DWM3000

®
IEEE 802.15.4-z UWB Transceiver Module
Product Overview
The Qorvo® DWM3000 is a fully integrated Ultra-Wideband
(UWB) transceiver module based on the Qorvo® DW3110 IC.
It integrates antenna, all RF circuitry, power management and
clock circuitry in one module simplifying integration. It can be
used in 2-way ranging or TDoA location systems to locate assets
to a precision of 10 cm and supports data rates of up to
6.8 Mbps.

The DWM3000 is designed to be compliant to the FiRa™ PHY

and MAC specifications enabling interoperability with other
FiRa™ compliant devices.
24 Pin 23 x 13 mm side castellated package

Key Features
• IEEE 802.15.4-2015 and IEEE 802.15.4z BPRF compliant
Functional Block Diagram • Fully aligned with FiRa™ PHY, MAC and certification
development
• Supports UWB Channels 5 (6.5 GHz) and 9 (8 GHz)
• Programmable transmitter output power
• Fully coherent receiver for maximum range and accuracy
Ceramic • Designed to comply with FCC & ETSI UWB spectral masks
UWB • Supply voltage VDD3V3: 2.5 V – 3.6 V
antenna VDD1: 1.62 V – 3.6 V
• Low power consumption
• Data rates of 850 kbps, 6.8 Mbps
• Maximum packet length of 1023 bytes for high data
EXTON 1 24 VSS
throughput applications
WAKEUP 2 23 VSS • Integrated MAC support features
• SPI interface to host processor
RSTn 3 22 IRQ • Pin and pitch compatible with the DWM1000
R

GPIO7 4 21 VSS
Applications
VDD1 5 VDD1 20 SPICLK

VDD3V3 6 VDD2 DW3110 xtal 19 SPIMISO • Precision real time location systems (RTLS) using two-way
ranging or TDoA schemes in a variety of markets.
VDD3V3 7 DC-DC VDD3
EXTON
18 SPIMOSI • Location aware wireless sensor networks (WSNs)
VSS 8 17 SPICSn

9 10 11 12 13 14 15 16 Ordering Information
VSS
GPIO6

GPIO5

GPIO4

GPIO3

GPIO2

GPIO1

GPIO0

PART NUMBER DESCRIPTION

DWM3000SB 5 pcs bag
Top View
DWM3000SQ 25 pcs bag
DWM3000SR 100 pcs on a 7’’ reel
DWM3000TR13 500 pcs on a 13’’ reel
DWM3000EVB Evaluation board

DWM3000 Data Sheet Rev B, May 2021

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
Table of Contents

1 Overview ..............................................................3 4.1 Nominal Operating Conditions ..........................................13

4.2 DC Characteristics ...........................................................13
1.1 DWM3000 Functional Description ..................................... 3
4.3 Receiver AC Characteristics.............................................14
1.2 DWM3000 Power Up ........................................................ 3
4.4 Reference Clock AC Characteristics .................................14
1.3 SPI Host Interface............................................................. 5
4.4.1 Reference Frequency ............................................... 14
1.3.1 SPI Timing Parameters .............................................. 5
4.5 Transmitter AC Characteristics .........................................14
1.3.2 SPI Operating Modes ................................................. 6
4.6 Absolute Maximum Ratings ..............................................15
1.3.3 SPI Transaction Formatting ........................................ 7
1.4 General Purpose Input Output (GPIO) ............................... 8 5 Antenna Performance ......................................... 16
1.5 Always-On (AON) Memory ................................................ 8 6 Application Information ...................................... 19
1.6 One-Time Programmable (OTP) Memory .......................... 8
6.1 Application Board Layout Guidelines ................................19
1.7 Interrupts and Device Status ............................................. 8
6.2 Application Circuit Diagram ..............................................20
1.8 MAC ................................................................................. 8
6.3 GPIO and SPI I/O Internal Pull Up / Down ........................20
2 DWM3000 Calibration ...........................................9 7 Package Information .......................................... 21
2.1 Crystal Oscillator Trim ....................................................... 9
7.1 Module Drawings .............................................................21
2.2 Transmitter Calibration ...................................................... 9
7.2 Module Land Pattern........................................................22
2.3 Antenna Delay Calibration ................................................. 9
7.3 Module Marking Information .............................................22
3 DWM3000 Pin Connections................................. 10 7.4 Module Solder Profile.......................................................23
3.1 Pin Numbering .................................................................10 7.5 Tape and Reel Information ...............................................24
3.2 Pin Descriptions ...............................................................11 8 Glossary ............................................................. 25
4 Electrical Specifications ..................................... 13 9 Revision History ................................................. 26
10 Further Information ............................................ 26

List of Figures
Figure 1: Timing diagram for cold start POR ................4 Figure 10: Application Board Keep-Out Areas ........... 19
Figure 2: Timing diagram for warm start ......................4 Figure 11: Example DWM3000 Application Circuit ..... 20
Figure 3: SPI Timing Diagram.......................................5 Figure 12: SPI and GPIO Pull Up / Down .................... 20
Figure 4: SPI Detailed Timing Diagram.........................5 Figure 13: Module Package Size (mm) ....................... 21
Figure 5: DW3000 SPIPHA=0 Transfer Protocol ...........6 Figure 14: Module Land Pattern (units: mm) .............. 22
Figure 6: DW3000 SPIPHA=1 Transfer Protocol ...........7 Figure 15: Module Marking Information...................... 22
Figure 7: SPI Command Formatting .............................7 Figure 16: DWM3000 Module Solder Profile ............... 23
Figure 8: DWM3000 Pin Diagram ................................ 10 Figure 17: Module Carrier Dimension (mm) ................ 24
Figure 9: Carrier Board Dimensions and Radiation Figure 18: Module Tape Carrier Dimension (mm) ....... 24
Pattern Planes .............................................. 16

List of Tables
Table 1: SPI Timing Parameters ...................................6 Table 8: DWM3000 Transmitter AC Characteristics .... 14
Table 2: DWM3000 Pin Functions ............................... 11 Table 9: DWM3000 Absolute Maximum Ratings ......... 15
Table 3: Explanation of Abbreviations ....................... 12 Table 10 Antenna Radiation Patterns - Channel 5 ...... 17
Table 4: DWM3000 Operating Conditions ................... 13 Table 11 Antenna Radiation Patterns - Channel 9 ...... 18
Table 5: DWM3000 DC Characteristics ....................... 13 Table 12: Glossary of Terms ...................................... 25
Table 6: DWM3000 Receiver AC Characteristics ........ 14
Table 7: Reference Clock AC Characteristics ............. 14

DWM3000 Data Sheet Rev B, May 2021

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
1 Overview
The DWM3000 module is an IEEE 802.15.4-2011 and IEEE 802.15.4z (BPRF mode) UWB implementation. RF components, Qorvo
DW3110 UWB transceiver, and other components reside on-module. DWM3000 enables cost effective and reduced complexity
integration of UWB communications and ranging features, greatly accelerating design implementation.

1.1 DWM3000 Functional Description

The DW3110 on-board the DWM3000 is a fully integrated low-power, single chip CMOS RF transceiver IC. The DWM3000 module
requires no RF design as the antenna and associated analog and RF components are on the module.

The module contains an on-board 38.4 MHz reference crystal. The crystal has been trimmed in production to reduce the initial
frequency error to approximately 2 ppm, using the DW3110 IC’s internal on-chip crystal trimming circuit, see section 2.1.

Always-On (AON) memory can be used to retain DWM3000 configuration data during the lowest power operational states when the on-chip
voltage regulators are disabled. This data is uploaded and downloaded automatically. Use of DWM3000 AON memory is configurable.

The on-chip voltage and temperature monitors allow the host to read the voltage on the VDD1 pin and the internal die temperature
information from the DW3110.

See the DW3000 datasheet for more detailed information on device functionality, electrical specifications, and typical performance.

1.2 DWM3000 Power Up

DWM3000 is designed such that it can be powered in a number of different configurations depending on the application. These options
are described below. Figure 1 shows the power up sequence when external power sources are applied. The power supply design
should ensure that VDD2a/b and VDD3 are stable less than 10 ms after VDD1 (3.3 V) comes up, otherwise a device reset is required.

When the external power source is applied to the DWM3000 for the first time (cold power up), the internal Power On Reset (POR)
circuit compares the externally applied supply voltage (VDD1) to an internal power-on threshold (approximately 1.5 V), and once this
threshold is passed, the AON block is released from reset and the external device enable pin EXTON is asserted.

Then the VDD2a/b and VDD3 supplies are monitored and once they are above the required voltage as specified in the datasheet (2.2 V
and 1.4 V respectively), the fast RC oscillator (FAST_RC) and crystal (XTAL Oscillator) will come on within 500 µs and 1 ms respectively.

The DWM3000 digital core will be held in reset until the crystal oscillator is stable. Once the digital reset is de-asserted the digital core
wakes up and enters the INIT_RC state, (see Figure 1 and Figure 2). Then once the configurations stored in AON and OTP have been
restored (into the configuration registers) the device will enter IDLE_RC. Then the host can set the AINIT2IDLE configuration bit in
SEQ_CTRL and the IC will enable the CLKPLL and wait for it to lock before entering the IDLE_PLL state.

DWM3000 Data Sheet Rev B, May 2021

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module

Figure 1: Timing diagram for cold start POR

VDD1
POR

PORn/RSTn

EXTON
Comparators

VDD2/VDD3
Supply

VDD2/VDD3 OK

Fast Oscillator
Oscillators

XTAL Oscillator
<1 ms

DIG State OFF WAKEUP INIT_RC IDLE_RC IDLE_PLL

Digital Core

Sample GPIOs 5&6 to set ~70 µs

SPI mode OTP boot
Host interrupt (SPI comms
HOST IRQ
allowed @ 38 MHz)

ACTIVE States
AON Power up
(INIT_RC, IDLE_RC, IDLE_PLL, TX, RX)

Figure 2: Timing diagram for warm start

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
1.3 SPI Host Interface
The host interface to DWM3000 is a 4-wire SPI-compatible slave. The assertion of SPICSn low by the SPI master indicates the
beginning of a transaction.

The SPI interface is used to read and write registers in the DW3110 device. All data and address transfers on the SPI are most
significant bit first. All address bytes are transmitted with MSB first, and all data is transmitted commencing with lowest addressed byte.

• Assertion low of SPICSn initializes transaction.

• De-assertion high of SPICSn ends the SPI transaction.
• The device supports direct and per-byte sub-addressing access to the full register space.
• Efficient block data reading / writing is allowed. Continuous, long transactions can be carried out while the addressed location
is auto incremented on the DW3110 side.

The SPIMISO I/O is required to go open-drain when SPICSn is de-asserted, to allow interoperation with other slaves on the SPI bus. SPI
daisy chaining is not supported. This is the mode where the MISO, MOSI lines are passed through a device when it is not chip selected.

1.3.1 SPI Timing Parameters

The SPI slave complies with the Motorola SPI protocol within the constraints of the timing parameters listed in Table 1 and illustrated in
Figure 3 and Figure 4.

SPICSn

SPICLK

SPIMISO Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit 7 Bit 6 Bit 5

SPIMOSI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5

t6
t7 t5 t8
t9

Figure 3: SPI Timing Diagram

SPICSn

SPICLK

SPIMISO Bit 7 Bit 6 Bit 5

SPIMOSI 7 6 5

t3 t4
t1 t2

Figure 4: SPI Detailed Timing Diagram

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
Table 1: SPI Timing Parameters

Parameter Min. Typ. Max. Unit Description

t1 3 ns SPI select asserted low to valid slave output data.
t2 3 ns SPICLK low to valid slave output data.
t3 14 ns Master data setup time.
t4 2 ns Master data hold time.
t5 27 ns LSB last byte to MSB next byte.
t6 3 ns SPICSn de-asserted high to MISO tristate.
t7 14 ns Start time; time from select asserted to first SPICLK.
t8 24 ns Last SPICLK to SPICSn de-asserted.
t9 24 ns Idle time between consecutive accesses.
t10 38 MHz SPI CLK Fmax @1.8 V VDD1, 25C, SPI mode 0.

1.3.2 SPI Operating Modes

Both clock polarities (SPIPOL=0/1) and phases (SPIPHA=0/1) are supported, as defined in the Motorola SPI protocol. The DW3110
transfer protocols for each SPIPOL and SPIPHA setting are given in Figure 5 and Figure 6.

Cycle 8*Number of
1 2 3 4 5 6 7 8 9
bytes
Number, #

SPIPOL=0, SPIPHA=0

SPICLK

SPIPOL=1, SPIPHA=0

SPICLK

SPICSn

SPIMISO z MSB 6 5 4 3 2 1 LSB MSB LSB X Z

SPIMOSI z MSB 6 5 4 3 2 1 LSB MSB LSB X Z

Figure 5: DW3000 SPIPHA=0 Transfer Protocol

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
Cycle 8*Number of
1 2 3 4 5 6 7 8 9
Number, # bytes

SPIPOL=0, SPIPHA=1

SPICLK

SPIPOL=1, SPIPHA=1

SPICLK

SPICSn

SPIMISO z X MSB 6 5 4 3 2 1 LSB MSB LSB Z

SPIMOSI z X MSB 6 5 4 3 2 1 LSB MSB LSB Z

Figure 6: DW3000 SPIPHA=1 Transfer Protocol

1.3.3 SPI Transaction Formatting

The SPI command structure allows for 4 different types of SPI command:

1. Fast, single byte commands. Up to 32 unique commands such as “TX now”, “TX/RX Off”.
2. Fast addressed mode. Allowing for read and write addressing to 32 master addresses. This command structure is padded by a
trailing bit to allow the SPI address decoder time to fetch any read data. The length of the read is determined by the length of
the SPI transaction.
3. Full addressed mode. Allowing for read and write addressing to 32 master addresses and up to 128-byte offset addressing.
This command structure is padded by a trailing bit to allow the SPI address decoder time to fetch any read data. The length of
the read or write is determined by the length of the SPI transaction.
4. Masked write transaction. These are intended to simplify read-modify-write operations by allowing the host to write to an
address and apply a set, clear or toggle mask to 1, 2, or 4 bytes. The SPI command decoder then carries out the required
read-modify-write instructions internally.
Bit count
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
MSB byte0 LSB MSB byte1 LSB
RD 8/
/ Mode bits (M1, M0):
16
WR ADD 00 = RD/WR
01= WR: AND/OR 8-bit
Fast 10 = WR: AND/OR 16-bit
command 1 0 Fast Command 1 11 = WR: AND/OR 32-bit
transaction

Short addressed 1/ byte0[5:1]

0 0 X octet data
transaction 0 5-bit base address

byte0[0]
sub-address [6] M1 M0
Full
addressed 1/ byte0[5:1] byte1[7:2]
transaction 1 0 0 X octet data
0 5-bit base address sub-address [5:0]

byte0[5:1] byte1[7:2]
1 1 0 1 1 octet AND mask 1 octet OR mask
5-bit base address sub-address [5:0]

Masked write byte0[5:1] byte1[7:2]

1 1 1 0 2 octet AND mask 2 octet OR mask
transaction 5-bit base address sub-address [5:0]

byte0[5:1] byte1[6:0]
1 1 1 1 4 octet AND mask 4 octet OR mask
5-bit base address 7-bit sub-address

Figure 7: SPI Command Formatting

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
1.4 General Purpose Input Output (GPIO)
The DWM3000 provides 8 configurable pins.

On reset, all GPIO pins default to input. GPIO inputs, when appropriately configured, are capable of generating interrupts to the host
processor via the IRQ signal.

See DW3000 datasheet and DW3000 user manual for full details of the configuration and use of the GPIO lines.

1.5 Always-On (AON) Memory

Configuration retention in lowest power states is enabled in DWM3000 by provision of an Always-On (AON) memory array with a
separate power supply, VDD1. The DWM3000 may be configured to upload its configuration to AON before entering a low-power state
and to download the configuration when waking up from the low–power state.

1.6 One-Time Programmable (OTP) Memory

The DWM3000 contains a 128x32-bit user programmable OTP memory that is used to store per chip calibration information.

1.7 Interrupts and Device Status

DWM3000 has a number of interrupt events that can be configured to drive the IRQ output pin. The default IRQ pin polarity is active
high. A number of status registers are provided in the system to monitor and report data of interest. See DW3000 user manual for a full
description of system interrupts and their configuration and of status registers.

1.8 MAC
A number of MAC features are implemented including CRC generation, CRC checking and receive frame filtering. See the DW3000
datasheet and DW3000 user manual for full details.

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
2 DWM3000 Calibration
Depending on the end-use applications and the system design, DWM3000 settings may need to be tuned. To help with this tuning a
number of built-in functions such as continuous wave TX and continuous frame transmission can be enabled. See the DW3000 user
manual for further details.

The DWM3000 has crystal oscillator trimmed during module production but no transmit power or antenna delay calibration.

2.1 Crystal Oscillator Trim

DWM3000 modules are calibrated at production at room temperature to minimise initial frequency error to reduce carrier frequency
offset between modules and thus improve receiver sensitivity. The calibration carried out at module production will trim the initial
frequency offset to less than 2 ppm, typically.

2.2 Transmitter Calibration

In order to maximize range, DWM3000 transmit power spectral density (PSD) should be set to the maximum allowable for the
geographic region in which it will be used. For most regions this is -41.3 dBm/ MHz.

As the module contains an integrated antenna, the transmit power can only be measured over the air. The Effective Isotropic Radiated
Power (EIRP) must be measured, and the power level adjusted to ensure compliance with applicable regulations.

The DWM3000 provides the facility to adjust the transmit power in coarse and fine steps; 2 dB and 0.5 dB nominally. It also provides
the ability to adjust the spectral bandwidth. These adjustments can be used to maximize transmit power whilst meeting regulatory
spectral mask.

If required, transmit calibration should be carried out on a per DWM3000 module basis, see DW3000 user manual for full details.

2.3 Antenna Delay Calibration

In order to measure range accurately, precise calculation of timestamps is required. To do this the antenna delay must be known. The
DWM3000 allows this delay to be calibrated and provides the facility to compensate for delays introduced by PCB, external
components, antenna and internal DWM3000 delays.

To calibrate the antenna delay, range is measured at a known distance using two DWM3000 systems. Antenna delay is adjusted until
the known distance and reported range agree. The antenna delay can be stored in OTP memory.

Antenna delay calibration must be carried out as a once-off measurement for each DWM3000 design implementation. If required, for greater
accuracy, antenna delay calibration should be carried out on a per DWM3000 module basis, see DW3000 user manual for full details.

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
3 DWM3000 Pin Connections

3.1 Pin Numbering

DWM3000 module pin assignments are as follows (viewed from top):

UWB
Chip
Antenna

EXTON 1 24 VSS

WAKEUP 2 23 VSS

RSTn 3 22 GPIO8

GPIO7 4 21 VSS
VDD1 5 20 SPICLK
VDD3V3 6 19 SPIMISO
VDD3V3 7 18 SPIMOSI

VSS 8 17 SPICSn
9
GPIO5 10

GPIO4 11

GPIO3 12
GPIO2 13
GPIO1 14

GPIO0 15

VSS 16
GPIO6

Figure 8: DWM3000 Pin Diagram

DWM3000 Data Sheet Rev B, May 2021

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
3.2 Pin Descriptions
Table 2: DWM3000 Pin Functions

Signal I/O
Pin Description
Name (Default)
Digital Interface
SPICLK 20 DI SPI clock
DO
SPIMISO 19 SPI data output.
(O–L)
SPIMOSI 18 DI SPI data input.
SPI chip select. This is an active low enable input. The high-to-low transition on
SPICSn 17 DI SPICSn signals the start of a new SPI transaction. SPICSn can also act as a
wake-up signal to bring DW3110 out of either SLEEP or DEEPSLEEP states.
When asserted into its active high state, the WAKEUP pin brings the DW3110 out
WAKEUP 2 DIO of SLEEP or DEEPSLEEP states into operational mode.
If unused, this pin can be tied to ground.
External device enable. Asserted during wake-up process and held active until
DO device enters sleep mode. Can be used to control external DC-DC converters or
EXTON 1
(O-L) other circuits that are not required when the device is in sleep mode so as to
minimize power consumption.
Interrupt Request output from the DWM3000 to the host processor. By default,
IRQ is an active-high output but may be configured to be active low if required.
For correct operation in SLEEP and DEEPSLEEP modes it should be configured
DIO for active high operation. This pin will float in SLEEP and DEEPSLEEP states and
GPIO8 / IRQ 22 may cause spurious interrupts unless pulled low externally (100 kΩ
(O-L)
recommended).
When the IRQ functionality is not being used the pin may be reconfigured as a
general purpose I/O line, GPIO8.
GPIO7 / DIO Defaults to operate as a SYNC input. This pin may be reconfigured as a general
4
SYNC (I) purpose I/O pin under software control.
General purpose I/O pin.
GPIO6 / On power-up it acts as the SPIPHA (SPI phase selection) pin for configuring the
DIO
EXTRXE / 9 SPI mode of operation.
SPIPHA (I)
After power-up, the pin will default to a General Purpose I/O pin.
On engineering samples E1.0 GPIO6 is on pin 10.
General purpose I/O pin.
GPIO5 / On power-up it acts as the SPIPOL (SPI polarity selection) pin for configuring the
DIO
EXTTXE / 10 SPI operation mode.
SPIPOL (I)
After power-up, the pin will default to a General Purpose I/O pin.
On engineering samples E1.0 GPIO5 is on pin 9.
DIO
GPIO4 11 General purpose I/O pin.
(I)
General purpose I/O pin.
GPIO3 / DIO
12 It may be configured for use as a TXLED driving pin that can be used to light a
TXLED (I)
LED following a transmission.
General purpose I/O pin.
GPIO2 / DIO
13 It may be configured for use as a RXLED driving pin that can be used to light a
RXLED (I)
LED during receive mode.

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
Signal I/O
Pin Description
Name (Default)
General purpose I/O pin.
GPIO1 / DIO
14 It may be configured for use as a SFDLED driving pin that can be used to light a
SFDLED (I)
LED when SFD (Start Frame Delimiter) is found by the receiver.
General purpose I/O pin.
GPIO0 / DIO
15 It may be configured for use as a RXOKLED driving pin that can be used to light a
RXOKLED (I)
LED on reception of a good frame.
DIO Reset pin. Active Low Output.
RSTn 3
(O-H) May be pulled low by external open drain driver to reset the DW3000.
Power Supplies
VDD1 5 P External supply for the Always-On (AON) portion of the chip.
VDD3V3 6,7 P 3 V supply pins.
Ground
GND 8,16, 21,23,24 G Common ground.

Table 3: Explanation of Abbreviations

Abbreviation Explanation
I Input
IO Input / Output
O Output
G Ground
P Power Supply
PD Power Decoupling
O-L Defaults to output, low level after reset
O-H Defaults to output, high level after reset
I Defaults to input.
Note: Any signal with the suffix ‘n’ indicates an active low signal.

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module
4 Electrical Specifications
4.1 Nominal Operating Conditions
Table 4: DWM3000 Operating Conditions

Parameter Min. Typ. Max. Units Condition / Note

Operating temperature -40 +85 ˚C
Supply voltage VDD1 1.62 3.6 V
Supply voltage VDD3V3 2.5 3.6 V
Voltage on digital pins 3.6 V

Note: Unit operation is guaranteed by design when operating within these ranges

4.2 DC Characteristics

Tamb = 25 ˚C, all supplies centered on typical values

Table 5: DWM3000 DC Characteristics

Parameter Min. Typ. Max. Units Condition / Note

Supply current DEEP SLEEP mode 260 nA
Supply current SLEEP mode 850 nA
Supply current CH5 IDLE mode 12 mA Total current drawn from all
Supply current CH9 IDLE mode 20 mA supplies.
Supply current CH5 INIT mode 6 mA
Supply current CH9 INIT mode 6 mA
CH5 TX: 3.3 V supplies
40 mA
(VDD1, VDD3V3)
CH9 TX: 3.3 V supplies
45 mA
(VDD1, VDD3V3)
CH5 RX: 3.3 V supplies Receiver active, no frames
50 mA
(VDD1, VDD3V3) received
CH9 RX: 3.3 V supplies Receiver active, no frames
55 mA
(VDD1, VDD3V3) received
Digital input voltage high 0.7*VDD1 V
Digital input voltage low 0.3*VDD1 V
Digital output voltage high 0.7*VDD1 V Assumes 500 Ω load
Digital output voltage low 0.3*VDD1 V Assumes 500 Ω load
Digital Output Drive Current GPIOx, IRQ 0.8 mA
Digital Output Drive Current SPIMISO 8 10 mA
Digital Output Drive Current EXTON 3 4 mA

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 DWM3000
®
IEEE 802.15.4-z UWB Transceiver Module

4.3 Receiver AC Characteristics

Tamb = 25 ˚C, all supplies centered on nominal values

Table 6: DWM3000 Receiver AC Characteristics

Parameter Min. Typ. Max. Units Condition / Note

Centre Frequency CH5 6489.6
Centre Frequency CH9 7987.2 MHz
Channel bandwidth 500 Channel 5 and 9

4.4 Reference Clock AC Characteristics

Tamb = 25 ˚C, all supplies centered on typical values

4.4.1 Reference Frequency

Table 7: Reference Clock AC Characteristics

Parameter Min. Typ. Max. Units Condition / Note

On-board crystal oscillator reference frequency 38.4 MHz

On-board crystal aging ±1 ppm in 1st year

4.5 Transmitter AC Characteristics

Tamb = 25 ˚C, all supplies centered on typical values

Table 8: DWM3000 Transmitter AC Characteristics

Parameter Min. Typ. Max. Units Condition / Note

Frequency range 6250 8250 MHz
Channel Bandwidths 500 MHz Channel 5 and 9

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
4.6 Absolute Maximum Ratings

Table 9: DWM3000 Absolute Maximum Ratings

Parameter Min. Max. Units

Voltage
-0.3 4.0 V
VDD3V3 / VDD1
Receiver Power 0 dBm
Temperature - Storage temperature -40 +125 ˚C
Temperature - Operating temperature -40 +85 ˚C
ESD (Charged Device Model) 1000 V

Stresses beyond those listed in this table may cause permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions beyond those indicated in the operating conditions of the specification is not implied.
Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

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5 Antenna Performance
This section presents antenna radiation patterns for the DWM3000. As is illustrated in Figure 9, measured radiation patterns were made
with the module mounted on a DWM3000EVB evaluation board.

Table 10 and Table 11 show antenna radiation patterns in channels 5 and 9, respectively. Three planes in spherical space about the
centre of the board are measured, with theta and phi plots representing perpendicular polarisations.

The DWM3000 antenna is vertically polarised, meaning that the module is intended to be positioned vertically upright when used in an
RTLS system. An omnidirectional radiation pattern is seen in the XZ plane when observed by another antenna which is also vertically
polarised. This is shown in the XZ plane antenna patterns, where the vertically polarised plot, phi, has a circular, or omnidirectional
shape.

If the antennas are oriented perpendicular relative to each other, then the polarisation changes. In this case, the horizontally polarised
pattern, theta, applies and there are nulls at certain angles which can limit range and introduce location inaccuracy.

y
UW B0 B

Figure 9: Radiation Pattern Planes

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Table 10: Antenna Radiation Patterns - Channel 5
Planes: Antenna Gain (dBi) vs. Angle (°)

XZ Plane 0
344 352 5 8 16
336 24
328 0 32
320 40
312 -5 48
304 -10 56
296 64
UW B0 B

-15
180° 288 72
-20
280 80
-25
270° 272
-30
88

264 96
Phi 90° 256 104
248 112
240 120
232 128
0° 224 136
Theta 216 144
208 152
200 160
192 184 176 168

XY Plane 0
344 352 5 8 16
336 24
90° 328 0 32
320 40
312 -5 48
304 -10 56
296 -15 64
180° 288
-20
72

280 80
-25
272 88
-30
Phi Theta 264 96

256 104
248 112
0°
240 120
232 128
224 136
216 144
208 152
200 160
192 184 176 168
270°

YZ Plane 0
344 352 5 8 16
336 24
328 0 32
320 40
312 -5 48
180° 304 -10 56
296 -15 64
288 72
-20
280 80
90° -25
272 88
-30
270° 264 96
Phi
256 104
248 112
240 120

0° Theta 232
224 136
128

216 144
208 152
200 160
192 184 176 168

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Table 11: Antenna Radiation Patterns - Channel 9

Planes: Antenna Gain (dBi) vs. Angle (°)

XZ Plane 0
344 352
5.00 8 16
336 24
328 0.00 32
320 40
312 -5.00 48
304 -10.00 56
296 64
UW B0 B

-15.00
180° 288 72
-20.00
280 80
-25.00
270° 272
-30.00
88

264 96
Phi 90° 256 104
248 112
240 120
232 128
0° 224 136
Theta 216 144
208 152
200 160
192 184 176 168

XY Plane
0
344 352
5.00 8 16
90° 336 24
328 0.00 32
320 40
312 -5.00 48
304 -10.00 56
296 -15.00 64
180° 288 72
-20.00
280 80
-25.00
272 88
Phi Theta
-30.00
264 96

256 104
248 112
0°
240 120
232 128
224 136
216 144
208 152
200 160
192 184 176 168
270°

YZ Plane 344 352

0
8 16
5.00
336 24
328 0.00 32
320 40
312 -5.00 48
304 -10.00 56
296 -15.00 64

180° 288
-20.00
72

280 80
-25.00
272 88
-30.00
90° 264 96

256 104
270°
Phi 248 112
240 120
232 128
224 136
216 144
0° Theta 208
200 160
152
192 184 176 168

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6 Application Information

6.1 Application Board Layout Guidelines

When designing the PCB onto which DWM3000 will be soldered, the proximity of the DWM3000 on-board ceramic monopole antenna to
metal and other non-RF transparent materials needs to be considered carefully. Two suggested placement schemes are shown below.

For best RF performance, ground copper should be flooded in all areas of the application board, except in the areas marked
“Keep-Out Area”, where there should be no metal either side, above or below (e.g., do not place battery under antenna).

The placement schemes in Figure 10 show an application board with no non-RF transparent material in the keep-out area, or an
application board with the antenna projecting off of the board so that the keep out area is in free-space. In this second scheme it is still
important not to place metal components above or below the antenna in a system implementation. It is also important to note that the
ground plane on the application board affects the DWM3000 antenna radiation pattern. In Figure 10 below, ‘d’ should ideally be 10 mm.
This gives the most vertically polarized radiation pattern. As ‘d’ is increased from 10 mm the degree of vertical polarization reduces.

d d

Keep-Out Antenna Keep-Out Antenna

Area Area
d d

DWM3000 DWM3000

Application Board Application Board

Figure 10: Application Board Keep-Out Areas

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6.2 Application Circuit Diagram

A simple application circuit integrating the DWM3000 module need only power the device and connect the device to a host controller,
see Figure 11.

UWB
Chip
Antenna
DWM3000_RSTn
24 VSS DWM3000_RSTn
EXTON 1
Open Drain
23 VSS GPIO
WAKEUP 2

RSTn 3 22 IRQ / GPIO8

Optional pulldown

+3.3 V
GPIO7 4 21 VSS 100 k on IRQ to prevent
spurious Host
VDD1 5 DWM3000 20 SPICLK GND interrupts

VDD3V3 6 19 SPIMISO
uProcessor
VDD3V3 7 18 SPIMOSI

VSS 8 17 SPICSn
GPIO5 10

GPIO4 11

GPIO3 12

GPIO2 13

GPIO1 14

GPIO0 15
9

VSS 16
GPIO6

GND

Figure 11: Example DWM3000 Application Circuit

6.3 GPIO and SPI I/O Internal Pull Up / Down

All of the GPIO pins have a software controllable internal pull up/down resistor to ensure safe operation when input pins are not driven.
This defaults to enabled and pull-down except for the SPICSn pin which defaults to pull-up. The value of the pull-up / down will vary
with the VDD1 supply voltage over a range from 10 kΩ to 30 kΩ.
VDD1
30kOhm (1.8V)

SPICSn

SPIMOSI

30kOhm (1.8V)
SPI PORT

Host
SPICLK Controller
DW3000
30kOhm (1.8V)

SPIMISO
AON IO

IRQ
GPIO(x)

30kOhm (1.8V)

DIG IO

Figure 12: SPI and GPIO Pull Up / Down

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7 Package Information

7.1 Module Drawings

Figure 13: Module Package Size (mm)

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7.2 Module Land Pattern

The diagram below shows the DWM3000 module land pattern.

22.7
Figure 14: Module Land Pattern (units: mm)

7.3 Module Marking Information

The module is identified by a sticker on the shield can which gives the part number and serial number as follows:
“YY” is year, “WW” is calendar week number (week code per ISO-8601), “3” is DWM3000, SSSSS is serial number: 00001, 00002…….
7.00 mm

9.00 mm

Figure 15: Module Marking Information

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
7.4 Module Solder Profile

Figure 16: DWM3000 Module Solder Profile

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
7.5 Tape and Reel Information

Figure 17: Module Carrier Dimension (mm)

Figure 18: Module Tape Carrier Dimension (mm)

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
8 Glossary
Table 12: Glossary of Terms

Abbreviation Full Title Explanation

The amount of power that a theoretical isotropic antenna (which evenly distributes power in
Equivalent Isotropic
EIRP all directions) would emit to produce the peak power density observed in the direction of
Radiated Power
maximum gain of the antenna being used.
European
Regulatory body in the EU charged with the management of the radio spectrum and the
ETSI Telecommunication
setting of regulations for devices that use it.
Standards Institute
Federal
Regulatory body in the USA charged with the management of the radio spectrum and the
FCC Communications
setting of regulations for devices that use it.
Commission
General Purpose Pin of an IC that can be configured as an input or output under software control and has no
GPIO
Input / Output specifically identified function.
Institute of
Is the world’s largest technical professional society. It is designed to serve professionals
Electrical and
IEEE involved in all aspects of the electrical, electronic and computing fields and related areas of
Electronic
science and technology.
Engineers
Phase Locked Circuit designed to generate a signal at a particular frequency whose phase is related to an
PLL
Loop incoming “reference” signal.
Used to quantify very small relative proportions. Just as 1% is one out of a hundred, 1 ppm
PPM Parts Per Million
is one part in a million.
Generally used to refer to signals in the range of 3 kHz to 300 GHz. In the context of a
RF Radio Frequency radio receiver, the term is generally used to refer to circuits in a receiver before
down-conversion takes place and in a transmitter after up-conversion takes place.
Real Time Location
RTLS System intended to provide information on the location of various items in real-time.
System
Start of Frame
SFD Defined in the context of the IEEE 802.15.4-2011 standard.
Delimiter
Serial Peripheral An industry standard method for interfacing between IC’s using a synchronous serial
SPI
Interface scheme first introduced by Motorola.
Temperature
A crystal oscillator whose output frequency is very accurately maintained at its specified
TCXO Controlled Crystal
value over its specified temperature range of operation.
Oscillator
Method of measuring the physical distance between two radio units by exchanging
TWR Two Way Ranging messages between the units and noting the times of transmission and reception. Refer to
Qorvo’s website for further information.
Method of deriving information on the location of a transmitter. The time of arrival of a
transmission at two physically different locations whose clocks are synchronized is noted
Time Difference of and the difference in the arrival times provides information on the location of the
TDoA
Arrival transmitter. A number of such TDoA measurements at different locations can be used to
uniquely determine the position of the transmitter. Refer to Qorvo’s website for further
information.
UWB Ultra-Wideband A radio scheme employing channel bandwidths of, or in excess of, 500 MHz.
Wireless Sensor A network of wireless nodes intended to enable the monitoring and control of the physical
WSN
Network environment.

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
9 Revision History

Revision Change Description

A Preliminary version

B May 2021 Updated for production release, completion of outstanding information.

10 Further Information
Qorvo develops semiconductors solutions, software, modules, reference designs - that enable real-time, ultra-accurate, ultra-reliable
local area micro-location services. Qorvo’s technology enables an entirely new class of easy to implement, highly secure, intelligent
location functionality and services for IoT and smart consumer products and applications.

For further information on this or any other Qorvo product, please refer to our website www.qorvo.com.

Handling Precautions

Parameter Rating Standard

ESD - Charged Device Model (CDM) 1000V ANSI/ESDA/JEDEC JS-002 Caution!
ESD-Sensitive Device
MSL – Moisture Sensitivity Level Level 3 IPC/JEDEC J-STD-020

Regulatory Approvals
The DWM3000, as supplied from Qorvo, has not been certified for use in any particular geographic region by the appropriate regulatory
body governing radio emissions in that region although it is capable of such certification depending on the region and the manner in
which it is used.

All products developed by the user incorporating the DWM3000 must be approved by the relevant authority governing radio emissions
in any given jurisdiction prior to the marketing or sale of such products in that jurisdiction and user bears all responsibility for obtaining
such approval as needed from the appropriate authorities.

RoHS Compliance
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment) as amended by Directive 2015/863/EU.

This product also has the following attributes:

• Antimony Free
• TBBP-A (C15H12Br402) Free
• SVHC Free

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 DWM3000
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IEEE 802.15.4-z UWB Transceiver Module
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.qorvo.com
Tel: 1-844-890-8163
Email: customer.support@qorvo.com

Important Notice
The information contained in this Data Sheet and any associated documents (“Data Sheet Information”) is believed to be reliable; however, Qorvo makes no warranties
regarding the Data Sheet Information and assumes no responsibility or liability whatsoever for the use of said information. All Data Sheet Information is subject to change
without notice. Customers should obtain and verify the latest relevant Data Sheet Information before placing orders for Qorvo® products. Data Sheet Information or the use
thereof does not grant, explicitly, implicitly or otherwise any rights or licenses to any third party with respect to patents or any other intellectual property whether with regard to
such Data Sheet Information itself or anything described by such information.

DATA SHEET INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY
DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF
PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE. Without limiting the generality of the foregoing, Qorvo® products are not warranted or authorized for use as critical components in medical, life-saving, or life-
sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Applications described in the Data Sheet
Information are for illustrative purposes only. Customers are responsible for validating that a particular product described in the Data Sheet Information is suitable for use in a
particular application.

FiRa, FiRa Consortium, the FiRa logo, the FiRa Certified logo, and FiRa tagline are trademarks or registered trademarks of FiRa Consortium or its licensor(s)/ supplier(s) in
the US and other countries and may not be used without permission. All other trademarks, service marks, and product or service names are trademarks or registered
trademarks of their respective owners.

© 2021 Qorvo US, Inc. All rights reserved. This document is subject to copyright laws in various jurisdictions worldwide and may not be reproduced or distributed, in whole or
in part, without the express written consent of Qorvo US, Inc. | QORVO® is a registered trademark of Qorvo US, Inc.

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