M24C08-A125

Automotive 8-Kbit serial I²C bus EEPROM with 1 MHz clock

Datasheet - production data

Features
• Compatible with all I2C bus modes
– 1 MHz
– 400 kHz
– 100 kHz
• Memory array
TSSOP8 (DW) – 8 Kbits (1024 bytes) of EEPROM
169 mil width – Page size: 16 bytes
– Additional Write lockable page
(Identification page)
• Extended temperature and voltage ranges
– -40 °C to 125 °C; 1.7 V to 5.5 V
• Schmitt trigger inputs for noise filtering
• Short Write cycle time
SO8 (MN)
150 mil width – Byte Write within 4 ms
– Page Write within 4 ms
• Write cycle endurance
– 4 million Write cycles at 25 °C
– 1.2 million Write cycles at 85 °C
– 600 k Write cycles at 125 °C
WFDFPN8 (MF) • Data retention
2 x 3 mm
– 50 years at 125 °C
– 100 years at 25 °C
• ESD Protection (Human Body Model)
– 4000 V
• Packages
– RoHS compliant and halogen-free
(ECOPACK2®)

March 2016 DocID025850 Rev 6 1/40

This is information on a product in full production. www.st.com
Contents M24C08-A125

Contents

1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Chip Enable (E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 VSS (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.2 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.3 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.4 Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.5 Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.6 Identification page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

4 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1 Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1.3 Write Identification Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1.4 Lock Identification Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.1.5 Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 19
4.2 Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2.1 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.2.2 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.4 Read Identification Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.5 Read the lock status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2.6 Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

2/40 DocID025850 Rev 6

M24C08-A125 Contents

5 Application design recommendations . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.1 Operating supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.2 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.3 Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 Error correction code (ECC x 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6 Delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

8 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

9.1 TSSOP8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
9.2 SO8N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.3 WFDFPN8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

10 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

DocID025850 Rev 6 3/40

3
List of tables M24C08-A125

List of tables

Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Table 2. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 3. Significant address bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. Device identification code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6. Operating conditions (voltage range) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 7. AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 8. Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 9. Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 10. DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 11. 400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 12. 1 MHz AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 13. TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 14. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 15. WFDFPN8 (MLP8) – 8-lead, 2 x 3 mm, 0.5 mm pitch very thin fine pitch
dual flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 16. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

4/40 DocID025850 Rev 6

M24C08-A125 List of figures

List of figures

Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 2. 8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 6. Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 7. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 8. Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 9. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10. Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 11. Maximum Rbus value versus bus parasitic capacitance Cbus) for an I2C
bus at maximum frequency fC = 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 12. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 13. TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 14. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 15. WFDFPN8 (MLP8) – 8-lead, 2 x 3 mm, 0.5 mm pitch very very thin fine pitch
dual flat package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

DocID025850 Rev 6 5/40

5
Description M24C08-A125

1 Description

The M24C08-A125 is a 8-Kbit serial EEPROM Automotive grade device operating up to

125 °C. The M24C08-A125 is compliant with the very high level of reliability defined by the
Automotive standard AEC-Q100 grade 1.
The device is accessed by a simple serial I2C compatible interface running up to 1 MHz.
The memory array is based on advanced true EEPROM technology (electrically erasable
programmable memory). The M24C08-A125 is a byte-alterable memory (1024 × 8 bits)
organized as 64 pages of 16 bytes in which the data integrity is significantly improved with
an embedded Error Correction Code logic.
The M24C08-A125 offers an additional Identification Page (16 bytes) in which the ST device
identification can be read. This page can also be used to store sensitive application
parameters which can be later permanently locked in read-only mode.

Figure 1. Logic diagram

7# (IGHVOLTAGE
%I #ONTROLLOGIC
GENERATOR

3#,

3$! )/SHIFTREGISTER

!DDRESSREGISTER $ATA
ANDCOUNTER REGISTER
9DECODER

PAGE
)DENTIFICATIONPAGE

8DECODER

-36

6/40 DocID025850 Rev 6

M24C08-A125 Description

Table 1. Signal names

Signal name Function Direction

E2 Chip Enable Input

SDA Serial Data I/O
SCL Serial Clock Input
WC Write Control Input
VCC Supply voltage -
VSS Ground -

Figure 2. 8-pin package connections

E ϭ ϴ s

E Ϯ ϳ t

Ϯ ϯ ϲ ^>

s^^ ϰ ϱ ^

069

1. See Section 9: Package mechanical data for package dimensions, and how to identify pin 1.

DocID025850 Rev 6 7/40

39
Signal description M24C08-A125

2 Signal description

2.1 Serial Clock (SCL)

The signal applied on this input is used to strobe the data available on SDA(in) and to output
the data on SDA(out).

2.2 Serial Data (SDA)

SDA is an input/output used to transfer data in or out of the device. SDA(out) is an open
drain output that may be wire-OR’ed with other open drain or open collector signals on the
bus. A pull up resistor must be connected between SDA and VCC (Figure 10 and Figure 11
indicate how to calculate the value of the pull-up resistor).

2.3 Chip Enable (E2)

This input signal is used to set the value that is to be looked for on the bit b3 of the device
select code (see Table 2). These inputs must be tied to VCC or VSS to establish the device
select code , as shown in Figure 3. When not connected (left floating), these inputs are read
as low (0).

Figure 3. Device select code

6## 6##

-XXX -XXX

%I %I

633 633

!I

2.4 Write Control (WC)

This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven high. Write operations are enabled when Write Control (WC) is either
driven low or left floating.
When Write Control (WC) is driven high, device select and address bytes are
acknowledged, Data bytes are not acknowledged.

8/40 DocID025850 Rev 6

M24C08-A125 Signal description

2.5 VSS (ground)

VSS is the reference for the VCC supply voltage.

2.6 Supply voltage (VCC)

VCC is the supply voltage pin.

DocID025850 Rev 6 9/40

39
Device operation M24C08-A125

3 Device operation

The device supports the I2C protocol (see Figure 4).

The I2C bus is controlled by the bus master and the device is always a slave in all
communications.
The device (bus master or a slave) that sends data on to the bus is defined as a transmitter;
the device (bus master or a slave) is defined as a receiver when reading the data.

Figure 4. I2C bus protocol

3#,

3$!

3$! 3$!
34!24 )NPUT #HANGE 34/0
#ONDITION #ONDITION

3#,      

3$! -3" !#+

34!24
#ONDITION

3#,      

3$! -3" !#+

34/0
#ONDITION
!)"

10/40 DocID025850 Rev 6

M24C08-A125 Device operation

3.1 Start condition

Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the high state. A Start condition must precede any data transfer instruction. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition.

3.2 Stop condition

Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable and
driven high. A Stop condition terminates communication between the device and the bus
master.
A Stop condition at the end of a Write instruction triggers the internal Write cycle.

3.3 Data input

During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven low.

3.4 Acknowledge bit (ACK)

The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) low to
acknowledge the receipt of the eight data bits.

DocID025850 Rev 6 11/40

39
Device operation M24C08-A125

3.5 Device addressing

To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, as
shown in Table 2.
The device select code consists of a 4-bit device type identifier and a Chip Enable address
(E2). A device select code handling any value other than 1010b (to select the memory) or
1011b (to select the Identification page) is not acknowledged by the memory device.
Up to two memory devices can be connected on a single I2C bus. When the device select
code is received, the memory device only responds if the Chip Enable Address is the same
as the value decoded on the E2 input.
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write
operations.
Table 2. Device select code
Device type identifier (1) Chip Enable address(2) RW

b7 b6 b5 b4 b3 b2 b1 b0

When accessing the

1 0 1 0 E2 A9 A8 RW
memory
When accessing the
1 0 1 1 E2 X X RW
identification page
1. The most significant bit, b7, is sent first.
2. X bit is a Don’t Care bit

If the memory device does not match the device select code, it deselects itself from the bus,
and enters the Standby mode.
If the memory device matches the device select code, the corresponding memory device
gives an acknowledgment on Serial Data (SDA) during the 9th SCL clock period. Once the
memory device has acknowledged the device select code, the memory device waits for the
master to send the address byte. The memory device responds to the address byte with an
acknowledge bit.

12/40 DocID025850 Rev 6

M24C08-A125 Device operation

Table 3. Significant address bits

Memory Identification page
(Device type identifier = 1010b) (Device type identifier = 1011b)

Read Write Lock

Random
Write Identification Identification Identification Read lock status
Address Read
page page page

b2(1) A9 A9 X X X
address bits
significant
Most

b1(1) A8 A8 X X X

b7 A7 A7 0 0 1
b6 A6 A6 X X X
b5 A5 A5 X X X see Section 4.2.5
Address byte

b4 A4 A4 X X X
b3 A3 A3 A3 A3 X
b2 A2 A2 A2 A2 X
b1 A1 A1 A1 A1 X
b0 A0 A0 A0 A0 X
1. Address bits defined inside the DeviceSelect code (see Table 2)

Note: A: significant address bit.

X: bit is Don’t Care.

DocID025850 Rev 6 13/40

39
Device operation M24C08-A125

3.6 Identification page

The M24C08-A125 offers an Identification Page (16 bytes) in addition to the 8-Kbit memory.
The Identification page contains two fields:
• Device identification code: the first three bytes are programmed by STMicroelectronics
with the Device identification code, as shown in Table 4.
• Application parameters: the bytes after the Device identification code are available for
application specific data.
Note: If the end application does not need to read the Device identification code, this field can be
overwritten and used to store application-specific data. Once the application-specific data
are written in the Identification page, the whole Identification page should be permanently
locked in Read-only mode.
The instructions Read, Write and Lock Identification Page are detailed in Section 4:
Instructions.

Table 4. Device identification code

Address in
Content Value
Identification page

00h ST manufacturer code 20h

2C
01h I family code E0h
02h Memory density code 0Ah (8-Kbit)

14/40 DocID025850 Rev 6

M24C08-A125 Instructions

4 Instructions

4.1 Write operations

For a Write operation, the bus master sends a Start condition followed by a device select
code with the R/W bit reset to 0. The device acknowledges this, as shown in Figure 5, and
waits for the master to send the address byte with an acknowledge bit, and then waits for
the data byte.
When the bus master generates a Stop condition immediately after a data byte Ack bit (in
the “10th bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write
cycle tW is then triggered. A Stop condition at any other time slot does not trigger the internal
Write cycle.
During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does
not respond to any requests.
After the successful completion of an internal Write cycle (tW), the device internal address
counter is automatically incremented to point to the next byte after the last modified byte.
If the Write Control input (WC) is driven High, the Write instruction is not executed and the
accompanying data bytes are not acknowledged, as shown in Figure 6.

DocID025850 Rev 6 15/40

39
Instructions M24C08-A125

4.1.1 Byte Write

After the device select code and the address byte, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven high, the
device replies with NoAck on the received data byte, and the location is not modified (see
Figure 6). If, instead, the addressed location is not Write-protected, the device replies with
Ack. The bus master terminates the transfer by generating a Stop condition, as shown in
Figure 5.

Figure 5. Write mode sequences with WC = 0 (data write enabled)

7#

!#+ !#+ !#+

"YTE7RITE $EV3ELECT "YTEADDRESS $ATAIN

3TART

3TOP
27

7#

!#+ !#+ !#+ !#+

0AGE7RITE $EV3ELECT "YTEADDRESS $ATAIN $ATAIN $ATAIN

3TART

27

7#CONTgD

!#+ !#+

0AGE7RITE $ATAIN.
CONTgD
3TOP

!)C

16/40 DocID025850 Rev 6

M24C08-A125 Instructions

4.1.2 Page Write

The Page Write mode allows up to N(1) bytes to be written in a single Write cycle, provided
that they are all located in the same page in the memory: that is, the most significant
memory address bits, A9/A4, are the same. If more bytes are sent than will fit up to the end
of the page, a condition known as “roll-over” occurs. In case of roll-over, the first bytes of the
page are overwritten.
Note: The bus master sends from 1 to N(1) bytes of data, each of which is acknowledged by the
device if Write Control (WC) is low. If Write Control (WC) is high, the contents of the
addressed memory location are not modified, and each data byte received by the device is
not acknowledged, as shown in Figure 6. After each byte is transferred, the internal byte
address counter is incremented. The transfer is terminated by the bus master generating a
Stop condition.

Figure 6. Write mode sequences with WC = 1 (data write inhibited)

7#

!#+ !#+ ./!#+

"YTE7RITE $EVSELECT "YTEADDRESS $ATAIN

3TART

3TOP
27

7#

!#+ !#+ ./!#+ ./!#+

0AGE7RITE $EVSELECT "YTEADDRESS $ATAIN $ATAIN $ATAIN

3TART

27

7#CONTgD

./!#+ ./!#+

0AGE7RITE $ATAIN.
CONTgD
3TOP

!)D

1. N is the number of bytes in a page.

DocID025850 Rev 6 17/40

39
Instructions M24C08-A125

4.1.3 Write Identification Page

The Identification Page (16 bytes) is an additional page which can be written and (later)
permanently locked in Read-only mode. It is written by issuing the Write Identification Page
instruction. This instruction uses the same protocol and format as Page Write (into memory
array), except for the following differences:
• Device type identifier = 1011b
• Most significant address bits A9/A4 are don't care, except for address bit A7 which
must be “0”. Least significant address bits A3/A0 define the byte location inside the
Identification page.
If the Identification page is locked, the data bytes transferred during the Write Identification
Page instruction are not acknowledged (NoAck).

4.1.4 Lock Identification Page

The Lock Identification Page instruction (Lock ID) permanently locks the Identification page
in Read-only mode. The Lock ID instruction is similar to Byte Write (into memory array) with
the following specific conditions:
• Device type identifier = 1011b
• Address bit A7 must be ‘1’; all other address bits are don't care
• The data byte must be equal to the binary value xxxx xx1x, where x is don't care

18/40 DocID025850 Rev 6

M24C08-A125 Instructions

4.1.5 Minimizing Write delays by polling on ACK

The maximum Write time (tw) is shown in AC characteristics tables in Section 8: DC and AC
parameters, but the typical time is shorter. To make use of this, a polling sequence can be
used by the bus master.
The sequence, as shown in Figure 7, is:
• Initial condition: a Write cycle is in progress.
• Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
• Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).

Figure 7. Write cycle polling flowchart using ACK

:ULWHF\FOH
LQSURJUHVV

6WDUWFRQGLWLRQ

'HYLFHVHOHFW
ZLWK5: 

12 $&.
UHWXUQHG

)LUVWE\WHRILQVWUXFWLRQ <(6
ZLWK5: DOUHDG\
GHFRGHGE\WKHGHYLFH

1H[W
12 2SHUDWLRQLV <(6
DGGUHVVLQJWKH
PHPRU\
6HQG$GGUHVV
5H6WDUW DQG5HFHLYH$&.

6WRS 12 <(6
6WDUW&RQGLWLRQ

'DWDIRUWKH 'HYLFHVHOHFW
:ULWHRSHUDWLRQ ZLWK5: 

&RQWLQXHWKH &RQWLQXHWKH
:ULWHRSHUDWLRQ 5DQGRP5HDGRSHUDWLRQ

$,H

DocID025850 Rev 6 19/40

39
Instructions M24C08-A125

4.2 Read operations

Read operations are performed independently of the state of the Write Control (WC) signal.
After the successful completion of a Read operation, the device internal address counter is
incremented by one, to point to the next byte address.

Figure 8. Read mode sequences

!#+ ./!#+
#URRENT
!DDRESS $EVSELECT $ATAOUT
2EAD
3TART

3TOP
27

!#+ !#+ !#+ ./!#+

2ANDOM
!DDRESS $EVSELECT
"YTEADDRESS $EVSELECT
$ATAOUT
2EAD
3TART

3TART

3TOP
27 27

!#+ !#+ !#+ ./!#+

3EQUENTIAL
#URRENT $EVSELECT $ATAOUT $ATAOUT.
2EAD
3TART

3TOP
27

!#+ !#+ !#+ !#+

3EQUENTIAL
2ANDOM $EVSELECT
"YTEADDRESS $EVSELECT
$ATAOUT
2EAD
3TART

3TART

27 27

!#+ ./!#+

$ATAOUT.
3TOP

!)B

4.2.1 Random Address Read

The Random Address Read is a sequence composed of a truncated Write sequence (to
define a new address pointer value, see Table 3) followed by a current Read.
The Random Address Read sequence is therefore the sum of [Start + Device Select code
with R/W=0 + address byte] (without Stop condition, as shown in Figure 8) and [Start
condition + Device Select code with R/W=1]. The memory device acknowledges the
sequence and then outputs the contents of the addressed byte. To terminate the data
transfer, the bus master does not acknowledge the last data byte and then issues a Stop
condition.

20/40 DocID025850 Rev 6

M24C08-A125 Instructions

4.2.2 Current Address Read

For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the R/W bit set to 1. The device acknowledges this, and
outputs the byte pointed by the internal address counter. The counter is then incremented.
The bus master terminates the transfer with a Stop condition, as shown in Figure 8, without
acknowledging the byte.
Note that the address counter value is defined by instructions accessing either the memory
or the Identification page. When accessing the Identification page, the address counter
value is loaded with the Identification page byte location, when accessing the memory, it is
safer to always use the Random Address Read instruction (this instruction loads the
address counter with the byte location to read in the memory) instead of the Current
Address Read instruction.

4.2.3 Sequential Read

A sequential Read can be used after a Current Address Read or a Random Address Read.
After a Read instruction, the device can continue to output the next byte(s) in sequence if
the bus master sends additional clock pulses and if the bus master does acknowledge each
transmitted data byte. To terminate the stream of bytes, the bus master must not
acknowledge the last byte, and must generate a Stop condition, as shown in Figure 8.
The sequential read is controlled with the device internal address counter which is
automatically incremented after each byte output. After the last memory address, the
address counter “rolls-over”, and the device continues to output data from memory address
00h.

4.2.4 Read Identification Page

The Identification Page can be read by issuing a Read Identification Page instruction. This
instruction uses the same protocol and format as the Random Address Read (from memory
array) with device type identifier defined as 1011b. The most significant address bits A9/A4
are don't care except bit A7 which must be 0, the least significant address bits A3/A0 define
the byte location inside the Identification page. The number of bytes to read in the ID page
must not exceed the page boundary.

4.2.5 Read the lock status

The locked/unlocked status of the Identification page can be checked by transmitting a
specific truncated command [Identification Page Write instruction + one data byte] to the
device. The device returns an acknowledge bit after the data byte if the Identification page is
unlocked, otherwise a NoAck bit if the Identification page is locked.
Right after this, it is recommended to transmit to the device a Start condition followed by a
Stop condition, so that:
• Start: the truncated command is not executed because the Start condition resets the
device internal logic,
• Stop: the device is then set back into Standby mode by the Stop condition.

DocID025850 Rev 6 21/40

39
Instructions M24C08-A125

4.2.6 Acknowledge in Read mode

For all Read instructions, the device waits, after each byte sent out, for an acknowledgment
from the bus master during the “9th bit” time slot. If the bus master does not send the
Acknowledge (the master drives SDA high during the 9th bit time), the device terminates the
data transfer and enters its Standby mode.

22/40 DocID025850 Rev 6

M24C08-A125 Application design recommendations

5 Application design recommendations

5.1 Supply voltage

5.1.1 Operating supply voltage (VCC)

Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Table 6).
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal Write cycle (tW). In order to
secure a stable DC supply voltage, it is recommended to decouple the VCC line with a
suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package
pins.

5.1.2 Power-up conditions

When the power supply is turned on, the VCC voltage has to rise continuously from 0 V up to
the minimum VCC operating voltage defined in Table 6.
In order to prevent inadvertent write operations during power-up, a power-on-reset (POR)
circuit is included.
At power-up, the device does not respond to any instruction until VCC reaches the internal
threshold voltage (this threshold is defined in the DC characteristic Table 10 as VRES).
When VCC passes over the POR threshold, the device is reset and in the following state:
• in the Standby power mode
• deselected
As soon as the VCC voltage has reached a stable value within the [VCC(min), VCC(max)]
range (defined in Table 6), the device is ready for operation.

5.1.3 Power-down
During power-down (continuous decrease in the VCC supply voltage below the minimum
VCC operating voltage defined in Table 6), the device must be in Standby power mode (that
is after a STOP condition or after the completion of the Write cycle tW if an internal Write
cycle is in progress).

5.2 Error correction code (ECC x 1)

The error correction code (ECC x 1) is an internal logic function which is transparent for the
I2C communication protocol.
The ECC x 1 logic is implemented on each byte of the memory array. If a single bit out of the
byte happens to be erroneous during a Read operation, the ECC x 1 detects this bit and
replaces it with the correct value. The read reliability is therefore much improved.

DocID025850 Rev 6 23/40

39
Delivery state M24C08-A125

6 Delivery state

The device is delivered as follows:

• The memory array is set to all 1s (each byte = FFh).
• Identification page: the first three bytes define the Device identification code (value
defined in Table 4). The content of the following bytes is Don’t Care.

7 Maximum rating

Stressing the device outside the ratings listed in Table 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.

Table 5. Absolute maximum ratings

Symbol Parameter Min. Max. Unit

Ambient operating temperature –40 130 °C

TSTG Storage temperature –65 150 °C
TLEAD (1)
Lead temperature during soldering see note °C
VIO Input or output range –0.50 6.5 V
IOL DC output current (SDA = 0) - 5 mA
VCC Supply voltage –0.50 6.5 V
VESD Electrostatic pulse (Human Body model)(2) - 4000 V
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb-free assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS
directive 2011/65/EU of July 2011).
2. Positive and negative pulses applied on pin pairs, according to AEC-Q100-002 (compliant with
ANSI/ESDA/JEDEC JS-001-2012, C1=100 pF, R1=1500 Ω, R2=500 Ω).

24/40 DocID025850 Rev 6

M24C08-A125 DC and AC parameters

8 DC and AC parameters

This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device.

Table 6. Operating conditions (voltage range)

Symbol Parameter Min. Max. Unit

VCC Supply voltage 1.7 5.5 V

TA Ambient operating temperature –40 125 °C

Table 7. AC measurement conditions

Symbol Parameter Min. Max. Unit

Cbus Load capacitance 100 pF

- SCL input rise/fall time, SDA input fall time - 50 ns
- Input levels 0.2 VCC to 0.8 VCC V
- Input and output timing reference levels 0.3 VCC to 0.7 VCC V

Figure 9. AC measurement I/O waveform

)NPUTVOLTAGELEVELS )NPUTANDOUTPUT
4IMINGREFERENCELEVELS
6##
6##

6##
6##
-36

DocID025850 Rev 6 25/40

39
DC and AC parameters M24C08-A125

Table 8. Input parameters

Symbol Parameter (1) Test condition Min. Max. Unit

CIN Input capacitance (SDA) - - 8 pF

CIN Input capacitance (other pins) - - 6 pF
ZL VIN < 0.3 VCC 30 - kΩ
Input impedance (WC)
ZH VIN > 0.7 VCC 500 - kΩ
1. Characterized only, not tested in production.

Table 9. Cycling performance

Symbol Parameter Test condition Min. Max. Unit

TA ≤ 25 °C, 1.7 V < VCC < 5.5 V - 4,000,000

Write cycle
Ncycle Write cycle endurance TA = 85 °C, 1.7 V < VCC < 5.5 V - 1,200,000 (1)

TA = 125 °C, 1.7 V < VCC < 5.5 V - 600,000

1. A Write cycle is executed when either a Page Write, a Byte Write, a Write Identification Page or a Lock Identification Page
instruction is decoded.

26/40 DocID025850 Rev 6

M24C08-A125 DC and AC parameters

Table 10. DC characteristics

Test conditions (in addition to
Symbol Parameter Min. Max. Unit
those in Table 6 and Table 7)

Input leakage current VIN = VSS or VCC,

ILI - ±2 µA
(SCL, SDA, Ei) device in Standby mode
SDA in Hi-Z, external voltage
ILO Output leakage current - ±2 µA
applied on SDA: VSS or VCC
fC = 400 kHz, VCC = 5.5 V - 2 mA
fC = 400 kHz, VCC = 2.5 V - 2 mA
fC = 400 kHz, VCC = 1.7 V - 1 mA
ICC Supply current (Read)
fC = 1 MHz, VCC = 5.5 V - 2 mA
fC = 1 MHz, VCC = 2.5 V - 2 mA
fC = 1 MHz, VCC = 1.7 V - 2 mA
ICC0 Supply current (Write) During tW - 2 mA
(1),
Device not selected t° = 85 °C,
- 1 µA
VIN = VSS or VCC, VCC = 1.7 V
Device not selected(1), t° = 85 °C
- 2 µA
VIN = VSS or VCC, VCC = 2.5 V
Device not selected(1), t° = 85 °C,
- 3 µA
VIN = VSS or VCC, VCC = 5.5 V
ICC1 Standby supply current
Device not selected(1), t° = 125 °C,
- 15 µA
VIN = VSS or VCC, VCC = 1.7 V
Device not selected(1), t° = 125 °C,
- 15 µA
VIN = VSS or VCC, VCC = 2.5 V
Device not selected(1), t° = 125 °C,
- 20 µA
VIN = VSS or VCC, VCC = 5.5 V
VIL Input low voltage (SCL, SDA, WC, Ei)(2) - –0.45 0.3 VCC V
Input high voltage (SCL, SDA) - 0.7 VCC 6.5 V
VIH
Input high voltage (WC, Ei)(3) - 0.7 VCC VCC +0.6 V
IOL = 2.1 mA, VCC = 2.5 V or
- 0.4 V
VOL Output low voltage IOL = 3 mA, VCC = 5.5 V
IOL = 1 mA, VCC = 1.7 V - 0.3 V
(4)
VRES Internal reset threshold voltage - 0.5 1.5 V
1. The device is not selected after power-up, after a Read instruction (after the Stop condition), or after the completion of the
internal write cycle tW (tW is triggered by the correct decoding of a Write instruction).
2. Ei inputs should be tied to Vss (see Section 2.3).
3. Ei inputs should be tied to VCC (see Section 2.3).
4. Characterized only, not 100% tested.

DocID025850 Rev 6 27/40

39
DC and AC parameters M24C08-A125

Table 11. 400 kHz AC characteristics

Symbol Alt. Parameter Min. Max. Unit

fC fSCL Clock frequency - 400 kHz

tCHCL tHIGH Clock pulse width high 600 - ns
tCLCH tLOW Clock pulse width low 1300 - ns
tQL1QL2 (1) tF SDA (out) fall time (2) 20 120 ns
(3) (3)
tXH1XH2 tR Input signal rise time ns
(3) (3)
tXL1XL2 tF Input signal fall time ns
tDXCH tSU:DAT Data in set up time 100 - ns
tCLDX tHD:DAT Data in hold time 0 - ns
(4)
tCLQX tDH Data out hold time 100 - ns
tCLQV (5) tAA Clock low to next data valid (access time) - 900 ns
tCHDL tSU:STA Start condition setup time 600 - ns
tDLCL tHD:STA Start condition hold time 600 - ns
tCHDH tSU:STO Stop condition set up time 600 - ns
Time between Stop condition and next Start
tDHDL tBUF 1300 - ns
condition
tWLDL(6)(1) tSU:WC WC set up time (before the Start condition) 0 - µs
tDHWH(7)(1) tHD:WC WC hold time (after the Stop condition) 1 - µs
tW tWR Write time - 4 ms
Pulse width ignored (input filter on SCL and
tNS (1) - - 80 ns
SDA) - single glitch
1. Characterized value, not tested in production.
2. With CL = 10 pF.
3. There is no min. or max. values for the input signal rise and fall times. It is however recommended by the
I²C specification that the input signal rise and fall times be more than 20 ns and less than 300 ns when
fC < 400 kHz.
4. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
5. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3VCC or 0.7VCC,
assuming that Rbus × Cbus time constant is within the values specified in Figure 10.
6. WC=0 set up time condition to enable the execution of a WRITE command.
7. WC=0 hold time condition to enable the execution of a WRITE command.

28/40 DocID025850 Rev 6

M24C08-A125 DC and AC parameters

Table 12. 1 MHz AC characteristics

Symbol Alt. Parameter Min. Max. Unit

fC fSCL Clock frequency 0 1 MHz

tCHCL tHIGH Clock pulse width high 260 - ns
tCLCH tLOW Clock pulse width low 500 - ns
tXH1XH2 (1) (1)
tR Input signal rise time ns
(1) (1)
tXL1XL2 tF Input signal fall time ns
(2)
tQL1QL2 tF SDA (out) fall time 20 120 ns
tDXCH tSU:DAT Data in setup time 50 - ns
tCLDX tHD:DAT Data in hold time 0 - ns
(3)
tCLQX tDH Data out hold time 100 - ns
tCLQV (4) tAA Clock low to next data valid (access time) - 450 ns
tCHDL tSU:STA Start condition setup time 250 - ns
tDLCL tHD:STA Start condition hold time 250 - ns
tCHDH tSU:STO Stop condition setup time 250 - ns
Time between Stop condition and next Start
tDHDL tBUF 500 - ns
condition
tWLDL(5) (2) tSU:WC WC set up time (before the Start condition) 0 - µs
(6) (2)
tDHWH tHD:WC WC hold time (after the Stop condition) 1 - µs
tW tWR Write time - 4 ms
Pulse width ignored (input filter on SCL and
tNS (2) - - 80 ns
SDA)
1. There is no min. or max. values for the input signal rise and fall times. However, it is recommended by the
I²C specification that the input signal rise and fall times be more than 20 ns and less than 120 ns when
fC < 1 MHz.
2. Characterized only, not tested in production.
3. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
4. tCLQV is the time (from the falling edge of SCL) required by the SDA bus line to reach either 0.3 VCC or 0.7 VCC,
assuming that the Rbus × Cbus time constant is within the values specified in Figure 11.
5. WC=0 set up time condition to enable the execution of a WRITE command.
6. WC=0 hold time condition to enable the execution of a WRITE command.

DocID025850 Rev 6 29/40

39
DC and AC parameters M24C08-A125

Figure 10. Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C
bus at maximum frequency fC = 400 kHz

"USLINEPULL UPRESISTOR


4HE2X#TIMECONSTANT
BUS BUS
MUSTBEBELOWTHENS 6##

K

TIMECONSTANTLINEREPRESENTED
2 ONTHELEFT
 BU
S §
#
BU 2BUS
(ERE2BUS §#BUSNS S 

K½ N
S
)£#BUS 3#,
-XXX
MASTER
3$!
 P&
#BUS
  
"USLINECAPACITORP&

AIB

Figure 11. Maximum Rbus value versus bus parasitic capacitance Cbus) for an I2C
bus at maximum frequency fC = 1MHz

  6##
"USLINEPULL UPRESISTORK

2BUS
2 4HE2BUS§#BUSTIMECONSTANT
BUS § MUSTBEBELOWTHENS
#
BUS  3#,
 NS TIMECONSTANTLINEREPRESENTED )£#BUS -XXX
ONTHELEFT MASTER

3$!
 (ERE
2 BUS § #BUSNS
#BUS


  
"USLINECAPACITORP&
-36

30/40 DocID025850 Rev 6

M24C08-A125 DC and AC parameters

Figure 12. AC waveforms

^ƚĂƌƚ ^ƚŽƉ ^ƚĂƌƚ

ĐŽŶĚŝƚŝŽŶ ĐŽŶĚŝƚŝŽŶ ĐŽŶĚŝƚŝŽŶ

ƚy>ϭy>Ϯ ƚ,>
ƚy,ϭy,Ϯ ƚ>,

^>

ƚ>>

ƚy>ϭy>Ϯ

^/Ŷ

^
ƚ,> ƚy,ϭy,Ϯ /ŶƉƵƚ ƚ>y ^ ƚy, ƚ,, ƚ,>
ŚĂŶŐĞ

t

ƚt>> ƚ,t,

^ƚŽƉ
^ƚĂƌƚ
ĐŽŶĚŝƚŝŽŶ
ĐŽŶĚŝƚŝŽŶ

^>

^/Ŷ

ƚt
ƚ,, ƚ,>
tƌŝƚĞĐLJĐůĞ

ƚ,>

^>

ƚ>Ys ƚ>Yy ƚY>ϭY>Ϯ

^KƵƚ ĂƚĂǀĂůŝĚ ĂƚĂǀĂůŝĚ

DLN

DocID025850 Rev 6 31/40

39
Package mechanical data M24C08-A125

9 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

32/40 DocID025850 Rev 6

M24C08-A125 Package mechanical data

9.1 TSSOP8 package information

Figure 13. TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package outline

ϴ ϱ
Đ

ϭ 

ϭ ϰ

ϭ >
 Ϯ
W >ϭ

ď Ğ
76623$0B9

1. Drawing is not to scale.

Table 13. TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package mechanical data
millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.

A - - 1.200 - - 0.0472
A1 0.050 - 0.150 0.0020 - 0.0059
A2 0.800 1.000 1.050 0.0315 0.0394 0.0413
b 0.190 - 0.300 0.0075 - 0.0118
c 0.090 - 0.200 0.0035 - 0.0079
CP - 0.100 - - 0.0039
D 2.900 3.000 3.100 0.1142 0.1181 0.1220
e - 0.650 - - 0.0256 -
E 6.200 6.400 6.600 0.2441 0.2520 0.2598
E1 4.300 4.400 4.500 0.1693 0.1732 0.1772
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - - - 0.0394 -
α 0° 8° 0° - 8°
1. Values in inches are converted from mm and rounded to four decimal digits.

DocID025850 Rev 6 33/40

39
Package mechanical data M24C08-A125

9.2 SO8N package information

Figure 14. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package outline

K[Û

$ $
F
FFF
E
H

PP
' *$8*(3/$1(

N


( (
 /
$
/
62$B9

1. Drawing is not to scale.

Table 14. SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package mechanical data
millimeters inches (1)
Symbol
Min Typ Max Min Typ Max

A - - 1.750 - - 0.0689
A1 0.100 - 0.250 0.0039 - 0.0098
A2 1.250 - - 0.0492 - -
b 0.280 - 0.480 0.0110 - 0.0189
c 0.170 - 0.230 0.0067 - 0.0091
ccc - - 0.100 - - 0.0039
D 4.800 4.900 5.000 0.1890 0.1929 0.1969
E 5.800 6.000 6.200 0.2283 0.2362 0.2441
E1 3.800 3.900 4.000 0.1496 0.1535 0.1575
e - 1.270 - - 0.0500 -
h 0.250 - 0.500 0.0098 - 0.0197
k 0° - 8° 0° - 8°
L 0.400 - 1.270 0.0157 - 0.0500
L1 - 1.040 - - 0.0409 -
1. Values in inches are converted from mm and rounded to four decimal digits.

34/40 DocID025850 Rev 6

M24C08-A125 Package mechanical data

9.3 WFDFPN8 package information

Figure 15.WFDFPN8 (MLP8) – 8-lead, 2 x 3 mm, 0.5 mm pitch very very thin fine pitch
dual flat package outline
'
'
'DWXP<
$ % H
'
3LQ,'PDUNLQJ
3LQ

( (
(
6HH=
'HWDLO

[ DDD # .

1;E EEE - & $ %

[ DDD # 1'[H GGG - &
7RSYLHZ %RWWRPYLHZ

'DWXP<
 FFF #
&
HHH # $
6HDWLQJSODQH $
/ /

H
/ 6LGHYLHZ
H 7HUPLQDOWLS

'HWDLO³=´ $<B0(B9

1. Drawing is not to scale.

2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating
(not connected) in the end application.

DocID025850 Rev 6 35/40

39
Package mechanical data M24C08-A125

Table 15. WFDFPN8 (MLP8) – 8-lead, 2 x 3 mm, 0.5 mm pitch very thin fine pitch
dual flat package mechanical data
millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.

A 0.700 0.750 0.800 0.0276 0.0295 0.0315

A1 0.025 0.045 0.065 0.0010 0.0018 0.0026
b 0.200 0.250 0.300 0.0079 0.0098 0.0118
D 1.900 2.000 2.100 0.0748 0.0787 0.0827
E 2.900 3.000 3.100 0.1142 0.1181 0.1220
e - 0.500 - - 0.0197 -
L1 - - 0.150 - - 0.0059
L3 0.300 - - 0.0118 - -
D2 1.050 - 1.650 0.0413 - 0.0650
E2 1.050 - 1.450 0.0413 - 0.0571
K 0.400 - - 0.0157 - -
L 0.300 - 0.500 0.0118 - 0.0197
(2)
NX 8
(3)
ND 4
aaa - - 0.150 - - 0.0059
bbb - - 0.100 - - 0.0039
ccc - - 0.100 - - 0.0039
ddd - - 0.050 - - 0.0020
eee(4) - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to four decimal digits.
2. NX is the number of terminals.
3. ND is the number of terminals on “D” sides.
4. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.

36/40 DocID025850 Rev 6

M24C08-A125 Part numbering

10 Part numbering

Table 16. Ordering information scheme

Example: M24C08-D R MN 3 T P /K

Device type
M24 = I2C serial access EEPROM

Device function
C08-D = 8 Kbits (1024 x 8 bits) plus identification page

Operating voltage
R = VCC = 1.7 V to 5.5 V

Package(1)
MN = SO8 (150 mil width)
DW = TSSOP8 (169 mil width)
MF = WFDFPN8 (2 x 3 mm)

Device grade
3 = -40 to 125 °C. Device tested with high reliability certified flow (2)

Option
T = Tape and reel packing
blank = tube packing

Plating technology
P or G = ECOPACK2®

Process
/K = Manufacturing technology code
1. All packages are ECOPACK2® (RoHS compliant and free of brominated, chlorinated and antimonyoxide
flame retardants).
2. The high reliability certified flow (HRCF) is described in quality note QNEE9801. Please ask your nearest
ST sales office for a copy.

Note: For a list of available options (speed, package, etc.) or for further information on any aspect
of the devices, please contact your nearest ST sales office.

DocID025850 Rev 6 37/40

39
Part numbering M24C08-A125

Engineering samples
Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are
not yet qualified and therefore not yet ready to be used in production and any consequences
deriving from such usage will not be at ST charge. In no event, ST will be liable for any
customer usage of these engineering samples in production. ST Quality has to be contacted
prior to any decision to use these Engineering samples to run qualification activity.

38/40 DocID025850 Rev 6

M24C08-A125 Revision history

11 Revision history

Table 17. Document revision history

Date Revision Changes

17-Feb-2014 1 Initial release

Added note 2 on Figure 8.
05-May-2014 2
Updated Table 16: Ordering information scheme.
12-Aug-2014 3 Changed product maturity from Target spec to Preliminary data
Changed product maturity from Preliminary to Production data.
Updated Package information on Cover page.
16-Sep-2014 4 Updated Table 15: WFDFPN8 (MLP8) – 8-lead thin fine pitch dual flat
package no lead 2 x 3 mm, mechanical data and Table 16: Ordering
information scheme.
Updated:
– Note 2 on Table 5
07-Jan-2015 5 – Figure 8
– Table 12
Added sentence about Engineering sample on Section 10.
Updated:
– Features
15-Mar-2016 6
– Table 9: Cycling performance, Table 10: DC characteristics,
Table 16: Ordering information scheme

DocID025850 Rev 6 39/40

39
 M24C08-A125

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2016 STMicroelectronics – All rights reserved

40/40 DocID025850 Rev 6

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

STMicroelectronics:
M24C08-DRMF3TG/K M24C08-DRMN3TP/K M24C08-DRDW3TP/K