Level
–IN OC Shift Q2
U1
–IN –OUT

Figure 14.1 — Block diagram of Input Attenuator Module (IAM)

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gate of the FET to a voltage in excess of its source. In the case Input Current
where multiple DC-DC Driver modules are connected to one IAM, Inrush current is a function of the number of DC-DC converters
an external charge pump through the parallel pin (connected that are connected to the input attenuator module (modules are
to the gate of the FET) must be added to ensure that the FET not gated off at turn-on) and the amount of external capacitance
remains enhanced in the event GATE OUT enhancement is lost added between the Input Attenuator Module and the DC-DC
(Figure 14.4). The additional circuitry, C2, D1 and D2 are added converter. The inrush current specification is 125% of steady
externally to charge pump through the parallel pin. state input current for 10ms. To avoid excessive dissipation in the
Shut down of the DC-DC converters is accomplished by saturating element controlling the inrush (Q1), the following maximum values
Q2 during an input overvoltage to prevent possible damage to of external capacitance must be adhered to.
the converters. The IAM will automatically restart when the input
overvoltage is reduced to within the input voltage range. Input Voltage Maximum Capacitance [a]
If the long term transient withstand specifications are exceeded, 24VDC (21 – 32V) 470µF
the recommended external fuse will clear.
24VDC (18 – 36V) 470µF
28VDC (18 – 50V) 390µF
Input Voltage Recommended Fuse
48VDC (42 – 60V) 220µF
24V 20A / 32V (AGC-20)
48VDC (36 – 76V) 120µF
24V “W” 20A / 36V (AGC-20)
270VDC (125 – 400V) 27µF
48V 20A / 60V (3AB-20)
300VDC (200 – 400V) 27µF
48V “N” 20A / 80V (3AB-20)
Table 14.4 — Recommended distributed capacitance on input of
300V 5A / 250V Bussman PC-Tron DC-DC converter(s)
28V 20A / 250V (3AB-20 or F03A, 125V, 20A)
270V 5A / 250V Bussman PC-Tron or F03A, 250V, 4A
Table 14.3 — Recommended fusing based on input voltage

Safe Operating Area

(1% duty cycle max., ZS = 0.5Ω, for short duration transient capability refer to specifications).
MI-IAM Safe Operating Area, 28Vin

24V Inputs 48V Input

600
Standard Wide Range 500
VOLTS-PEAK VALUE OF SPIKE VOLTAGE

28VDC Input
R.E. 400
Ratings Exceeded
100V 100V 300
160V R.E.
200

I.S.W. 100
Full Load
S.D. OVP
50V
100V I.S.W. 0
Full Load S.D. -100
32V 36V 60V -200

Normal Operating Area Normal Operating Area -300

21V 18V 42V -400

0.1 1 10ms 100 1000 0.1 1 10ms 100 1000 -500
-600
10-6 10-5 10-4 10-3 10-2 10-1 100
48V Wide Range Input 300V Input MI-IAM Safe Operating
1ms 10ms
Area, 270Vin
100ms 1s
TIME (SECONDS)

276V R.E.
800V R.E.
VOLTS-PEAK VALUE OF SPIKE VOLTAGE

270VDC Input
Ratings Exceeded
125V I.S.W. 500V I.S.W. 800
Full Load S.D. 100V Full Load S.D. 600
76V 400V OVP 500V
400 400V
Normal Operating Area Normal Operating Area
S.D. 200
36V 200V 0
0.1 1 10ms 100 1000 0.1 1 10ms 100 1000
500ms 200
500ms
400
600

I.S.W.: Input surge withstand (no disruption of performance)

R.E.: Ratings exceeded 10-6 10-5 10-4 10-3
1ms
10-2
10ms
10-1
100ms
100
1s
S.D.: Shut down TIME (SECONDS)

Figure 14.2 — Output noise, with Ripple Attenuator Module (RAM)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Output Overcurrent / Short Circuit Protection Expansion Capabilities

Output overcurrent protection is a foldback type, followed by a The Input Attenuator Module incorporates a parallel pin permitting
timed latched shut down should the overcurrent persist beyond power expansion as long as the total output power from the
2ms. If the overcurrent condition is removed before the timeout DC‑DC converters does not exceed the power rating of each Input
interval, auto restart shall occur. Should latched shut down occur, Attenuator Module (EMC specifications are guaranteed for up
input power must be recycled to restart. to two input attenuators in parallel). It is necessary to include a
100Ω, 1/4W resistor between the negative outputs of the Input
Attenuator Modules to ensure equal potential at these points when
Output Overcurrent Threshold
paralleling Input Attenuator Modules, so as not to impact the
24VIN “W,” 28VIN, 48VIN “N” 20A effectiveness of the internal common-mode choke.
24VIN, 48VIN 15A
270VIN, 300VIN 4A
Table 14.5 — IAM overcurrent 4,700 pF

+IN +OUT
GATE +S
IN Driver/
To IAM C1 Booster TRIM
GATE –S
OUT
–IN –OUT

Connection to module baseplate

or ground plane
4,700 pF connected to baseplate

Figure 14.3 — External x, y capacitors for EMC requirements

+IN +OUT +IN +OUT

D3 GATE
+IN GATE IN IN +S
+
PAR Driver Trim
–
–IN GATE
GATE OUT OUT –S
–IN –OUT –IN –Out

IAM +IN +OUT

D3 GATE
IN +S
D2
[a] D1 C2 Driver TRIM
D1, D2, D3: 1N4148 GATE
OUT –S
C2: 470 pF/500V
–IN –OUT

+IN +OUT
D3 GATE +S
D2 IN
D1 C2 Driver TRIM
GATE
[a] OUT –S
For bus voltages greater than 75 V,
a 1N4006 diode should be used for –IN –OUT
the diodes (D3) connected to the
GATE IN pins.

Note: x, y capacitors not shown for clarity

Figure 14.4 — IAM multiple-driver interconnection

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Safety Considerations
Shock Hazard. Agency compliance requires that the baseplate be
grounded or made inaccessible
Fusing. Safety agency conditions of acceptability require module
input fusing. See Table 14.3 for recommended fuse ratings.

+IN +OUT +IN +OUT

+IN GATE IN GATE +S
+ IN VI-200
PAR Driver TRIM
– –IN GATE OUT
GATE –S
OUT
–IN –OUT –IN –OUT

IAM +OUT
+IN
GATE +S
[a] IN VI-200 TRIM
Diodes: 1N4148 GATE Booster –S
OUT
C2: 470 pf / 500 V –OUT
–IN

+IN +OUT
GATE +S
C2 IN VI-200 TRIM
GATE Driver
–S
OUT
– IN –OUT

100Ω

+IN +OUT +IN +OUT

+IN GATE IN GATE +S
IN VI-200 TRIM
PAR Booster
–IN GATE –S
GATE OUT OUT
–IN –OUT –IN –OUT

IAM +IN +OUT

GATE +S
C2 IN VI-200
TRIM
GATE Driver
OUT –S
[a] – IN –OUT
For bus voltages greater than 75 V,
a 1N4006 diode should be used for the
diodes connected to the GATE IN pins.
Note: x, y capacitors not shown for clarity

Figure 14.5 — Paralleling connections for the IAM

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview The power supply’s sense leads feed through the RAM for
connection at the RAM output, for local sense, or at the load,
The RAM/MI-RAM is an accessory product for VI-/MI-200, for remote sense (converter compensation is 0.5V maximum).
VI‑/MI‑J00, MegaMod/MI-MegaMod, ComPAC/MI-ComPAC and The attenuation and insertion loss are constant up to 10A or
FlatPAC. It reduces line frequency related ripple and converter 20A, depending on model. In overload (above 10A or 20A), the
switching noise to less than 3mVP-P (10mVP-P on the VI-J00). voltage drop will increase as the current increases. A single RAM
Features include: can be used on any output from 5 – 50VDC and will maintain the
original output set point of the converter within 0.5% at the sense
Reduced differential noise (<3mVP-P at loads up to 20A). The
nn connection. Care should be taken not to connect IN to OUT pins
input of the RAM must be between 5 – 50VDC. (i.e., through scope probe returns, grounds, etc.) as attenuation will
Active and passive filtering
nn be adversely affected.
Attenuation of low frequency input power source harmonics and
nn Inserting the RAM into the output leads of a Vicor VI-200/VI-J00
high frequency switching components from DC-20MHz converter adds phase shift to the converter’s control loop. This
occurs because voltage is sensed at the output of the RAM’s
Remote sense, trim, overvoltage protection and overcurrent
nn
internal filter. The 220µF capacitor between –S IN and –IN (See
protection features retained
Figure 15.1) provides additional high-frequency bypassing for the
Applications for the RAM include medical diagnostic and sense leads to ensure stability of the converter and RAM. It may
automated test equipment, radio receivers, transmitters be possible to reduce its value or remove it in applications where
and communication products, and other products requiring transient response is important. If it is removed a network analyzer
the noise performance of a linear supply. Refer to RAM should be used to verify stable operation.
operation in Section 9.
The RAM is a combination active / passive filter. A simplified
schematic is shown in Figure 15.2. The output of the switcher feeds
+S +S
directly into a high frequency passive filter which attenuates the
switching noise. Low frequency, line related ripple attenuation is +IN +OUT
via a FET series regulator that maintains a constant average forward
voltage drop of about 350mV. The FET gate is modulated to
maintain the AC component of the FET drain-source voltage equal
to the ripple component of the incoming DC voltage, effectively
cancelling it out.
–IN –OUT

–S –S

Figure 15.2 — Basic RAM schematic

+ +IN +OUT +IN +OUT
L1 + S IN +S OUT
GATE +S
CM IN VI- / MI-200 TRIM RAM N/C Load
GATE
OUT –S – S IN – S OUT
220 µF 0.22 µF
– –IN –OUT – IN –OUT
25db

30db
35db

40db
Attenuation

45db
Figure 15.1 — RAM with optional trimming circuit and 50db
recommended common-mode choke 55db
60db
10Hz 100Hz 1KHz 10KHz 100KHz 1MHz 10MHz

Frequency

Figure 15.3 — Attenuation vs. frequency (typical)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Single-Phase Front Ends protection, active inrush limiting, AC-OK (AC fail indicator), and a
BUS-OK status output suitable for controlling Vicor modules via
Vicor single-phase non-isolated AC front ends are available in both the GATE IN pin.
PCB and chassis mount versions, and deliver reliable DC bus voltage
to VI-x6x converter modules or Mega Modules at power levels up Vicor front ends have been designed to comply with the
to 250, 500 and 750W. These front ends are strappable to provide requirements of major safety agencies when used in conjunction
operation from either 115VAC or 230VAC single-phase lines, and with recommended mains switching and input fusing.
provide conducted EMC filtering to VDE / FCC Level B. They also
offer transient surge

INPUT OUTPUT
Ground all baseplates
(500 W, 750 W front end only) to Earth Ground

EARTH AC-OK+ +V
Earth Ground Vce sat. <70 V F2
GROUND F1 <0.4 V @
AC-OK– +IN
L1 (Phase) 1.5 mA GATE IN VI-x6x
A.C. MAINS BUS-OK Module
L2 (Neutral) –IN
CONNECT VDC–
ST1 TO ST2 ST1
F3
FOR 115 Vac VDC+ +IN
OPEN FOR ST2
GATE IN VI-x6x
230 Vac Module
–IN

USE #4 HARDWARE F4
TORQUED @ 5 in.-lbs. FUSING INFORMATION +IN
(4 PLACES) GATE IN VI-x6x
FOR SAFE OPERATION, REPLACE ONLY Module
WITH RECOMMENDED FUSES –IN
250 W — FUSE 1: 6.3 A / 250 V (IEC 5 x 20 mm) BUSSMAN
GDB-6.3 OR 7 A / 250 V (3AG 1/4" x 1 1/4") LITTLEFUSE Fn
314-007 OR BUSSMAN MTH-7 OR ABC-7 +IN
FUSES 2,3,4...n: 3 A / 250 V BUSSMAN PC-TRON GATE IN VI-x6x
Module
500 W — FUSE 1: 12A/250V BUSSMAN ABC-12, –IN
LITTLEFUSE 314-012
FUSES 2,3,4...n: 3 A / 250 V BUSSMAN PC-TRON
Note: x, y capacitors not shown for clarity
750 W — FUSE 1: 15 A / 250 V BUSSMAN ABC-15,
LITTLEFUSE 314-015
FUSES 2,3,4...n: 3 A / 250 V BUSSMAN PC-TRON

Figure 16.1 — 250W, 500W, 750W front ends

Notes If unit is strapped for 115V operation and 230V is applied,

nn
the input fuse will clear. Replace fuse, strap correctly and
Ambient temperature must be less than 50°C in free air.
nn reapply power.
Temperature may exceed 50°C with moving air. (refer to
de‑rating curves in Figure 16.2) To control EMC most effectively, the return path to ground
nn
from either the front end or modules should be made via a
Do not obstruct vent holes.
nn good RF ground (i.e., a braided wire) if possible.
Observe module installation requirements
nn The BUS-OK, VDC– and VDC+ lines should be run in close
nn
(refer to Module Dos & Don’ts, Section 3). proximity to one another or as a twisted group between the
Minimize length of all unshielded line cord.
nn front end and modules.
Minimum conductor size for supply is 16AWG (250W),
nn Bypass the baseplates of the modules to –IN and –OUT (refer
nn
14AWG (500W) and 12AWG (750W) including the to EMC Considerations, Section 9).
115/230 strap.
If the DC output bus is shorted before application of AC
nn
power, the fuse may not blow, and the unit will not turn on.
If wire distance from front end to modules is greater than
nn
3 feet, (0.91m) install a TRANSZORB (Part #1.5KE400A)
across the input of each module.

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Thermal Considerations
Free Convection Derating 250W
80
250W:
nn
Derate output power linearly at 7.2W/°C over 50°C.

Ambient Temperature ϒC
70
500W:
nn
Derate output power linearly at 14.3W/°C over 50°C.
60
750W:
nn
Derate output power linearly at 18.8W/°C over 45°C. 50
Forced Convection. The curves to the right represent worst case
data for chassis mounted (enclosed) front ends; i.e., low line, full 40
load. System conditions such as higher line voltage, lighter load or 0 100 200 300 400 500 600

PC mount versions of the front ends will increase reliability if the Airflow (LFM)
following data is used as the nominal design criteria.
The sigmoid shape of the curves at low airflow is due to the chassis
mount cover restricting the airflow to the inboard components. 500W
When an airflow of approximately 200LFM is achieved, the velocity 80
of air rushing over the cover causes air to be pulled in through the
side perforations, resulting in a rapid improvement in the cooling of

Ambient Temperature ϒC
70
internal components.
60

50

40
0 100 200 300 400 500 600
Airflow (LFM)

750W
80
Ambient Temperature ϒC

70

60

50

40
0 100 200 300 400 500 600
Airflow (LFM)

Figure 16.2 — Maximum ambient temperature vs. airflow (LFM)

over cover (full load, 90VAC input, chassis mount)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

3-Phase Front End also provided for advance warning of DC bus dropout due to AC
line failure and indication of internal DC bus integrity in the user
Vicor 3-phase front ends are available as chassis-mount products system, respectively.
that deliver reliable DC bus voltage to VI-x6x Family (nominal
300VDC input) converters up to 1.5kW, 3kW and 5kW. These front ends have been designed to comply with the
requirements of major safety agencies when used in conjunction
Front ends operate from 3-phase (4-wire delta or 4- or 5-wire with the recommended mains switching and input fusing
wye) AC mains input and provide conducted EMC filtering to VDE/
FCC Class A, transient surge protection, inrush current limiting and
ENABLE output suitable for controlling an array of Vicor converters
via the GATE IN pin. Isolated AC-OK and BUS-OK outputs are

Ground all baseplates to Earth Ground [a]

Vce sat.<0.4 V
@ 1.5 mA F2
BUS-OK +
+V +IN
<70 V
L3 BUS-OK – GATE IN VI-x6x
+V Module
AC L2 AC-OK + <70 V –IN
MAINS AC-OK –
L1
N F3
MOD ENBL
GND Vdc+ +IN
EARTH Vdc– GATE IN VI-x6x
GROUND Module
–IN

F4
+IN
GATE IN VI-x6x
Caution: External capacitors connected to +VDC and –VDC will significantly Module
increase inrush current. Also these capacitors are subject to AC ripple –IN
voltages of approximately 40V at full load.
Fn
+IN
GATE IN VI-x6x
Module
[a]
–IN
To control EMC most effectively, the return path to ground
from either the front-end or modules should be made via a
Note: x, y capacitors not shown for clarity
good RF ground (i.e., a braided wire) if possible.

Figure 16.3 — 1.5, 3.0kW front end

Ground all baseplates to Earth Ground [a]

Vce sat.<0.4V F2
@ 1.5 mA +IN
+V
BUS-OK + <70 V
Caution: External capacitors BUS-OK – GATE IN VI-x6x
connected to AC-OK + +V Module
<70 V –IN
+VDC and –VDC AC-OK –
will significantly
MOD ENBL
increase inrush F3
Vdc+ +IN
current. Also
GATE IN VI-x6x
these capacitors Vdc– Module
are subject to AC –IN
ripple voltages of L3
L2 AC
approximately 40V MAINS F4
L1 +IN
at full load. N
GND GATE IN VI-x6x
EARTH
GROUND Module
–IN

Fn
+IN
GATE IN VI-x6x
Module
–IN
[a]To control EMC most effectively, the return path to ground
from either the front-end or modules should be made via a
Note: x, y capacitors not shown for clarity
good RF ground (i.e., a braided wire) if possible.

Figure 16.4 — 5.0kW front end

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Fusing Information DC Output Connections and Module Enable

1.5kW front end: 7A / 250V normal blow in all three phases of
nn A three terminal barrier block labeled VDC–, VDC+ and MOD EN
the AC line (Bussman ABC-7 or Littlefuse 314-007). provides both the DC input enable and enable control line for
Vicor converters.
3kW front end: 12A / 250V normal blow in all three phases of
nn
the AC line (Bussman ABC-12 or Littlefuse 314-012). VDC–: Negative DC input terminal to all Vicor converters.
nn
5kW front end: 20A / 250V normal blow in all three phases of
nn VDC+: Positive DC input terminal to all Vicor converters.
nn
the AC line (Bussman ABC-20). MOD EN: Connect to the GATE IN terminal of all Driver modules.
nn
This connection must be made to guarantee proper enabling of
Environmental Data
the converter array on power-up and proper shut down of the
Operating temperature (no load to full load): –20°C to +50°C,
nn converter array on power loss, loss of phase or output fault.
free convection
Cautions
Non operating temperature: –40°C to +80°C
nn
This product is designed to operate with Vicor VI-x6x Family
Operating / non-operating humidity: 95% relative,
nn
(300VDC input) converters, Mega Modules and the 300VIN Maxi,
non‑condensing
Mini and Micro converters.
Electrical Data — AC Line Input Voltage Connections This product is not intended for use with European 380 – 415VAC
nn
(phase to phase) three phase distribution.
3-phase delta (4-wire): 208VAC (nominal) +20% / –10%.Connect
nn This product is an offline AC-DC power supply. It is not isolated
nn
the three phases (L1, L2, L3) and GND (earth) to the five‑terminal from the AC mains.
barrier block marked as such.
Proper grounding is mandatory for safe operation.
nn
3-phase wye distribution (5-wire): 208VAC (nominal)
nn
+20% / –10%. Connect the three phases (L1, L2, L3),
N (neutral), and GND (earth) to the five-terminal barrier block
marked as such.
Line frequency: 47 – 440Hz
nn

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17. DC Input Power System (ComPAC™ / MI-ComPAC™ Family) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview EMC Performance, Conducted EMC: The ComPAC will

conform to the following conducted EMC specifications on the
The ComPAC is a low-profile, highly efficient, high-density
input power leads:
configurable DC-DC power solution with EMC filtering, transient
protection and reverse polarity protection. It has an isolated w Telecom (24V, 48V inputs): Bellcore TR-TSY-000513,
nn
disable input for remote shut down, and provides outputs from Issue 2 July 1987 and Rev. 1, December 1988.
1 – 95VDC and power-up to 600W. British Telecom Document BTR2511, Issue 2.
There are five input voltages available which comply with Commercial (300V input): FCC Pt. 15 Subpt. J,
nn
telecommunication and industrial control EMC specifications. Refer Class A / VDE 0871 Class A.
to data sheet for applicable standards at vicorpower.com. Military (28V, 270V): MIL-STD-461C
nn
Conducted Emissions: CE01, CE03, CE07
Nominal Input Input Conducted Susceptibility: CS01, CS02, CS06
Input Voltage Designator Voltage Range
Radiated EMC: The ComPAC will conform to the following
24V 1 21.7 – 32V radiated specifications:
24V (wide) W 18.7 – 36V Military: Radiated Emissions: RE02; Radiated
nn
48V 3 42 – 60V Susceptibility: MIL-STD-461C, RS02, RS03.
48V (wide) N 36 – 76V Input Transient Protection: The input transient protection will
suppress short term transients appearing on the input line. Refer to
300V 6 200 – 400V
data sheet for applicable standards at vicorpower.com.

There are two military input voltages available which comply Input Surge Withstand: The 24V, 48V and 300V input ComPAC
with military EMC specifications and the transient and spike shall withstand, without damage or interruption of power, an input
specifications. Refer to data sheet for applicable standards at line surge shown below for a duration of 100ms from a source
vicorpower.com. impedance of 500mΩ.
Extended Input OV Shut Down: Surge protection shall also
Nominal Input Input shut down the ComPAC in the presence of sustained input
Input Voltage Designator Voltage Range surges (100 – 1,000ms) which would cause excessive dissipation
28V 2 18 – 50V or damage. The ComPAC will auto restart when the input
overvoltage is removed.
270V 6 125 – 400V
Input Reverse Polarity Protection: The ComPAC’s input is
protected against reverse polarity. No damage will occur provided
ComPACs can be configured in 1-up, 2-up or 3-up packages with that external current limiting is present (i.e., fuse).
total output power limited to the maximum power of individual
VI-200 or MI-200 series converters. Output voltages may be Output Short Circuit Protection: Output short circuit protection
trimmed by the user. is provided by the current limiting of the Vicor DC-DC converters.
Output Power: The maximum total power which is delivered Undervoltage Lockout: The ComPAC incorporates an
from the ComPAC is: undervoltage lockout which will inhibit the output of all converters
until the input line exceeds the brownout voltage specified for the
converter input range.
Nominal Total Output Power
Input Voltage 1-Up 2-Up 3-Up
Nominal Undervoltage Lockout
24V and 24V (wide) 150W 300W 450W Input Voltage (VDC , Typical)
28V, 270V (military) 100W 200W 300W 24V 19

48V and 48V (wide), 300V 200W 400W 600W 24V (wide) 17
28V 17
Weight: 48V 41
1-Up: 1.2lbs [540g] 48V (wide) 35
2-Up: 2.4lbs [1,080g]
3-Up: 3.6lbs [1,630g] 270V 121
300V 188
Operating Case Temperature:
E-Grade: –10 to +85°C Following startup, the undervoltage lockout will inhibit the
C-Grade: –25 to +85°C converter output(s) should the input drop roughly 8 – 10 V below
I-Grade: –40 to +85°C the UV lockout limits stated above.
M-Grade: –55 to +85°C
Overall Efficiency: The overall efficiency of the ComPAC is
approximately 1% less than the efficiency of the Vicor DC-DC
converters (typical efficiencies: 77% for 2V output, 81% for 5V
output and 83% for 12 – 48V output).

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Recommended Input Line Fusing Disable Current

The ComPAC must be fused externally. The table below lists the 4mA DC minimum for 1-up ComPAC
nn
fuse ratings for one, two and three-up units (maximum output 8mA DC minimum for 2-up ComPAC
nn
200, 400 and 600W).
12mA DC minimum for 3-up ComPAC
nn
Nominal Fuse Rating
Trimming
Input Voltage 1-Up 2-Up 3-Up
The nominal output voltage of the ComPAC can be adjusted
24V 10A / 32V 20A / 32V 30A / 32V from 110 to 50% of nominal voltage. Refer to Output Voltage
24V (wide) 12A / 32V 20A / 32V 30A / 32V
Trimming, Section 5, for external resistor values. Do not trim the
outputs higher than 110% of their nominal output power (output
28V 10A / 250V 20A / 250V 30A / 125V overvoltage protection may trigger). When the output is trimmed
48V 8A / 60V 15A / 60V 25A / 60V up, do not exceed its maximum rated output power.

48V (wide) 6A / 100V 15A / 100V 25A / 100V NOTE: 10V, 12V and 15V outputs, standard trim range ±10%,
3.3V output trim range 2.20 – 3.63V.
270V 2A / 250V 4A / 250V 6A / 250V
Remote Sensing
300V 2A / 250V 4A / 250V 6A / 250V
+SENSE and –SENSE must be connected locally or remotely.
Recommended Input Wiring and Torque Output Terminal Connections
Configuration Wiring Torque A hardware kit with parts for output terminal connections is
provided with each ComPAC unit. The following drawing shows
1-Up #16AWG 10in.lb the assembly of those parts for the proper connection of metal
2-Up #14AWG 15in.lb power terminals. Assembly for PCB power terminals is the same
except that they do not require an external tooth lockwasher. See
Recommended Output Wiring Figure 17.2 for the recommended torque level for each stud size.
Use the output wire gauge that corresponds to the output current
of the ComPAC unit:
#10 TERMINAL
RETAINING NUT
Output Current & Corresponding Wiring EXTERNAL TOOTH
LOCKWASHER
105 – 160A #4 26 –40A #10 7 – 10A #16
66 – 104A #6 16 – 25A #12 4 – 6A #18
USER OUTPUT
TERMINALS
41 – 65A #8 11 – 15A #14 0 – 3A #20 TERMINAL COVER
NEGATIVE
#10 NUT PLATE
HELICAL
LOCKWASHER
Long cable runs, or wires in large bundles will require heavier cable (FITS WITHIN
OPENING PROVIDED)
to avoid excessive voltage drops or overheating. #10 BRASS STUD

Grounding Terminal and Terminal Recommended

Stud Size
For safe operation, the ComPAC unit must be grounded. Product Model Style Torque
Connect a ground lead to the terminal marked (GND). Use the –OUT, +OUT Terminals
same wire gauge as that specified for your ComPAC unit’s input
voltage connections. LC, PC, RC Series PCB 8-32 UNC 10in.lbs [1.1N.m]
MC and NC Series Metal 10-32 UNC 15in.lbs [1.7N.m]
Overall Disable
PCB 8-32 UNC 10in.lbs [1.1N.m]
QC Series
The ComPAC incorporates an optically isolated Overall Disable Metal 10-32 UNC 15in.lbs [1.7N.m]
input which will shut down the ComPAC output when a current is –SENSE, +SENSE, TRIM Terminals
driven through the disable terminals.
Sized to accept Amp Faston®
All models
insulated receptical #2-520184-2.

20mA Max. Figure 17.2 — Output terminal connections

Disable
+

V DIS+

DIS–

Figure 17.1 — ComPAC module disable

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Thermal Data Thermal Impedance, Free Convection:

Thermal resistance baseplate to air.
Operating Ambient Temperature: Depends on factors such as
output power, availability of forced air, and mounting technique.
Do not allow the ComPAC to exceed its maximum operating Thermal Resistance (°C / W)
Mounting Type
temperature, which is reached when the case is 85°C. Temperature 1-Up 2-Up 3-Up
measured at center of heat sink. (Full power can be delivered
Vertical 2.44 1.17 0.76
up to this temperature.) Refer to Section 21, Thermal Curves, to
determine the maximum ambient temperature for your application. Horizontal 3.60 1.70 1.35

Note: To ensure proper heat transfer from the internal module(s) to the heat
sink, the mounting holes through the heat sink must be properly torqued at
all times during operation. If the unit is operated unmounted, insert a #6 or Forced Convection:
metric M3.5 flathead screw through each hole from below and secure with Thermal resistance baseplate to air (horizontal mount):
a nut on top, torqued to 6lb.in [0.83N.m].
Thermal Resistance (°C / W) Airflow
1-Up 2-Up 3-Up (LFM)

3.6 1.7 1.35 0

2.7 1.4 1.26 50
2.3 1.3 1.11 100
1.6 0.97 0.82 250
1.15 0.70 0.58 500
0.9 0.54 0.46 750
0.78 0.45 0.38 1,000

Note: A 1.37in [34,8mm] heat sink, option H1, is also available.

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18. AC Input Power System (FlatPAC™ Family) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview The control circuit maintains the converter GATE IN pins low, the
PTC shunt inactive and the AC‑OK and BUS‑OK outputs in FAIL
The Vicor FlatPAC consists of an offline single phase AC front end
status until the DC bus potential reaches a minimum threshold
and one, two or three VI‑26x / VI‑B6x Family DC‑DC converter
at which full power and hold‑up can be delivered. The GATE
modules (1‑up, 2‑up, 3‑up), combined in an integrated mechanical
IN terminals of all Driver modules internal to the FlatPAC are
assembly. This assembly provides a complete, high‑efficiency,
FET‑controlled by a logical replica of the BUS‑OK status line, and as
offline switching power supply delivering power up to 600W.
such will inhibit converter operation at power‑up until the DC bus
The offline front end provides rectification and filtering of the AC
potential has settled to full operating level. The converters are then
input, delivering a nominal unregulated 300VDC bus as input to the
enabled and the PTC shunt activated.
VI‑26x / VI‑B6x Family converter modules. The front end control
circuit will automatically strap the bridge as a voltage doubler for The AC‑OK and BUS‑OK status lines go to their respective active
115VAC operation or as a full bridge for 230VAC operation. states almost simultaneously on initial power‑up. AC‑OK will
de‑assert prior to BUS‑OK on loss of AC input, providing advance
Circuit Operation warning of impending DC failure should the AC line not return
AC line voltage is applied via an agency‑approved terminal prior to the expiration of the ride‑through time (a function of both
block providing AC mains (L1, L2/N and GND). Current in the load and line voltage).
L1 lead is applied to a 15A / 250V fuse for the 3‑up FlatPAC, a The front‑end output is bled down automatically after loss of
12A / 250V fuse for the 2‑up FlatPAC and a 8A / 250V fuse for AC input, as the logic circuit operating power is derived from a
the 1‑up FlatPAC. This current is interrupted only in the event bleed path across the DC output bus. Wait two minutes before
of a catastrophic failure of a main power component internal reapplying input after shutdown. Input voltage to the converters is
to the FlatPAC. made via fast‑acting 3A / 250V Buss PC‑Tron fuses in each positive
The input current beyond the fuse is passed through an EMC filter input lead. The fuse will clear rapidly and protect the front‑end
designed to meet conducted noise limits of FCC Part 15 EN55022 from damage in the event of a module input short.
Class B for the 2‑up and 3‑up versions. At start‑up, AC inrush Input overvoltage sensing and protection is performed by a voltage
current is limited by a PTC thermistor prior to being passed to sensing circuit connected across the DC bus. In the event of an
the main energy storage capacitors. This PTC thermistor serves as overvoltage condition, a SCR / PTC combination will simultaneously
both an inrush current limiter on power‑up and a current limiting disable the drive for the TRIAC / SCR PTC shunt, disable the
shutdown device in the event of a line overvoltage condition. The converters and apply a load across the DC bus. Normal operation
PTC is shunted out shortly after initial power‑up by a pair of inverse resumes when the input voltage falls within the normal operating
parallel SCRs on the 3‑up FlatPAC (TRIAC for the 1‑up and 2‑up range when operated from a 230VAC source.
FlatPAC), controlled by an opto‑TRIAC coupler driven by a DC bus
voltage sense circuit. The main rectifiers and filter capacitors are A Overall Disable function is incorporated in the 2‑up and 3‑up
arranged in a conventional selectable configuration and act as FlatPAC (MOD DIS+, MOD DIS–). This optically isolated input
either a full wave bridge or voltage doubler, delivering a nominal will disable the output of all converters simultaneously. Applying
300VDC to the converter modules. a current to this input will disable the converters. This disable
current should be limited to 30mA maximum by an external
At initial power‑up, the front end is configured for 230V operation control element.
and the PTC inrush limiter permits the main storage capacitors
to charge up at a controlled rate toward full operating DC bus FlatPAC AC‑OK and BUS‑OK Status Outputs, MOD‑DIS Input
potential. If the bus voltage is below the operating threshold for (2‑up and 3‑up only)
the converter, the unit will autostrap for 115V operation. The
autostrapping function is performed by a control circuit and TRIAC The BUS‑OK and AC‑OK outputs provide the user with both an
(dual SCRs on 3‑up unit) which configures the front end from a optically isolated status indication of the internal DC bus condition
full wave bridge to a voltage doubler. Once the unit autostraps for and advance warning of pending DC bus drop‑out due to AC line
230V operation, it will be necessary to recycle the AC power to loss. These outputs, in system applications, can provide power
allow operation at 115V. If the unit is operating in the 115V mode supply status, switch in (standby) backup sources or initiate
and a long duration transient is applied to the FlatPAC (>150VAC for “power‑down” sequences to save volatile memory contents in the
50ms), the unit will autostrap for 230V operation. event of AC line loss. The MOD‑DIS input is an optically coupled
input and allows for remote disabling of the outputs of 2‑up
and 3‑up FlatPACs.

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

BUS-OK: An internal replica of BUS-OK is wired to the GATE IN

input of all internal Driver modules. The modules will be disabled
(no DC output) during initial power-up of the FlatPAC until the MOD-DIS –
internal DC input bus voltage to the DC-DC converters is sufficient MOD-DIS + Internal 2-Up
to support fully-loaded operation. The BUS-OK status output AC-OK – Supervisory and
reflects the status of this inhibit function. This same logic circuit AC-OK + Circuits 3-Up
BUS-OK – (Optocouplers)
will shut down the converters when the internal DC bus voltage BUS-OK +
is insufficient to support proper loaded operation. This shut down
will occur during normal power down, AC line dropouts of duration
exceeding the hold-up time, or internal faults causing the internal L1 1-Up
AC Mains
DC bus voltage at the input of the converters to collapse. L2/N
Earth Ground GND
AC-OK: This output is provided primarily as an advance warning
of a potential DC BUS-OK shut down due to loss of AC line or an
internal fault. A minimum advance warning time of 5ms is provided Note: Product is internally fused.
at 90VAC and full load.
Figure 18.1 — AC mains and supervisory connections
MOD-DIS+, MOD-DIS–
The Module Disable function will disable the output(s) of the Mod-Dis Input: Apply a current of 1 – 30mA to disable
2-up and 3-up FlatPACs. The supply is disabled by applying output. Forward voltage drop of internal opto diode is 1.65V
current to the MOD-DIS+ / MOD-DIS– input. The minimum input max. at 30mA max.
current for disabling the supplies is 1mA. The maximum allowable
current is 30mA. AC-OK and BUS-OK Status Outputs: Outputs low when OK.
VCE sat. = <0.4V at 1.5mA. Maximum external pull up is 70VDC.
Electrical Connections AC-OK and BUS-OK signals are isolated and can have different
reference levels.
Status output pairs AC-OK+, AC-OK– and BUS-OK+, BUS-OK– are
the collectors (+) and emitters (–) of NPN optoisolator output
transistors (one optoisolator per status signal). The collector
terminals AC-OK+ and BUS-OK+ of the optocouplers, in a typical 30 mA max.
FlatPAC
application, can be connected via current limiting resistors to a
source no greater than 70VDC. These resistors should limit the
maximum current to the optocoupler output transistors to 1.5mA. Disable
+
The emitter terminals AC-OK– and BUS-OK– are connected to the
V +
return of the external source. The status OK condition will set the
optocoupler output transistors in saturation and are capable of MOD-DIS –
sinking up to 1.5mA with a VCE saturation voltage of 0.4V. Users
should be cautioned that although the output of the FlatPAC can
be used as the pull-up source, shortly after BUS-OK changes from 1.5 mA
max.
OK (saturated) to NOT OK (high Z), the pull-up voltage will be shut +
down. It is thus advisable to provide a capacitive reservoir, if the r
V
pull-up source is one of the FlatPAC’s outputs, in order to maintain +
the pull-up potential after loss of DC current output. Use edge AC-OK
–
sensing logic to detect assertion of logic outputs, or a separate
source of bias supply voltage (i.e., backup batteries) to provide a
safe pull-up voltage source regardless of the AC line status. 1.5 mA
+ max.
V r
+
BUS-OK
–

Figure 18.2 — External supervisory functions

(2-up and 3-up models only)

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VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Input Voltage Connections: Connect the line voltage to L1 (hot)

VLINE > 90 (180)Vac
and L2N (neutral). For 1-up FlatPAC models (max. output 200W),
AC use #16AWG input wire; for 2-up and 3-up models (max. output
Line
AC Line
400W and 600W), use #14AWG input wire. Recommended
Interrupted connector screw torque is 5 to 7in.lbs (0.5 – 0.8N.m).
AC-OK Recommended strip length is 8mm. Use your FlatPAC model only
with the correspond­ing input voltages and frequencies shown in
BUS-OK
the table below.

Product Grade Model 90 – 132VAC 180 – 264VAC

T0 T1 T2 T3 T4
C-Grade VIxU-Cx 47 – 63Hz
Conditions: Full Load 90 (180)Vac, AC Line
I-Grade VI-xU-Ix 47 – 440Hz
Time Interval Min Typ Max Unit Notes Output Wire Gauge: Use the output wire gauge that corre­sponds
T1 – T0 0 0.1 1.0 ms to the output current of your Autoranging FlatPAC unit, below: Do
not loosen bottom nut.
T3 – T2 0 – – ms Ride-through time
T4 – T2 5 – – ms Hold-up time Output Current & Corresponding Wiring
T4 – T3 5 – – ms AC fail warning time 100 – 160A #2 30 – 50A #8 10 – 15A #14
75 – 100A #4 20 – 30A #10 6 – 10A #16
Figure 18.3 — Timing diagram, status signals
(2-up and 3-up models only) 50 – 75A #6 15 – 20A #12 0 – 6A #18

Long cable runs, or wires in large bundles will require heavier cable
+ VOUT
to avoid excessive voltage drops or overheating.
+OUT
+SENSE
Output Voltage Trimming: Do not trim the outputs higher
R1
TRIM than 110% of their nominal output voltage. When an output is
–SENSE 10K trimmed up, do not exceed its maximum rated output power.
–OUT VOUT RTN
(refer to Section 5)
R2
Operating Temperature: Do not allow the FlatPAC to exceed its
Note: +SENSE and –SENSE must be connected locally or maximum operating temperature, which is reached when the heat
remotely (shown).
sink is 85°C. (Full power can be delivered up to this temperature.)
Resistor Values for Trimming Standard Output Voltages Heat sink temperature is a function of the output power and
voltage of the supply, ambient temperature, and airflow across
Nominal Output Voltage the heat sink. Always use worst-case conditions when calculating
Resistor Trim Range
5V 12V 15V 24V 28V 48V operating temperature.
R1 (kΩ) 0.953 15.8 22.1 41.2 48.7 90.9
+10%, –10% Note 1: To ensure proper heat transfer from the internal module(s) to the
R2 (kΩ) 90 heat sink, the mounting holes through the heat sink (two, three,
and four holes on 1-up, 2-up and 3-up models, respectively) must
Figure 18.4 — Output SENSE and TRIM contain torqued screws at all times during operation, whether or
(all models with VI-200s) not the unit is mounted. If the unit is operated unmounted, insert
a #6 or M3.5 panhead screw through each hole from below and
secure with a nut on top, torqued to 6in.lbs [0.7 N.m].
Battery Programmable Current Note 2: All FlatPAC models are available with a conduction cooled flat plate
Charger or Voltage Source
instead of the top heat sink.
+OUT
Go to vicorpower.com for outline drawings.
+OUT
+ +
VTRIM External VTRIM External
ITRIM Control
12 – 48 V ITRIM Control Load
Input / Output Retrofit Connections: A hardware kit, available
IMON Battery IMON
Functions Functions from Vicor, allows the input and output supervisory terminals to be
– – connected in the same manner as for the earlier style FlatPAC (2-up
–OUT –OUT
model only). The retrofit output terminals are sized to accept AMP
Faston® insulated receptacle #2-520184-2.
Figure 18.5 — Typical applications
(models with BatMods only)
Fusing: The FlatPAC’s internal fuses are not user-replaceable. Please
return the unit to vendor if servicing is necessary.
Grounding: To satisfy IEC950 Class I grounding requirements,
connect a ground lead to the terminal marked (GND). For 1-up
FlatPAC models (max. output 200W), use
1.5mm2 / #16AWG wire; for 2-up and 3-up models (max. output
400W and 600W), use 2.5mm2 / #14AWG wire.

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19. AC Input Power System (PFC FlatPAC™) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview – PFC FlatPAC Fusing: The PFC FlatPAC’s internal fuse is not user-replaceable.
The PFC FlatPAC consists of a universal input (85-264VAC) AC front Grounding: To satisfy IEC950 Class I grounding requirements,
PFCDC-DC
end and one Maxi FlatPAC Output
converter Vs.integrated
in an Input Voltage
mechanical connect a ground lead to the terminal marked (GND).
assembly providing up to 575W of power. Using the Vicor Use 2.5mm2 / #14AWG wire.
Harmonic Attenuator Module (HAM) and integrated filtering,
the PFC FlatPAC meets EN61000-3-2 harmonic current limits and Input Voltage Connections: Connect the line voltage to L1 (hot) and
0.99 power factor. The internal filtering provides compliance to L2N (neutral). Use #14AWG input wire. Recommended connector
EN55022-A conducted EMI. screw torque is 5 – 7in.lbs [0.5 – 0.8 N.m]. Recommended strip
length is 8mm. Refer to Figure 19.2.
The PFC FlatPAC will accept an input voltage of 85 – 264VAC,
derate power at 9W/VRMS as shown in Figure 19.1. Output Wire Gauge: Use the output wire gauge that corresponds
to the output current of your FlatPAC unit, below: Do not loosen
bottom nut. Long cable runs, or wires in large bundles will require
600 heavier cable to avoid excessive voltage drops or overheating.
580
560 Output Current & Corresponding Wiring
540
520 100 – 160A #2 30 – 50A #8 10 – 15A #14
500
Pout (W)

480 75 – 100A #4 20 – 30A #10 6 – 10A #16

460
440
50 – 75A #6 15 – 20A #12 0 – 6A #18
420
400 Output Voltage Trimming: The Maxi converters used in the PFC
380
360
FlatPAC have a wide trim range of +10% to –90%. See the Maxi,
340 Mini, Micro Design Guide for details.
85 105 125 145 165 185 205 225 245 265

Vin (Vrms)

Figure 19.1 — PFC FlatPAC output power vs. input voltage +Out + VOUT

+Sense R1
Circuit Operation Trim
–Sense 10K
AC line voltage is applied via an agency-approved terminal block VOUT RTN
–Out
providing AC mains (L1, L2/N and GND). Current in the L1 lead is R2
applied to a 15A / 250V internal fuse This current is interrupted only
in the event of a catastrophic failure of a main power component Note: +SENSE and –SENSE must be connected locally or remotely
internal to the PFC FlatPAC. (shown). See calculator for output voltage trimming at vicorpower.com.

The input current beyond the fuse is passed through an EMC

filter designed to meet conducted noise limits of FCC Part 15 Figure 19.3 — Output sense and trim
EN55022 Class A. At start up, AC inrush current is limited by the
HAM’s internal circuitry prior to being passed to the main energy Operating Temperature: Do not allow the PFC FlatPAC to
storage capacitors. exceed its maximum operating temperature, which is reached
when the heat sink is 85°C. (Full power can be delivered up to this
The DC-DC converter is held off until the internal DC bus potential temperature.) Heat sink temperature is a function of the output
has settled to full operating level. The converter is then enabled. power and voltage of the supply, ambient temperature, and airflow
across the heat sink. Always use worst-case conditions when
calculating operating temperature.

L1
AC Mains
L2/N
Earth Ground GND

Note: Product is internally fused

Figure 19.2 — AC mains connections

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600 600

500 550

Output Power (Watts)

Output Power (W)

400 500

300 Cold Plate 450

Temp (°C)

200 80 400
70
60 350
100
50

0 300
20 25 30 35 40 45 50 55 60 65 70 75 80 85 85 110 135 160 185 210 235 260

Ambient Temperature (°C) Input Voltage (Vac)

Figure 19.4 — Power de-rating conduction-cooled option Figure 19.5 — Output power start-up de-rating at –30°C (I-Grade
only); five minute warm up required before full
power (see Figure 19.1) is available

Note 1: To ensure proper heat transfer from the internal module(s) to Note 2: All PFC FlatPAC models are available with a conduction-cooled flat
the heat sink, the mounting holes through the heat sink (three plate instead of the top heat sink. Go to vicorpower.com for outline
holes on 2-up models) must contain torqued screws at all times drawings. Refer to Figure 19.4 for additional de-ratings for
during operation, whether or not the unit is mounted. If the unit is the –cc variants.
operated unmounted, insert a #6 or M3.5 panhead screw through
each hole from below and secure with a nut on top, torqued to
6in.lbs [0.7N.m].

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Overview The first step in evaluating cooling requirements is to calculate

worst-case dissipation based on converter efficiency and worst-
Simplified thermal management is one of the benefits of using
case anticipated load power. Clearly, higher efficiency will translate
Vicor converters. High operating efficiency minimizes heat loss, and
into lower power dissipation and simplify the cooling problem.
the low profile package features an easily accessible, electrically
Vicor converters are among the most efficient converters available,
isolated thermal interface surface.
with full load efficiencies typically in excess of 80%.
Proper thermal management pays dividends in terms of improved
converter and system MTBFs, smaller size and lower product life- Removing Heat From Vicor Converters
cycle costs. The following pages provide guidelines for achieving Heat is removed from Vicor converters through the flat metal
effective thermal management of Vicor converters. baseplate on top of the module. The baseplate is thermally coupled
to, but electrically isolated from, all internal heat-generating
Efficiency and Dissipated Power components. The basic thermal design problem is to transfer heat
A DC-DC converter takes power from an input source and from the baseplate into the surrounding environment as a means of
converts it into regulated output power for delivery to a load. Not maintaining baseplate temperature at or below rated maximum.
all of the input power is converted to output power however;
Heat energy is transferred from regions of high temperature to
some is dissipated as heat within the converter. The ratio of
regions of low temperature via three basic mechanisms; radiation,
delivered output power to converter input power is defined as the
conduction and convection.
converter’s efficiency. Efficiency is a basic figure of merit that can
be used to relate power dissipation directly to converter output Radiation: Electromagnetic transfer of heat between masses at
power, as illustrated in Figures 20.1a and 20.1b. different temperatures.
Conduction: Transfer of heat through a solid medium.

Efficiency
Convection: Transfer of heat through the medium of a
fluid; typically air.
92% 12 V, 15 V, 24 V and 48 V Models
All three of these heat transfer mechanisms are active to some
degree in every application. Convection will be the dominant heat
88%
transfer mechanism in most applications. Nondominant effects
will provide an added contribution to cooling; in some cases,
84%
however, they may result in undesirable and unanticipated thermal
interactions between components and subassemblies.
80%
5 V Models All three of these mechanisms should be given consideration when
developing a successful cooling strategy.
20% 50% 75% 100%
Percentage of Load Radiation
Radiant heat transfer occurs continuously between objects at
Figure 20.1a — Module efficiency
different temperatures that are exposed to each other. The net
effect on the temperature of an individual part is dependent on
a great many factors, including its temperature relative to other
parts, relative part orientations, surface finishes and spacing. The
Power Input = Power Dissipated as Heat + Power Output
difficulty in quantifying many of these factors, combined with the
universal presence of radiant energy exchange, makes calculation
of radiational temperature effects both a complex and generally
imprecise task.
Load
Input
Source +

Power Dissipated = Power Output X ) )

1 –1
n

Power Input x Efficiency (η) = Power Output

Figure 20.1a — Dissipated power

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Temperature differentials encountered in practical applications

of Vicor converters are never large enough to cause radiational Surface Irregularities
Produce Temperature Mating Member
cooling to be the dominant heat transfer mechanism. Radiation Drop in the Interface at Temperature = Ts
will account for less than 10% of total heat transfer in the majority
Heat Flow
of cases. For these reasons, the presence of radiant cooling is
often assumed to provide safety margins over and above the
dominant cooling mechanism, and detailed consideration of its
effects are neglected. A valid assumption, in most cases, is that the
converter will be warmer than its surroundings and radiant energy θ bs = Interface Thermal Resistance (°C/Watt)
Baseplate

transfer will aid cooling. In some cases, however, nearby objects

(PC boards, power resistors, etc.) may be much hotter than the
θbs
converter and net radiant energy transfer may actually increase the
converter’s temperature. (+)
+
Surveying the relative positions and estimated temperatures Pdiss Tb Ts
of converters and surrounding parts is advisable as a means of –
Power
anticipating the potential effects of radiant transfer. In cases where Dissipated (–) Temperature
hot components are in close proximity to the converter, the use of by Converter of Mating
(Watts) Surface (°C)
interposing barriers can generally moderate undesirable radiational Tb = Baseplate Temperature
= Ts + Pdiss x θbs
heating effects.

Conduction Figure 20.2 — Baseplate thermal considerations

In most applications, heat will be conducted from the baseplate
into an attached heat sink or heat conducting member. Heat
conducted across the interface between the baseplate and
mating member will result in a temperature drop which must be
Thermal Resistance of Conducting Member (θm)
controlled. As shown in Figure 20.2, the interface can be modeled L
θm =
as a “thermal resistance” in series with the dissipated power flow. KA
K = Thermal Conductivity
The baseplate temperature will be the sum of the temperature rise A = Cross Sectional Area
L = Length
in the interface and the temperature of the member to which the L
baseplate is attached.
A

Temperature rise across a surface interface can be significant if not

controlled. The area of the interface should be as large as possible,
and the surface flatness of the attached member should be within θ bm θ ms
Cooling
Surface at
5mils. Thermal compound or a thermal pad should be used to fill Interface Interface Temperature
Resistance Resistance = Ts
surface irregularities. Thermal resistance across surface interfaces
can be held to under 0.1°C/Watt with proper measures.
θ bm θm θms
Many applications require that heat be conducted from the (+)
baseplate of the converter to a “remote” dissipative surface via a +
thermally conductive member. The resulting baseplate temperature Pdiss Tb Ts
will be the sum of the temperature of the dissipative surface, Power –
the temperature rise in the heat conducting member, and the Dissipated (–) Temperature
by Converter of Cooling
rises across the two surface interfaces. The thermal resistance (Watts) Surface (°C)
of the conductive member is proportional to its length, and Tb = Baseplate Temperature
= Ts + ( θ bm + θ m + θ ms) x Pdiss
inversely proportional to both its cross-sectional area and thermal
conductivity (Figure 20.3). Minimizing total temperature rise is
dependent on controlling interface resistance, as described above, Figure 20.3 — Interface thermal considerations
and controlling the thermal resistance of the transfer member
through appropriate material selection and dimensioning.

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To select a suitable heat sink for free convection cooling,

Surrounding Air Temperature (Ta) follow these steps:
1. Determine the power to be dissipated by the heat sink. This
Heat Flow should be based upon converter efficiency and worst-case
converter power output using the formula given in the section
on Module Efficiency and Dissipated Power.
Heatsink (Figures 20.1a and 20.1b)

( 1n – 1)
Baseplate

Power Dissipated = Power Output •

θ bs θsa
(+) 2. Estimate or experimentally determine the surface interface
+ thermal resistance. Use of thermal compound or a thermal pad
Pdiss Tb Ta is recommended to minimize this resistance. An estimate of
Power – 0.2°C/Watt should provide an adequate safety margin.
Dissipated (–) Ambient Air
by Converter Temperature 3. Referencing Figure 20.4, we can derive the following formula
(Watts)
for heat sink-to-air thermal resistance:

( )
Tb = Baseplate Temperature
θ bs = Baseplate – Heatsink Interface Resistance
θ sa = Heatsink-to-Air Thermal Resistance TB – T A
Tb = Ta + (θbs + θsa) x Pdiss
θSA = – θBS
PDISS
Figure 20.4 — Heat sink thermal considerations Where:
Convection TA = Worst case anticipated operating
Convective heat transfer into air is a common method for cooling ambientair temperature.
Vicor converters. “Free” or “natural” convection refers to heat θBS = Surface interface thermal resistance, from Step 2.
transfer from a dissipative surface into a cooler surrounding mass
of otherwise still air; forced convection refers to heat transfer into a PDISS = Worst-case power dissipation, from Step 1.
moving air stream. TB = Baseplate temperature.
The convection cooling model is shown in Figure 20.4. Baseplate Start with a value of TB = 85°C (or 100°C, VI-J00) to determine
temperature depends on the temperature of the air, total the maximum acceptable heat sink-to-air thermal resistance.
dissipated power and the values of two thermal resistances; the
thermal resistance of the surface interface between the baseplate 4. Select several heat sinks that appear physicallyacceptable for
and the heat sink, and the heat sink-to-air thermal resistance. the application. Using data provided, obtain values for their
Surface interface resistance can be minimized as discussed under free convection thermal resistance, preferably at worst-case
Conduction. The heat sink-to-air resistance is dependent on a ambient temperature, TA. If values obtained are less than
variety of factors including heat sink material and geometry, air the value calculated in Step 3, go on to Step 5. If the values
temperature, air density and air flow rate. Fortunately, thermal are greater, then either a physically larger heat sink will be
resistance data is available for a very wide range of standard heat required or a different cooling method will need to be used
sinks for use in both free and forced convection applications. The (i.e., forced air, etc.).
following sections will provide guidelines for both free and forced
5. Select the heat sink with the lowest available thermal
convection cooling of Vicor converters and configurables.
resistance consistent with space and cost limits. Keep in
mind that small reductions in baseplate temperature produce
Free Convection
dramatic improvements in MTBF.
The benefits of free convection include low cost of implementation,
no need for fans, and the inherent reliability of the cooling 6. Baseplate temperature can be estimated by using the following
process. Compared to forced air cooling, however, free convection formula:

TB = TA + PDISS • (θBS + θSA)

will require more heat sink volume to achieve an equivalent
baseplate temperature.

7. Test to verify that performance is in line with expectations.

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Heat sink data is almost always given for vertical fin orientation. Multiple Modules Using Common Fasteners: The following
Orienting the fins horizontally will reduce cooling effectiveness. mounting scheme should be used to attach modules to a heat sink
If horizontal mounting is mandatory, obtain relevant heat sink for two or more modules. A large, heavy washer should be used
performance data or use forced convection cooling. on the common fasteners to distribute the mounting force equally
between modules. The torquing sequence shown in Figure 20.6
Free convection depends on air movement caused by heat-induced can easily be expanded from two to any number of modules. An
density changes. Thermal resistance data is dependent on the heat array of three is shown.
sink fins being completely exposed to the ambient air without
any significant interference to air flow at the ends of or along
the length of the fins. If packaging will tend to block or baffle air
movement over the fins, a larger heat sink might be required. In the 8 4 12 1 8

worst case, free convection may be ineffective. Make sure that the
fins are well exposed to ambient air.
It is not necessary to limit the size of the heat sink to the size of
the baseplate. Heat sinks with footprints larger than the baseplate
area can often be used to advantage. In the latter case, heat 7 3 11 7 2

must be conducted along the base surface of the heat sink to

get to the outer fins, so don’t count on achieving full cooling
capability. Also, several modules can be mounted to a common
heat sink, but cooling calculations must now take into account total
power dissipation with consideration given to possible localized
overheating if worst-case converter power dissipations are greatly 6 2 10 3 6

imbalanced. When securing a PC board containing two or more

converters to a heat sink, it is good practice to use sockets on the
converter pins to allow for mechanical alignment. If sockets are not
used, be sure to mount the converters first mechanically, then
solder the units in place. A fixture should be used to maintain 5 1 9 5 4
alignment if soldering must be performed before attachment.
When mounting heat sinks to Vicor modules, use #6 or M3.5
Figure 20.6 — Torquing sequence,
screws torqued uniformly through the mounting slots provided.
The following tightening sequence should be used: multiple VI-200 / VI-J00 converters

Lightly finger-tighten all screws

nn
Forced Convection
Torque screws to 6in.lbs [0.7N.m] per Figure 20.5.
nn
Forced air can make a great difference in cooling effectiveness.
Heat sink-to-air thermal resistance can be improved by as much
as an order of magnitude when compared to free convection
performance, by using suitable heat sinks. Consider the following
data for baseplate-to-air thermal resistance (no heat sink) of a
4 2 5 1 4
VI‑200 or VI‑J00 module at various airflow rates:

Baseplate-to-Air Thermal Resistance

Airflow
VI-200 VI-J00
Free Air 5.1°C/W 8.1°C/W
3 1 6 3 2
200LFM 2.8°C/W 5.1°C/W
400LFM 1.8°C/W 2.7°C/W
600LFM 1.4°C/W 2.3°C/W
Figure 20.5 — Heat sink torquing sequence VI-200 / VI-J00 800LFM 1.2°C/W 1.7°C/W
1000LFM 1.0°C/W 1.4°C/W
Table 20.1 — Baseplate-to-airflow thermal resistance
(no heat sink)

Forced air implies the use of fans. Many applications require that
fans be used to achieve some desired combination of overall system
reliability and packaging density. Industrial environments will
require filters that must be changed regularly to maintain cooling
efficiency, and neglecting to change a filter or the failure of the fan
could cause the system to shut down or malfunction.

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The steps involved in selecting a heat sink / fan combination for Heat sink airflows may be given either in CFM or LFM (linear
forced convection are essentially the same as those followed for feet per minute). The conversion between LFM and CFM is
free convection, with the additional requirement that the heat sink dependent on the cross-sectional area through which air is
and fan be matched to achieve desired heat sink-to-air thermal flowing: CFM = LFM • Area
resistance. Attention must also be paid to proper channeling of
The cross-sectional area between the fins is the area through
fan airflow so that maximum utilization of its cooling capability
which the total airflow must pass. (Figure 20.8) Correct
is realized. Selection of a heat sink / fan combination involves the
interpretation of heat sink data requires that only the airflow
following three steps:
through this area be considered. Simply pointing a fan at a
1. Determine maximum acceptable heat sink-to-airthermal heat sink will clearly not result in all of the flow going through
resistance by following the first three steps of the heat sink the cooling cross-section of the sink; some channeling of air is
selection procedure given in the Free Convection section. usually required to get the full benefit of fan output.
2. Selection of a heat sink / fan combination requires that forced The fan curves give output in CFM versus pressure drop. Fan
convection data for both the heat sink and fan be available. pressure drop is the total of all drops encountered by the fan
Forced convection characteristics for heat sinks define both airflow. The heat sink, any ducting that is used, and air entry
heat sink-to-air thermal resistance and pressure drop through and exit channels all contribute to pressure drop. Pressure drop
the heat sink as a function of airflow. Fan characteristics represents the work done by the fan in moving air through
define airflow as a function of pressure drop. The intersection a region, so care should be taken to minimize unproductive
point of the airflow versus pressure curves for the fan and heat pressure losses. Ensure that air entry and exit locations and
sink will define the operating airflow through the heat sink. internal air channels are not unduly constricted, and avoid
(Figure 20.7) The heat sink-to-air thermal resistance for this sharp turns in airflow paths.
airflow may be read directly off the airflow versus resistance
curve for the heat sink.
Cooling Airflow is Air Which
Flows Through the Shaded
Airflow Cooling Cross-Sectional Area
(CFM) Area = (N - 1) x H x S
Heatsink S
Curve

H
Operating
Airflow
Fan
Curve
Pressure
Airflow (in. H 2O)
(CFM)

S = Fin Spacing
H = Fin Height
N = No. of Fins

Figure 20.8 — Heat sink cross section

X
Heatsink to Air
Thermal Resistance
Thermal Resistance
(˚C/Watt)
The thermal resistance that was determined by overlapping the
at Operating Airflow
fan and heat sink curves will represent an optimistic estimate
since it assumes that all the fan output flows through the heat
Figure 20.7 — Airflow vs. resistance sink cooling cross section, and that all the pressure drop occurs
along the heat sink. If the estimated thermal resistance is close
Finding and interpreting the operating point requires to the minimum value determined in Step 1, then it is likely
consideration of the following: that a larger fan or different heat sink is required. This will not
be a problem in most cases; relatively modest heat sinks and
Units of pressure drop are generally given in inches of fans usually provide ample cooling.
water. Units of fan airflow are in cubic feet per minute
(CFM). Occasionally metric units are used, but conversion is Careful channeling and ducting of airflow as a means of both
straightforward. maximizing flow through the cooling cross-section of the heat
sink and minimizing extraneous flow of air around the sink is
well worth the small extra design effort required. Every degree
of improvement in baseplate temperature results in significant
improvement in MTBF. If you are paying for a fan, you may as
well leverage it for all that it is worth.

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3. Steps 5 through 7 in the Free Convection section will complete Note: The values of θSA incorporating add-on or integral heat
the heat sink selection process. Select the fan / heat sink sinks include the baseplate-to-heat sink thermal resistance
combination with the lowest thermal resistance consistent θBA. When using heat sinks from other sources, the thermal
with cost and space constraints, calculate the estimated impedance baseplate-to-air will be the sum of the thermal
baseplate temperature and test to verify. impedance heat sink-to-air specified by the heat sink
manufacturer and the baseplate-to-heat sink impedance from
the following Thermal Impedance Charts that follow.
Thermal Impedance Table

Table usage: The forced convection thermal impedance data shown in the tables below assumes airflow through the heat sink fins. Actual airflow through
the fins should be verified. For purposes of heat sink calculation, assume efficiencies of 81% for 5V outputs and 85% for 12V and above.

Part #30089 Part #30775 Part #30090 Part #30780 Part #30193 Part #30194
VI-200 FinMod FinMod
Baseplate 0.9”L Fins [a] 0.7”L Fins 0.9”T Fins [b] 1.45”L Fins 0.7”T Fins 0.4”T Fins SlimMod
MI-200 –F1 / –F3 –F2 / –F4
[22,86mm] [17,78mm] [22,86mm] [36,83mm] [17,78mm] [10,16mm]
θBS = 0.2°C/W
θSA (°C/W)
Free Air 5.10 3.40 4.08 2.70 2.60 3.15 3.80 5.40 5.00 3.70
200LFM 2.80 1.50 1.80 1.10 1.00 1.28 1.55 3.20 2.40 1.80
400LFM 1.80 1.00 1.20 0.80 0.60 0.93 1.13 2.20 1.50 1.20
600LFM 1.40 0.80 0.96 0.60 0.50 0.70 0.84 1.60 1.10 0.90
800LFM 1.20 0.60 0.72 0.50 0.40 0.58 0.70 1.30 0.90 0.70
1000LFM 1.00 0.50 0.60 0.40 0.30 0.47 0.56 1.20 0.80 0.60
Table 20.2a — Thermal impedance for VI-200 / MI-200

Part #30191 Part #30771 Part #30140

VI-J00 FinMod FinMod
Baseplate 0.9”L Fins 0.9”L Fins 0.4”T Fins SlimMod
MI-J00 –F1 / –F3 –F2 / –F4
[22,86mm] [26,86mm] [10,16mm]
θBS = 0.4°C/W
θSA (°C/W)
Free Air (H) 8.10 4.20 4.00 5.63 8.50 8.00 7.00
Free Air (V) 7.60 4.00 3.90 5.49 8.40 7.30 6.70
200LFM 5.10 1.60 1.60 2.25 5.50 5.00 2.70
400LFM 2.70 1.30 1.30 1.83 3.60 2.50 1.50
600LFM 2.30 0.90 0.90 1.27 2.90 2.10 1.20
800LFM 1.70 0.70 0.70 0.99 2.30 1.30 0.80
1000LFM 1.40 0.60 0.60 0.84 2.00 1.10 0.70
Table 20.2b — Thermal impedance for VI-J00 / MI-J00

FlatPAC™ [c] ComPAC™ [c] MegaMod™ [c]

Configurables
(also applies to θBM θBM θBM θBM θBM θBM θBM θBM θBM
MI-ComPAC and 0.1°C/W 0.05°C/W 0.03°C/W 0.1°C/W 0.05°C/W 0.03°C/W 0.1°C/W 0.05°C/W 0.03°C/W
MI-MegaMod)
θSA (°C/W) θSA (°C/W) θSA (°C/W)
Free Air 2.1 1.3 1.0 3.6 1.7 1.4 4.4 2.1 1.7
50LFM 1.5 1.1 0.9 2.7 1.4 1.3 3.3 1.7 1.6
100LFM 1.2 0.9 0.7 2.3 1.3 1.1 2.8 1.6 1.3
250LFM 0.7 0.5 0.4 1.6 1.0 0.8 2.0 1.2 1.0
500LFM 0.4 0.3 0.3 1.2 0.7 0.6 1.5 0.9 0.7
750LFM 0.3 0.2 0.2 0.9 0.5 0.5 1.1 0.6 0.6
1000LFM 0.2 0.2 0.2 0.8 0.4 0.4 1.0 0.5 0.5
Table 20.2b — Thermal impedance for FlatPAC, ComPAC / MI-ComPAC and MegaMod / MI-MegaMod families
[a] Longitudinal fins
[b] Transverse fins
[c] Assumes uniform loading of two and three output units.

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Definitions
PDISS = Dissipated Power = POUT
Typical Examples
1
( η – 1)
VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

( )
TMAX = maximum baseplate temperature
= CFM
Example 1
(Available from converter’s data sheet, which can be found Airflow the
Determine (LFM)
maximum output power for a 100W, VI-200
converter, no heat sink, Area
on vicorpower.com.) delivering 5V in 400LFM at a maximum
TA = ambient temperature ambient temperature of 45°C.

η = efficiency = POUT / PIN TMAX –TA

( )
Maximum Output Power =
(Assume effiencies of 81% for 5V outputs, 1
θSA –1
85% for 12VOUT and above.)
η
θBS = baseplate-to-heat sink thermal resistance Where:
(From thermal impedance tables) TMAX –TA

( )
TMaximum Thermal Impedance =
MAX = 85°C
θSA = heat sink-to-air thermal resistance 1
POUT –1
(From thermal impedance tables) TA = 45°C η

( 1 )( η )
θSA = 1.8°C/W
Thermal Equations Maximum
PDISS =
η 81% = (0.81)Power = POUT η – 1 1 – 1
= Dissipated

( η1 – 1 )
Ambient Temperature = TMAX – θSA • POUT
PDISS = Dissipated Power = POUT Maximum Output Power = 85 –45
Airflow (LFM) = ( CFM ) 1.8 ( 0.81
1 – 1)
1
θ • P ( – 1)
Temperature Rise =Area
( )
SA OUT η
Airflow (LFM) = CFM = 95W Max
Area
T –TA
(( ))
Maximum
Example 2 Output Power = MAX
1
Thermalthe
Determine Drop = θBS •thermal
maximum 1– 1
POUT θimpedance of a 50W, VI‑J00
TMAX –TA η at–45W
1 in free air
converter, no heat sink, delivering SA η
( )
Maximum Output Power = 24V
1 convection at 55°C ambient.
θSA –1
η TMAX –TA

( )
Maximum Thermal Impedance =
1
TMAX –TA POUT –1
η
( )
Maximum Thermal Impedance =
1
POUT –1

( η1 – 1 )
Where:
η Maximum
TAmbient Temperature = T
MAX = 100°C – θSA • POUT

( )
MAX
Maximum
1 TA = 55°C
Ambient Temperature = TMAX – θSA • POUT –1
η
(1 )
POUT = 45W
Temperature
η = 85% =Rise = θSA • POUT –1
η
( η1 – 1 )
(0.85)

Temperature Rise = θSA • POUT

Maximum Thermal Impedance = 100 –55
Thermal Drop = θBS • POUT (
1 45 1 – 1
η
– 1 0.85 )( )
Thermal Drop = θBS • POUT ( η1 – 1 ) = 5.7°C/W

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 TMAX –TA

( )
20.Maximum
ThermalOutput Power = Mounting
and Module Considerations Design Guide & Applications Manual
1
θSA –1
η VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Example 3 TMAX –TA

( )
Maximum
Determine theThermal
maximumImpedance =
ambient temperature of a 3-up FlatPAC™
1

(η )
delivering 12V at 600W in 500LFM withPno – 1 conduction
additional
1OUT η
P to
cooling = the
DISS
Dissipated
chassis. Power = P –1 OUT

– θ • P ( – 1)
Maximum
1
Ambient Temperature = TMAX
( )
SA η OUT
Airflow (LFM) = CFM
Area

( )
Where:
1
TTemperature
MAX = 85°C Rise = θ • POUT –1
SA η
TMAX –TA
θMaximum

( )
Output Power =
SA = 0.3°C/W
1
θSA –1
( )
POUT = 600W
1 η
Thermal
η Drop
= 85% = θBS • POUT
= (0.85) –1
η

( () ) )
T –TA
Maximum ThermalPower
PDISS = Dissipated Impedance
= POUT= 1 MAX
– 11 1
Ambient Temperature = 85 – 0.3 •P600η – 1– 1
OUT 0.85
η

( )
= 53°C

( )
Maximum
Airflow (LFM) = CFM 1
Ambient
Example 4 Temperature = TMAX – θSA • POUT
Area –1
Determine the temperature rise of a 150W, VI‑200η converter
delivering 5V at 132W with a Part #30090 heat sink in 200LFM.

(( ))
TMAX –TA
Maximum Output Power 1
Temperature Rise = θSA • =
POUT 1 – 1
θSA η –1
η
Where:
θSA = 1.1°C/W
(
1 = TMAX –TA
)
( )
Maximum Thermal
Thermal Drop = θBSImpedance
• POUT –1
η P 1
POUT = 132W –1
OUT
η
η = 81% = (0.81)

( )( )
Maximum
1 1
Ambient Temperature
Temperature = •T132
Rise = 1.1 – OUT
– θSA • P 1 –1
MAX 0.81 η

= 34°C over ambient temperature

Temperature
Example 5 Rise = θSA • POUT
1
η
–1 ( )
Determine the baseplate to coldplate thermal drop for an MI‑200
converter delivering 5V at 50W with a thermal pad.

Thermal Drop = θBS • POUT ( η1 – 1 )

Where:
θBS = 0.2°C/W
POUT = 50W
η = 81% = (0.81)

Thermal Drop = 0.2 • 50 (0.811 – 1 )

= 2.34°C

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21. Thermal Curves Design Guide & Applications Manual
FREE AIR 50 LFM 100 LFM 250 LFM 500 LFM 750 LFM 1000 LFM
VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

VI-200 Family Thermal Curves

Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200 200

175
175
FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
150 150

Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.1 — VI-200 family baseplate-to-air (no heat sink) Figure 21.2 — VI-200 family baseplate-to-air (no heat sink)
5V output 12 – 48V output

200 200

175 175

150 150
Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.3 — VI-200 family, part #30089 heat sink Figure 21.4 — VI-200 family, part #30089 heat sink
5V output 12 – 48V output

200 200

175 175

150 150
Output Power (Watts)
Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.5 — VI-200 family, part #30194 heat sink Figure 21.6 — VI-200 family, part #30194 heat sink
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual
FREE AIR 50 LFM 100 LFM 250 LFM 500 LFM 750 LFM 1000 LFM
VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

VI-200 Family Thermal Curves (Cont.)

Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200 200

175
FREE AIR, H FREE AIR, V 200 LFM 400 LFM 175
600 LFM 800 LFM 1000 LFM
150 150
Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.7 — VI-200 family, part #30090 heat sink Figure 21.8 — VI-200 family, part #30090 heat sink
5V output 12 – 48V output

200 200

175 175

150 150
Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.9 — VI-200 family, part #30775 heat sink Figure 21.10 — VI-200 family, part #30775 heat sink
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
VI-J00 Family Thermal Curves
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

100 100

90 90

80 80

70 70

Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100

Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.11 — VI-J00 family baseplate-to-air (no heat sink) Figure 21.12 — VI-200 family baseplate-to-air (no heat sink)
5V output 12 – 48V output

100 100

90 90

80 80

70 70
Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Page 1

Figure 21.13 — VI-200 family, part #30191 heat sink Figure 21.14 — VI-200 family, part #30191 heat sink
5V output 12 – 48V output

100 100

90 90

80 80

70 70
Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.15 — VI-200 family, part #30771 heat sink Figure 21.16 — VI-200 family, part #30771 heat sink
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
VI-J00 Family Thermal Curves (Cont.)
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

100 100

90 90

80 80

70 70

Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.17 — VI-200 family, part #30140 heat sink Figure 21.18 — VI-200 family, part #30140 heat sink
5V output 12 – 48V output

Page 1

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21. Thermal Curves Design Guide & Applications Manual
FREE AIR 50 LFM 100 LFM
VI-200 and VI-J00 Family DC-DC Converters750
250 LFM
andLFM 500 LFM 1000 LFM
Configurable Power Supplies

FinMod™ VI-200 Family Thermal Curves

Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200 200

175 175
FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
150 150
Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.19 — FinMod VI-200 family F1/F3 configuration Figure 21.20 — FinMod VI-200 family F1/F3 configuration
5V output 12 – 48V output

200 200

175 175

150 150
Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.21 — FinMod VI-200 family F2/F4 configuration Figure 21.22 — FinMod VI-200 family F2/F4 configuration
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
FinMod™ VI-J00 Family Thermal Curves
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

100 100

90 90

80 80

70 70
Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.23 — FinMod VI-J00 family F1/F3 configuration Figure 21.24 — FinMod VI-J00 family F1/F3 configuration
5V output 12 – 48V output

100 100

90 90

80 80

70 70
Output Power (Watts)

Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.25 — FinMod VI-J00 family F2/F4 configuration Figure 21.26 — FinMod VI-J00 family F2 /F4 configuration
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual
FREE AIR 50 LFM 100 LFM
VI-200 and VI-J00 Family DC-DC Converters750
250 LFM
andLFM 1000 LFM
500 LFM
Configurable Power Supplies

SlimMod™ VI-200 Family Thermal Curves

Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200 200

175
FREE AIR, H FREE AIR, V 200 LFM 400 LFM 175
600 LFM 800 LFM 1000 LFM
150 150

Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

FREE AIR 50 LFM 100 LFM 250 LFM 500 LFM 750 LFM 1000 LFM
Figure 21.27 — SlimMod VI-200 family Figure 21.28 — SlimMod VI-200 family
5V output 12 – 48V output

FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
SlimMod™ VI-J00 Family Thermal Curves
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

100 100

90 90

80 80

70 70
Output Power (Watts)
Output Power (Watts)

60 60

50 50

40 40

30 30

20 20

10 10

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.29 — SlimMod VI-J00 family Figure 21.30 — SlimMod VI-J00 family
5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
ComPAC™ Family Thermal Curves
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200 200

175 175

150 150

Output Power (Watts)

Output Power (Watts)

125 125

100 100

75 75

50 50

25 25

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.31 — 1-up ComPAC Figure 21.32 — 1-up ComPAC

5V output 12 – 48V output

400
400

350 350

300 300
Output Power (Watts)

Output Power (Watts)

250 250

200 200

150 150

100 100

50 50

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85

Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.33 — 2-up ComPAC Figure 21.34 — 2-up ComPAC

5V output 12 – 48V output

600 600

525 525

450 450
Output Power (Watts)
Output Power (Watts)

375 375

300 300

225 225

150 150

75 75

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.35 — 3-up ComPAC Figure 21.36 — 3-up ComPAC

5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM
FlatPAC™ Family Thermal Curves
Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR, H FREE AIR, V 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

200
200

175
175

150
150

Output Power (Watts)

125
Output Power (Watts)

125

100
100

75
75

50
50

25
25

0
0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)
Ambient Temperature (°C)

Figure 21.37 — 1-up FlatPAC Figure 21.38 — 1-up FlatPAC

5V output 12 – 48V output

400 400

350 350

300 300
Output Power (Watts)
Output Power (Watts)

250 250

200 200

150 150

100 100

50 50

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.39 — 2-up FlatPAC Figure 21.40 — 2-up FlatPAC

5V output 12 – 48V output

600 600

525 525

450 450
Output Power (Watts)

Output Power (Watts)

375 375

300 300

225 225

150 150

75 75

0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.41 — 3-up FlatPAC Figure 21.42 — 3-up FlatPAC

5V output 12 – 48V output

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21. Thermal Curves Design Guide & Applications Manual
FREE AIR 50 LFM 100 LFM 250 LFM
VI-200 500 LFM
and VI-J00 Family 750 LFM
DC-DC Converters 1000 LFM
and Configurable Power Supplies

PFC FlatPAC™ Family Thermal Curves

Note: Use as a design guide only. Verify final design by actual temperature measurement.

Legend: FREE AIR 200 LFM 400 LFM 600 LFM 800 LFM 1000 LFM

575 400
525
FREE AIR, H FREE AIR, V 200 LFM 400 LFM 350 600 LFM 800 LFM 1000 LFM

Output Power (Watts)

475
Output Power (Watts)

425 300
375 250
325
275 200
225 150
175
125 100
75 50
25
0 0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C) Ambient Temperature (°C)

Figure 21.43 — Output power de-rating vs. temperature, Figure 21.44 — Output power de-rating vs. temperature,
VOUT ≥ 12V VOUT = 5V

264
240
216
Output Power (Watts)

192
168
144
120
96
72
48
24
0
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85
Ambient Temperature (°C)

Figure 21.45 — Output power de-rating vs. temperature,

VOUT = 3.3V

VI-200 and VI-J00 Family Design Guide Rev 3.9

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22. Lead-Free Pins (RoHS) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Overview
The following chapters contain soldering information for the
following Vicor product families: Maxi, Mini, Micro;
VE-200, VE-J00; VI Brick® and similar package filters and
front‑ends. This document is intended to provide guidance for
making high-quality solder connections of RoHS-compliant Vicor
power modules to printed circuit boards. This application note
applies to lead-free soldering of Vicor RoHS-compliant modules.
The following provides an outline for appropriate soldering
procedures and the evaluation of solder joints to ensure an optimal
connection to the power module. Common soldering defects
will be examined and direction will be provided for detecting and
handling them. Vicor manufacturing facilities use the IPC-A-610
standards for establishing quality solder joints. It is recommended
that manufacturing processes using Vicor modules refer to these
same standards, which can be found, along with supporting
documentation, at www.ipc.org.

Analysis of a Good Solder Joint

Figure 22.1 — Side profile of Maxi or Mini module’s RoHS
The IPC-A-610 standard requires that solder fill at least 75% of
the barrel to ensure a solid connection. Ideally, all connections solder joint
should have a 100% fill. To accomplish this, the solder applied
to both the barrel and the pin must exhibit a process known as Soldering Procedures
wetting. Wetting occurs when liquid solder on a surface is heated Hand Soldering. Before soldering, make sure that the PCB
to the point that it loses a significant amount of latent surface is clean and free of debris, chemical residue or liquid. It is not
tension and evenly coats the surface via capillary action (both recommended that additional flux other than what is contained in
cohesion and adhesion). the solder be used during soldering because it potentially leaves
During the soldering process wetting can be identified by an even a residue that cannot be removed without potentially damaging
coating of solder on the barrel and pin. In addition, coating the or compromising the power module. Also, the presence of these
surface of barrel and pin, the solder will gather at the intersection residues on the modules may cause harm or improper operation.
of the two and produce a trailing fillet along each surface. The pins on Vicor modules are optimized to provide a
Once wetting has occurred, then upon solidification it will bond low‑resistance electrical connection. The final mounting scheme
appropriately to both components, producing a quality connection. for any module should be designed to minimize any potential
Figure 22.1 shows a side profile of a good solder joint with a power mechanical stress on the pins and solder joints. Modules with
module. Notice that the solder forms a concave meniscus between heat sinks or modules used in systems that are subject to shock or
pin and barrel. This is an example of a properly formed fillet and is vibration should use standoffs to minimize stress on the pins. It is
evidence of good wetting during the soldering process. The joint not recommended that discrete wires or connectors be soldered
between solder and pin as well as solder and pad should always directly onto a module.
exhibit a feathered edge. In Figure 22.1 it can also be seen that the Also necessary for a good solder connection is pin protrusion
solder covers a good deal of the surface area of both the pin and from the PCB. It is not possible to create a good solder joint
the pad. This is also evidence of good wetting. (Notice also that the without some protrusion of module pins from the PCB. If the PCB
solder joint is dull compared to leaded processing). This is evidence is too thick to allow good pin protrusion, consider using Vicor
of good immobilization of the joint during cooling as well as good module accessories such as sockets to allow proper mounting.
cleaning of the board prior to soldering. All soldering connections Before soldering, the module should be mechanically affixed or
should exhibit similar characteristics regardless of whether they are immobilized with
soldered by hand, by fountain, or by wave.
In examining a solder joint, be sure that there is no solder
connecting one pad to another. This is known as a solder bridge
and will be discussed later.

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22. Lead-Free Pins (RoHS) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

respect to the PCB to ensure no movement during the soldering Since there are so many factors that influence soldering time,
process. The standoffs can be used for this process. Vicor power listing actual times is difficult. In general, it is recommended that
modules contain two types of pins: power pins (which deliver the the joint be examined post-process to insure a quality soldering
power to the load and are typically sized according to the rated joint. If necessary, different parameters can then be varied in order
output current) and signal pins (which typically carry very little to ensure a solid process. The soldering times listed in Table 22.1
current and are of a uniform size across a given product family). can be used as a guideline for establishing more application and
The larger the pin, the more soldering time required to form an process specific parameters. Below are some recommendations for
adequate connection. In addition to the sizing of the pin, the time general practice:
required to create a robust connection will vary depending on
1. Do not run tip temperature above 810°F [430°C]. This will
several parameters:
greatly increase the risk of damaging the pads, traces, printed
1. PCB Thickness. The thicker the printed circuit board, the circuit board, or Vicor power module. Check with the printed
more heat it is able to dissipate, and will require more circuit board manufacturer thatthe boards are RoHS capable
soldering time. and for any additional recommendations in regard
to temperature.
2. Copper Trace Area. Power pins require large copper traces
to minimize resistive power losses in carrying thepower to the 2. Apply the soldering iron to one side of the pin and padand
load. Since the copper tends to conductheat well, the actual apply the solder to the other, allowing the heatfrom the
sizes of these copper tracesdirectly affect the amount of time pin and pad to melt the solder. Do not apply solder to the
necessary to heatthe PCB socket. soldering iron and subsequently attempt to transfer it to the
pad and pin. Melting the solder by applying it directly to the
3. Copper Trace Thickness. As above, the thickness of the soldering iron does not guarantee adequate wetting on the
copper trace is a function of output current of themodule, and joint and is not considered good technique.
has a direct impact on the amount ofsoldering time. Typically,
PCB copper thickness isspecified in terms of weight per square 3. Do not apply excessive pressure with the soldering iron to
foot, typically 2oz or 3oz copper for current-carrying planes. the printed circuit board, barrel, or pad. This couldresult in
breaking a trace, dislodging a barrel, or damaging the PCB,
4. Soldering Iron Power. A higher power soldering iron can which becomes noticeably softerwhen heated.
source more heat and thus take less time to heat a PCB trace.
As a soldering iron is heating a point on the board, everything 4. Do not apply the soldering iron to a connection for an
that is adjacent to this point is beingheated as well, including extended period of time or damage to the module could
the Vicor power module. A large copper trace, because it result. If the soldering times exceed the upper limit listed
conducts heat very well, will exhibit less of a thermal gradient, in Table 22.1, consider using a larger tip or a higher power
and thus a low-power soldering iron will have to heat the soldering iron.
whole trace to a higher temperature before the area close to
5. Make sure PCB pads and holes are clean before to soldering.
the iron is hot enough to flow solder. Because the trace and
board are both dissipating and conducting thermal energy, 6. Solders with no-clean flux may be used to facilitate soldering.
some irons may not have enough power to heat a trace to the
temperature that will allow proper soldering. 7. Keep the tip of the soldering iron clean and free from resin.
Apply a small amount of solder directly to the tip of the iron.
5. Tip Temperature. Typical SAC-type solder melts at This process is known as tinning.
419 – 491°F [215 – 225°C]. Pb-free soldering requires a tip
temperature of about 800°F. A higher tip temperature will
bring the barrel and pin above the melting point of solder
faster. However, a higher tip temperature may cause damage
to the pad, printed circuit board, or module pin.
6. Type of Lead-free Solder. The actual melting point ofthe
solder varies depending on the type of solder used and
affects the necessary temperature of the pad and pin for flow.
Vicor recommends SAC305 SnAgCu solder for use on Vicor
power modules.
7. Tip Size. A larger tip will be able to heat a larger surface area,
thus lowering soldering time.

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8. Be careful not to jar the module or PCB while the solder is Preheating of the PCB is generally required for wave soldering
cooling. This could result in a cold solder joint, a void in the operations to ensure adequate wetting of the solder to the PCB.
barrel or a cracked joint. The recommended temperature for PCB top side is 203 – 248°F
[95 – 120°C] prior to the molten wave. Thick, multilayer PCBs
9. If it is necessary to re-solder a joint, remove all existing solder should be heated toward the upper limit of this range, while
from the pad and pin before reapplying solder. simple two-layer PCBs should be heated to the lower limit. These
10. Use of a soldering gun is not recommended for soldering parameters are consistent with generally accepted requirements
Vicor modules. for circuit-card assembly. The power module is often much more
massive than other components mounted to the PCB. During wave
11. It is not recommended that Maxi / Mini / Micro module pins solder preheating, the pins will dissipate much of their absorbed
be trimmed under any circumstances. heat within the module; therefore, adjustments to preheaters
As a procedural benchmark, given an 800°F (427°C) temperature alone will not improve module soldering significantly. A more
on a 60W iron with a 3mm tip, approximate times to solder effective way to improve the soldering of the module is to lower
a Vicor power module to a 0.062in [1,5mm] thick PCB board the conveyor speed and increase the dwell time in the molten
with an appropriately sized copper trace would be in the wave. Approximately 5 seconds of exposure to the molten wave
range of Table 22.1. is required to achieve an acceptable solder joint for a Maxi / Mini /
Micro power module. The VE-200 / VE-J00/ VE-HAM and VI Brick®
Soldering Time modules should solder in approximately 4 seconds of molten
Converter Family Pin Type wave exposure.
(Range)
VE-200 / VE-J00 Signal 3 – 5 seconds Post Solder Cleaning. Vicor modules are not hermetically sealed
and must not be exposed to liquid, including but not limited to
VE-200 Power 5 – 8 seconds
cleaning solvents, aqueous washing solutions or pressurized sprays.
VE-J00 Power 4 – 7 seconds Cleaning the backside of the PCB is acceptable provided no solvent
Maxi / Mini / Micro Singal 3 – 5 seconds contacts the body of the module.

Maxi Power 5 – 8 seconds When soldering, it is recommended that no-clean flux solder be
used, as this will ensure that potentially corrosive mobile ions
Mini Power 4 – 7 seconds
will not remain on, around or under the module following the
Micro Power 3 – 5 seconds soldering process.
VI Brick Input & Signal 3 – 5 seconds If the application requires the PCB to be subject to an aqueous
VI Brick Power 4 – 7 seconds wash after soldering, then it is recommended that Vicor module
accessories such as through-hole or surface-mount sockets
Table 22.1 — Recommended pin soldering times for RoHS be used. These sockets should be mounted to the PCB, and
family modules the modules subsequently inserted following the aqueous
washing sequence.
Again, please note that soldering for significantly longer periods
of time than those listed above could result in damage to the De-soldering Vicor Modules. Vicor modules should not be
module. Table 22.1 should not be used without verifying that re‑used after desoldering for the following reasons:
the times will produce a quality soldering joint as defined in the 1. Most de-soldering procedures introduce damaging mechanical
previous sections. and thermal stresses to the module.
Wave Soldering. Vicor modules achieve an adequate solder 2. Devices or processes that may be capable of desoldering a
connection on a wave-soldering machine with conveyor speeds Vicor module from a printed-circuit board without causing
from three to seven feet per minute. As with hand soldering, damage have not been qualified for use with Vicor modules.
times and parameters vary with the properties of the PCB and
copper traces. As a standard benchmark, the parameters below For applications that require removal of a module with the intent of
may be used. As with hand-soldered boards, the results should be reuse, use Vicor socketing systems.
examined to ensure a quality soldering joint and a sound process.
Wave Soldering Profile.
1. Bottom-side preheaters: Zone 1: 350°F [177°C],
Zone 2: 300°F [149°C], Zone 3: 675°F [357°C]
2. Top-side preheaters: 220 – 235°F [104 – 113°C]
3. Wave temperature: 510°F [266°C]
4. Wave type: 4.25in [107,95mm] standard laminar wave

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Index of Common Soldering Defects 4. De-wetting. The solder initially appears to wet but then pulls
back to expose the pad surface. More common in
1. Solder Bridge. A short circuit between two electrically
wave soldering.
inadvertently forming a “bridge” or connection between the
two points. Recommended Solution. Make sure the PCB is clean
prior to soldering.
Recommended Solution. Use a smaller soldering tip, or hold
the tip at a different angle when soldering, so as to contact 5. Dry Joint. The solder has a dull gray appearance as opposed
only one pad at a time. to a bright silver surface. The solder joint may have a mottled
look as well, with jagged ridges. It is caused by the solder joint
2. Cold Solder. An incomplete or poor connection caused by
moving before it has completely cooled.
either the barrel or the pin not being heated to the flow
temperature of solder. A cold solder joint will typically exhibit a Recommended Solution. Immobilize the module
convex meniscus with possibly a dark spot around the barrel or with respect to the PCB to ensure that the solder joint
pad. Also, a cold solder joint will not be shiny, but will typically cools properly.
have a “dirty” appearance.
6. Icicles. Jagged or conical extensions from solder fillet. These
CAUTION: A cold solder joint is not necessarily an open are caused by soldering with the temperature too low, or
connection electrically, and cannot be diagnosed by a soldering to a highly heat-absorbent surface.
simple continuity check. A cold solder joint is frequently
an electrically intermittent connection and is best Recommended Solution. Increase the soldering temperature,
diagnosed by way of visual inspection. A cold solder joint but not outside the recommended limits. If necessary, use a
will likely become electrically open following a period of higher power soldering iron.
temperature cycling.
7. Pinholes. Small or large holes in surface of solder joint, most
Recommended Solution. Increase soldering iron commonly occurring in wave-solder systems.
temperature, soldering time, or use a soldering iron with a
higher output wattage if hand soldering. If wave soldering, Recommended Solution. Increase preheat or topside heater
lower conveyor speed or increase preheat temperature. temperature, but not outside the recommended limits.

3. PC Board Damage. An intermittent or poor connection

caused by damage to a trace, pad, or barrel. A damaged pad is
best identified by a burn mark on the PCB or a trace pad that
moves when prodded with a mechanical object.
Recommended Solution. Lower the soldering iron
temperature or the soldering time. If damage persists, use a
lower power iron or consult with the manufacturer of the PCB
for recommended soldering guidelines.

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References

Organizations
www.ipc.org

Commercial

www.aimsolder.com
www.alphaassembly.com
www.kester.com
www.multicore-association.org

Maxi / Mini / Micro Standoff Kits for Solder-Mounted Modules

Board Mounting Slotted Through-Hole Threaded
Thickness Options Baseplate Baseplate Baseplate
Nominal Mounting Pin Through-Hole Threaded Through-Hole Threaded Through-Hole
(Min – Max) Style Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146
0.062in Inboard F
(0.055 – 0.071in) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
1,5mm Kit-18156 Kit-18157 Kit-18150 Kit-18152 Kit-18150
(1,4 – 1,8mm) Onboard G
Bag-19132 Bag-19133 Bag-19126 Bag-19128 Bag-19126

0.093in Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

(0.084in/0.104in)
Inboard G
2,4mm
(2,1 – 2,6mm) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122

Kits include six (6) standoffs and screws. Mini and Micro modules require a minimum of four (4) standoffs.
Bags contain 100 standoffs only (#4-40 screws required).

Table 22.2 — Standoff kits for solder mounted modules

VI Brick® Standoff Kits

Standoffs Description Part No.
12pc kit for 0.125in PCB (includes M3 x 5mm and M3 x 6mm screws) 34717
F-F Standoff
12pc kit for 0.062in PCB (includes M3 x 5mm screws) 34718
0.287in long
100pc bag 34709

M-F Standoff 12pc Kit (includes M3 x 6 mm screws) 34719

0.287in long 100pc bag 34710
Bags contain 100 standoffs only (M3 screws required).

Table 13.3 — VI Brick® Standoff Kits

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Overview
The following chapters contain soldering information for the
following Vicor product families; Maxi, Mini, Micro; VI-200, VI-J00;
VI Brick® and similar package filters and front ends. This document
is intended to provide guidance in utilizing soldering practices to
make high-quality connections of Vicor power modules to printed
circuit boards. Some care will be taken to outline appropriate
soldering procedures as well as the evaluation of solder joints
in a manner that enables the customer to ensure that the end
application has an optimal connection to the power module.
Common soldering defects will be examined and direction will be
provided for detecting and handling the common defects.
Vicor manufacturing facilities use the IPC-A-610C standards as
a means of establishing quality solder joints. It is recommended
that manufacturing processes using Vicor modules refer to these
same standards, which can be found, along with supporting
documentation, at www.ipc.org.
Figure 23.1 — Side profile of a Mini module solder joint
Analysis of a Good Solder Joint
The IPC-A-610C standard requires that solder fill at least 75%
of the barrel in order to ensure a solid connection. Ideally, all
connections should have a 100% fill. In order to accomplish this,
the solder applied to both the barrel and the pin must exhibit a
process known as wetting. Wetting occurs when liquid solder on
a surface is heated to the point that it loses a significant amount
of latent surface tension and evenly coats the surface via capillary
action (both cohesion and adhesion).
During the soldering process wetting can be identified by an even
coating of solder on the barrel and pin. In addition to coating the
surface of barrel and pin, the solder will gather at the intersection
of the two and produce a trailing fillet along each surface.
Once wetting has occurred, then upon solidification it will bond
appropriately to both components, producing a quality connection.
Figure 23.1 shows a side profile of a good solder joint with a Mini
power module. Notice that for both examples the solder forms a
concave meniscus between pin and barrel. This is an example of
a properly formed fillet and is evidence of good wetting during Figure 23.2 — Maxi / Mini output power pin and Sense pin
the soldering process. The joint between solder and pin as well
as solder and pad should always exhibit a feathered edge. In
Figure 23.2 is a top view of the signal and power pin of a Maxi or
Figure 23.1 it can also be seen that the solder covers a good deal of
Mini module properly soldered to a printed circuit board. Notice
the surface area of both the pin and the pad. This is also evidence
that both the joint and the area around the joint are clean and
of good wetting. Notice also that the solder joint has a smooth
free from resin and solder residue. Also the pad and printed circuit
surface with a silver color. This is evidence of good immobilization
board adjacent to the barrel are not burnt or discolored and are
of the joint during cooling as well as good cleaning of the board
solidly attached to each other. In examining a solder joint, be
prior to soldering. All soldering connections should exhibit similar
sure that there is no solder connecting one pad to another. This is
characteristics regardless of whether they are soldered by hand
known as a solder bridge and will be discussed further along with
or wave soldered.
other potential soldering defects.

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Soldering Procedures 3. Copper Trace Thickness. As above, the thickness of the

copper trace is a function of output current of the module,
Hand Soldering. Before soldering, make sure that the PCB
and has a direct impact on the amount of soldering time.
is clean and free of debris, chemical residue or liquid. It is not
Typically, PCB copper thickness is specified in terms of
recommended that additional flux other than what is contained
weight per square foot, typically 2oz or 3oz copper for
in the solder be used during soldering as it potentially leaves a
current‑carrying planes.
residue that cannot be removed without potentially damaging
or compromising the power module. Also, the presence of these 4. Soldering Iron Power. A higher power soldering iron can
residues themselves on the modules may cause harm or improper source more heat and thus take less time to heat a PCB
operation. The pins on Vicor modules are optimized in design for trace. When a soldering iron is heating a point on the board,
providing a low-resistance electrical connection. The final mounting everything that is adjacent to this point is being heated as
scheme for any module should be designed so as to minimize any well, including the Vicor power module. A large copper
potential mechanical stress on the pins and solder joints. Modules trace, because it conducts heat very well, will exhibit less of a
with heat sinks or modules used in systems that are subject to thermal gradient and thus a low-power soldering iron will
shock or vibration should use standoffs to minimize stress on have to heat the whole trace to a higher temperature before
the pins. Tin / lead pins are specifically designed for soldering the area close to the iron is hot enough to flow solder.
applications while gold pin options are specified for socketed Because the trace and board are both dissipating and
applications (see SurfMate or InMate mounting systems). It is conducting thermal energy, some irons may not have enough
not recommended that discrete wires or connectors be soldered power to heat a trace to the temperature that will allow
directly onto a module. proper soldering.
Also necessary for a good solder connection is pin protrusion from 5. Tip Temperature. Typical 63 / 37 solder melts at 392°F
the PCB. It is not possible to create a good solder joint without [200°C]. A higher tip temperature will bring the barrel and pin
some protrusion of module pins from the PCB. If the PCB is too above the melting point of solder faster. However, a higher
thick to allow good pin protrusion, consider using Vicor module tip temperature may cause damage to the pad, printed circuit
accessories such as sockets to allow proper mounting. board, or module pin.
Before soldering, the module should be mechanically affixed or 6. Type of Solder. The actual melting point of the solder
immobilized with respect to the PCB to ensure no movement varies depending on the type of solder used and affects the
during the soldering process. The standoffs can be used necessary temperature of the pad and pin for flow. Vicor
for this process. recommends 63 / 37 SnPb solder for use on Vicor
power modules.
Vicor power modules contain two types of pins: power pins (which
deliver the power to the load and are typically sized according to 7. Tip Size. A larger tip will be able to heat a larger surface area,
the rated output current) and signal pins (which typically carry thus lowering soldering time.
very little current and are of a uniform size across a given product
family). The larger the pin, the more soldering time required to
form an adequate connection. In addition to the sizing of the pin
the time required to create a robust connection will vary depending
on several parameters:
1. PCB Thickness. The thicker the printed circuit board is, the
more heat it is able to dissipate, and thus it will require more
soldering time.
2. Copper Trace Area. Power pins require large copper traces
to minimize resistive power losses in carrying the power to the
load. Since the copper tends to conduct heat rather well, the
actual size of these copper traces directly affect the amount of
time necessary to heat the PCB socket.

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Since there are so many factors that influence soldering time, As a procedural benchmark, given a 750°F [400°C] temperature
listing actual times is difficult. In general, it is recommended that on a 60W iron with a 0.19in [3 mm] tip, approximate times to
the joint be examined post-process to ensure a quality soldering solder a Vicor power module to a 0.062in [1,5 mm] thick PCB
joint. If necessary, different parameters can then be varied in order board with an appropriately sized copper trace would be in the
to ensure a solid process. The soldering times listed in Table 23.1 range of Table 23.1.
can be used as a guideline for establishing more application and
process-specific parameters. Below are some recommendations for Soldering Time
Converter Family Pin Type
general practice: (Range)
1. Do not run tip temperature above 750°F [400°C] because it VI-200 / VI-J00 Signal 3 – 5 seconds
will greatly increase the risk of damaging the pads, traces, VI-200 Power 5 – 8 seconds
printed circuit board, or Vicor power module. Check with
the printed circuit board manufacturer for any additional VI-J00 Power 4 – 7 seconds
recommendations with regards to temperature. Maxi / Mini / Micro Singal 3 – 5 seconds
2. Apply the soldering iron to one side of the pin and pad and Maxi Power 5 – 8 seconds
apply the solder to the other, allowing the heat from the
Mini Power 4 – 7 seconds
pin and pad to melt the solder. Do not apply solder to the
soldering iron and subsequently attempt to transfer it to the Table 23.1 — Recommended pin soldering times Vicor modules
pad and pin. Melting the solder by applying it directly to the
soldering iron does not guarantee adequate wetting on the
joint and is not considered good technique. Again, please note that soldering for significantly longer periods
of time than the time listed above could result in damage to the
3. Do not apply excessive pressure with the soldering iron to module. The time listed in Table 23.1 should not be used without
the printed circuit board, barrel, or pad. This could result in verifying that the times will produce a quality soldering joint as
breaking a trace, dislodging a barrel or damaging the PCB, defined in the previous sections.
which becomes noticeably softer when heated.
Wave Soldering. Vicor modules achieve an adequate solder
4. Do not apply the soldering iron to a connection for an
connection on a wave soldering machine with conveyor speeds
extended period of time or damage to the module could
from three to seven feet per minute. As with hand soldering,
result. If the soldering times exceed the upper limit listed
times and parameters vary with the properties of the PCB and
in Table 23.1, consider using a larger tip or a higher power
copper traces. As a standard benchmark the parameters below
soldering iron.
may be used. As with hand-soldered boards, the results should be
5. Make sure PCB pads and holes are clean prior to soldering. examined to ensure a quality soldering joint and a sound process.
6. Solders with no-clean flux may be used to facilitate soldering. Wave Soldering Profile
7. Keep the tip of the soldering iron clean and free from resin. 1. Bottom-side preheaters: Zone 1: 650°F [343°C],
Apply a small amount of solder directly to the tip of the iron. Zone 2: 750°F [398°C]
This process is known as tinning.
2. Top-side preheaters: 203 – 248°F [95 – 120°C]
8. Be careful not to jar the module or PCB while the solder is
cooling. This could result in a cold solder joint, a void in the 3. Wave temperature: 500°F [260°C]
barrel, or a cracked joint. 4. Wave type: 4.25in [107,9mm] standard laminar wave
9. If it is necessary to re-solder a joint, remove all existing solder
from the pad and pin prior to reapplying solder. Preheating of the PCB is generally required for wave soldering
operations to ensure adequate wetting of the solder to the PCB.
10. Use of a soldering gun is not recommended for soldering The recommended temperature for PCB topside is 203 – 248°F
Vicor modules. [95 – 120°C] prior to the molten wave. Thick, multilayer PCBs
should be heated toward the upper limit of this range, while
11. It is not recommended that Maxi, Mini, Micro module pins be
simple two-layer PCBs should be heated to the lower limit. These
trimmed under any circumstances.
parameters are consistent with generally accepted requirements for
12. The caps of the InMate socket are designed to repel solder. It circuit-card assembly.
is normal for this surface to be free of solder.

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The power module is often much more massive than other Index of Common Soldering defects.
components mounted to the PCB. During wave solder preheating, 1. Solder Bridge. A short circuit between two electrically
the pins will dissipate much of their absorbed heat within the unconnected points caused by a piece of solder inadvertently
module. Adjustments to preheaters alone, therefore, will not forming a “bridge” or connection between the two points.
improve module soldering significantly.
Recommended Solution. Use a smaller soldering tip, or
A more effective way to improve the soldering of the module is hold the tip at a different angle when soldering, so as to only
to lower the conveyor speed and increase the dwell time in the contact one pad at a time.
molten wave. Approximately 5 seconds of exposure to the molten
wave is required to achieve an acceptable solder joint for a Maxi, 2. Cold Solder. An incomplete or poor connection caused by
Mini or Micro power module. either the barrel or the pin not being heated to the flow
Post Solder Cleaning. Vicor modules are not hermetically sealed temperature of solder. A cold solder joint will typically exhibit a
and must not be exposed to liquid, including but not limited to convex meniscus with possibly a dark spot around the barrel or
cleaning solvents, aqueous washing solutions or pressurized sprays. pad. Also a cold solder joint will not be shiny, but will typically
Cleaning the back-side of the PCB is acceptable provided no solvent have a “dirty”appearance.
contacts the body of the module. CAUTION: A cold solder joint is not necessarily an open
When soldering, it is recommended that no-clean flux solder be connection electrically, and cannot be diagnosed by a
used, as this will ensure that potentially corrosive mobile ions simple continuity check. A cold solder joint is frequently
will not remain on, around or under the module following the an electrically intermittent connection and is best
soldering process. diagnosed by visual inspection. A cold solder joint will
likely become electrically open following a period of
If the application requires the PCB to be subject to an aqueous temperature cycling.
wash after soldering, then it is recommended that Vicor module
accessories such as through-hole or surface-mount sockets Recommended Solution. Increase soldering iron
be used. These sockets should be mounted to the PCB and temperature, soldering time or use a soldering iron with a
the modules subsequently inserted following the aqueous higher output wattage if hand soldering. If wave soldering,
washing sequence. lower conveyor speed or increase preheat temperature.

De-soldering Vicor Modules. Vicor modules should not be 3. PC Board Damage. An intermittent or poor connection
re‑used after desoldering for the following reasons: caused by damage to a trace, pad or barrel. A damaged pad
is best identified by a burn mark on the PCB or a trace of pad
1. Most de-soldering procedures introduce damaging mechanical that moves when prodded with a mechanical object.
and thermal stresses to the module.
Recommended Solution. Lower the soldering iron
2. Devices or processes that may be capable of de-soldering a temperature or the soldering time. If damage persists use a
Vicor module from a printed circuit board without causing lower power iron, or consult with the manufacturer of the PCB
damage have not been qualified for use with Vicor modules. for recommended soldering guidelines.
For applications that require removal of a module with the
intent of reuse, use Vicor socketing systems. 4. De-wetting. The solder initially appears to wet but then
pulls back to expose the pad surface, more common in wave
soldering.
Recommended Solution. Make sure the PCB is clean
prior to soldering.

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5. Dry Joint. The solder has a dull gray appearance as opposed 7. Pinholes. Small or large holes in surface of solder joint, most
to a bright silver surface. The solder joint may have a mottled commonly occurring in wave-solder systems.
look as well, with jagged ridges. It is caused by the solder joint
Recommended Solution. Increase preheat or topside heater
moving before completely cooled.
temperature, but not outside the recommended limits.
Recommended Solution. Immobilize the module
with respect to the PCB to ensure that the solder joint
cools properly.
6. Icicles. Jagged or conical extensions from solder fillet. These
are caused by soldering with the temperature too low, or
soldering to a highly heat-absorbent surface.
Recommended Solution. Increase the soldering temperature,
but not outside the recommended limits. If necessary, use a
higher power soldering iron.

References

Organizations
www.ipc.org

Commercial

www.aimsolder.com
www.alphaassembly.com
www.kester.com
www.multicore-association.org

Maxi / Mini / Micro Standoff Kits for Solder-Mounted Modules

Board Mounting Slotted Through-Hole Threaded
Thickness Options Baseplate Baseplate Baseplate
Nominal Mounting Pin Through-Hole Threaded Through-Hole Threaded Through-Hole
(Min – Max) Style Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink

Short Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

0.062in Inboard
(0.055 – 0.071in) Tin/Lead Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
1,5mm Kit-18156 Kit-18157 Kit-18150 Kit-18152 Kit-18150
(1,4 – 1,8mm) Onboard L
Bag-19132 Bag-19133 Bag-19126 Bag-19128 Bag-19126

0.093in Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146

(0.084in/0.104in)
Inboard L
2,4mm
(2,1 – 2,6mm) Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122

Kits include six (6) standoffs and screws. Mini and Micro modules require a minimum of four (4) standoffs.
Bags contain 100 standoffs only (#4-40 screws required).

Table 23.2 — Standoff kits for solder mounted modules

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24. Module Packaging Options (SlimMod™, FinMod™, BusMod and MegaMod™ Families) Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Full Size

Half Size

Figure 24.1 — Full- and half-size SlimMods Figure 24.3 — BusMod module housing assembly

SlimMod™ BusMod™
Vicor PCB mount power components are available in flangeless The BusMod is a rugged module housing assembly that combines
“SlimMod” package configurations that provide users with convenient chassis mounting with a screw / lug wiring interface for
narrower width 1.8in [45,7mm] for tight printed circuit all electrical connections. To order the BusMod option, add “–B1”
mount applications. to the standard part number.
To order the SlimMod configuration, add the suffix “S” to the NOTE: The BusMod may be used with any of Vicor VI-/MI-200, VI-/MI-J00,
standard part number. Example: VI-260-CV-S. SlimMod clips are IAM or VI-/MI-RAM modules, with the exception of the HAM.
available for grounding the baseplate to the PCB ground plane.

Figure 24.2 — Longitudinal and transverse FinMods Figure 24.4 — MegaMods housing assembly

FinMod™ MegaMod™/MI-MegaMod DC-DC Converter Family

Vicor PCB mount power components are also available in MegaMod/MI-MegaMod and MegaMod/MI-MegaMod Jr. DC‑DC
flangeless “FinMod” package configurations with integral finned converters incorporate one, two or three Vicor VI-/MI-200 or
heat sinks. FinMods eliminate the need for secondary heat sink VI-/MI-J00 DC-DC converters in a modular package to provide a
assembly operations. chassis-mounted alternative to board-mounted power supplies.
MegaMod/MI-MegaMods offer 50 – 600W of power from 1 – 3
The full-size and half-size module components are available
outputs. MegaMod/MI-MegaMod Jr.s offer a total of 25 – 300W
with heat sink heights of 0.25in [6,35mm] and 0.5in [12,7mm]
from 1 – 3 outputs. Each output may be independently sensed,
longitudinal or transverse fin versions. To order the longitudinal fin
adjusted, and sequenced using the procedures outlined for
configurations add the suffix “F1” 0.25in [6,35mm] or “F2” 0.5in
VI‑/MI‑200 and VI-/MI-J00 DC-DC converters.
[12,7mm] to the standard part number. [a] For transverse fins, add
the suffix “F3” 0.25in [6,35mm] or “F4” 0.5in [12,7mm] to the
standard part number.

[a]
FinMod clips are available for grounding the baseplate to the PCB
ground plane.

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25. Product Weights Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

Typical Weights for Vicor Products

Weight
Product
Standard Heat Sink Options

VI-/MI-200 Family (Including SlimMod) 170g [6.0oz]

VI-/MI-J00 Family 85g [3.0oz]

BatMod 170g [6.0oz]

BusMod
VI-2XX-XX-B1 357g [12.6oz]
MI-2XX-XX-B1 357g [12.6oz]
VI-JXX-XX-B1 181g [6.4oz]
MI-JXX-XX-B1 181g [6.4oz]
FinMod
VI-2XX-XX-F1,MI-2XX-MX-F1 198g [7.0oz]
VI-2XX-XX-F2, MI-2XX-MX-F2 213g [7.5oz]
DC-DC

VI-JXX-XX-F1, MI-JXX-MX-F1 99g [3.5oz]

VI-JXX-XX-F2, MI-JXX-MX-F2 113g [4.0oz]
MegaMod/MI-MegaMod Family
L Family (1-up) 255g [9.0oz]
M and P Family (2-up) 545g [1.2lbs]
N, Q, R Family (3-up) 772g [1.7lbs]
MegaMod/MI-MegaMod Jr. Family
L Family (1-up) 127g [4.5oz]
P Family (2-up) 250g [8.8oz]
R Family (3-up) 377g [13.3oz]
ComPAC/MI-ComPAC Family –CC –H1 –CC –H1
LC Family (1-up) 545g [1.2lbs] 636g [1.4lbs] 590g [1.3lbs]
MC Family (2-up) 1.248kg [2.4lbs] 1.27kg [2.8lbs] 1.23kg [2.7lbs]
NC Family (3-up) 1.633kg [3.6lbs] 1.91kg [4.2lbs] 1.82kg [4.0lbs]

AC Input Module (AIM/MI-AIM) 85g [3.0oz]

Harmonic Attenuator Module (HAM) 170g [6.0oz]

FlatPAC –CC –CC

LU Family (1-up) 652g [1.4lbs] 817g [1.8lbs]
PU, MU Family (2-up) 1.248kg [2.75lbs] 1.59kg [3.5lbs]
NU, QU, RU Family (3-up) 1.843kg [4.0lbs] 2.32kg [5.1lbs]
Offline Front Ends (Includes Industrial Grade)
VI-FPE6-CUX (250W PC Mount) 184g [6.5oz]
VI-FKE6-CUX (250W Chassis Mount) 340g [12.0oz]
AC-DC

VI-FPE6-CQX (500W PC Mount 391g [13.8oz]

VI-FKE6-CQX (500W Chassis Mount) 610g [1.3lbs]
VI-FPE6-CMX (750W PC Mount) 496g [1.1lbs]
VI-FPE6-CMX (750W Chassis Mount) 737g [1.6lbs]
3-Phase Front Ends
VI-TKY6-CHX (1500W) 862g [1.9lbs]
VI-TKY6-CEX (3000W) 1.497kg [3.3lbs]
VI-TRY6-CCX (5000W) 2.857kg [6.3lbs]
Filters
Input Attenuator Module (IAM/MI-IAM) 91g [3.2oz]
Ripple Attenuator Module (RAM/MI-RAM) 79g [2.8oz]
HAM Filter Part #30205 85g 85g [13.6oz]

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A C
AC-OK Signal: The signal used to indicate the loss of AC input Capacitive Coupling: Coupling of a signal between two circuits,
voltage from the 115 / 230V line. due to discrete or parasitic capacitance between the circuits.
Altitude Testing: Generally performed to determine the Center Tap: An electrical connection made at the center of a
proper functionality of equipment in airplanes and other flying transformer or inductor winding, usually so as to result in an equal
objects. MIL-STD-810. number of turns on either side of the tap.
Ambient Temperature: The temperature of the environment, Centralized Power Architecture (CPA): One of the oldest power
usually the still air in the immediate proximity of the power supply. systems architectures, generates all system voltages at a central
location and distributes them to load locations via distribution
Apparent Power: A value of power for AC circuits that is buses. This can be effective if the voltages are high and the
calculated as the product of RMS current times RMS voltage, currents low or if the distances between the power supply and the
without taking power factor into account. loads are small.
C-Grade: Industry standard where the operating temperature of a
B device does not drop below –20°C.

Bandwidth: A range of frequencies over which a certain Chassis-Mount Configuration: A configuration where the
phenomenon is to be considered. modules or AC front ends are mounted directly to the chassis.

Baseplate: All modular products have an aluminum mounting base Common-Mode Noise: Noise present equally on two conductors
at which Vicor specifies operating temperatures and which should with respect to some reference point; often used specifically to
be affixed to a thermally conductive surface for cooling. refer to noise present on both the hot and neutral AC lines with
respect to ground.
Bellcore Specification: A telecommunications industry standard
developed by Bellcore. ComPAC™: A Vicor DC input power supply that provides EMC
filtering and transient suppression for industrial, military and
Bipolar Transistor: A transistor that operates by the action of telecommunications markets.
minority carriers across a PN junction; and is a current controlled
device as opposed to a voltage controlled device. Constant-Current Power Supply: A power supply designed
to regulate output current for changes in line, load, ambient
Bleeder Resistor: A resistor added to a circuit for the purpose of temperature and drift resulting from time.
providing a small current drain, to assure discharge of capacitors.
Constant-Voltage Power Supply: A power supply designed
Bobbin: A device upon which the windings of a transformer or to regulate output voltage for changes in line, load, ambient
inductor are wound, it provides a form for the coil and insulates the temperature and drift resulting from time.
windings from the core.
Control Circuit: A circuit in a closed-loop system, typically
Booster Converter: A “child” module in a Driver / Booster containing an error amplifier, that controls the operation of the
combination, where the Driver is the parent. Several Boosters can system to achieve regulation.
be paralleled with a Driver module for higher output power.
Converter: An electrical circuit that accepts a DC input and
Breakdown Voltage: A voltage level at which dielectric insulation generates a DC output of a different voltage usually achieved by
fails by excessive leakage current or arcing. In reference to power high frequency switching action employing inductive and capacitive
supplies the breakdown voltage is the maximum AC or DC voltage filter elements.
that can be applied from input to output and / or chassis.
Crest Factor: In an AC circuit, the mathematical ratio of the peak
Bridge Converter: A DC-DC converter topology (configuration) to RMS values of a waveform. Crest factor is sometimes used for
employing two or four active switching components in a bridge describing the current stress in AC mains supply wires, since for a
configuration across a power transformer. given amount of power transferred, the RMS value, and hence the
Bridge Rectifier: A full wave rectifier circuit employing four losses, become greater with increasing peak values. Crest factor
rectifiers in a bridge configuration. gives essentially the same information as power factor, and is being
replaced by power factor in power supply technology.
British Telecom Standards: A telecommunications industry
standard developed by the British PTT authorities. Cross Regulation: The effect of a load change on one output to
the regulation of another output. It usually only applies to non
Brownout: A reduction of the AC mains distribution voltage, postregulated (quasi) outputs.
usually caused deliberately by the utility company to reduce
power consumption when demand exceeds generation or Crowbar: An overvoltage protection method that shorts the
distribution capacity. power supply output to ground in order to protect the load when
an overvoltage fault is detected.
Burn-In: Operating a newly manufactured power supply, usually at
rated load, for a period of time in order to force component infant CSA: Canadian Standards Association. Defines the standards and
mortality failures or other latent defects. safety requirements for power components.

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Current Limiting: An overload protection circuit that limits the EMC: Electromagnetic Compatibility. Relating to compliance with
maximum output current of a power supply in order to protect the electromagnetic emissions and susceptibility standards.
load and/or the power supply.
EMI: Electromagnetic Interference. The generation of unwanted
Current Mode: A control method for switch-mode converters noise during the operation of a power supply or other electrical or
where the converter adjusts its regulating pulsewidth in response electronic equipment.
to measured output current and output voltage, using a dual loop
ESR: Equivalent Series Resistance. The value of resistance in
control circuit.
series with an ideal capacitor that duplicates the performance
Current Monitor: An analog power supply signal that is linearly characteristics of a real capacitor.
proportional to output current flow.

F
D
Factorized Power Architecture (FPA™): A power distribution
DC-OK Signal: Signal used to monitor the status of the DC output. architecture that is inherently more granular and leverages
an allocation of the DC-DC converter functions consistent
De-rating: A reduction in an operating specification to improve with efficient power distribution principles. An optimal power
reliability. For power supplies it is usually a specified reduction in distribution architecture should efficiently support demanding low
output power to facilitate operation at higher temperatures. voltage, high current loads. FPA is a higher level power architecture
Design Life: The expected lifetime of a power supply during which that offers dramatic improvements in onboard power distribution
it will operate to its published specifications. systems, in performance, reliability and economy.

Differential-Mode Noise: Noise that is measured between Fault Tolerant Configuration: A method of parallel operation,
two lines with respect to a common reference point excluding using output Oring diodes, in which the failure of a single supply
common‑mode noise. The resultant measurement is the difference (module) will not result in a loss of power. The total current
of the noise components of the two lines. The noise between the of the parallel system must not exceed the load requirements
DC output and DC return is usually measured in power supplies. to a point where the failure of a single unit will not result in a
system overload.
Distributed Power Architecture (DPA): A power distribution
architecture that replaces multiple central power sources with a FET: Field Effect Transistor. A majority carrier-voltage
single bulk supply that is converted to the end-use voltages by controlled transistor.
DC-DC converters located at the point of need. The growth of FinMod™: A flangeless / finned packaging option available on the
this design technique is demonstrated by the size of the DC‑DC Vicor VI-/MI-Family converters and accessory modules.
converter market. Distributed power can reduce the system
size, reduce the system weight, provide better operation with FlatPAC™: A Vicor AC-DC switcher available with one, two or
battery power, and deliver more efficient sub-system isolation three outputs, with total power rating from 50 – 600W.
and redundancy.
Floating Output: An output of a power supply that is not
Drift: The change in an output voltage, after a warm-up period, connected or referenced to any other output, usually denoting full
as a function of time when all other variables such as line, load and galvanic isolation. Floating outputs can generally be used as either
operating temperature are held constant. positive or negative outputs. Non floating outputs share a common
return line and are hence DC referenced to one another.
Driver Module: The controlling module in a standalone or
Driver / Booster configuration. The Driver module contains all the Foldback Current Limiting: A type of protection circuit where
control circuitry. the output current decreases as the overload increases. The
output current reaches a minimum as the load approaches a short
Dropout: The lower limit of the AC input voltage where the circuit condition.
power supply just begins to experience insufficient input to
maintain regulation. The dropout voltage for linears is largely Forward Converter: A switching power supply in which the
line dependent, whereas for most switchers it is largely load energy is transferred from the input to the output during the “on”
dependent, and to a smaller degree line dependent. time of the primary switching device.
Dynamic Load Regulation: The delta in output voltage when the
output load is rapidly changed.
G
GATE IN: The GATE IN pin of the module may be used to turn
E the module on or off. When GATE IN is pulled low, the module is
turned off. When GATE IN is floating (open collector) the module
Efficiency: The ratio of total output power to input power is turned on. The open circuit voltage of the GATE IN pin is less
expressed as a percentage. than 10V, referenced to –VIN. A GATE OUT / GATE IN connection
Electronic Load: An electronic device designed to provide a load is necessary to run Driver / Booster configurations.
to the outputs of a power supply, usually capable of dynamic
loading, and frequently programmable or computer controlled.

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GATE OUT: The GATE OUT pin is the clock pulse of the converter. Inrush Current: The peak current flowing into a power supply the
It is used to synchronize Booster modules to a Driver module for instant AC power is applied. This peak may be much higher than
high power arrays. the steady state input current due to the charging of the input
filter capacitors.
Ground: An electrical connection to earth or some other
conductor that is connected to earth. Sometimes the term Inrush-Current Limiting: A circuit that limits the amount of inrush
“ground” is used in place of “common,” but such usage is not current when a power supply is turned on.
correct unless the connection is also connected to earth.
Isolation: Two circuits that are completely electrically separated
Ground Loop: An unintentionally induced feedback loop caused with respect to DC potentials, and almost always AC potentials. In
by two or more circuits sharing a common electrical ground. power supplies, it is defined as the electrical separation of the input
and output via the transformer.
Isolation Voltage: The maximum AC or DC test voltage that
H may be applied from input to output and/or chassis of a power
Haversine: A waveform that is sinusoidal in nature, but consists of supply. Usually this has a time limit per preregulatory agency
a portion of a sine wave superimposed on another waveform. The such as EN60950.
input current waveform to a typical offline power supply has the Intermediate Bus Architecture (IBA): A power distribution
form of a haversine. architecture that relies on non-isolated point-of-load regulators
Headroom: Used in conjunction with series pass regulators, (niPOLs), reducing the PoL function to regulation and
headroom is the difference between the input and output voltages. transformation. The niPOLs operate from an intermediate bus
voltage provided by upstream isolated converters. However, IBA
Heat Sink: A medium of high thermal mass that can absorb (sink) has inherent limitations that require tradeoffs between distribution
heat indefinitely with negligible change in temperature. Heat and conversion loss that limit responsiveness to rapid load changes.
sinks are not necessarily needed with Vicor modules, and their IBA has proven effective as an interim method of containing power
use is highly dependent on the individual application, power and system cost while addressing the trend toward a proliferation of
ambient temperature. lower load voltages.
High Line Input: The maximum steady-state input voltage
on the input pin.
L
Hipot: Abbreviation for high potential, and generally refers to
the high voltages used to test dielectric withstand capability for Leakage Current: A term relating to current flowing between the
regulatory agency electrical safety requirements. AC supply wires and earth ground. The term does not necessarily
denote a fault condition. In power supplies, leakage current usually
Hold-Up Capacitor: A capacitor whose energy is used to provide refers to the 60Hz current that flows through the EMC filter
output voltage for a period after the removal of input voltage. capacitors connected between the AC lines and ground (Y caps).
Hold-Up Time: The length of time a power supply can operate Linear Regulator: A regulating technique where a dissipative
in regulation after failure of the AC input. Linears have very active device such as a transistor is placed in series with a power
short hold-up times due to the energy stored on the low-voltage supply output to regulate the output voltage.
secondary side output capacitors. Switchers have longer times due
to higher-voltage primary-side energy storage capacitors. Line Regulation: The change in output voltage when the AC input
voltage is changed from minimum to maximum specified.
Hot Swap: Insertion and extraction of a power supply into a
system while power is applied. Line Voltage (Mains): The sine wave voltage provided to the
power supply, usually expressed in volts RMS.
Load Regulation: The change in output voltage when the load on
I the output is changed.
I-Grade: Industry standard where the operation temperature of a Local Sensing: Using the voltage output terminals of the power
device does not drop below –40°C. supply as sense points for voltage regulation.
Impedance: The ratio of voltage to current at a Long-Term Stability: Power supply output voltage change due
specified frequency. to time with all other factors held constant. This is expressed in
Induced Noise: Noise generated in a circuit by varying a magnetic percent and is a function of component aging.
field produced by another circuit. Low Line: The minimum steady state voltage that can be applied
Input Line Filter: An internally or externally mounted lowpass or between the +IN and –IN pins of a converter and still maintain
band-reject filter at the power supply input that reduces the noise output regulation.
fed into the power supply.

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M Output Filtering: Filter used to reduce switching power supply

noise and ripple.
Mains: The utility AC power distribution wires.
Output Good: A power supply status signal that indicates the
Margining: Adjusting a power supply output voltage up or down output voltage is within a certain tolerance. An output that is either
from its nominal setting in order to verify system performance too high or too low will deactivate the Output Good signal.
margin with respect to supply voltage. This is usually done
electrically by a system-generated control signal. Output Impedance: The ratio of change in output voltage to
change in load current.
MegaMod™: A chassis mount packaging option that incorporates
one, two or three VI-/MI-200 Family converters for single, dual or Output Noise: The AC component that may be present on the
triple outputs having a combined power of up to 600W. DC output of a power supply. Switch-mode power supply output
noise usually has two components: a lower frequency component
M-Grade: An industry standard where the operating temperature at the switching frequency of the converter and a high frequency
of a device does not drop below –55°C. component due to fast edges of the converter switching transitions.
MIL-SPECS: Military standards that a device must meet to be used Noise should always be measured directly at the output terminals
in military environments. with a scope probe having an extremely short grounding lead.

MiniMod™: A junior size (VI-/MI-J00) version of the VI-/MI-200 Output-Power Rating: The maximum power in watts
Family of DC-DC converters offering up to half the power in a that the power supply can provide and still maintain safety
2.28 x 2.4 x 0.5in [57,9 x 61,0 x 12,7mm] package. agency approvals.
Minimum Load: The minimum load current / power that must Output-Voltage Accuracy: See Setpoint Accuracy.
be drawn from the power supply in order for the supply to meet Overload Protection: A power supply protection circuit that limits
its performance specifications. Less frequently, a minimum load is the output current under overload conditions.
required to prevent the power supply from failing.
Overshoot: A transient output voltage change exceeding
Module Evaluation Board: A test fixture used to evaluate Vicor the high limit of the voltage accuracy specification caused by
DC-DC converters. turning the power supply on or off, or abruptly changing line or
MTBF (Mean Time Between Failure): MTBF is the point at which load conditions.
63% of a given population no longer meet specification. It can Overtemp Warning: A TTL compatible signal that indicates an
either be calculated or demonstrated. The usual calculation is per overtemperature condition exists in the power supply.
MIL-STD-217 Rev. E. Demonstrated reliability is usually determined
by temperature accelerated life testing and is usually greater than Overvoltage Protection (OVP): A circuit that either shuts down
calculated MTBF. the power supply or crowbars the output in the event of an output
overvoltage condition.
N
Nominal Input: The center value for the input voltage range.
P
Nominal Value: A usual, average, normal, or expected operating
condition. This stated value will probably not be equal to the value Parallel Boost: VI-/MI-200 Family Booster modules may be added
actually measured. to a Driver to create multi-kilowatt arrays. Boosters do not contain
any feedback or control circuitry.
Parallel Operation: Connecting the outputs of two or more
O power supplies together for the purpose of obtaining a higher
Offline: A power supply that receives its input power from the output current. This requires power supplies specially designed
AC line, without using a 50 / 60Hz power transformer prior to for load sharing.
rectification and filtering, hence the term “offline” power supply. PARD: Periodic And Random Deviation. Referring to the sum of all
Open Frame: A power supply where there is no external metal ripple and noise components on the DC output of a power supply,
chassis; the power supply is provided to the end user essentially as regardless of nature or source.
a printed circuit board that provides mechanical support as well as Peak Power: The absolute maximum output power that a power
supporting the components and making electrical connections. supply can produce without immediate damage. Peak power
Operating Temperature: The range of temperatures in which a capability is typically well beyond the continuous output power
unit can operate within specifications. capability and the resulting average power should not exceed rated
specifications.
Optoisolator: An electro-optical device that transmits a signal
across a DC isolation boundary. Pi Filter: A commonly used filter at the input of a switching
supply or DC-DC converter to reduce reflected ripple current.
ORing Diodes: Diodes used to isolate supplies from one another The filter usually consists of two shunt capacitors with
under a fault condition. inductance between them.

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Post Regulator: A secondary regulating circuit on an auxiliary Remote On / Off: Enables power supply to be remotely turned on
output of a power supply that provides regulation on that output. or off. Turn-on is typically performed by open circuit or TTL logic
“1”, and turn-off by switch closure or TTL logic “0”.
Power Fail: A power supply interface signal that gives a
warning that the input voltage will no longer sustain full power Remote Sense: Wires connected in parallel with power supply
regulated output. output cables such that the power supply can sense the actual
voltage at the load to compensate for voltage drops in the output
Power Factor: The ratio of true power to apparent power in an cables and/or isolation devices.
AC circuit. In power conversion technology, power factor is used in
conjunction with describing AC input current to the power supply. Return: The designation of the common terminal for the power
supply outputs. It carries the return current for the outputs.
Preload: A small amount of current drawn from a power supply to
stabilize its operation. Reverse-Voltage Protection: A protection circuit that prevents
the power supply from being damaged in the event that a reverse
Primary: The input section of an isolated power supply, it is voltage is applied at the input or output terminals.
connected to the AC mains and hence has dangerous voltage
levels present. RFI: Radio Frequency Interference. Undesirable noise produced by
a power supply or other electrical or electronic device during its
Product Grade: The environmental and acceptance tests operation. In power supply technology, RFI is usually taken to mean
performed on Vicor products. the same thing as EMC.
Pulse Width Modulation (PWM): A switching power Ripple and Noise: The amplitude of the AC component on the DC
conversion technique where the on-time (or width) of a duty output of a power supply usually expressed in millivolts
cycle is modulated to control power transfer for regulating power peak-to-peak or RMS. For a linear power supply it is usually at the
supply outputs. frequency of the AC mains. For a switching power supply, it is
Push-Pull Converter: A switch-mode power supply topology that usually at the switching frequency of the converter stage.
utilizes a center-tapped transformer and two power switches. The
two switches are alternately driven on and off.
S
Safety Ground: A conductive path to earth that is designed
Q to protect persons from electrical shock by shunting
Quasi-Regulated Output: The regulation of an auxiliary away any dangerous currents that might occur due to
output that is accomplished by regulation of the main output. A malfunction or accident.
transformer turns ratio, commensurate with the desired auxiliary Secondary: The output section of an isolated power supply, it is
output voltage, is used in conjunction with the output around isolated from the AC mains and specially designed for safety of
which the main control loop is closed. Quasi-regulated outputs are personnel who might be working with power on the system.
significantly affected by second order effects in the converter.
SELV: An acronym for Safety Extra Low Voltage, a term generally
defined by the regulatory agencies as the highest voltage that
R can be contacted by a person and not cause injury. It is often
specifically defined as 30VAC or 42.4VDC.
Rated Output Current: The maximum load current that a power
supply can provide at a specified ambient temperature. Setpoint Accuracy: Ratio of actual to specified output voltage.
Reflected Ripple Current: The RMS or peak-to-peak AC current Sequencing: The technique of establishing a desired order of
present at the input of the power supply that is a result of the activating the outputs of a multiple output power supply.
switching frequency of the converter. Soft Start: A technique for gradually activating a power supply
Regulation: The ability of a power supply to maintain an output circuit when the power supply is first turned on. This technique
voltage within a specified tolerance as referenced to changing is generally used to provide a gradual rise in output voltages and
conditions of input voltage and / or load. inrush current limiting.

Regulation Band: The total error band allowable for an output Soft Line: A condition where there is substantial impedance
voltage. This includes the effects of all of the types of regulation: present in the AC mains feeding input power to a power supply.
line, load, temperature and time. The input voltage to the power supply drops significantly with
increasing load.
Regulatory Agencies: CSA: Canadian Standards Association; FCC:
Federal Communications Commission; FTZ: Fernmelde Technisches Split-Bobbin Winding: A transformer winding technique where
Zentralamt; TÜV: Technischer Überwachungs Verein; U.L.: the primary and secondary are wound side-by-side on a bobbin
Underwriters Laboratory; VDE: Verband Deutscher Electrotechniker. with an insulation barrier between them.

Remote Inhibit: A power supply interface signal, usually TTL

compatible, that commands the power supply to shut down one
or all outputs.

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Standby Current: The input current drawn by a power V

supply when shut down by a control input (remote inhibit)
VI Chip® (VIC): VI Chips are the smallest power components
or under no load.
available today – about the size of a 1/16 brick and very power
Stiff Line: A condition where there is no significant impedance dense. They can be used as building blocks to replace existing
present in the AC mains feeding input power to a power circuits (quarter bricks and silver box power supplies). VI Chips offer
supply. The input voltage to the power supply does not change flexible thermal management: a low thermal impedance package
appreciably with load. and the design of the package simplifies heat sink design.
Switching Frequency: The rate at which the DC voltage is Voltage Balance: The difference in magnitudes, in percent, of two
switched on and off in a switching power supply. output voltages that have equal nominal voltage magnitudes but
opposite polarities.
Voltage Mode: A method of closed loop control of a switching
T converter to correct for changes in the output voltage.
Temperature Coefficient: The average output voltage
change expressed as a percent per degree Celsius of ambient
temperature change. This is usually specified for a predetermined W
temperature range.
Warm-Up Drift: The initial change in the output voltage of a
Temperature De-rating: Reducing the output power of a power power supply in the time period between turn-on and when
supply with increasing temperature to maintain reliable operation. the power supply reaches thermal equilibrium at 25°C, full load
and nominal line.
Thermal Pad: A phase change material (ThermMate) used as a
thermal interface between the converter and a heat sink or chassis. Warm-Up Time: The time required after initial turn-on for a power
supply to achieve compliance to its performance specifications.
Thermal Protection: A power supply protection circuit that
shuts the power supply down in the event of unacceptably high
internal temperatures.
X
Topology: The design type of a converter, indicative of the
X-Capacitor: A capacitor connected across the supply lines to
configuration of switching transistors, utilization of the transformer,
suppress normal mode interference.
and type of filtering. Examples of topologies are the Flyback,
Forward, Half Bridge, Full Bridge, Resonant and
Zero-Current Switching.
Y
Tracking: A characteristic in a multiple output power supply where
any changes in the output voltage of one output caused by line, Y-Capacitor: Power conversion modules generally require
load, and/or temperature are proportional to similar changes in bypass capacitors from line to chassis (earth ground) to shunt
accompanying outputs. common‑mode noise currents and keep them local to the
converter. In cases where the converters are operating from
Transient-Recovery Time: The time required for an output rectified AC line voltage, the failure of a bypass capacitor could
voltage to be within specified accuracy limits after a step change in result in excessive leakage current to the equipment chassis thus
line or load conditions. creating a ground fault and shock hazard. For this reason, a
special classification of capacitor, referred to as a Y-capacitor, is
True Power: In an AC circuit, true power is the actual power
recommended. These capacitors contain a dielectric with unique
consumed. It is distinguished from apparent power by eliminating
“self-healing” properties to help prevent against excessive leakage.
the reactive power component that may be present.
To meet general EMC requirements (Section 9), Vicor recommends
U
the use of Y-capacitors with all power conversion modules.
Undershoot: A transient output voltage change which does not Y-capacitors meet IEC384-14, EN132400, and UL1283 standards.
meet the low limit of the voltage accuracy specification and is
caused by turning the power supply on or off, or abruptly changing
line or load conditions. Z
Universal Input: An AC input capable of operating from major AC Zero-Current Switching: The turn-on and turn-off of a switching
lines worldwide, without straps or switches. device at zero current, resulting in essentially lossless switching. The
zero-current-switching topology allows Vicor converters to operate
at frequencies up to 1MHz, with efficiencies higher than 80% and
power densities greater than conventional topologies.
Zero-Voltage Switching: This technique significantly minimizes
the switching losses and dV/dt noise due to the discharge of the
switching MOSFET junction capacitance and reverse recovery
of the diode, and enables switch mode converters to operate at
higher frequencies.

VI-200 and VI-J00 Family Design Guide Rev 3.9

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 Design Guide & Applications Manual

VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies

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VI-200 and VI-J00 Family Design Guide Rev 3.9

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