Title Page

APPLIED MATERIALS

Producer SE
PECVD Operations and Programming

March 2002 Revision 001

 Pub History

Confidentiality Notice

The materials and information contained herein are being provided by Applied Materials
to its Customer solely for Customer’s use for its internal business purposes.
Applied Materials retains all right, title, interest in and copyrights to the materials and
information herein. The materials and information contained herein constitute
confidential information of Applied Materials and Customer shall not disclose or
transfer any of these materials or information to any third party.

PUBLICATION HISTORY

Revision: 001
Date: March 2002
Document Project Number 207-023-01

3050 Bowers Avenue

Santa Clara, California 95054
_________________

U.S. and Foreign Patents Pending

Applied Materials, the Applied Materials logo, Centura, Precision 5000, and Producer,
are registered trademarks of Applied Materials, Inc. in the U.S. and other countries;
Black Diamond, BLOk, DARC, DCVD, DxZ, Giga-Fill, GPLIS, µClean, Optima,
Precision Liquid Injection System, Producer QA, Remote Clean, SACVD, and Twin Chamber
are trademarks of Applied Materials, Inc. in the U.S. and other countries

Copyright  Applied Materials, Inc., 2002

3050 Bowers Avenue
Santa Clara, California 95054

All rights reserved. No part of this book may be reproduced in any form
without written permission from Applied Materials, Inc.
Trademarks

The following registered trademarks are some of the trademarks used in

Applied Materials manuals.

Name Owner

Baratron Registered trademark of MKS Instruments, Inc.

Cajon Registered trademark of Swagelok Company
Conflat Registered trademark of Varian Associates, Inc.
Convectron Registered trademark of Granville-Phillips Company
DRYVAC Registered trademark of Leybold Vacuum Products Inc.
FastRegen Trademark of the CTI Cryogenics, Inc.
Freon Registered trademark of E.I. DuPont de Nemours & Co., Inc.
Kalrez Registered trademark of E.I. DuPont de Nemours & Co., Inc.
Kovar Registered trademark of Westinghouse Electric Corporation
Krytox Registered trademark of E.I. DuPont de Nemours & Co., Inc.
Lucite Registered trademark of E.I. DuPont de Nemours & Co., Inc.
Procomm Registered trademark of DATASTORM Technologies Inc.
Pyrex Registered trademark of Corning Glass Works
Q-tip Registered trademark of Cheseborough Ponds
RUVAC Registered trademark of Leybold Vacuum Products Inc.
Snap-Loc Registered trademark of Nor-Cal Products, Inc.
Swagelok Registered trademark of Swagelok Company
Scotch-Brite Registered trademark of 3M Corporation
Teflon Registered trademark of E.I. DuPont de Nemours & Co., Inc.
TRIVAC Registered trademark of Leybold Vacuum Products Inc.
Unival Registered trademark of Unival Company
VCR Registered trademark of The Swagelok Company
VCO Registered trademark of The Swagelok Company
Vespel Registered trademark of DuPont de Nemours & Co., Inc.

Viton Registered trademark of E.I. DuPont de Nemours & Co., Inc.
X-Acto Registered trademark of Hunt Manufacturing Co.
APPLIED MATERIALS  Producer SE PECVD Operations and Programming C-i

Table of Contents

Title Page

P Preface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P-1
P.1 Manual Error Reporting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P-1

1 Safety. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

2 Document Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

2.1 Acronym List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2 Software Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
2.3 Chapter Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
2.4 Screen Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10
2.5 Buffer Chamber and Transfer Chamber . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

3 User Interface Conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

3.1 Operator Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2 Screen Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.3 Color Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.4 Events and Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11

4 Basic Operation Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

4.1 System Powerup and Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.1.1 System Powerdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.1.2 System Powerup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2 User Login and Logout Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.1 Login Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.2 Logout Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.3 Process Run Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.4 File Management Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.1 Copying Process Recipes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.2 Copying Wafer Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.3 Installing System Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.4.4 Retrieving System Information for Troubleshooting . . . . . . . . . . . . . . 4-20
4.5 Error Recovery Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
4.5.1 Process Error Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22
4.5.2 Wafer Handling Error Recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-22

5 System Header Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

5.1 System Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.2 Control System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.2.1 Chamber Cleans Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
5.3 Monitor Wafers Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
5.3.1 Device-Specific Windows in Work Area . . . . . . . . . . . . . . . . . . . . . . . 5-12
5.3.1.1 Chamber Summary Window . . . . . . . . . . . . . . . . . . . . . . 5-12
5.3.1.2 Loadlock Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . 5-14
5.3.1.3 Cooling Station Detailed Window. . . . . . . . . . . . . . . . . . . 5-15
5.3.1.4 Cassette Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . 5-16
5.4 Monitor Interlocks Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18

6 Chamber Header Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1

6.1 Ch (Chamber) Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
6.2 Monitor Chamber Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4

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6.2.1 Device-Specific Windows in Work Area . . . . . . . . . . . . . . . . . . . . . . . 6-10

6.2.1.1 Gas Panel Detailed Window . . . . . . . . . . . . . . . . . . . . . . 6-11
6.2.1.2 Interlock Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . 6-12
6.2.1.3 Lifts Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13
6.2.1.4 Recipe Control Detailed Window . . . . . . . . . . . . . . . . . . . 6-14
6.2.1.5 Reactor Laminar Flow (RLF) Detailed Window . . . . . . . . 6-16
6.2.1.6 RPS (Remote Clean) Detailed Window . . . . . . . . . . . . . . 6-18
6.2.1.7 HF RF Generator Detailed Window . . . . . . . . . . . . . . . . . 6-20
6.2.1.8 LF RF Generator Detailed Window . . . . . . . . . . . . . . . . . 6-22
6.2.1.9 Heater Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
6.2.1.10 Heat Exchanger Detailed Window . . . . . . . . . . . . . . . . . . 6-25
6.2.1.11 Throttle Valve Detailed Window. . . . . . . . . . . . . . . . . . . . 6-26
6.2.1.12 Pump Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . 6-27
6.3 Monitor Process Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-28
6.4 Leak Rate Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-32
6.4.1 Leak Rate Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-34
6.5 Gas Panel Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36
6.5.1 Monitor Gas Panel Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36
6.5.1.1 Stick Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-40
6.5.1.2 MFC Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46
6.5.2 Set Up Gas Panel Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-48
6.5.3 Service Gas Panel Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-50
6.5.4 Calibrate Gas Panel Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-54
6.6 RF Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-58
6.7 Lift Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-60
6.8 Endpoint Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-62

7 Mainframe (MF) Header Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1

7.1 MF Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
7.2 Monitor Mainframe Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
7.2.1 Device-Specifc Windows in Work Area . . . . . . . . . . . . . . . . . . . . . . . 7-8
7.2.1.1 Buffer Robot Detailed Window. . . . . . . . . . . . . . . . . . . . . 7-8
7.2.1.2 Wafer Detect Detailed Window . . . . . . . . . . . . . . . . . . . . 7-12
7.2.1.3 Indexer Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . 7-16

8 Factory Interface (FI) Header Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1

8.1 FI Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
8.2 Monitor FI Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
8.2.1 Device-Specifc Windows in Work Area . . . . . . . . . . . . . . . . . . . . . . . 8-6
8.2.1.1 FI Robot Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . 8-6
8.2.1.2 Cooling Station Detailed Window. . . . . . . . . . . . . . . . . . . 8-7
8.2.1.3 Cassette Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . 8-8

9 Go To Header Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1

9.1 Go To Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
9.2 Event Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4
9.3 Setup Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-6
9.3.1 Events Configuration for Alarm Line Screen. . . . . . . . . . . . . . . . . . . . 9-6
9.3.2 Set Up Signal Tower Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
9.3.3 User Settings Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
9.4 Preventive Maintenance Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-12
9.5 Diagnostics Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-13
9.5.1 Generic Window Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14
9.5.2 General Charting Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
9.6 Factory Automation Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.6.1 Host Monitor Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
9.6.2 SECS Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-22

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9.6.2.1 SECS Configuration Screen — HSMS-SS . . . . . . . . . . . 9-22

9.6.2.2 SECS Configuration Screen — SECS-1 . . . . . . . . . . . . . 9-26
9.6.3 GEM Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-30
9.6.4 GEM Monitor Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-32
9.6.5 Host Terminal Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-38
9.6.6 PIO Handler Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-40
9.6.7 Carrier Id Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-44
9.6.8 FIC BDS Diagnostics Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-46
9.7 Wafer History Lot Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-48
9.7.1 Wafer Movements for Lot Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-50
9.7.2 Process Summary for Lot Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-52
9.7.3 Process Steps for Lot Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-54
9.8 Configure System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-58
9.9 Administration Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-60
9.9.1 Set Date and Time Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-60
9.9.2 User Access Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . 9-62
9.9.3 Screen Access Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . 9-64
9.10 I/O Screens. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-67
9.10.1 MF I/O List Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-68
9.10.2 Chamber I/O List Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-72

10 Editor Header Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1

10.1 Editor Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
10.2 Recipe Editor Screens . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-3
10.2.1 Recipes for Chamber Screen (Recipe Directory) . . . . . . . . . . . . . . . . 10-4
10.2.2 Recipe Passport Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6
10.2.3 Recipe Prestep Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10
10.2.4 Recipe Steps Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14
10.2.5 Endpoint Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-18
10.2.6 Endpoint Device Parameters Screen . . . . . . . . . . . . . . . . . . . . . . . . . 10-20
10.2.7 WH (Wafer History) Samples for Step Screen . . . . . . . . . . . . . . . . . . 10-22
10.3 Sequence Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24
10.3.1 Sequence Passport Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-26
10.3.2 Sequence Steps Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28
10.4 Lot-Sequence Association Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30

Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X-1

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List of Tables

Title Page

Table 3-1. Operator Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3

Table 3-2. Screen Configuration (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Table 3-3. Screen Configuration (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Table 3-4. Wafer Status Color Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Table 3-5. Header Status Color Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Table 3-6. Event Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Table 3-7. Safety and Fatal Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
Table 5-1. System Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
Table 5-2. Control System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5
Table 5-3. Control System Screen — Chamber Cleans Detail Window . . . . . . . . . . . . 5-7
Table 5-4. Monitor Wafers Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Table 5-5. Monitor Wafers Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
Table 5-6. Monitor Interlocks Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
Table 6-1. Chamber Header Pulldown Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Table 6-2. Monitor Chamber Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
Table 6-3. Monitor Chamber Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
Table 6-4. Monitor Process Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-29
Table 6-5. Monitor Process Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-31
Table 6-6. Leak Rate Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-33
Table 6-7. Monitor Gas Panel Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-37
Table 6-8. Monitor Gas Panel Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-39
Table 6-9. Stick Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-41
Table 6-10. Gas and Liquid Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-42
Table 6-11. Usage of Gas and Liquid Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-45
Table 6-12. MFC Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-47
Table 6-13. Set Up Gas Panel Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-49
Table 6-14. Service Gas Panel Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-51
Table 6-15. Service Gas Panel Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-53
Table 6-16. Calibrate Gas Panel Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-55
Table 6-17. Calibrate Gas Panel Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-57
Table 6-18. RF Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-59
Table 6-19. Lift Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-61
Table 6-20. Endpoint Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-63
Table 6-21. Endpoint Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-65
Table 7-1. MF (Mainframe) Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3
Table 7-2. Monitor Mainframe Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5
Table 7-3. Monitor Mainframe Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7
Table 7-4. Buffer Robot Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9
Table 7-5. Buffer Robot Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-11
Table 7-6. Wafer Detect Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-13
Table 7-7. Indexer Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17
Table 7-8. Indexer Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-19
Table 8-1. FI Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-3
Table 8-2. Monitor FI Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-5
Table 8-3. Cassette Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9
Table 8-4. Cassette Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-11
Table 9-1. Go To Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3
Table 9-2. Event Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5
Table 9-3. Events Configuration for Alarm Line Screen. . . . . . . . . . . . . . . . . . . . . . . . . 9-7
Table 9-4. Set Up Signal Tower Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-9
Table 9-5. Preventive Maintenance Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-13
Table 9-6. Generic Window Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-15
Table 9-7. General Charting Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-17

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Table 9-8. Host Monitor Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-19

Table 9-9. Host Monitor Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-21
Table 9-10. SECS Configuration Screen — HSMS-SS(1 of 2) . . . . . . . . . . . . . . . . . . . . 9-23
Table 9-11. SECS Configuration Screen — HSMS-SS (2 of 2). . . . . . . . . . . . . . . . . . . . 9-25
Table 9-12. SECS Configuration Screen — SECS-1 (1 of 2) . . . . . . . . . . . . . . . . . . . . . 9-27
Table 9-13. SECS Configuration Screen — SECS-1 (2 of 2) . . . . . . . . . . . . . . . . . . . . . 9-29
Table 9-14. GEM Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-31
Table 9-15. GEM Monitor Screen (1 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-33
Table 9-16. GEM Monitor Screen (2 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-35
Table 9-17. GEM Monitor Screen (3 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-37
Table 9-18. Host Terminal Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-39
Table 9-19. PIO Handler Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-41
Table 9-20. PIO Handler Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-43
Table 9-21. Carrier Id Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-45
Table 9-22. FIC BDS Diagnostics Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-47
Table 9-23. Wafer History Lot Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-49
Table 9-24. Wafer Movements for Lot Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-51
Table 9-25. Process Summary for Lot Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-53
Table 9-26. Process Steps for Lot Screen — First Page . . . . . . . . . . . . . . . . . . . . . . . . . 9-55
Table 9-27. Process Steps for Lot Screen — Second Page . . . . . . . . . . . . . . . . . . . . . . 9-57
Table 9-28. Configure System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-59
Table 9-29. Set Date and Time Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-61
Table 9-30. User Access Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-63
Table 9-31. Screen Access Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-65
Table 9-32. MF I/O List Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-69
Table 9-33. MF I/O List Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-71
Table 9-34. Chamber I/O List Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-73
Table 10-1. Editor Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
Table 10-2. Recipes for Chamber Screen (Recipe Directory) . . . . . . . . . . . . . . . . . . . . . 10-5
Table 10-3. Recipe Passport Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-7
Table 10-4. Recipe Passport Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-9
Table 10-5. Recipe Prestep Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-11
Table 10-6. Recipe Prestep Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13
Table 10-7. Recipe Steps Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-15
Table 10-8. Recipe Steps Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-17
Table 10-9. Endpoint Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-19
Table 10-10. Endpoint Device Parameters Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-21
Table 10-11. WH Samples for Step Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-23
Table 10-12. Sequence Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-25
Table 10-13. Sequence Passport Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-27
Table 10-14. Sequence Steps Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-29
Table 10-15. Lot-Sequence Association Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-31

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C-vi Producer SE PECVD Operations and Programming APPLIED MATERIALS 

List of Figures

Title Page

Figure 2-1. Screen Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

Figure 3-1. Operator Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Figure 3-2. Screen Configuration (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Figure 3-3. Screen Configuration (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Figure 3-4. Headers and Pulldown Menus (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
Figure 3-5. Headers and Pulldown Menus (2 of 2) — Go To Header
Pulldown Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Figure 4-1. System Powerup and Powerdown Summary . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Figure 4-2. Login Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
Figure 4-3. Monitor Wafers Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10
Figure 4-4. Monitor Process Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
Figure 4-5. Mainframe Components and Wafer Transfer Sequence . . . . . . . . . . . . . . . 4-12
Figure 4-6. GUI PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
Figure 4-7. Error Message — Login as System Administrator is Required. . . . . . . . . . . 4-16
Figure 4-8. Selecting Setup Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
Figure 4-9. Enable Auto Logon Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17
Figure 4-10. Real Time Application Files Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17
Figure 4-11. Selecting Data File Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
Figure 4-12. Setting Security Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
Figure 4-13. Rebooting Real Time PC and GUI PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19
Figure 5-1. System Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Figure 5-2. Control System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Figure 5-3. Control System Screen — Chamber Cleans Detail Window . . . . . . . . . . . . 5-6
Figure 5-4. Monitor Wafers Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Figure 5-5. Monitor Wafers Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Figure 5-6. Chamber Summary Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
Figure 5-7. Loadlock Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
Figure 5-8. Cooling Station Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
Figure 5-9. Cassette Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
Figure 5-10. Monitor Interlocks Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18
Figure 6-1. Ch (Chamber) Header Pulldown Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Figure 6-2. Monitor Chamber Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Figure 6-3. Monitor Chamber Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Figure 6-4. Process Positions 1 and 2 at Chambers A, B, and C . . . . . . . . . . . . . . . . . . 6-8
Figure 6-5. Chamber Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
Figure 6-6. Throttle Valve Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
Figure 6-7. Gas Panel Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
Figure 6-8. Interlock Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12
Figure 6-9. Lifts Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13
Figure 6-10. Recipe Control Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
Figure 6-11. Reactor Laminar Flow Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Figure 6-12. RPS (Remote Clean) Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Figure 6-13. HF RF Generator Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Figure 6-14. LF RF Generator Detailed Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
Figure 6-15. Heater Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Figure 6-16. Heat Exchanger Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25
Figure 6-17. Throttle Valve Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26
Figure 6-18. Pump Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-27
Figure 6-19. Monitor Process Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-28
Figure 6-20. Monitor Process Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-30
Figure 6-21. Leak Rate Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-32
Figure 6-22. Monitor Gas Panel Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-36
Figure 6-23. Monitor Gas Panel Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-38

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Figure 6-24. Stick Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-40

Figure 6-25. MFC Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-46
Figure 6-26. Set Up Gas Panel Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-48
Figure 6-27. Service Gas Panel Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-50
Figure 6-28. Service Gas Panel Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-52
Figure 6-29. Calibrate Gas Panel Screen (1 of 2) — Gas Stick Displayed
on Right . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-54
Figure 6-30. Calibrate Gas Panel Screen (2 of 2) — Liquid Stick Displayed
on Right . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-56
Figure 6-31. RF Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-58
Figure 6-32. Lift Calibration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-60
Figure 6-33. Endpoint Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-62
Figure 6-34. Endpoint Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-64
Figure 7-1. MF (Mainframe) Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-2
Figure 7-2. Monitor Mainframe Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-4
Figure 7-3. Monitor Mainframe Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-6
Figure 7-4. Buffer Robot Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8
Figure 7-5. Buffer Robot Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
Figure 7-6. Wafer Detect Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-12
Figure 7-7. Wafer Detector Numbers and Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-14
Figure 7-8. Wafer Detector Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-15
Figure 7-9. Indexer Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-16
Figure 7-10. Indexer Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-18
Figure 8-1. FI Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-2
Figure 8-2. Monitor FI Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-4
Figure 8-3. FI Robot Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-6
Figure 8-4. Cooling Station Detailed Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-7
Figure 8-5. Cassette Detailed Window (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
Figure 8-6. Cassette Detailed Window (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-10
Figure 9-1. Go To Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2
Figure 9-2. Event Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4
Figure 9-3. Events Configuration for Alarm Line Screen. . . . . . . . . . . . . . . . . . . . . . . . . 9-6
Figure 9-4. Set Up Signal Tower Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-8
Figure 9-5. User Settings Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-10
Figure 9-6. Preventive Maintenance Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-12
Figure 9-7. Generic Window Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-14
Figure 9-8. Attribute Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-15
Figure 9-9. General Charting Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-16
Figure 9-10. Host Monitor Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-18
Figure 9-11. Host Monitor Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-20
Figure 9-12. SECS Configuration Screen — HSMS-SS (1 of 2). . . . . . . . . . . . . . . . . . . . 9-22
Figure 9-13. SECS Configuration Screen — HSMS-SS (2 of 2). . . . . . . . . . . . . . . . . . . . 9-24
Figure 9-14. SECS Configuration Screen — SECS-1 (1 of 2) . . . . . . . . . . . . . . . . . . . . . 9-26
Figure 9-15. SECS Configuration Screen — SECS-1 (2 of 2) . . . . . . . . . . . . . . . . . . . . . 9-28
Figure 9-16. GEM Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-30
Figure 9-17. GEM Monitor Screen (1 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-32
Figure 9-18. GEM Monitor Screen (2 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-34
Figure 9-19. GEM Monitor Screen (3 of 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-36
Figure 9-20. Host Terminal Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-38
Figure 9-21. PIO Handler Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-40
Figure 9-22. PIO Handler Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-42
Figure 9-23. Carrier Id Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-44
Figure 9-24. FIC BDS Diagnostics Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-46
Figure 9-25. Wafer History Lot Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-48
Figure 9-26. Wafer Movements for Lot Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-50
Figure 9-27. Process Summary for Lot Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-52
Figure 9-28. Process Steps for Lot Screen — First Page . . . . . . . . . . . . . . . . . . . . . . . . . 9-54

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Figure 9-29. Process Steps for Lot Screen — Second Page . . . . . . . . . . . . . . . . . . . . . . 9-56
Figure 9-30. Configure System Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-58
Figure 9-31. Set Date and Time Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-60
Figure 9-32. User Access Configuration Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-62
Figure 9-33. Screen Access Configuration Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-64
Figure 9-34. MF I/O List Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-68
Figure 9-35. MF I/O List Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-70
Figure 9-36. Chamber I/O List Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-72
Figure 9-37. Flex 3 Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-74
Figure 9-38. Mainframe IO/Motion Controller Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-75
Figure 9-39. Chamber IO Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-76
Figure 10-1. Editor Header Pulldown Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-2
Figure 10-2. Recipe Editor Screen — Choose Chamber Type Window . . . . . . . . . . . . . . 10-3
Figure 10-3. Recipes for Chamber Screen (Recipe Directory) . . . . . . . . . . . . . . . . . . . . . 10-4
Figure 10-4. Recipe Passport Screen (1 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-6
Figure 10-5. Recipe Passport Screen (2 of 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-8
Figure 10-6. Recipe Prestep Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-10
Figure 10-7. Recipe Prestep Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-12
Figure 10-8. Recipe Steps Screen (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-14
Figure 10-9. Recipe Steps Screen (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-16
Figure 10-10. Endpoint Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-18
Figure 10-11. Endpoint Device Parameters Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-20
Figure 10-12. WH Samples for Step Screen. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-22
Figure 10-13. Sequence Directory Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-24
Figure 10-14. Sequence Passport Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-26
Figure 10-15. Sequence Steps Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-28
Figure 10-16. Lot-Sequence Association Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-30

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 APPLIED MATERIALS  Preface P-1

P Preface
P.1 Manual Error Reporting
When you have found an error in the manual, please contact your local Applied Materials
account team personnel and report the error.

Applied Materials uses the Failure Reporting Analysis and Corrective Action System
(FRACAS) for reporting and managing non-conformances. Your local Applied Materials
account team personnel will enter the error into the FRACAS program for an appropriate
corrective action.

NOTE
When entering a manual error into FRACAS, choose DOCUMENTATION
under the Problem Type field.

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 APPLIED MATERIALS 
Safety 1-1

1 Safety
The Producer SE system uses hazardous electrical power, radio frequency (RF) energy,
moving parts, heated areas, and a laser. The system may also be configured to use reactive
gases that are toxic, flammable, pyrophoric, or caustic, and require careful handling. The
hazards associated with the Producer SE system are:

• Electrical shock
• Inhalation or exposure to gases
• Exposure to chemicals or process by-products
• Non-ionizing radiation
• Laser light
• Absorption of toxic materials through the skin
• Fire or explosions
• Burns (electrical and thermal)
• Mechanical hazards
• Ergonomic hazards

NOTE
See the Producer SE Safety manual about the complete safety information for
the system.

NOTE
In case of emergency or equipment failure, contact the Applied Materials
Corporate Product Safety office by calling (888) 800-6901 or (408) 563-7810.

WARNING
GENERAL HAZARDS
Modifying the equipment, overriding or
defeating the interlocks, or failing to follow the
safety precautions or recommended
procedures could expose personnel to
hazardous conditions.
Always follow the safety precautions and
recommended procedures. Observe all the
applicable codes.

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 APPLIED MATERIALS 
Document Conventions 2-1

2 Document Conventions
This chapter provides the following sections:

• Section 2.1, Acronym List, page 2-2

• Section 2.2, Software Version, page 2-8
• Section 2.4, Screen Path, page 2-10
• Section 2.3, Chapter Organization, page 2-9
• Section 2.5, Buffer Chamber and Transfer Chamber, page 2-10

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2.1 Acronym List

This list contains some of the acronyms used in this manual and other Producer SE manuals:

ABS acrylonitrile, butadiene, and styrene. The generic name for a type of
plastic made of acrylonitrile, butadiene, and styrene.
ACGIH American Conference of Governmental Industrial Hygienists
ADCS Advanced Delivery & Chemical Systems, Ltd. A supplier of a dual
tank liquid refill (DTLR) system. The company was acquired by
ATMI.
ADO Automatic Door Opener
AFC automatic flow controller. Same as MFC.
AGV automated guided vehicle
AMHS automated material handling system
AMAT Applied Materials
ANSI American National Standards Institute
APF Advanced Pattering Film
ARAMS Automated, Reliability, Availability, and Maintainability Standard
(SEMI standard)
ATM atmospheric pressure
ATMI ATMI, Inc. A supplier of a dual tank liquid refill (DTLR) system and
a fluorine effluent abatement system. It acquired ADCS and EcoSys.
BD Black Diamond (process)
BDS Bay Distributed Stocker (Applied Materials’ internal buffer
implementation)
BKM best known method
BPSG boro-phospho-silicate glass (process)
BSG boro silicate glass
BTU British thermal unit
CAD computer-aided design
CD critical dimensions
CDA clean, dry air
CGA Compressed Gas Association, Inc. (U.S.)
CES customer engineering special
cPCI Compact PCI (Peripheral Component Interconnect)

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CPS Customer Productivity Support. A business group of Applied

Materials.
DARC Dielectric Anti-Reflective Coating (process)
DCVD dielectric chemical vapor deposition
DI deionized (water)
DLK Dielectric low k (process)
DP Docking Pedestal
DPA Downstream Plasma Apparatus
DRAM dynamic random access memory
DSM Dielectric Systems and Modules. A business group of Applied
Materials.
DTLR dual tank liquid refill (system)
EC equipment constant
EDX energy dispersive X-ray (spectroscopy)
EMO emergency off
EPA Environmental Protection Agency (U.S.)
EPROM erasable, programmable, read-only memory
ERAMS Equipment Reliability, Availability, Maintainability and Safety
EV electro valve
FA factory automation
FCW facilities chilled (or cooling) water
FI factory interface
FIFO first in first out
FIC factory interface controller
FIMS Front-Opening Interface Mechanical Standard
FDP Facilities Docking Pedestal
FIT Facilities Installation Template
FOB free on board. FOB means that any costs incurred after the shipment
is loaded on the transport are the responsibility of the recipient.
FOUP Front Opening Unified Pod

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FRACAS Failure Reporting Analysis and Corrective Action System. A tool

for reporting and managing non-conformances on Applied Materials
products.
FSG fluorinated silicate glass (process)
GEM Generic Equipment Model
GPLIS Gas Panel Liquid Injection System
GG Giant Gap
GUI graphical user interface
HAP hazardous air pollutants
HDP-CVD high density plasma chemical vapor deposition
HEPA high efficiency particle attenuator. HEPA means that the minimum
filter assembly efficiency is 99.999% at 0.3 µm particle size.
HF high frequency
HP high purity
HPM hazardous production material. HPM is a solid, liquid, or gas that
has a degree-of-hazard rating in health, flammability, or reactivity
of Class 3 or Class 4 as ranked by NFPA 704 standard and is used
directly in research, laboratory, or production processes in which end
product materials are not hazardous.
HSMS High-Speed SECS Message Services
HVCR high flow vacuum-coupled ring
I.D. inside dimension
IEC International Electrotechnical Commission
IMD intermetal dielectric
IPA isopropyl alcohol
IPM Integrated Particle Monitor
IPUP integrated point of use pump
ISO International Organization for Standardization
IV injection valve
LCD liquid crystal display
LED light emitting diode
LF low frequency
LFC liquid flow controller

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LFM liquid flow meter

LFT Low Field Toroidal (plasma)
MAC ID media access control identification number
MF mixed frequency
MFC mass flow controller
MSDS Material Safety Data Sheet
MV manual valve
NCDRH National Center for Devices and Radiological Health (U.S.)
NEC National Electrical Code (U.S.)
NEMA National Electrical Manufacturers Association (U.S.)
NFPA National Fire Protection Association (U.S.)
NPT national pipe thread
O.D. outside dimension (or diameter)
OCLP Open Cassette Load Port
ODS ozone depleting substance
OEM original equipment manufacturer
OHT overhead hoist transport
OSHA Occupational Safety and Health Administration (U.S.)
OTF On-The-Fly centerfinder
PC personal computer
PCB printed circuit board
PE plasma enhanced
PCI Peripheral Component Interconnect
PCW process chilled (or cooling) water
PFC perfluorinated compound
PGV person guided vehicle
PIO parallel input/output interface
PLIS Precision Liquid Injection System
PM preventive maintenance
PMD pre-metal dielectric

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PO purchase order
ppb parts per billion
PPE personal protective equipment
ppm parts per million
PSG phospho silicate glass (process)
PTFE polytetrafluoroethylene
PV purge valve
RAM random access memory
RF radio frequency
RGA residual gas analyzer
RGV rail guided vehicle
RI refractive index
RMPP Risk Management and Prevention Planning
RPM Ramp Performance Management
RPS remote plasma source
RT real time
SACVD sub-atmospheric chemical vapor deposition
sccm standard cubic centimeters (per) minute
sccs standard cubic centimeters (per) second
SEM scanning electron microscopy
SEMI Semiconductor Equipment and Materials International (U.S.)
SECS SEMI Equipment Communication Standard
SF single frequency
SLD single line drop
SOG spin-on-glass (process)
SP Smart Pedestal
SP standard purity
SPI Smart Pump Interface
SRAM static random access memory
SST stainless steel

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SSPS Site and System Preparation Specification

SV status variable
TCP/IP Transmission Control Protocol/Internet Protocol
TCS Thermal Conditioning System. A CVD effluent abatement system
by BOC Edwards.
TEB triethyl borate
TEOS tetraethyl orthosilicate
TEPO triethyl phosphate
TIG tungsten inert gas (welding)
TPU Thermal Processing Unit. A CVD effluent abatement system by
BOC Edwards.
TV throttle valve
UHP ultra high purity
UI user interface
ULPA ultra low particulate attenuator. ULPA means that the minimum filter
assembly efficiency is 99.999% at 0.12 µm particle size.
UMAC Universal Motion Automation Controller
UPS uninterruptible power supply
USB Universal Serial Bus
USG undoped silicate glass (process)
UV ultra violet
VAC volts AC
VCR vacuum-coupled ring
VGA video graphics array
VHP very high productivity
VME Versa Modular European
VOC volatile organic compounds
VSPI Visual Spare Parts Identifier
WER wet etch rate
WERR wet etch rate ratio

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2.2 Software Version

This manual describes the PECVD screen features provided by Version A1.3 of the Producer
SE system software unless otherwise stated. Software version on your system can be viewed
on the Copyright screen through the Help button at the top of the screen.

The real time PC and the GUI PC currently work on the Windows NT 4.0 with Service Pack 6.
Also, the GUI PC currently uses the Microsoft Internet Explorer 5.5 with Java Virtual
Machine installed for the operator to interact with the system. Independent clients outside
the Producer SE require the same software configuration as the GUI PC.

NOTE
See the Producer SE Functional Description manual for a description of the
control system.

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2.3 Chapter Organization

See Chapter 5 through Chapter 10 for a detailed description of the screens that are accessed
under each header (navigation button) on top of the screen. The following headers are
displayed on each screen. See Figure 2-1 and Section 3.2, Screen Configuration, page 3-4.

• System header — See Chapter 5, System Header Screens.

• Ch (chamber) headers — See Chapter 6, Chamber Header Screens.
• MF (mainframe) header — See Chapter 7, Mainframe (MF) Header Screens.
• FI (factory interface) header — See Chapter 8, Factory Interface (FI) Header
Screens.
• MET header — Available only when the metrology unit (Producer QA) is installed
on the system.
• IPM header — Available only when the Integrated Particle Monitor (IPM) is
installed on the system.
• Go To header — See Chapter 9, Go To Header Screens.
• Editor header — See Chapter 10, Editor Header Screens.

FI (FACTORY MET IPM (INTEGRATED

SYSTEM CHAMBER MF (MAINFRAME) INTERFACE) (METROLOGY) PARTICLE MONITOR) GO TO EDITOR
HEADER HEADERS HEADER HEADER HEADER HEADER HEADER HEADER

Figure 2-1. Screen Headers

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2.4 Screen Path

In this manual, how to access the screen is indicated on top of each screen figure with arrows.
Also, the screen path is indicated in parentheses in the text.

For example:

Go to the Monitor Chamber screen (Ch X → Monitor Chamber).

This means that to access the Monitor Chamber screen for chamber X (X = chamber name
A, B, or C), you should first touch the Ch X header, then select Monitor Chamber from
the pulldown menu.

2.5 Buffer Chamber and Transfer Chamber

“Buffer chamber” is often used instead of “transfer chamber” in the system software. Both
chamber names are used to call the center unit of the mainframe where the dual-blade
VHP robot is located.

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User Interface Conventions 3-1

3 User Interface Conventions

This chapter provides the following sections:

• Section 3.1, Operator Interface, page 3-2

• Section 3.2, Screen Configuration, page 3-4
• Section 3.3, Color Scheme, page 3-10
• Section 3.4, Events and Alarms, page 3-11

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3.1 Operator Interface

The operator interacts with the system with the factory interface (FI) and the monitor screens.
See Figure 3-1 and Table 3-1.

OHT BULKHEAD
VARIABLE SPEED
FAN AIR INTAKE

FACTORY SIGNAL LAMP

INTERFACE (FI) 1 2 TOWER

EMO (EMERGENCY
3 OFF) BUTTONS

MAINFRAME

FI MOTOR STOP
BUTTONS
WAFER CARRIER (FOUP) (BOTH SIDES)
LOAD PORTS

ACCESS PLATES
(BOTH SIDES)

STYLUS
FLAT PANEL MONITOR

FAULT AND WARNING

FACILITY INDICATOR BOX
(OPTION) KEYBOARD WITH
TRACK BALL

TRANSFER HANDLE

CABLE/POWER
SUPPLY BOX

MONITOR PEDESTAL
POWER CABLE CONNECTION
TO MAINFRAME AC BOX
(LOCAL MONITOR) OR REMOTE CASTERS (5×)
AC BOX (REMOTE MONITOR) 4" [102 MM] DIAMETER

CONTROL CABLE
CONNECTION TO
PRODUCER SE

TP01876A.

4 TOUCH-SCREEN MONITOR ON PEDESTAL

Figure 3-1. Operator Interface

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APPLIED MATERIALS  User Interface Conventions 3-3

Table 3-1. Operator Interface

No. Item Description

1 Factory interface Mounted at the front of the mainframe. Wafers are transferred from the
(Producer SE FI) FI into the loadlock. The 2-pod front opening unified pods (FOUP)
interface is currently available.

2 Signal lamp tower Indicates various system states. Color arrangement, lamp functions,
and audible alarm are configurable. See Section 9.3.2, Set Up Signal
Tower Screen, page 9-8. Through-the-wall and stand-alone
installations are available.
Front Lamp Tower (default)
• 4 color (clear-A-G-B) CE Mark compliant — Clear, amber,
green, and blue and sound module located on the bottom
of a stack. PATLITE model with DeviceNet interface
WEP-D4B (C/A/G/B), 1.5″ (37.5 mm) wall mount. This color
configuration meets the CE Mark requirements.
• 4 color (red-A-G-B) non-CE Mark – Red, amber, green, and
blue, and sound module located on the bottom of a stack.
PATLITE model with DeviceNet interface WEP-D4B
(R/A/G/B), 1.5″ (37.5 mm) wall mount. This color
configuration does not meet the CE Mark requirements due
to the presence of a red lamp.
Rear Lamp Tower (option)
• 4 color (Clear-A-G-B) CE Mark compliant — Clear, amber,
green, and blue and sound module located on the bottom
of a stack. PATLITE model with DeviceNet interface
LHE-D4B (C/A/G/B), 2.8″ (70 mm) diameter pole mount.
This color configuration meets the CE Mark requirements.
• 4 color (RED-A-G-B) non-CE Mark – Red, amber, green,
and blue, and sound module located on the bottom of a
stack. PATLITE model with DeviceNet interface LHE-D4B
(R/A/G/B), 2.8″ (70 mm) diameter pole mount. This color
configuration does not meet the CE Mark requirements due
to the presence of a red lamp.

3 EMO (emergency Bring the system to a safe shutdown condition in an emergency.

off) buttons EMO buttons are located at the following locations:
• Remote AC box
• Factory interface (FI) front panel and both sides
• Chamber module (one for each chamber)
• Chamber pump controller (one for each chamber pump)
• Heat exchanger

4 Touch-screen flat The main interface between the operator and the system. Up to three
panel monitor monitors (stand-alone or through-the-wall; local or remote) are used.
A local monitor is powered by the Producer SE system. A remote
monitor is powered by the facility. Second and third monitors
duplicate the screen shown on the active monitor.

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3.2 Screen Configuration

Each screen has a common configuration. See Figure 3-2 and Table 3-2.

SYSTEM → MONITOR WAFERS

Figure 3-2. Screen Configuration (1 of 2)

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Table 3-2. Screen Configuration (1 of 2)

No. Item Description

1 Title bar Displays the following information (from left to right):
• Host control state — Disabled, Trying, Att Sync
(Attempting to Synchronize), Att Comm (Attempting
to Communicate), Spooling, Comm (Communicating),
and Comm Spool (Communicating - Spooling).
• GEM control state — Offline, Online/Local, or
Online/Remote.
• Date and time
• Name of the current screen
• System name
• User name who has currently logged in
See Section 9.6.1, Host Monitor Screen, page 9-18 for a
description of the host control state and the GEM control state.
2 Event bar Displays an event message (alarm, warning, prompt, trace, or
cleared alarm) when it occurs. Touch the Ack button to
acknowledge the current message and stop the audible alarm.
This will display the next message if any. When more than one
message have occurred, the Ack All button is displayed next
to the Ack button. Touch Ack All to clear all the messages.
See Section 3.4, Events and Alarms, page 3-11.
3 Signal tower icon (When the signal tower is used) Displays the status of each
location lamp and the buzzer: on, off, or flashing.
4 Navigation headers Provide a pulldown menu to access screens or system
functions. See Figure 3-4 and Figure 3-5. Also, see Table 3-5,
Header Status Color Scheme, page 3-10.
• System header — Accesses the screens to control
and monitor the system-wide functions. See
Chapter 5, System Header Screens.
• Ch A, Ch B, and Ch C headers — Accesses the
screens and commands to control and monitor the
chamber functions. See Chapter 6, Chamber Header
Screens. When a chamber is absent in the position,
the header is dimmed and unavailable to use.
• MF (mainframe) header — Accesses the screens to
control and monitor the mainframe components. See
Chapter 7, Mainframe (MF) Header Screens.
• FI (factory interface) header — Accesses the screens
to control and monitor the FI. See Chapter 8, Factory
Interface (FI) Header Screens.
• MET header — Available only when the metrology unit
(Producer QA) is installed on the system.
• IPM header — Available only when the Integrated
Particle Monitor (IPM) is installed on the system.
• Go To header — Accesses the screens that provide
miscellaneous system functions. See Chapter 9, Go
To Header Screens.
• Editor header — Accesses the screens to program
process recipes, wafer sequences, and lots. See
Chapter 10, Editor Header Screens.

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SYSTEM → MONITOR WAFERS

COMPONENT GRAPHICS 5

7 DEVICE FRAMES WORK AREA

Figure 3-3. Screen Configuration (2 of 2)

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Table 3-3. Screen Configuration (2 of 2)

No. Item Description

5 Command buttons The following command buttons are available in the navigation
bar:
• Back — Displays the screen that was previously
viewed.
• Forward — Displays the screen that was viewed after
the current screen.
• Print (currently not used) — Prints out the current
page when an optional network printer is connected
to the FI bulkhead through Ethernet.
• Logout — Displays the Login screen to log out of or
log into the system. See Section 4.2, User Login and
Logout Procedures, page 4-7.
• Help — Provides the Help window. The Control
System Copyright screen is accessed from this
window.

6 Dynamic area Displays the main content of the individual screen. The dynamic
(screen content) area have some common components:
• Component graphics — Displays the system status.
On some screens, lines or symbols representing
system components (such as gas lines, valves, and
wafers) are selectable and allow you to manipulate
the component.
• Device frames — Represent individual system
components. Selectable device frames are displayed
in blue surrounding borders with 3D shadow. Touch a
device frame, then the work area on the right will
display detailed information of the device.
• Work area — Displays detailed information of a
selected device frame. You can enter values or
commands for that device from this area.

7 Operator message Displays messages to the operator.

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Figure 3-4. Headers and Pulldown Menus (1 of 2)

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Figure 3-5. Headers and Pulldown Menus (2 of 2) — Go To Header Pulldown Menus

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3.3 Color Scheme

See Table 3-4 and Table 3-5 about the color scheme of the wafer status and chamber status
displayed on the screen.

NOTE
See Table 3-6 for a description of the color scheme of events.

Table 3-4. Wafer Status Color Scheme

Wafer Status Background Color

Not Present Light gray

Unknown White

Unprocessed White

Unresolved Orange

In process Cyan

Processed Green

Failure during process Red

Warning during process Yellow

In mid process Magenta

Wafer/lot association not assigned Blue

Table 3-5. Header Status Color Scheme

Status Text Background Border

System and Ch Headers (note 1)

Not present Gray Light gray Light gray

Offline idle Black Light gray White

Online idle Black Blue White

Offline running Black Light gray Green

Online running Black Blue Green

Offline fault Black Red (alarm) Red (alarm)

Online fault Black Red (alarm) Red (alarm)

MET and IPM Headers

MET or IPM in local mode Black Cyan White

Note:
1. For the System header, the “Auto mode” is equivalent to “Online” for the Ch headers.

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3.4 Events and Alarms

System events are displayed in the event bar at the top of the screen as they occur. They are
also displayed in the Event screen. See Section 9.2, Event Screen, page 9-4 and Section 9.3.1,
Events Configuration for Alarm Line Screen, page 9-6.

Events are color-coded and also categorized according to seven levels of severity. See
Table 3-6.

Table 3-6. Event Types

Event Text Background Severity Description

Type Color Color (in this order)

Alarm Yellow Red Safety Most severe and critical fault event (serious error)
related to personal or equipment safety. Generates a
GEM alarm and its associated events.

White Red Fatal Fault event (serious error). Generates a GEM alarm
and its associated events.

Warning Black Yellow Problem Warning event that changes the wafer color to yellow
when it happens during a recipe. Also puts the
chamber to the fail state when the recipe finishes.
Generates a GEM alarm and its associated events.

Warning Warning event that changes the wafer color to yellow

when it happens during a recipe. The sequencer will
try to avoid using the chamber that sent this warning.
Generates a GEM alarm and its associated events.

Caution Warning event that changes the wafer color to yellow

when it happens during a recipe. Generates a GEM
alarm and its associated events.

Attention Warning event that generates a GEM event.

Prompt White Blue Information Prompt event (request to the operator) that generates
a GEM event.

Trace Black White Trace Trace event (system activities and internal control
messages) that generates a GEM event.

Cleared Green Black Displayed when an alarm has been cleared.

alarms

See Table 3-7 for a description of the critical events that might happen during the system
operation. These are either Safety or Fatal events that generate a fault.

NOTE
When an event name in Table 3-7 includes X, XX, or an item name in
parentheses such as (reason), it is a variable that will change to indicate a
specific component, value, description, or information, depending on the
event that has occurred.

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Table 3-7. Safety and Fatal Events (1 of 14)

Event Events Description

ID

System Startup

3 Power Up sequence failed - System powerup failed for the indicated reason.
(description)

12 XX (subsystem) configuration The subsystem was not correctly configured in software.

incomplete! Please reconfigure Verify the configuration.
system.

39 Error installing XX (node), An error occurred while software tried to install the indicated
(description) node (such as Twin chamber, buffer chamber, loadlock, FI,
and cassette). This is an internal software error. Report to
Applied Materials.

Electrical

3035 Fuse(s) are blown, see Voltage Power emergency. Identify which fuses were blown.
Monitor/Fuse status screen for details Note: The Voltage Monitor/Fuse status screen is currently
not available. See the Generic Window screen.

3036 Fuse is blown (description) A fuse was blown at the indicated location.
Note: The Voltage Monitor/Fuse status screen is currently
not available. See the Generic Window screen.

3037 Voltage is out of range (current The current voltage was out of range as indicated.
voltage)

FI and Cassettes

87 Cassette X wafer map failed Wafer mapping failed in the cassette. Verify that the cassette
is correctly placed. Verify the hardware and calibration.

92 FI Cassette X AGV handoff failed with AGV handoff failed in the cassette. Check for the hardware.
error - XX

96 FI Cassette X AGV unload requested Unloading the cassette to the AGV was requested, but the
when not ready for unload cassette was not ready for unloading.

97 FI LoadPort X failed to release Pod The FI load port failed to release the pod. Check for the
hardware.

98 FI LoadPort X failed to latch Pod The FI load port failed to latch the pod. Check for the
hardware.

99 FI vacuum is below set point Vacuum at the FI is below the setpoint. Verify the vacuum
supply.

100 FI cda is below set point CDA at the FI is below the setpoint. Verify the CDA supply.

101 FI fan flow fault A fault occurred with the FI fan flow. Check for the hardware.

102 FI side panel interlock has been The FI side door interlock triggered. Verify that both side
tripped panels are closed.

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Table 3-7. Safety and Fatal Events (2 of 14)

Event Events Description

ID

103 FI Light curtain interlock interrupted The FI light curtain interlock triggered while the AGV was
AGV transfer for Cassette X transferring the cassette. The AGV transfer stopped. Check
for the hardware.

108 Cassette X Read CID1 MID failed Reading the material ID of carrier ID 1 failed at the cassette.
For events 108 through 118, check for the tag at the cassette
and the tag reader at the load port. Check for the hardware
and the FI software.

110 Cassette X Read CID2 MID failed Reading the material ID of carrier ID 2 failed at the cassette.
See event 108.

112 Cassette X Read CID1 data failed Reading data of carrier ID 1 failed at the cassette. See event
108.

114 Cassette X Read CID2 data failed Reading data of carrier ID 2 failed at the cassette. See event
108.

116 Cassette X Write CID1 data failed Writing data of carrier ID 1 failed at the cassette. See event
108.

118 Cassette X Write CID2 data failed Writing data of carrier ID 2 failed at the cassette. See event
108.

121 Cassette X presence error There is no cassette when it is supposed to be. Load the
cassette and retry.

122 Cassette X placement error The cassette is not correctly placed at the load port. Verify
the placement.

123 Cassette X dock failure The load port failed to dock at the FOUP.

124 Cassette X undock failure The load port failed to undock at the FOUP.

125 Cassette X door open failure There was an error while the FI door attempted to open the
FOUP. Check for the hardware.

126 Cassette X door close failure There was an error while the FI door attempted to close the
FOUP. Check for the hardware.

134 Cassette X unload with latch failed The load port failed to unload the FOUP with the latch on.
Check for the hardware.

139 BDS Carrier Out failed for Pod in X There was an error when the BDS attempted to move the
carrier out.

142 BDS transfer failed for Pod in X There was an error when the BDS crane attempted to
transfer the FOUP in the BDS.

145 FI Load Port X reservation state The FI load port reservation state was requested to change,
change to XX failed and it failed.

155 AGV attempted to start handoff while The AGV, OHT, or AMHS attempted to start handoff, but it
handoff is not available at Load Port X was not ready at the load port. Check for the hardware.

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Table 3-7. Safety and Fatal Events (3 of 14)

Event Events Description

ID

156 FIC BDS in error state - manual There was an error with the BDS. Identify the problem and
intervention required resolve manually.

159 Active Carrier list send to FIC failed Communication error between the real time controller and
the FIC. Sending the active carrier list to the FIC was
requested, but it failed to be delivered.

161 Send Control Job State change (XX) Communication error between the real time controller and
to FIC failed the FIC. Sending change of the control job state to the FIC
was requested, but it failed to be delivered.

177 Cassette X Load Failed The load port failed to load the FOUP. Check for the
hardware.

179 Cassette X Unload Failed The load port failed to unload the FOUP. Check for the
hardware.

183 Cassette X command (X) failed: XX The cassette command failed for the indicated reason.

184 Cannot go to automatic mode: X The system cannot go to the automatic mode for the
indicated reason.

185 Cannot load cassette: X The FI cannot load the FOUP for the indicated reason.

186 Cannot unload cassette: X The FI cannot unload the FOUP for the indicated reason.

187 Cannot map cassette: X The FI cannot map the FOUP for the indicated reason.

191 Load cassette failed: X The FOUP failed to load for the indicated reason.

192 Unload cassette failed: X The FOUP failed to unload for the indicated reason.

193 Map cassette failed: X Cassette mapping failed for the indicated reason.

Wafer Transfer and Sequencing

5 Set (device) (attribute name) (value) The device attribute value change interlocked. Identify the
interlocked - (reason) problem.

10 Cannot XX (action) in automatic mode The requested command cannot be executed in the
Automatic mode. Place the system in the Manual mode.

11 Interlock triggered - XX A software interlock was detected as indicated.

13 Recipe rejected by chamber X: XX The recipe was rejected by the chamber for the indicated
(reason) reason. Resolve the problem and retry.

16 Wafer Move impossible: bad source or The requested wafer transfer command is physically
destination impossible. This is an internal software error. Report to
Applied Materials.

17 Wafer Move impossible: no wafers to The requested wafer transfer command cannot be executed
transfer because no wafer is present. Verify the wafer position.

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Table 3-7. Safety and Fatal Events (4 of 14)

Event Events Description

ID

18 Wafer Move impossible: inconsistent The requested wafer transfer command cannot be executed
wafer presence flags in source and because there is inconsistency in the wafer presence and
destination absence information with the source wafer or the destination
wafer. Verify the wafer location and resolve the conflict.

19 Wafer Move rejected by chamber XX: The transfer command was rejected by the source or
XX (reason) destination chamber for the indicated reason.

20 Wafer Move step X rejected by A specific step of the wafer transfer command was rejected
chamber X (error XX) by the source or destination chamber for the indicated error.

21 Wafer Move step X failed (error XX) A specific step of the wafer transfer command failed in the
source or destination chamber for the indicated error.

22 Wafer Move step X not completed by A specific step of the wafer transfer command did not
chamber X (timeout error) complete by the source or destination chamber within the
timeout.

23 Return Wafers command rejected: The Return Wafers command was rejected because a wafer
cassette X slot X occupied was present in the requested slot.

25 Cannot start sequence: XX (reason) The requested sequence could not start because of the
indicated reason.

26 Cannot start sequence: at least one X The requested sequence could not start because no slots
slot must be online were online. Place a valid slot online.

27 Cannot start sequence: XX process The requested sequence could not start because software
recipe cannot be loaded could not load the indicated process recipe. Verify the
sequence and the recipe.

28 Cannot continue sequence: deadlock The currently running sequence was stopped because of a
deadlock. This is an internal software error. Report to
Applied Materials.

35 Should be online to perform this The requested operation could not be executed because the
operation specified slot was offline. Place the slot online.

41 (Device name) Device event XX The indicated device event failed because of an error. This
failure, (error code) is an internal software error. Report to Applied Materials.

45 Should be offline to perform this The slot must be offline to perform the requested operation.
operation Place it offline and retry.

46 Invalid sequence file X The selected sequence file was invalid. Verify the sequence.

53 XX out of fault tolerance The indicated process parameter was out of the fault
tolerance. Identify the cause.

73 Service (service name) aborted, error The service routine aborted for the indicated error.
- XX

74 Service (service name) failed, error - The service routine failed for the indicated error.
XX

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Table 3-7. Safety and Fatal Events (5 of 14)

Event Events Description

ID

75 Cannot update lot-sequence: XX The lot-sequence association cannot be updated for the
indicated reason.

76 Cannot delete lot: XX The lot cannot be deleted for the indicated reason.

77 Cannot select lot: XX The lot cannot be selected for the indicated reason.

78 Set of (attribute name) failed - (reason) The indicated attribute failed. This is an internal software
(error code) error. Report to Applied Materials.

1039 Could not open port:X, Error Code XX The load port could not open for the indicated error. Identify
the error and recover.

3012 Command XX is rejected due to XX The command was rejected for the indicated reason.

3043 Interlock DI XX triggered Hardware interlock was detected, and the interlock
DI triggered. Identify and clear the fault situation.

3048 Slit valve open was disabled - XX The slit valve was requested to open, but the command was
(reason) rejected for the indicated reason.

3061 Load Lock X error: (error message) A loadlock error occurred. One of the following error
message will be displayed:
• Timeout to Move Load Lock to pos = (position)
• Load Lock Move failed with error = (error number)
• Load Lock is not at requested position
• Timeout to OPEN/CLOSE Load Lock Door
• Timeout to OPEN/CLOSE Load Lock Slit
• Load Lock Stop cmd time-out
• Load Lock PumpDown time-out
• Load Lock PumpDown Error = (error number)
• Load Lock Stop cmd time-out
• Load Lock Vent time-out
• Load Lock Vent Error = (error number)
The above error numbers are internal information. When an
event with one of these error numbers occurs, report to
Applied Materials.

3062 Buffer Chamber error: (error A buffer chamber error occurred. One of the following error
message) message will be displayed:
• Not OK to open Buffer slit valve for (position)
• Buffer slit valve for (position) is not closed
The position will be CHA, CHB, CHC, or LOAD LOCK.

3088 Vacuum Robot Rotation of max 1mm The vacuum robot rotation is allowed at the maximum of
allowed with blade not in retracted 1 mm when the blade is not in the retracted position. Change
position the blade position and retry.

3089 Vacuum Robot command execution There was an execution error with the vacuum robot
error = (description) command as indicated.

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Table 3-7. Safety and Fatal Events (6 of 14)

Event Events Description

ID

3090 Wafer Detect command execution There was an execution error with the wafer detect
error = (description) command as indicated.

3091 Failed Wafer Detect Calibration, The wafer detect calibration failed for the indicated reason.
(description)

3092 LL Indexer command execution error There was an execution error with the loadlock indexer
= (description) command as indicated.

3095 Vacuum Robot can not perform The vacuum robot cannot perform the requested operation
requested operation with wafer on when a wafer is on the robot blade. Remove the wafer from
blade the blade and retry.

3105 FI Robot blade position interlocks The FI robot blade is blocking the loadlock door close
Load lock Door Close operation operation. Move the robot and retry.

Recipe and Process

8 Bad recipe - Slot X - (error name) An invalid recipe was passed to a chamber for the indicated
slot. Verify the recipe.

30 Recipe interlocked, XX The recipe was interlocked for the indicated reason.

32 Set X (XX) in step X refused by XX The process value in the indicated step was interlocked by
(device) - (description) a device. Verify the value.

33 Set X (XX) in step X failed - The process value in the indicated step failed to achieve.
(description) Verify the value.

44 Set X (XX) Recipe X step X blocked The indicated step could not be run because of an interlock.
by interlock Verify the step.

60 Process recipe (recipe name) failed on The process recipe failed as indicated.
(step type) step X, code : XX

63 Clean recipe (recipe name) failed on The clean recipe failed as indicated.
(step type) step X, code : XX

66 Service (service name) failed on (step The service routine failed as indicated.
type) step X, code : XX

69 Online recipe (recipe name) failed on The online recipe failed as indicated.
(step type) step X, code : XX

72 Offline recipe (recipe name) failed on The offline recipe failed as indicated.
(step type) step X, code : XX

3001 Pump was shut off because of Over One of the pumps was shut off because of over-temperature
Temp at the pump. Verify the cooling water flow to the pump.

3005 Buffer chamber N2 purge out of fault The N2 purge supply to the buffer (transfer) chamber is out
band of the fault band. Verify the flow.

3007 Pressure out of fault band Pressure servo of a Twin chamber is out of the fault band.
Verify the pressure control PID.

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Table 3-7. Safety and Fatal Events (7 of 14)

Event Events Description

ID

3008 Lift fault due to XX (reason) A fault occurred with the wafer lift for the indicated reason.

3065 Lift fault due to XX (reason) (Motor The motorized wafer lift generated a fault for the indicated
State: XX Motor Status: XX) reason.

3073 Recipe process cannot stabilized gas The gas and pressure did not stabilize within the maximum
and pressure within time limit time limit of the step. The recipe was aborted.

3078 Recovery of Inline Ozone comm failed Ozonator communication kept failing and did not recover
after X retry after the indicated number of retries.

3086 X wafer detect is not calibrated The wafer detector has not been calibrated. Calibrate the
wafer detector and retry.

3087 X Heater Lift is not in release position The heater lift is not in the Release position. Move it to the
Release position and retry.

Heat Exchanger

3015 Heat Exchanger temperature out of The heat exchanger coolant temperature was out of the fault
fault band band.

3017 Heat Exchanger fluid level fault The coolant fluid level inside the heat exchanger was too low.

3018 Heat Exchanger resistivity fault The heat exchanger coolant resistivity was too high.

3019 Heat Exchanger facility water fault The facility cooling water for the heat exchanger generated
a fault. The heat exchanger was shut off. Verify the flow and
water temperature.

3020 Heat Exchanger fuse fault A heat exchanger fuse was blown.

3021 Heat Exchanger fault summary The overall summary status of the heat exchanger
detected generated a fault. The heat exchanger was shut off. Identify
the problem.

High Frequency (HF) RF Generators

3026 Cannot talk to Apex RF Gen An RS232 communication error occurred between the Apex
RF generator and the Producer SE software. Verify the
generator hardware and the RS232 connection.

3027 Apex RF Gen overtemp fault The Apex RF generator caused an over-temperature fault.
Verify the water flow.

3028 Apex RF Gen interlock open fault The Apex RF generator interlock was not satisfied. The
generator was shut off.

3042 AEBus cannot open port Software could not open the communication port to the Apex
RF generator.

3070 RF Gen HW fault - (reason) The RF generator caused a hardware fault for the indicated
reason. The generator was shut off.

3071 RF Gen Plasma not ON within time The RF generator did not strike a plasma within the time
limit limit. The generator was shut off.

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Table 3-7. Safety and Fatal Events (8 of 14)

Event Events Description

ID

3072 RF Gen Plasma went OFF The RF generator plasma went off unexpectedly. The
generator was shut off.

3044 RF gen was detected OFF The RF generator turned off unexpectedly.
unexpectedly

3045 RF gen cannot be turn on with time The RF generator did not turn on within the time limit.
limit

Remote Clean Generators

3038 RPS shut off due to plasma not Remote Clean plasma was not detected within the time limit.
detected within time limit The Remote Clean generator was shut off.

Heater

3009 Heater on both sides shut off due to XX Both heaters in the chamber were shut off for the indicated
reason.

3051 HEATER1OK Interlock, Going Fault The Heater 1 OK interlock triggered. The heater was shut
State off, and the chamber has gone to the fault state.

3052 HALF ATM Interlock, Going Fault The chamber half-atmosphere interlock triggered. The
State chamber has gone to the fault state.

3054 Temperature delta for dual heaters too The temperature difference between the two heaters was
large/Heater OFF too large. The heaters were shut off.

3055 Temperature servo fault ramping up/ Heater servo ramp-up fault. A fault occurred while the
Heater OFF temperature was ramping up. The heater was shut off.

3056 Temperature servo fault ramping Heater servo ramp-down fault. A fault occurred while the
down/Heater OFF temperature was ramping down. The heater was shut off.

3057 Temperature servo warning ramping Heater servo ramp-up alarm. A warning occurred while the
up temperature was ramping up. The wafer heater was not shut
off.

3058 Temperature servo warning ramping Heater servo ramp-down alarm. A warning occurred while
down the temperature was ramping down. The wafer heater was
not shut off.

3083 HEATER2OK Interlock, Going Fault The Heater 2 OK interlock has triggered. The heater was
State shut off, and the chamber has gone to the fault state.

3085 N2 Pressure Fault, Heater going to Purge N2 pressure fault. The heater was shut off and cools
room temperature down to the room temperature.

Gas Panel and DeviceNet

1005 XX device fault A device on the stick failed. Verify the hardware.

1006 XX interlock raised An interlock caused the gas stick to turn off.

1007 XX flow is out of range, Setpoint = XX, The gas flow was out of the fault tolerance band as indicated.
Flow = XX

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Table 3-7. Safety and Fatal Events (9 of 14)

Event Events Description

ID

1010 Stick X and Stick X cannot have the Duplicate gas name. The same name cannot be given to
same gas name XX more than one gas stick on the same chamber. Enter a new
name.

1011 Stick X was turned off since required The gas stick turned off because the required stick had low
stick is not flowing or no flow.

1012 Service cannot continue - stick An interlock with the gas stick caused the service in progress
interlock is raised to abort.

1013 Lost connection to Devicenet Mfc with DeviceNet MFC disconnect. The system lost the DeviceNet
Mac Id XX connection to the MFC. Verify the MFC hardware and the
connection.

1014 Failed to send new setpoint to The connection to the MFC is active, but the message sent
Devicenet Mfc with Mac Id X to the MFC giving the new setpoint was not accepted by the
MFC. Verify the MFC hardware.

1015 MacId X Calibration set mismatch. DeviceNet MFC calibration mismatch. The calibration gas
Configured: X, Actual: X set for the MFC with the indicated MAC ID is not correctly
configured.
The MFC stores a calibration set in memory. This event
indicates that this set does not match the set stored on the
Producer SE controller. Perform one of the following in the
Set Up Gas Panel screen (Ch X → Gas Panel → Setup GP).
• Reconfirm the set that is currently displayed on
the screen.
• Select a new set on the screen.

1019 Mfc with Mac Id X has internal error DeviceNet MFC fault. The MFC with the indicated MAC ID
has an internal hardware error. Verify the MFC hardware.

1020 Failed to start XX on Stick X The selected gas panel service routine failed to start on the
stick.

1024 Gas Service aborted The current gas service was aborted. This occurs either
when the Abort button was pressed on the screen or there
was a hardware problem in the chamber or the gas panel.
Verify the hardware.

1025 Gas Service timed out The gas service was aborted because of timeout.

1027 Pressure out of valid range for The pressure of the selected calibration gas was out of the
calibration valid range at the beginning of the flow verify service. Verify
the pressure.

1028 Mfc not ready to continue service The MFC was not ready to continue the service because it
was in the wrong state. The service was aborted.

1033 Could not open card:X, Error Code XX The DeviceNet scanner is not responding. Check for a
hardware problem or wiring.

1034 Could not go online, Error Code XX The DeviceNet scanner could not go online. Check for a
hardware problem or wiring.

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Table 3-7. Safety and Fatal Events (10 of 14)

Event Events Description

ID

1037 Could not define device, Error Code The DeviceNet scanner could not add a device to the scan
XX list. This is an internal error. Report to Applied Materials.

3010 Watlow96 fault and error code is XX The Watlow temperature controller generated a fault.
Identify the error code and the cause of the problem.

Producer SE Controller

14 SW Exception (exception code) (text), Software exception occurred with the Producer SE software.
file name (line number) Record the error and report to Applied Materials.

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Table 3-7. Safety and Fatal Events (11 of 14)

Event Events Description

ID

Factory Interface Controller (FIC) and Delta Tau Motion Controller

1001 XX Communication Link Failed Communication failed to link as indicated.

1003 No Response from DTau Controller There was no response from the Delta Tau motion controller
while Async Response Poll while the asynchronous response was being polled.

1001 XX (controller type) Communication Communication between the indicated controller (FIC or
Link Failed Delta Tau) and the Producer SE failed. Verify the connection
and verify that the controller software is up and running.

1029 XX (controller type): XX An error occurred at the indicated controller. One of the
following messages would be displayed. The reason would
be given from the FIC.
• DTau: Invalid Port Name specified
• DTau: Checksum Error in response (reason)
• DTau: Invalid Cmd Id in response (reason)
• DTau: QryAlarm Error
• FIC: Invalid Port Name specified
• FIC: Checksum Error in response (reason)
• FIC: Invalid Cmd Id in response (reason)

1030 XX (controller type) Command X The requested command failed for the indicated reason.
failed: (reason) One of the following messages would be displayed.
• Command X failed: Not Communicating
• Command X failed: Write Failed
• Command X failed: Command
Acknowledgement Timed Out
• Command X failed: Command Response Timed
Out
• DTau Command X failed: Command Ack Failed
with code = XX
• DTau Command X failed: Invalid Ack received
• DTau Command X failed: Resp= XX
• DTau Command X failed: Invalid Response
received
• FIC Command X failed: Command Ack Failed
with code = XX
• FIC Command X failed: Invalid Ack received
• FIC Command X failed: Invalid Response
received
• FIC Command X failed: Fetch Map Data Error

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Table 3-7. Safety and Fatal Events (12 of 14)

Event Events Description

ID

1031 FI Command X execution error = The requested FIC command caused an execution error for
(device) (reason) the indicated reason. The error description would be
combination of the device and the reason below.
Device
• System
• Robot 1
• Robot 2
• Load Port A
• Load Port B
• Load Port C
• Load Port D
• Aligner 1
Reason
• Command Completed Ok
• Command execution error
• Wafer Pickup Failure
• Wafer Place Failure
• Controller Failure
• Command timeout error
• Communication Failure
• Wafer mapping Failure
• LoadPort Operation Failure
• Subsystem not homed
• Subsystem not initialized
• Command not allowed
• Command Aborted
• Wafer alignment failure
• Carrier Id Operation Failed
• Interlock Error

1032 Interpreted FI Error X (error code): The requested FIC command generated an error while the
(reason) Producer SE software was trying to interpret it. Identify the
error code. The reason would be given from the FIC.

3060 FIC Device X error: X An FIC device error occurred as indicated.

3093 FI XX command execution error = XX An FI command execution error occurred. Identify the error
code.

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Table 3-7. Safety and Fatal Events (13 of 14)

Event Events Description

ID

3094 FIC Device X error: (error message) The indicated FIC device caused an error. The device name
would be Cassette A, Cassette B, or FIC. The error message
would be one of the following:
• Not in PROCESS Position
• Wafer map command time-out
• Wafer map command failed with error = XX
• Fetch Wafer map Result command time-out
• Invalid Robot Slot X Specified
• Invalid FI Robot X Specified
• FI Robot1 is busy
• FI Robot2 is busy
• Invalid FI Robot Command
• FI Robot X Error = XX
• Not in PROCESS Position (Please LOAD the
cassette)
• Load Failed
• Unload Failed
• Not Present
• Map Failed
• Not in Process position

Factory Automation, SECS, and GEM

169 SECS connection failed for XX The SECS connection failed for the indicated reason.

170 SECS date and time did not set The SECS date and time are not correctly set. Reset the
correctly date and time.

175 Host Generated Alarm The host generated an alarm.

195 Modify Recipe Param=X not found The requested recipe parameter was not found. Verify the
parameter name and retry.

196 Failed to Modify Recipe=X, Step=X, The recipe, step, or parameter failed to be modified. Verify
Param=X the parameter name and value and retry.

197 Modify Recipe failed, Reason: X The modified recipe failed for the indicated reason. Verify
the parameter name and value and retry.

198 Modified Recipe download to The modified recipe failed to be downloaded to the chamber
chamber X failed, Reason: XX for the indicated reason. Check for the chamber state.

3106 Secs communication timeout SECS communication has timed out.

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Table 3-7. Safety and Fatal Events (14 of 14)

Event Events Description

ID

Metrology (Producer QA)

3097 Metrology chamber stage error An error occurred with the metrology chamber stage.
1. Re-initialize the metrology software and verify the
vacuum and air pressure.
2. If the error does not clear, call for service.

3098 Nano chamber preAlign error An error occurred during the metrology chamber
pre-alignment sequence.
1. Visually inspect wafer placement.
2. If the placement is not centered on the lift pins, verify
the robot handoff.

3099 Nano chamber deskew error An error occurred with the metrology chamber deskew
sequence.
1. Make sure that a patterned wafer is being measured.
2. Make sure that the metrology recipe deskew pattern
matches the pattern on the wafer being measured.
3. Re-teach the deskew pattern and verify the
measurement points.

3103 Metrology chamber communication An error occurred with communication between the
error - command X fail error code (XX) metrology controller and the Producer SE.
1. Identify the error code.
2. Check the communication connections and the status.
3. Re-initialize the metrology software.

3108 Metrology chamber set control state to An error occurred while the metrology chamber control state
remote fail - error code (XX) was being set to the Remote mode.
1. Identify the error code.
2. Make sure the metrology chamber is in the idle state.
3. If the metrology chamber is “OnLine Busy”, wait for the
metrology chamber to finish current job and retry.
4. If the metrology chamber is in the busy state for more
than a few minutes, shut down and restart the software.

3109 Process state is wrong The process state is incorrect. Change the state and retry.

3110 Remote command XX failed The requested remote command failed.

1. Make sure that the metrology chamber software is still
running.
2. Check the communication connections and status.
3. Re-initialize the metrology software.

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NOTE
System and operations manuals for the metrology chamber are provided as
Acrobat files (*.pdf) in the root directory of the metrology PC controller hard
drive.

NOTE
For the normal powerdown of the Producer SE, you must shut down all the
Windows NT operating systems, one at a time. These include:

• GUI PC
• Real Time PC
• FI PC
• Metrology chamber (Producer QA; Nanometrics NanoSpec 9000i)
— If present.
• Integrated Particle Monitor (IPM) — If present.

See Section 4.1.1, System Powerdown, page 4-3.

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Basic Operation Procedures 4-1

4 Basic Operation Procedures

This chapter provides the following sections:

• Section 4.1, System Powerup and Powerdown, page 4-2

– Section 4.1.1, System Powerdown, page 4-3
– Section 4.1.2, System Powerup, page 4-5
• Section 4.2, User Login and Logout Procedures, page 4-7
– Section 4.2.1, Login Procedure, page 4-7
– Section 4.2.2, Logout Procedure, page 4-7
• Section 4.3, Process Run Sequence, page 4-8
• Section 4.4, File Management Procedures, page 4-13
– Section 4.4.1, Copying Process Recipes, page 4-13
– Section 4.4.2, Copying Wafer Sequences, page 4-13
– Section 4.4.3, Installing System Software, page 4-14
– Section 4.4.4, Retrieving System Information for Troubleshooting, page 4-20
• Section 4.5, Error Recovery Procedures, page 4-22
– Section 4.5.1, Process Error Recovery, page 4-22
– Section 4.5.2, Wafer Handling Error Recovery, page 4-22

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4.1 System Powerup and Powerdown

The initial system startup must be done by an Applied Materials representative. Use the
following procedures to power up or power down the Producer SE system after the startup.
See Figure 4-1 for a summary of the procedures. See the following sections for detailed
procedures:

• Section 4.1.1, System Powerdown, page 4-3

• Section 4.1.2, System Powerup, page 4-5

SYSTEM POWERDOWN SYSTEM POWERUP

Shut down all the NT Remove lockout/tagout on

operating systems: CB100 in remote AC box
and close CB100.
• GUI PC
• Real Time PC Remove lockout/tagout on
• FI PC CB900 at the UPS
• Metrology (if present) interface compartment (if
• IPM (if present) present) and close CB900.

Press STOP button on Press EMO ENABLE

remote AC box. button on remote
AC box.
This shuts down
AC power to Producer SE
and all supporting
components.

Press START button on

remote AC box.

Open CB100 on remote

AC box and apply
lockout/tagout.

Open CB900 at the UPS

interface compartment (if Log into Producer SE
present) and apply software.
lockout/tagout.

Verify all supporting

components have
powered up (if present):
• Metrology
• IPM

Figure 4-1. System Powerup and Powerdown Summary

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4.1.1 System Powerdown

CAUTION
EQUIPMENT DAMAGE
Failure to follow the proper controller shutdown procedure may cause file corruption, resulting
in delay or failure in re-startup of the tool.
Shut down the system as described in this section. Follow all standard shutdown procedures
that have been established by the customer or Applied Materials.

Use this procedure to power down the Producer SE system.

NOTE
Whenever possible, remove power to the specific component rather than
powering down the entire system. For example, if the pump needs to be off,
turn off the pump circuit breaker located in the remote AC box.

1. Remove all wafers from the system, including the robots and the metrology
chamber.
2. Confirm that the robot is at the home position and that the loadlock indexer is at
step 0 (zero).

NOTE
Otherwise, when the system powers up again, it may take up to five minutes
before the system software boots up and all the motors return home.

3. Confirm the following:

• The wafer heaters are turned off.
• The throttle valves are closed.
• The vacuum pumps are turned off.

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4. Shut down all the Windows NT operating systems, one at a time, as follows. These
include:
• GUI PC
• Real Time PC
• FI PC
• Metrology chamber (Producer QA; Nanometrics NanoSpec 9000i) — If
present.
• Integrated Particle Monitor (IPM) — If present.

a. Switch to each control system from the Producer SE software.

b. Go to the Windows NT Workstation menu (ctrl-esc) and select Shut Down.
c. On the Shut Down Windows popup menu, select Shut down the
computer?, then select Yes.
5. After all the NT operating systems are shut down, press the STOP button (PB163)
on the remote AC box. This will turn off the AC power to the Producer SE and
all the supporting components.

WARNING
HAZARDOUS VOLTAGE
After CBl00 and CB900 are opened in the
next steps, AC power is still present at the
input terminals to CBl00 and CB900.
Be sure to lock out and tag out CBl00 and
CB900.

6. Open CBl00 (main disconnect) on the remote AC box. Apply the lockout/tagout.
7. If the UPS is present, open CB900 (UPS disconnect) on the UPS interface
compartment. Apply the lockout/tagout.

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4.1.2 System Powerup

To restart the Producer SE system after a powerdown:

1. Confirm that all circuit breakers on the remote AC box are turned on except the
main disconnect (CB100).
2. Remove the lockout/tagout from CB100 on the remote AC box.
3. If the UPS is present:
a. Confirm that all circuit breakers on the UPS interface compartment are turned
on except the UPS disconnect (CB900).
b. Remove the lockout/tagout from CB900 on the UPS interface compartment.
4. Confirm that the facility power is on and functioning properly, following the
required safety procedures.
5. Confirm that all exposed AC breaker boxes and AC boxes are closed and secured.
6. Close CB100 by placing the main disconnect handle in the ON position.
7. If the UPS is present, close CB900 by placing the UPS disconnect handle in the
ON position.
8. Confirm that the 24 V Present (LT160) indicator lamp on the remote AC box is lit.
9. Press the EMO ENABLE (PB161) button on the remote AC box.
10. Confirm the green light inside the EMO Enable button remains lit. If the light does
not remain lit, check the EMO loop and ensure that all the EMO buttons on the
system are enabled and all the cables are attached.
11. Push the START button (PB162) on the remote AC box. While the contactor is
being pushed, K140 will be energized, making noise that resembles a single
hammer stroke.
12. Confirm that the green light inside the START button remains lit.
The system is powered on, and there is line voltage (208 V) present throughout
the system, including the system controller. Software will start loading.
13. At the monitor, manually launch the Internet Explorer program.

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14. When the system controller has finished reading the software files, the monitor
will display the Login screen. See Figure 4-2.
15. Log into the Producer SE software. See Section 4.2.1, Login Procedure, page 4-7.

16. Verify that all supporting components have powered up (if present):
• Producer QA (metrology chamber)
• IPM

LOGOUT BUTTON

Figure 4-2. Login Screen

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4.2 User Login and Logout Procedures

Users must “log in” and “log out” of the system to operate the Producer SE system.

NOTE
See the following screens to set up the user profile and the access authority:
• Section 9.3.3, User Settings Screen, page 9-10
• Section 9.9.2, User Access Configuration Screen, page 9-62
• Section 9.9.3, Screen Access Configuration Screen, page 9-64

4.2.1 Login Procedure

1. Touch the Logout button in the navigation bar. The Login screen is displayed.
See Figure 4-2.
2. Touch the area to the right of User Name. Enter the user name.
3. Touch the area to the right of Password. Enter the user password.
4. Touch the Login button. The screen displays:
Loading Configuration, please wait...
Then, the Monitor Wafers screen will display.

4.2.2 Logout Procedure

1. Touch the Logout button in the navigation bar. See Figure 4-2.
2. Confirm that the screen will return to the Login screen.

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4.3 Process Run Sequence

Initiating a normal, automatic process sequence consists of the following basic steps:

• Verifying the system status

• Verifying the chamber status
• Selecting the process sequence to run
• Loading the cassettes
• Running the sequence
• Unloading the cassettes

To run a process:

1. Verify that system power is on. See Section 4.1.2, System Powerup, page 4-5.
2. Log into the Producer SE software. See Section 4.2.1, Login Procedure, page 4-7.
3. Place the transfer (buffer) chamber online for process as follows:
a. From the Monitor MF screen (MF → Monitor), ensure that the transfer
chamber is pumped down to the base pressure.
b. Ensure that the transfer chamber purge MFC has the correct online default
flow setpoint.
c. Place the transfer chamber online for process (MF → Put Buffer OnLine).
4. Place the loadlock online for process as follows:
a. From the Monitor FI screen (FI → Monitor), home the FI robot.
b. From the Monitor MF screen (MF → Monitor), home the loadlock lifts and
the VHP (transfer chamber) robot.
c. Place the loadlock online for process (MF → Put LL OnLine).
5. Place the Twin chamber online for process as follows:
a. From the Monitor Chamber screen (Ch X → Monitor), ensure that the wafer
heaters and the heat exchanger are at the process temperature.
b. In the Monitor Chamber screen (Ch X → Monitor), ensure that the desired
chamber is pumped down to the base pressure.
c. Ensure that the lifts are in a known position. If not, home the lifts from the
Monitor Chamber screen (Ch X → Monitor).
d. Place the chamber online for process (Ch X → Put Chamber OnLine).

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6. Prepare the system for process as follows:

a. From the Control System screen (System → Control System), set the State
field to Automatic. See Section 5.2, Control System Screen, page 5-4.
b. From the Control System screen, select the lot name.
c. Verify the System header and the Chamber headers for the desired chambers
are all blue.

If the headers are blue, the system is in the normal wafer processing mode
and set up for the automatic operation and the chambers are online for process.
7. From the Control System screen (System → Control System), confirm the desired
mode (Serial or Parallel) and select the desired sequence to run.
8. From the Monitor Wafers screen (System → Monitor Wafers), select the desired
cassette to load. See Section 5.3, Monitor Wafers Screen, page 5-8.
9. Place a cassette of wafers onto the cassette platform.
An operator or automated handling system delivers a wafer carrier (FOUP) to an
open load port.
10. Select the Start button on the Control System screen.
The fab host system (via SECS, GEM, or HSMS) or the operator initiates loading.
11. From the Monitor Wafers screen (System → Monitor Wafers), monitor the wafer
transfer within the system. See Figure 4-3 and Section 5.3, Monitor Wafers
Screen, page 5-8.
From the Monitor Process screen (Ch X → Monitor Process), monitor the process
status. See Figure 4-4 and Section 6.3, Monitor Process Screen, page 6-28.
Wafers are typically transferred in the following sequence (see Figure 4-5):
FI
a. The cassettes are moved to the process position.
b. FOUP opens.
c. Wafer mapping is performed in the carrier.
d. The atmospheric FI robot transfers individual wafers onto the lift pins in the
loadlock.
Loadlock
a. Wafers are lowered onto the preheaters.
b. The preheaters heat wafers to the temperature (typically 250°C to 350°C)
programmed in the selected preheat recipe. Preheat reduces the preheat time
and wafer bow in the Twin chamber.
c. The twin-blade VHP vacuum robot in the transfer chamber transfers a pair of
wafers to one of the Twin chambers.

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Twin Chamber A, B, or C
a. A pair of wafers are processed at the same time.
b. The VHP robot transfers wafers back to the loadlock.
FI
a. The FI robots transfer wafers from the loadlock to the cooling station inside
the FI. Wafers are cooled by passive timed cooling for, typically, about
60 seconds.
b. The FI robots transfer wafers back to the FOUP.
c. FOUP closes.
12. After the wafers are transferred back to the cassette, select the desired cassette to
unload from the Monitor Wafers screen. See Section 5.3, Monitor Wafers Screen,
page 5-8.
13. After the cassette is moved to the load/unload position, remove the cassette of
processed wafers.
An operator or automated handling system removes the FOUP.
SYSTEM → MONITOR WAFERS

LLA LLB

Figure 4-3. Monitor Wafers Screen

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CH X → MONITOR PROCESS

Figure 4-4. Monitor Process Screen

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TWIN CHAMBER A

TRANSFER (BUFFER)
CHAMBER CONTAINING
VHP VACUUM ROBOT
2 1
3
PROCESS POSITION 2

1 2

TWIN CHAMBER B TWIN CHAMBER C

2 1
PROCESS POSITION 1

2 4
LOADLOCK CONTAINING
TWO TRAYS (LLA AND LLB)

5
COOLING STATION

FACTORY INTERFACE (FI)

1 6 CONTAINING TWO ROBOTS
AND COOLING STATION

TP01676A. CASSETTE A CASSETTE B

FOUP LOAD PORTS

Figure 4-5. Mainframe Components and Wafer Transfer Sequence

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4.4 File Management Procedures

This section provides the following file management procedures.
• Section 4.4.1, Copying Process Recipes, page 4-13
• Section 4.4.2, Copying Wafer Sequences, page 4-13
• Section 4.4.3, Installing System Software, page 4-14
• Section 4.4.4, Retrieving System Information for Troubleshooting, page 4-20

4.4.1 Copying Process Recipes

NOTE
See Section 4.4.4, Retrieving System Information for Troubleshooting,
page 4-20 on how to take recipe backup files from the hard disk.

To copy process recipes between the hard disk and floppy disk:

1. Go to the Recipes for Chamber screen (Editor → Edit Recipe → Choose Chamber
→ Desired Chamber).
2. Select Backup at the bottom of the screen. The following options will be
displayed:
• Backup to Floppy — Copies a recipe from the hard disk to a floppy.
• Restore from Floppy — Copies a recipe from a floppy to the hard disk.

NOTE
This feature is available for Producer SE software Version A1.4 and higher.

4.4.2 Copying Wafer Sequences

NOTE
See Section 4.4.4, Retrieving System Information for Troubleshooting,
page 4-20 on how to take sequence backup files from the hard disk.

1. Go to the Sequence Directory screen (Editor → Edit Sequence).

2. Select Backup at the bottom of the screen. The following options will be
displayed:
• Backup to Floppy — Copies a sequence from the hard disk to a floppy.
• Restore from Floppy — Copies a sequence from a floppy to the hard disk.

NOTE
This feature is available for Producer SE software Version A1.4 and higher.

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4.4.3 Installing System Software

To install or upgrade the system software:

1. Return all wafers to the cassettes (System → Return All Wafers).

2. Make sure that all chambers are offline.
3. Close all the applications.

NOTE
When the installation completes, the Producer SE system will reboot. Be sure
to close all the applications before starting the installation.

4. Insert the system CD into the CD drive of the GUI PC. The GUI PC is located at
the upper right-hand corner inside the factory interface (FI). See Figure 4-6.

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FACTORY INTERFACE (FI)

PC POWER ON INDICATOR
RESET BUTTON HDD INDICATOR FLOPPY DISK DRIVE
KEYBOARD (HDD ACCESSED)
LOCKOUT BUTTON KEYBOARD LOCKOUT
INDICATOR CD DRIVE

TP01765A.
INTERFACE CONNECTION POWER ON/OFF
(NOT USED) SWITCH

Figure 4-6. GUI PC

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5. Log off and log back in as a system administrator.

NOTE
If you are not logged in as a system administrator, the program will display an
error message. See Figure 4-7.

Figure 4-7. Error Message — Login as System Administrator is Required

6. Click on setup.exe from the system CD.

7. The program asks to select the setup type. Select Typical and proceed with Next.
See Figure 4-8.

Figure 4-8. Selecting Setup Type

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8. When the Enable Auto Logon window appears, accept the setting as it is. Proceed
with Next. See Figure 4-9.

Figure 4-9. Enable Auto Logon Window

9. The system starts to install the real time application files. Wait until it completes.
See Figure 4-10.

Figure 4-10. Real Time Application Files Installation

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10. The program asks which the data file version to be used with the new software.
Select Current if you use the most recent data files. Proceed with Next. See
Figure 4-11.

Figure 4-11. Selecting Data File Version

11. The program will automatically start to set the security data. Wait until it
completes. See Figure 4-12.

Figure 4-12. Setting Security Information

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12. When the security data is set up, a message is displayed as shown in Figure 4-13.
Then, the real time PC will automatically reboot. Next, the GUI PC will
automatically reboot.

Figure 4-13. Rebooting Real Time PC and GUI PC

13. When the PCs have restarted, the program will automatically launch the
CGABridge. CGABridge is the communication software that interfaces between
the real time PC and web clients, developed by Applied Materials.
14. Open the Internet Explorer program. The Producer SE Login screen appears.
15. Log into the system. The system uses the user profile that has been retrieved as
part of the data files in step 10. See Section 4.2.1, Login Procedure, page 4-7.
16. Open the Copyright screen under the Help button and make sure that the screen
displays the new software revision.

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4.4.4 Retrieving System Information for Troubleshooting

1. Insert a floppy disk into the floppy disk drive of the GUI PC. The GUI PC is
located at the upper right-hand corner inside the factory interface (FI). See
Figure 4-6.
2. Run the backup script by clicking the MFBackup.bat shortcut icon at the desk
top. This will create backup files out of the data located on the real time PC and
save them in the GUI PC.

NOTE
You cannot copy out files directly from the real time PC. It does not have a
floppy disk drive or a CD drive.

3. The following backup files and folders will be saved under

E:\MF\ProducerSE\Data on the GUI PC:
• Calib.pm — Contains the calibration data including the lifts, heaters,
RF generators, and gas panels.
• Config.pm — Contains the system configuration data.
• mount.pm — Contains the data for device configuration.
• Setup.pm — Contains system constants and other parameter settings for
system operations.
• Debug Data
• Console.log — Contains the process log data.
• SeqTrace.log — Contains the sequencer log data.
• Exception — Exception reports are saved in .Exception files,
.FullRep files, and .Report files. Also, .Memory files contain
information about the memory.
Copy desired files from the hard disk to a floppy disk.
4. The following backup folders will be saved under C:\AMAT\ProducerSE\Data
on the GUI PC:
• Recipes
• Sequences
Copy desired files from the hard disk to a floppy disk.

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5. To copy out a file of events from the system, use the Export command from the
Event Browser screen (Go To → Event Browser → Export → .csv File → desired
file → Open).
The system will create a file in the Excel spreadsheet format and display it on a
separate window. Save it on your hard disk or on a floppy disk.

NOTE
This feature is available for Producer SE software Version A1.4 and higher.

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4.5 Error Recovery Procedures

When an error (fault) occurs, the audible alarm will sound and a fault message will be
displayed in red on the alarm line.

There are two general types of errors: process errors and wafer handling errors. If an error
is displayed on the screen, read the message and take the necessary steps as described in the
following sections:

• Section 4.5.1, Process Error Recovery, page 4-22

• Section 4.5.2, Wafer Handling Error Recovery, page 4-22

NOTE
See Section 3.4, Events and Alarms, page 3-11 for a description of critical
events (Safety or Fatal events) that generate a fault.

4.5.1 Process Error Recovery

When a process error occurs, the process immediately stops. Use the following procedure to
recover from the process error:

1. From the Monitor Process screen (Ch X → Monitor Process), select the Abort
Recipe button.
2. Select Return All Wafers from the System header pulldown menu.
3. Confirm that all the wafers return to the original location in the cassette.
4. From the appropriate Chamber header (Ch X), select Put Chamber OffLine.
5. Resolve the problem before resuming the process.

4.5.2 Wafer Handling Error Recovery

1. Go to the Monitor Wafers screen (System → Monitor Wafers). When a wafer
handling error occurs, wafers in conflict are displayed in orange.
2. Out of the two conflicting wafer locations that are displayed in orange, select the
desired location.
3. Select Confirm wafer on the popup menu.

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System Header Screens 5-1

5 System Header Screens

This chapter describes the screens accessed from the System header in the following sections.
These screens are used to control and monitor the system-wide functions including wafer
transfers, wafer processing, and system interlocks.

• Section 5.1, System Header Pulldown Menu, page 5-2

• Section 5.2, Control System Screen, page 5-4
– Section 5.2.1, Chamber Cleans Detailed Window, page 5-6
• Section 5.3, Monitor Wafers Screen, page 5-8
– Section 5.3.1, Device-Specific Windows in Work Area, page 5-12
Section 5.3.1.1, Chamber Summary Window, page 5-12
Section 5.3.1.4, Cassette Detailed Window, page 5-16
Section 5.3.1.2, Loadlock Detailed Window, page 5-14
Section 5.3.1.3, Cooling Station Detailed Window, page 5-15
• Section 5.4, Monitor Interlocks Screen, page 5-18

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5.1 System Header Pulldown Menu

See Figure 5-1 and Table 5-1 for pulldown menu items under the System header.

SYSTEM

Figure 5-1. System Header Pulldown Menu

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Table 5-1. System Header Pulldown Menu

No. Item Description

1 Control System Accesses the Control System screen. See Section 5.2, Control
System Screen, page 5-4.

2 Monitor Wafers Accesses the Monitor Wafers screen. See Section 5.3, Monitor
Wafers Screen, page 5-8.

3 Monitor Interlocks Accesses the Monitor Interlocks screen. See Section 5.4, Monitor
Interlocks Screen, page 5-18.

4 Go to Automatic Places the system in the Automatic mode for normal wafer processing.
mode In the Automatic mode, the System header is blue. Surrounding
borders are either white (idle) or green (running).

5 Go to Manual mode Places the system in the Manual mode for maintenance,
troubleshooting or testing. In the Manual mode, the System header is
gray. Surrounding borders are either white (idle) or green (running).

6 Return All Wafers Commands the robot to return all wafers to their original slots in the
cassettes. Only wafers from a cassette can be returned. When wafers
were manually created from any screen, they stay at the current
position.

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5.2 Control System Screen

Use the Control System screen to set up for a process run and run the sequence. Also, use
this screen to configure the lot association to each cassette.

See Figure 5-2 and Table 5-2.

SYSTEM → CONTROL SYSTEM

6 7
1

3
4

8 5
9

Figure 5-2. Control System Screen

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Table 5-2. Control System Screen

No. Item Description

1 Mode Configures the cassette loading mode:

• Serial — Runs the same sequence with cassette A, then
cassette B.
• Parallel — Runs different sequences with cassette A and
cassette B.
To switch the mode, touch the Switch to Parallel (or Switch to Serial)
button that is displayed, depending on the currently selected mode.

2 State Provides the following options:

• Automatic — Normal wafer processing mode. In the
Automatic mode, the System header is blue.
• Manual — For maintenance, troubleshooting or testing. In
the Manual mode, the System header is gray.
To switch the mode, touch the Switch to Automatic (or Switch to
Manual) button that is displayed, depending on the currently selected
mode.

3 Start button Starts the selected sequence.

4 Stop button Stops the sequence in progress. If the VHP robot is transferring
wafers, it stops when the transfer is completed. If a recipe is running,
it will complete, and the wafer will stay in the chamber.

5 Return All Wafers Commands the robot to return all wafers to their original slots in the
cassettes. Only wafers from a cassette can be returned. When wafers
were manually created, they stay at the current position.

6 Lot Control Used to select one lot name for the entire cassette. Touch the field
under Cassette A or Cassette B, and all the saved lot names are
displayed in a pulldown menu. Select a desired lot name and touch
the Set All button. Then, the lot name will appear next to all wafer
locations in the Lot Assoc Cass X window (see item 7).

7 Lot Assoc Displays the lot name associated with each wafer. To change the lot
Cassette X name association for individual wafers, touch each slot number and
enter a new lot name from the pulldown menu. To associate a lot
name to a wafer sequence, see Section 10.4, Lot-Sequence
Association Screen, page 10-30.

8 Chamber Process Configures a default chamber recipe for each chamber. When
Recipe Chamber Recipe is programmed in an individual sequence, the
sequence will run the default chamber recipe configured in this field.
(This feature is available with system software Version A1.4 and
higher.) See Section 10.3.2, Sequence Steps Screen, page 10-28.

9 Normal Clean Configures a cleaning recipe to be performed between process runs.

Recipe A different cleaning recipe can also be programmed in individual
sequences. The Normal Clean Recipe will always run regardless of
the setting in each sequence. See Section 10.3.2, Sequence Steps
Screen, page 10-28.
Touching each chamber frame brings up the Chamber Cleans
detailed window on the right. See Section 5.2.1, Chamber Cleans
Detailed Window, page 5-6.

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5.2.1 Chamber Cleans Detailed Window

Use the Chamber Cleans detailed window to select the chamber clean options. See
Figure 5-2 and Table 5-2.

SYSTEM → CONTROL SYSTEM → CHAMBER X FRAME

Figure 5-3. Control System Screen — Chamber Cleans Detail Window

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Table 5-3. Control System Screen — Chamber Cleans Detail Window

No. Item Description

1 On Go If Enabled, runs the selected cleaning recipe when the Start button is
pressed either on the Control System screen or the Monitor Wafer
screen.

2 On Load If Enabled, runs the selected cleaning recipe whenever the FI starts
to load a cassette in the Auto mode.

3 Periodic If Enabled, runs the selected cleaning recipe every time a certain
number of wafers have been processed. Enter the number of wafers
in the Interval field to define the cleaning interval. The So Far field
indicates the number of wafers processed since the last clean.
When a periodic leaning recipe is also programmed in a sequence for
the chamber, the periodic clean with a lower interval will always run,
and the other periodic clean will not run.

4 Idle If Enabled, runs the selected clean recipe when the chamber is idle
for the time defined (in minutes) in the Idle Time field. In the Min Wfrs
field, define the minimum number of wafers processed before the idle
clean starts. Enter zero (0) to disable this feature.

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5.3 Monitor Wafers Screen

Use the Monitor Wafers screen to monitor wafer movements and the process status summary
within the system. This screen graphically displays the wafer status within the system and
allows manual wafer transfers when the system is in the Manual mode.

Wafer display on this screen is color-coded. See Table 3-4, Wafer Status Color Scheme,
page 3-10. When a wafer is present, the original wafer location (cassette number and slot
number) is displayed. When the system is in the Manual mode, wafer graphic in gray indicates
that no wafer is present. If you touch the location, the Create wafer command is displayed.
In the Automatic mode, no wafer graphic is shown when a wafer is not present at the location.

See Figure 5-4, Figure 5-5, Table 5-4, and Table 5-5.
SYSTEM → MONITOR WAFERS

3 8

1
4
2

Figure 5-4. Monitor Wafers Screen (1 of 2)

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Table 5-4. Monitor Wafers Screen (1 of 2)

No. Item Description

1 Start button Starts the selected sequence. See Section 5.2, Control System
Screen, page 5-4 for selecting a sequence.

2 Stop button Stops the sequence in progress. If the VHP robot is transferring
wafers, it stops when the transfer is completed. If a recipe is running,
it will complete, and the wafer will stay in the chamber.

3 Twin chambers Displays the wafer location and status and the current chamber
pressure. Touch these frames to display the summary information on
the chamber in the work area. See Section 5.3.1.1, Chamber Summary
Window, page 5-12.
The status of the Twin chambers, buffer (transfer) chamber, loadlock,
and factory interface (FI) on this screen is indicated by the color of the
surrounding borders of each device graphic:
• Blue — Online idle
• Light blue — Offline idle
• Black — Undefined
• Red — In fault
• Green — Running

4 Buffer chamber Displays the wafer location and status and the current chamber
pressure.

5 LL (loadlock) Displays the wafer location and status and the current pressure.
Touch this frame to display detailed information on the loadlock in
the work area. See Section 5.3.1.2, Loadlock Detailed Window,
page 5-14.
The loadlock houses two wafer trays, each of which contains two
wafer slots (1 and 2). The preheaters heat wafers to the temperature
(typically 250°C to 350°C) programmed in the selected preheat
recipe. Preheat reduces the preheat time and wafer bow in the Twin
chamber.

6 FI Displays the wafer location and status at each FI robot.

7 Cool Touch this frame to display detailed information on the wafer cooling
(cooling station) station in the work area. See Section 5.3.1.3, Cooling Station
Detailed Window, page 5-15.
The cooling station houses up to 13 processed wafers for timed
cooling after the deposition process.

8 Work area Displays detailed information of a selected device frame. See

Section 5.3.1, Device-Specific Windows in Work Area, page 5-12.

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SYSTEM → MONITOR WAFERS

10

11

12

13

14

Figure 5-5. Monitor Wafers Screen (2 of 2)

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Table 5-5. Monitor Wafers Screen (2 of 2)

No. Item Description

9 Present (or Absent) Displays whether the cassette is present or absent at the FI load port.

10 Cass Cmd Displays a window with the following options (see Figure 5-5):
• Pod Well Placed — Confirms that the FOUP (cassette) is
correctly placed.
• Load Pod — Loads the FOUP. The FOUP will be latched
to the load port and move to the docking position, and the
FOUP door will open.
• Unload Pod — Unloads the FOUP. The FOUP door will
close, and the FOUP will move back to the load port.
• Latch Pod — Latches the FOUP to the FI load port.
• Unlatch Pod — Unlatches the FOUP from the FI load port.
• Dock Pod — Docks the FOUP toward the FI door.
• Undock Pod — Moves the FOUP away from the FI door
to the load/unload position at front.
• Open Door — Opens the FOUP door.
• Close Door — Closes the FOUP door.
• Map Pod — Performs a wafer mapping for the FOUP.

11 Cass A and Cass B Displays the individual wafer status. Touch this frame to display
detailed information on the cassette in the work area. See
Section 5.3.1.4, Cassette Detailed Window, page 5-16.

12 Pos Displays the current cassette position:

• Load/Unload
• Process
• Unknown

13 Map Displays the wafer mapping state for the cassette:

• Mapped — Wafer mapping has been performed.
• Not Mapped — Wafers have not been mapped.

14 CID Displays the carrier ID under one of the following conditions:

• The Read Carrier Id command is selected in the Command
field of the Cassette Detailed Window. See Section 8.2.1.3,
Cassette Detailed Window, page 8-8.
• The Auto Read Carrier Id on Pod Placement option is
enabled in the Generic Window screen (Go To →
Diagnostics → Generic Window → $ → AT → System →
FA → cnfFACarMoveInMoveOut).
See Section 9.6.7, Carrier Id Screen, page 9-44 for a description of
the carrier ID.

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5.3.1 Device-Specific Windows in Work Area

If you touch any selectable device frame on the left of the Monitor Wafers screen, detailed
information of that device frame is displayed in the work area on the right. See the following
sections:

• Section 5.3.1.1, Chamber Summary Window, page 5-12

• Section 5.3.1.2, Loadlock Detailed Window, page 5-14
• Section 5.3.1.3, Cooling Station Detailed Window, page 5-15
• Section 5.3.1.4, Cassette Detailed Window, page 5-16

When a wafer is present, the work area for the loadlock, FI cooling station, or cassettes
displays the original wafer location (cassette number and slot number). Wafer status is
color-coded. See Table 3-4, Wafer Status Color Scheme, page 3-10.

5.3.1.1 Chamber Summary Window

When you touch the Twin chamber graphic, the work area will display the summary of the
current recipe and the process parameters. See Figure 5-6.

SYSTEM → MONITOR WAFERS → CHAMBER X

Figure 5-6. Chamber Summary Window

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Recipe

• Recipe name in progress

• Step name in progress
• Step end mode — Time, Endpoint, or Time Or Endpoint
• Step num XX of XX — Current step number in progress and the total number of
steps in the recipe
• Step time XX of XX — Time elapsed and the maximum step time allowed
• Time in Recipe — Elapsed time in the current recipe

Process

• Total Flow — Current total process gas flow to the chamber in sccm
• Pressure — Current chamber pressure
• Temp — Current heater temperature in °C at the process positions 1 (Side 1) and
2 (Side 2)
• HF RF and LF RF (high frequency and low frequency RF generators) at the process
positions 1 (Side 1) and 2 (Side 2)
– Act SP — Actual forward power setpoint sent to the generator in W
– FWD — Actual forward power received at the chamber in W
See Section 6.2.1.7, HF RF Generator Detailed Window, page 6-20 and
Section 6.2.1.8, LF RF Generator Detailed Window, page 6-22 for detailed
information about the RF generators. Also, see Section 6.6, RF Calibration Screen,
page 6-58.

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5.3.1.2 Loadlock Detailed Window

When you touch the loadlock device frame, the work area will display the status of wafers
and the process status in the loadlock. Touch each slot to create, delete or move a wafer. See
Figure 5-7.

SYSTEM → MONITOR WAFERS → LL

2 SLOTS IN LLA 2 SLOTS IN LLB

Figure 5-7. Loadlock Detailed Window

LL Recipe

• Recipe name in progress

• Step name in progress
• Step end mode — Time, Endpoint, or Time Or Endpoint
• Step num XX of XX — Current step number in progress and the total number of
steps in the recipe
• Step time XX of XX — Time elapsed and the maximum step time allowed
• Time in Recipe — Elapsed time in the current recipe

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5.3.1.3 Cooling Station Detailed Window

When you touch the FI cooling station device frame, the work area will display the status of
wafers at the cooling station. The cooling station houses up to 13 processed wafers for
timed-cooling after the deposition process. Touch each slot to create, delete or move a wafer.
See Figure 5-8.

SYSTEM → MONITOR WAFERS → COOL

Figure 5-8. Cooling Station Detailed Window

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5.3.1.4 Cassette Detailed Window

When you touch the cassette device frame, the work area will display the status of wafers in
the cassette. Touch each slot to create, delete or move a wafer. See Figure 5-9.

SYSTEM → MONITOR WAFERS → CASSETTE A OR CASSETTE B

Figure 5-9. Cassette Detailed Window

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5.4 Monitor Interlocks Screen

Use the Monitor Interlocks screen to view the description, status, and conditions of interlocks
associated with each device. There are two types of interlocks:

• Periodic interlocks — Describe a condition that normally should not happen.

Software continuously checks this condition and will trigger actions when it
happens.
• Preventive interlocks — Describe a condition that should never happen. If the
user's action attempts to make this condition happen, software always rejects this
action.

See Figure 5-10 and Table 5-6.

SYSTEM → MONITOR INTERLOCKS

1 2

Figure 5-10. Monitor Interlocks Screen

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Table 5-6. Monitor Interlocks Screen

No. Item Description

1 Device tree Displays the tree structure of the interlock groups within the system.
Touch the desired item, then the associated interlocks will display on
the right.
Select the plus (+) symbol to open the tree. Select the minus (−)
symbol to collapse the tree.

2 Interlock list Displays the following information about the interlocks:

• Interlock status
• n/a — Not applicable. This is displayed for preventive
interlocks.
• ok — The interlock is currently satisfied.
• STOP (STOP) — The interlock has been activated and

has generated a fault. When a fault is generated, the

system responds as described in the Reaction field.
• Description of each interlock
• Condition — An assumed condition in which the interlock
occurs. If the device is not in this condition, the interlock will
never activate.
• Reaction — Resulting actions when the interlock occurs. A
different set of actions occur, depending on the type of the
fault. The following are standard types of actions when a
fault occurs during a wafer sequence:
• N/A (preventive) — Displayed for preventive interlocks.
• STOP — Stops the sequence. Wafers turn red.
• FINISH — Allows the current sequence to finish.
Wafers turn yellow. New wafer transfer is not allowed
to the chamber that caused a fault until the problem
has been cleared.
• FINISH LOT — Allows the current lot to finish. New lot
run is not allowed until the problem has been cleared.
• NO ACTION — No action is taken to the sequencing.

3 Interlock triggers Displays the specific conditions in which each interlock occurs. Touch
the desired interlock in the interlock list (see item 2) to display its
trigger conditions in this area. This is mostly for internal use by
Applied Materials.

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Chamber Header Screens 6-1

6 Chamber Header Screens

This chapter describes the screens accessed from the Ch (chamber) headers in the following
sections. These screens are used to control and monitor the chamber functions.

• Section 6.1, Ch (Chamber) Header Pulldown Menu, page 6-2

• Section 6.2, Monitor Chamber Screen, page 6-4
– Section 6.2.1, Device-Specific Windows in Work Area, page 6-10
Section 6.2.1.1, Gas Panel Detailed Window, page 6-11
Section 6.2.1.2, Interlock Detailed Window, page 6-12
Section 6.2.1.3, Lifts Detailed Window, page 6-13
Section 6.2.1.4, Recipe Control Detailed Window, page 6-14
Section 6.2.1.5, Reactor Laminar Flow (RLF) Detailed Window,
page 6-16
Section 6.2.1.6, RPS (Remote Clean) Detailed Window, page 6-18
Section 6.2.1.7, HF RF Generator Detailed Window, page 6-20
Section 6.2.1.8, LF RF Generator Detailed Window, page 6-22
Section 6.2.1.9, Heater Detailed Window, page 6-24
Section 6.2.1.10, Heat Exchanger Detailed Window, page 6-25
Section 6.2.1.11, Throttle Valve Detailed Window, page 6-26
Section 6.2.1.12, Pump Detailed Window, page 6-27
• Section 6.3, Monitor Process Screen, page 6-28
• Section 6.4, Leak Rate Screen, page 6-32
– Section 6.4.1, Leak Rate Sequence, page 6-34
• Section 6.5, Gas Panel Screens, page 6-36
– Section 6.5.1, Monitor Gas Panel Screen, page 6-36
Section 6.5.1.1, Stick Window, page 6-40
Section 6.5.1.2, MFC Window, page 6-46
– Section 6.5.2, Set Up Gas Panel Screen, page 6-48
– Section 6.5.3, Service Gas Panel Screen, page 6-50
– Section 6.5.4, Calibrate Gas Panel Screen, page 6-54
• Section 6.6, RF Calibration Screen, page 6-58
• Section 6.7, Lift Calibration Screen, page 6-60
• Section 6.8, Endpoint Screen, page 6-62

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6.1 Ch (Chamber) Header Pulldown Menu

See Figure 6-1 and Table 6-1 for pulldown menu items under each Ch X header.

CH X

1
2

3 5

4
6

7 10

8 11

9 12

Figure 6-1. Ch (Chamber) Header Pulldown Menu

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Table 6-1. Chamber Header Pulldown Menu

No. Item Description

1 Monitor Chamber Accesses the Monitor Chamber screen. See Section 6.2, Monitor
Chamber Screen, page 6-4.

2 Monitor Process Accesses the Monitor Process screen. See Section 6.3, Monitor
Process Screen, page 6-28.

3 Put Chamber Places the chamber online for process.

Online

4 Put Chamber Places the chamber offline for maintenance.

Offline

5 Abort Recipe Aborts the recipe running in the chamber.

6 Service Chamber Accesses the window with the following chamber service options:
• Pump down
• Vent
• Leak Rate — Displays the Leak Rate screen. See
Section 6.4, Leak Rate Screen, page 6-32.
• Abort Service — Aborts the service program in progress.

7 Gas Panel Displays a window to access the gas panel screens. See Section 6.5,
Gas Panel Screens, page 6-36.

8 Heater Displays a window to access the heater screens. These screens are
currently not supported.

9 Ozonator Not used for PECVD.

10 RF Generators Displays a window to access the RF Calibration screen. See

Section 6.6, RF Calibration Screen, page 6-58.

11 Lifts Displays a window to access the Lift Calibration screen. See

Section 6.7, Lift Calibration Screen, page 6-60.

12 Endpoint Accesses the Endpoint screen. See Section 6.8, Endpoint Screen,
page 6-62.

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6.2 Monitor Chamber Screen

The Monitor Chamber screen graphically displays the current chamber status. Each chamber
has its own Monitor Chamber screen.

When the chamber is offline for maintenance, this screen allows direct control of the chamber
hardware, subject to the interlocks, correct system state, and user level. When the chamber
is online for process, the chamber hardware cannot be turned off or on from this screen.

See Figure 6-2, Figure 6-3, Table 6-2, and Table 6-3. See Figure 6-4 for the location of two
process positions at each Twin chamber.

CH X → MONITOR CHAMBER

1 3 6

5
2 4

1 2

Figure 6-2. Monitor Chamber Screen (1 of 2)

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Table 6-2. Monitor Chamber Screen (1 of 2)

No. Item Description
1 Gas panel Displays the status of process gas final lines configured for the
chamber:
• Total gas flow in sccm
• Valve status (open or closed)
• Gas flow status — The gas line is blue when the gas is
flowing to the chamber. It is cyan when there is no flow.
Touch this frame to display the Gas Panel detailed window in the work
area. See Section 6.2.1.1, Gas Panel Detailed Window, page 6-11.
Also see Section 6.5, Gas Panel Screens, page 6-36.
2 Twin chamber Graphically displays the chamber status:
graphic • Interlock OK indicates that all the interlocks of the Interlock
detailed window are satisfied. Red flashing Interlocked
indicates that one or more interlocks of the Interlock
detailed window are active. Touch this field to display the
Interlock detailed window in the work area. See
Section 6.2.1.2, Interlock Detailed Window, page 6-12.
• Chamber pressure as read by the capacitance manometer.
• When a wafer is present, the original wafer location
(cassette number and slot number) is displayed.
• Heater lift position — Up or down
• Pin lift position — Up or down
Combination of the heater lift position and the pin lift position creates
the chamber position. See Figure 6-5.
• Release position — Both are down.
• Lift position — Heater is down; pin lift is up.
• Process position — Both are up.
• Unknown (gray background) — The lifts are not in any of
the above positions or not homed.
• Process Spacing — See item 2 of Table 6-19, Lift
Calibration Screen, page 6-61.
Touch the heater graphic to display the Lifts detailed window in the
work area. See Section 6.2.1.3, Lifts Detailed Window, page 6-13.
3 Chamber Displays the chamber status (Online, Offline, Init, Power Off, Going
online, or Failed) and the recipe name that is currently running. Touch
this frame to display the Recipe Control detailed window in the work
area. See Section 6.2.1.4, Recipe Control Detailed Window,
page 6-14.
4 RLF Displays the RLF status (On or Off). Touch this frame to display the
(reactor laminar Reactor Laminar Flow detailed window in the work area. See
flow) Section 6.2.1.5, Reactor Laminar Flow (RLF) Detailed Window,
page 6-16.
5 RPS Displays the status of the Remote Clean generator (Ready, Not
(Remote Clean) Ready, Plasma On, or Fault). One Remote Clean generator is used
for each chamber. Touch this frame to display the RPS detailed
window in the work area. See Section 6.2.1.6, RPS (Remote Clean)
Detailed Window, page 6-18.
6 Work area Displays detailed information of a selected device frame. Device
frames surrounded by blue borders with 3D shadow are selectable
to view the information in this area.

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CH X → MONITOR CHAMBER

1 2

10

12 11 13 14

Figure 6-3. Monitor Chamber Screen (2 of 2)

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Table 6-3. Monitor Chamber Screen (2 of 2)

No. Item Description

7 HF RF generator Displays the status of the high frequency (HF) RF generator for
process positions 1 (left) and 2 (right).
• On or Off status
• FWD — Requested forward power
• DC Bias — Currently measured DC bias
• Imp — Current impedance value in tenths of ohm (Ω).
• Match — Selected match position
Touch this frame to display the HF RF generator detailed window in
the work area. See Section 6.2.1.7, HF RF Generator Detailed
Window, page 6-20.

8 LF RF generator Displays the status of the low frequency (LF) RF generator for
(when used) process positions 1 (left) and 2 (right):
• On or Off status
• FWD — Requested forward power
• Pwr Avail — Currently available power percentage
(1%–100%) that the generator can produce out of the
maximum available power
Touch this frame to display the LF RF generator detailed window in
the work area. See Section 6.2.1.8, LF RF Generator Detailed Window,
page 6-22.

9 Temp Displays the current temperature of wafer heaters 1 (left) and 2 (right)
in °C. Touch this frame to display the Heater detailed window in the
work area. See Section 6.2.1.9, Heater Detailed Window, page 6-24.

10 HX Displays the status of heat exchanger:

(heat exchanger) • On or Off state
• Status — OK or Overtemp
• Temp — Current coolant temperature in °C
Touch this frame to display the Heat Exchanger detailed window in
the work area. See Section 6.2.1.10, Heat Exchanger Detailed
Window, page 6-25.

11 TV (throttle valve) Displays the status of the throttle valve. Touch the valve symbol to
fully open or fully close it. See Figure 6-6.
Touch this frame to display the Throttle Valve detailed window in the
work area. See Section 6.2.1.11, Throttle Valve Detailed Window,
page 6-26.

12 Isolation valve Displays the status of the isolation valve (open or closed). Touch the
valve symbol to open or close it.

13 FL Press Displays the current pressure of the chamber foreline.

(foreline pressure)

14 Pump Displays the current status of the chamber pump (Off, Ready, or Fault).
Touch this frame to display the Pump detailed window in the work area.
See Section 6.2.1.12, Pump Detailed Window, page 6-27.

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CHAMBER A

2 1

1 2

CHAMBER B CHAMBER C

2 1

TP01676A. FACTORY INTERFACE (FI)

Figure 6-4. Process Positions 1 and 2 at Chambers A, B, and C

TWIN CHAMBER

WAFER

HEATER

LIFT PINS

LIFT
PLATE

RELEASE POSITION LIFT POSITION PROCESS POSITION

HEATER IS DOWN. HEATER IS DOWN. HEATER IS UP.
PIN LIFT IS DOWN. PIN LIFT IS UP. PIN LIFT IS UP.

Figure 6-5. Chamber Positions

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FULLY CLOSED (HOME) FULLY OPEN

POSITIONED AT 0 DEGREE POSITIONED AT 90 DEGREES

Figure 6-6. Throttle Valve Positions

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6.2.1 Device-Specific Windows in Work Area

If you touch any selectable device frame on the left of the Monitor Chamber screen, detailed
information of that device frame is displayed in the work area on the right. See the following
sections:

• Section 6.2.1.1, Gas Panel Detailed Window, page 6-11

• Section 6.2.1.2, Interlock Detailed Window, page 6-12
• Section 6.2.1.3, Lifts Detailed Window, page 6-13
• Section 6.2.1.4, Recipe Control Detailed Window, page 6-14
• Section 6.2.1.5, Reactor Laminar Flow (RLF) Detailed Window, page 6-16
• Section 6.2.1.6, RPS (Remote Clean) Detailed Window, page 6-18
• Section 6.2.1.7, HF RF Generator Detailed Window, page 6-20
• Section 6.2.1.8, LF RF Generator Detailed Window, page 6-22
• Section 6.2.1.9, Heater Detailed Window, page 6-24
• Section 6.2.1.10, Heat Exchanger Detailed Window, page 6-25
• Section 6.2.1.11, Throttle Valve Detailed Window, page 6-26
• Section 6.2.1.12, Pump Detailed Window, page 6-27

NOTE
All the device frames that are displayed in blue text with blue surrounding
borders in the work area bring up a detailed window.

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6.2.1.1 Gas Panel Detailed Window

When you touch the Gas Panel device frame, the work area will display further information
of the gas panel. See Figure 6-7. Also, see Section 6.5, Gas Panel Screens, page 6-36.

CH X → MONITOR CHAMBER → GAS PANEL

Figure 6-7. Gas Panel Detailed Window

• Stick — Stick numbers and names of the gases and liquids.

• Path — Currently selected path. When it is blank, it means that the gas is currently
not flowing. See Table 6-10, Gas and Liquid Path, page 6-42.
• Setpoint — Flow setpoint
• Flow — Current flow
• Device Status — Overall status of all the gas devices: Ready or Not Ready.
• Flow Status — Overall flow status of all the gas and liquid sticks: Idle, In Spec,
Transition, Fully Open, or Fault. If any one of the sticks is in the fault condition,
this field displays Fault.

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6.2.1.2 Interlock Detailed Window

When you touch the Interlock device frame, the work area will display the status of all the
chamber interlocks. When each interlock is met, it displays Not Active. See Figure 6-8.

CH X → MONITOR CHAMBER → INTERLOCK

Figure 6-8. Interlock Detailed Window

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6.2.1.3 Lifts Detailed Window

When you touch the Twin chamber lift graphic, the work area will display further information
of the heater lift and the pin lift. Each process position (Side 1 or Side 2) has its own window.
See Figure 6-9. See Section 6.7, Lift Calibration Screen, page 6-60 for a description of the
displayed items.

CH X → MONITOR CHAMBER → LIFT GRAPHIC

USE THIS FIELD TO SWITCH

BETWEEN HEATER LIFT AND
PIN LIFT.

Figure 6-9. Lifts Detailed Window

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6.2.1.4 Recipe Control Detailed Window

When you touch the Chamber device frame, the work area will display the information of
the current recipe in progress and allows command control over the recipe. See Figure 6-10.

CH X → MONITOR CHAMBER → CHAMBER

Figure 6-10. Recipe Control Detailed Window

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Process Recipe

• Rec name — Process recipe name that is currently selected. Touch this field to
select a new recipe.

Clean Recipe

• Rec name — Clean recipe name that is currently selected. Touch this field to select
a new recipe.

Running Recipe

• Recipe name — Recipe name that is currently running

• Step name — Step name currently in progress
• Step end mode — Step end control parameter: Time, Endpoint, or Time Or
Endpoint. When “Time Or Endpoint” is selected in the recipe, the step ends when
the Max Time parameter is reached or when the endpoint parameter is achieved,
whichever the earliest. See Section 10.2.4, Recipe Steps Screen, page 10-14 and
Section 10.2.5, Endpoint Screen, page 10-18.
• Step Num XX of XX — Current step number in progress out of the total number
of steps in the recipe.
• Step Time XX of XX — Elapsed step time (in seconds) out of the maximum step
time allowed
• Time in Recipe — Elapsed time in the current recipe

Touch Process Recipe Action or Clean Recipe Action to access a window that
provides the following options (see Figure 6-10):

• Start Recipe — Starts the recipe from the beginning.

• Resume Recipe — Continues the recipe from the time it was stopped.
• Complete Step and Pause — Continues the recipe till the end of the step and
then pauses.
• Abort Step and Pause — Aborts the step in which the error occurred and then
pause.
• Abort Recipe — Aborts the recipe.

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6.2.1.5 Reactor Laminar Flow (RLF) Detailed Window

When you touch the RLF device frame, the work area will display further information of the
reactor laminar flow (RLF). When the RLF is on, selected gases keep flowing to the chamber
whenever the chamber is online and not running a recipe. See Figure 6-11.

CH X → MONITOR CHAMBER → RLF

Figure 6-11. Reactor Laminar Flow Detailed Window

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• RLF
– On — Enables the RLF. Selected gases keep flowing to the chamber whenever
the chamber is online and not running a recipe.
– Off — Disables the RLF.
• Status — Displays one of the following:
– Active — The RLF is flowing the selected gases to the chamber and
controlling the chamber pressure as defined in this window.
– Not Active — The RLF is enabled but idle (no gas flow or pressure control).
• Start Delay — Defines the start delay time in seconds. The RLF will delay
becoming active for this specified time after the chamber turns ready for the RLF
(online and no recipe running).
• Maximum Time — Defines the maximum time that the RLF will stay active.
Entering zero (0) means that the RLF will run infinitely.
• Pressure — Defines the chamber pressure that the RLF will maintain while it is
active. Entering zero (0) means that the RLF does not control the chamber pressure.
• Gas and Setpoint — Defines the gases to flow and their flow setpoints. Only
non-reactive gases will be available in the list.

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6.2.1.6 RPS (Remote Clean) Detailed Window

When you touch the RPS (Remote Clean) device frame, the work area will display further
information of the Remote Clean. See Figure 6-12.

CH X → MONITOR CHAMBER → RPS

Figure 6-12. RPS (Remote Clean) Detailed Window

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• Status — Displays one of the following:

– Ready — The Remote Clean is ready to accept a command.
– Not Ready — The Remote Clean is not ready to accept a command.
– Plasma On — A plasma has struck in the Remote Clean.
– Fault
– Off
• Command
– Off — Turns off the Remote Clean generator.
– On — Turns on the Remote Clean generator and sets it to the default power
setpoint.
• SetPoint — User-requested forward power setpoint in W.
• Actual SP — Actual forward power setpoint sent to the generator in W. Based on
the user-requested forward power setpoint above, software calculates how much
power needs to be generated, considering a power loss during the transmission to
the chamber.
• Fwd Pwr — Actual forward power received at the chamber in W.
• Timeout — Maximum waiting time for plasma-on after the Remote Clean
generator has turned on. When no plasma strikes within this time, a fault occurs.

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6.2.1.7 HF RF Generator Detailed Window

When you touch the HF RF generator device frame, the work area will display further
information of the HF RF generator. Each generator has its own window. See Figure 6-13.

CH X → MONITOR CHAMBER → HF RF

Figure 6-13. HF RF Generator Detailed Window

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• Status — Displays one of the following:

– On
– Off
– Fault
– Ramping — The generator power is ramping to the setpoint.
– Serving — The generator power is stable at the setpoint.
• State — ON, OFF, WaitON (waiting for RF on), Ramp, or Stable.
• Command — Allows the following command entry (see Figure 6-13):
– On — Turns the generator on.
– Off — Turns the generator off.
– Setpoint — Activates change of the setpoint after a new setpoint is entered
in the Setpoint field below.
– Host Control — Allows the generator control by the host.
– Local Control — Allows the local control at the generator.
– NULL — Do not use this command.
• Setpoint — User-requested forward power setpoint in W.
• Act SP — Actual forward power setpoint sent to the generator in W. Based on the
user-requested forward power setpoint above, software calculates how much
power needs to be generated, considering a power loss during the transmission to
the chamber.
• FWD — Actual forward power received at the chamber in W.
• Match — Requested match position (Default, Match 1, Match 2, Match 3, or
Match 4).
• Act Match — Current match position.

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6.2.1.8 LF RF Generator Detailed Window

When you touch the LF RF generator device frame, the work area will display further
information of the LF RF generator. Each generator has its own window. See Figure 6-14.

CH X → MONITOR CHAMBER → LF RF

Figure 6-14. LF RF Generator Detailed Window

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• Status — Displays one of the following:

– On
– Off
– Fault
– Ramping — The generator power is ramping to the setpoint.
– Serving — The generator power is stable at the setpoint.
• State — ON, OFF, WaitON (waiting for RF on), Ramp, or Stable.
• Command — Allows the following command entry (see Figure 6-14):
– On — Turns the generator on.
– Off — Turns the generator off.
– Setpoint — Activates change of the setpoint after a new setpoint is entered
in the Setpoint field below.
– Host Control — Do not use this command.
– Local Control — Do not use this command.
– NULL — Do not use this command.
• Setpoint — User-requested forward power setpoint in W.
• Act Sp — Actual forward power setpoint sent to the generator in W. Based on the
user-requested forward power setpoint above, software calculates how much
power needs to be generated, considering a power loss during the transmission to
the chamber.
• FWD — Actual forward power received at the chamber in W.
• Pwr Avail — Currently available power percentage (1%–100%) that the generator
can produce out of the maximum available power

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6.2.1.9 Heater Detailed Window

When you touch the heater temperature (Temp) device frame, the work area will display
further information of the wafer heater. See Figure 6-15.

NOTE
The same heater control software is used for the wafer heaters and the loadlock preheat
heaters. See Section 7.2, Monitor Mainframe Screen, page 7-4.

CH X → MONITOR CHAMBER → TEMP

Figure 6-15. Heater Detailed Window

The following information is displayed for the whole chamber:

• Status — OK, Servo, Stable (stable at the setpoint), Warning, or Fault

• Temp SP — Heater temperature setpoint in °C.
• Ramp Rate — Heater temperature ramp rate setpoint as °C per second

The following information is displayed for each process position (Side 1 or Side 2):

• Cur Temp — Current heater temperature in °C.

• Perc Out — Current heater power output as % of the full power

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6.2.1.10 Heat Exchanger Detailed Window

When you touch the heat exchanger (HX) device frame, the work area will display further
information of the heat exchanger. See Figure 6-16.

CH X → MONITOR CHAMBER → HX

Figure 6-16. Heat Exchanger Detailed Window

• Status — OK or Overtemp.
• State — On state or Off state.
• Command — Allows the following command entry (see Figure 6-16):
– Off — Turns off the heat exchanger.
– On — Turns on the heat exchanger.
– Change setpoint — Activates change of the setpoint after a new setpoint
is entered in the SP field below.
• SP — Coolant temperature setpoint in °C.
• Act SP — Actual coolant temperature in °C.
• Res — Current coolant resistivity in megaohm (MΩ).

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6.2.1.11 Throttle Valve Detailed Window

When you touch the throttle valve (TV) device frame, the work area will display further
information of the throttle valve. See Figure 6-17.

CH X → MONITOR CHAMBER → TV

Figure 6-17. Throttle Valve Detailed Window

• Status — Pressure stable, Pressure unstable, Device fault, Pressure control

warning, or Pressure control fault.
• Press SP — Chamber pressure setpoint in Torr.
• Pos SP — Throttle valve position setpoint in degrees clockwise from the home
(fully closed) position. See Figure 6-6, Throttle Valve Positions, page 6-9.
• Ramp Rate — Pressure ramp rate as Torr per second.
• Pos Ramp R — Throttle valve position ramp rate as degrees per second.
• Pressure — Current chamber pressure in Torr.
• Position — Current throttle valve position in degrees from the home position (fully
closed). See Figure 6-6, Throttle Valve Positions, page 6-9.
• Fully Open — Touch this button to fully open the throttle valve.
• Fully Close — Touch this button to fully close the throttle valve.

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6.2.1.12 Pump Detailed Window

When you touch the Pump device frame, the work area will display further information of
the Twin chamber vacuum pump. See Figure 6-18.

NOTE
The same pump control software is used for the mainframe pump. See Section 7.2,
Monitor Mainframe Screen, page 7-4.

CH X → MONITOR CHAMBER → PUMP

Figure 6-18. Pump Detailed Window

• Status — Displays one of the following:

– Off — The pump is turned off.
– Ready — The pump is on and ready to serve.
– Fault
• Command — Turns on or off the pump.

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6.3 Monitor Process Screen

Use the Monitor Process screen to monitor the current process status of the Twin chamber
on one screen. Each Twin chamber has its own screen.

See Figure 6-19, Figure 6-20, Table 6-4 and Table 6-5.

CH X → MONITOR PROCESS

1 2

Figure 6-19. Monitor Process Screen (1 of 2)

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Table 6-4. Monitor Process Screen (1 of 2)

No. Item Description

1 Recipe Info Displays the following information:

• Name — Recipe name that is currently running
• Step Num XX of XX — Current step number in progress out
of the total number of steps in the recipe
• Max Step Time — Maximum step time allowed in seconds
• Step Name — Step name currently in progress
• Step End Ctrl — Time, Endpoint, or Time Or Endpoint.
See Section 6.2.1.4, Recipe Control Detailed Window, page 6-14 and
Section 10.2, Recipe Editor Screens, page 10-3 for details.

2 Recipe Status Displays the following information:

• Step State — Idle, Preset TV, Wait Stable, or Stable. When
it is Preset TV, the throttle valve is being placed to the preset
position before the step starts. When it is Stable, the
chamber pressure, pressure control, and gas flow are
considered to be stable.
• Time in Step — Elapsed time in the current step
• Time in Recipe — Elapsed time in the current recipe

3 Pressure Control Displays the following information:

• Setpoint — The chamber pressure setpoint for the step.
• Actual Press — The actual chamber pressure.
• TV Pos — The current throttle valve position in degrees
clockwise from the home position.
• Status — The current throttle valve status: Pressure stable,
Pressure unstable, Device Fault, Pressure Control
Warning, or Pressure Control Fault.
See Section 6.2.1.11, Throttle Valve Detailed Window, page 6-26 for
details.

4 Side 1 Lift Displays the following information for the wafer lifts and heater:
Side 2 Lift • Position — Current chamber position: Release, Lift,
Process, Unknown, or Process Spacing.
• State — Current heater lift state: Idle, Homing, or Moving.
• Spacing — Distance between the top surface of the wafer
heater and the shower head (gas distribution plate) in mils
• Setpoint — Wafer heater temperature setpoint
• Temp — Current heater temperature
See Section 6.7, Lift Calibration Screen, page 6-60 for details.

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CH X → MONITOR PROCESS

10 11

7 9

Figure 6-20. Monitor Process Screen (2 of 2)

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Table 6-5. Monitor Process Screen (2 of 2)

No. Item Description

5 Side 1 HF RF Displays the following information for the HF RF generators:
Side 2 HF RF • Status — On, Off, Fault, Ramping, or Serving
• Setpoint — User-requested forward power setpoint in W.
• Fwd Pwr — Actual forward power received at the chamber
in W.
• Match — Requested match position.
• Actual — Current match position.
See Section 6.2.1.7, HF RF Generator Detailed Window, page 6-20
for details.
6 Side 1 LF RF Displays the following information for the LF RF generators:
Side 2 LF RF • Status — On, Off, Fault, Ramping, or Serving
(when used) • Setpoint — User-requested forward power setpoint in W.
• Fwd Pwr — Actual forward power received at the chamber
in W.
• Pwr Avail — Currently available power percentage
(1%–100%) that the generator can produce out of the
maximum available power
See Section 6.2.1.8, LF RF Generator Detailed Window, page 6-22 for
details.
7 RPS Displays the following information:
(Remote Clean) • Command — On or Off
• Status — Ready, Not Ready, Plasma On, Fault, or Off
See Section 6.2.1.6, RPS (Remote Clean) Detailed Window,
page 6-18 for details.
8 Endpoint Displays the following information:
• Status — Idle, Wait Min Time, Qualifying, Endpointing, and
Overetching
• Qualify Slope — Endpoint signal qualifier slope value (mV
per second) that is referenced after the specified minimum
time has passed.
• Endpoint Slope — Endpoint signal slope value (mV per
second). The step ends when this value is reached after
the qualifier value is met.
• Current Slope — Current slope value (mV per second)
• Duration — Elapsed clean step time in seconds.
See Section 6.8, Endpoint Screen, page 6-62 for details.
9 Gas Panel Displays the following information:
• Stick — Stick numbers and names of the gases and liquids.
• Path — Currently selected path. When it is blank, it means
that the gas is currently not flowing. See Table 6-10, Gas
and Liquid Path, page 6-42.
• Setpoint — Flow setpoint
• Flow — Current flow
See Section 6.5.1, Monitor Gas Panel Screen, page 6-36 for details.
10 End Step Ends the current step.
11 Abort Recipe Aborts the current recipe.

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6.4 Leak Rate Screen

Use the Leak Rate screen to perform a leak rate test. Each Twin chamber, buffer chamber,
and loadlock has its own Leak Rate screen.

NOTE
To perform a leak rate for the buffer chamber or the loadlock, go to the Leak Rate
BUFFER screen (MF → Service Buffer → Leak Rate) or the Leak Rate LL screen (MF
→ Service Load Lock → Leak Rate).

See Figure 6-21 and Table 6-6. Also, see Section 6.4.1, Leak Rate Sequence, page 6-34.

CH X → SERVICE CHAMBER → LEAK RATE

1 2

3
4

0.3

5 6

Figure 6-21. Leak Rate Screen

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Table 6-6. Leak Rate Screen

No. Item Description

1 Interval Display the following values. During the leak rate routine, each set of
Pressure values will be displayed as each sampling time has passed.
Leak Rate • Interval — Interval between leak rate samplings as
specified in the Sampling Interval field (see item 3)
• Pressure — Current chamber pressure measured at the
end of the sampling interval (in Torr).
• Leak Rate — Chamber pressure difference between
samplings (in Torr). The first Leak Rate value indicates the
difference between the Initial Pressure (see item 2) and the
chamber pressure measured at the end of the first interval
(that is, in 40 seconds in the example of Figure 6-21). The
second Leak Rate value indicates the pressure difference
between the one measured in 40 seconds and the one
measured in 80 seconds in the example of Figure 6-21.

2 Leak Rate Status Displays the following:

• Last Service Date — Date and time when the most current
leak rate routine was completed. When the system reboots,
the screen will be initialized to be blank.
• Elapsed Time — Total elapsed time since the Start button
was selected.
• Avg Leak Rate — Average leak rate out of all the samplings
(in mTorr per second). This value is calculated as below at
the end of the leak rate routine:
InitialPressure – EndPressure
---------------------------------------------------------------------------------
MaximumTime
• Base Pressure — Chamber pressure measured at the end
of the Pump Out time (see item 3).
• Initial Pressure — Chamber pressure taken in the time
specified in the Stable Time field after the base pressure
was measured. When the Initial Pressure is measured, the
first sampling starts.
• Leak Rate State — Current state of the leak test routine.

3 Leak Rate Configures the leak rate parameters. Default parameters are:
Parameters • Leak Chk Time — 600 seconds
• Pump Out Time — 120 seconds
• Sampling Interval — 40 seconds
• Stable Time — 10 seconds
• Max Leak Rate — 0.3 Torr/min. per sample. When the leak
rate reaches the value entered in this field, a fault occurs.
• Max Pressure — 10 Torr. When the chamber pressure
reaches the value entered in this field, a fault occurs.

4 Gas Stick Selection Use this area to open the MFCs and purge valves before starting the
leak rate test if necessary.

5 Start Touch this button to start the leak rate routine.

6 Stop Touch this button to stop the leak rate routine in progress.

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6.4.1 Leak Rate Sequence

The leak rate routine is performed in the following sequence:

1. In the Leak Rate Parameters area, enter the parameters.

2. In the Gas Stick Selection area, open the MFCs and purge valves if necessary.

NOTE
During the leak rate test, all MFCs and purge valves are usually closed.
However, it may be sometimes desirable to open certain MFCs or purge
valves to leakcheck a gas line.

3. Touch the Start button. The process chamber slit valves closes, and the chamber
pumpdown begins.
4. When the Pump Out Time has elapsed as specified (see item 3), the system
measures the base pressure and displays it in the Base Pressure field (see item 2).
Then, the chamber isolation valve closes, and the pumpdown stops.
5. The system waits for the Stable Time as specified (see item 3), then it measures
and displays the Initial Pressure (see item 2).
6. The system starts to take leak rate samplings. Every time the Sampling Interval
has elapsed as specified (see item 3), the actual chamber pressure and the leak rate
for that interval are displayed in the table on the left.
7. Sampling repeats during the Leak Chk Time (see item 3). The number of
samplings is determined by the Sampling Interval and the Leak Chk Time entered
in the Leak Rate Parameters area. For example, when the Leak Chk Time is set at
600 seconds and the Sampling Interval is 40 seconds, a total of 15 samplings
(600 ÷ 40 = 15) are taken.
When the leak rate reaches the value specified in the Max Leak Rate field (see
item 3), a fault occurs, and the leak rate routines is halted.
When the chamber pressure reaches the value specified in Max Pressure field (see
item 3), a fault occurs, and the leak rate routines is halted.
8. When the leak rate routine completes:
• The Last Service Date field displays the date and time of completion.
• The Leak Rate State field displays back to the Idle state.
• The Avg Leak Rate (see item 2) displays the average leak rate out of all the
samplings (in mTorr per second) as calculated below:

InitialPressure – EndPressure
---------------------------------------------------------------------------------
MaximumTime

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6.5 Gas Panel Screens

The Gas Panel submenu of the Ch X header provides the access to the following screens:

• Section 6.5.1, Monitor Gas Panel Screen, page 6-36

– Section 6.5.1.1, Stick Window, page 6-40
– Section 6.5.1.2, MFC Window, page 6-46
• Section 6.5.2, Set Up Gas Panel Screen, page 6-48
• Section 6.5.3, Service Gas Panel Screen, page 6-50
• Section 6.5.4, Calibrate Gas Panel Screen, page 6-54

6.5.1 Monitor Gas Panel Screen

Use the Monitor Gas Panel screen to monitor the gas panel functions and perform the gas
panel service routines. Each Twin chamber has its own Monitor Gas Panel screen. When the
chamber is offline and all interlocks are satisfied, gas valves can be manually opened or
closed from this screen. See Figure 6-22, Figure 6-23, Table 6-7 and Table 6-8.

CH X → GAS PANEL → MONITOR GP

Figure 6-22. Monitor Gas Panel Screen (1 of 2)

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APPLIED MATERIALS  Chamber Header Screens 6-37

Table 6-7. Monitor Gas Panel Screen (1 of 2)

No. Item Description

1 Gas stick Displays the following information about each gas or liquid stick that
is configured in the gas panel:
• Stick number
• Gas or liquid name
• Flow path that is currently selected
• Status — Displays the status of the gas path (Idle, In Spec,
Transition, Fully Open, or Fault). When a service routine is
being performed, displays the status of the routine.
The gas panel supports up to 10 gases for each chamber pallet.
However, when liquid delivery components are required, the total
number of gases and liquids per pallet (combined) can be up to 12.
Touch this frame to display the Stick window. See Section 6.5.1.1, Stick
Window, page 6-40.

2 Safety (source) Displays the valve status (open or closed). This valve closes to
valve isolate the gas source when the pump or purge routine is performed
from this screen.

3 Purge valve Displays the valve status (open or closed) and the purge gas stick
number that the gas stick is connected to (P1, P2, P3 or P4 as
configured). This valve opens to purge the gas line when the purge
routine is performed from this screen.

4 Pressure Displays the gas line pressure (in Torr) read by the transducer (when
present).

5 Upstream valve Displays the valve status (open or closed). This valve connects the
process gas from the source to the MFC and opens for both purge and
pump routines.

6 Mfc or Lfc Displays the following information for each MFC (mass flow
controller) or LFC (liquid flow controller):
• Flow setpoint
• Actual flow rate
Touch the Mfc frame to display the MFC window. See Section 6.5.1.2,
MFC Window, page 6-46. No LFC window is available.

7 Pneumatic shutoff Displays the valve status (open or closed). The first valve
valve downstream of the MFC or LFC. This valve opens for both purge and
pump routines.

8 Final line number Displays the final gas line that the gas stick is connected to.

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6-38 Chamber Header Screens APPLIED MATERIALS 

CH X → GAS PANEL → MONITOR GP

10 11 12 13 14 15 16 17

Figure 6-23. Monitor Gas Panel Screen (2 of 2)

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APPLIED MATERIALS  Chamber Header Screens 6-39

Table 6-8. Monitor Gas Panel Screen (2 of 2)

No. Item Description

9 Gas panel status Displays the summary status of the gas panel:
• Dev Status — Overall status of all the gas devices: Ready
or Not Ready.
• Flow Status — Overall flow status of all the gas and liquid
sticks: Idle, In Spec, Transition, Fully Open, or Fault. If any
one of the sticks is in the fault condition, this field displays
Fault.
• Total Setpt — Sum of all the setpoint flows.
• Total Flow — Sum of all the actual flows.
• Ch Pressure — Chamber pressure read by the capacitance
manometer.

10 Stop All Stops any gas flow from the gas panel.

11 Page 2 > Scrolls the screen to the second page (when present).

12 PURGE_1, Up to four purge sticks can be configured in each chamber gas panel.
PURGE_2, Touching this device frame displays a window with the following
PURGE_3, and options:
PURGE_4 • Stop — Stops the purge flow.
(purge gas sticks) • Open to Vent — Opens the purge gas line for venting.
• Cancel — Closes the window.

13 Purge valve Displays the valve status (open or closed). This valve opens to purge
the gas line when the purge routine is performed from this screen.

14 Lower purge valve Opens to vent the chamber.

15 Pressure Displays the purge line pressure (in Torr) read by the transducer.

16 Final valve Displays the valve status (open or closed) of the final valve that is
configured for the chamber. Up to six gas final lines can be configured
for each chamber.

17 Divert valve Displays the status (open or closed) of the divert valve (when
present) to flow the vapor to the foreline. A divert valve is installed
only when process liquid is used or an ozone stick is used. For an
ozone stick, ozone flows through the divert valve to the ozone
destructor.

Producer SE PECVD Operations and Programming

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6-40 Chamber Header Screens APPLIED MATERIALS 

6.5.1.1 Stick Window

When you touch each gas stick device frame, the Stick window is displayed for that gas stick.
Use this window to perform the gas panel service routines. See Figure 6-24 and Table 6-9.

CH X → GAS PANEL → MONITOR GP → GAS STICK DEVICE FRAME

4
3

OPTIONS FOR MFC OPTIONS FOR LFC OPTIONS FOR MFC OPTIONS FOR LFC

Figure 6-24. Stick Window

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APPLIED MATERIALS  Chamber Header Screens 6-41

Table 6-9. Stick Window

No. Item Description

1 Setpoint Displays the current flow setpoint (right) and allows entry of a new
setpoint (left) in sccm. After entering a new setpoint and a new gas
path, touch the Set button (see item 4) to activate the new entry.

2 Path Displays the current gas path (right) and allows entry of a new path
(left). Touch the Path field under New, then a pulldown menu is
displayed. See Figure 6-24. See Table 6-10 on which valves will
open for each path. See Table 6-11 for usage and description of each
path.

3 Stop Closes the gas stick and sets it to the idle state.

4 Set Activates a new flow setpoint and a new gas path. After entering a
new setpoint and a new path (see item 1 and item 2), touch this
button.

5 Open Full Opens the gas stick to the full scale to a new path. Touch this button
after selecting a new path.

6 Purge Thru Defines the duration of each service in seconds. When Cycle Purge
Purge is selected in the Service field, the Purge Through, Purge, and Pump
Pump paths will open for the selected time in this order. The whole cycle
repeats for the times specified in the Cycles field.

7 Cycles Defines a new number of cycles (left) and displays the current cycle
in progress (right).

8 Service Displays the currently active service name (right) and allows
command entry of a new service (left). See Figure 6-24 for the menu
options. See Table 6-11 for usage and description of each path.

9 OK Closes the window.

Producer SE PECVD Operations and Programming

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 Table 6-10. Gas and Liquid Path (1 of 3)

6-42
Layout Purge Lower Purge Pump/Purge Safety Upstream MFC/LFC Shutoff Final Valve Divert
Valve Valve Valve Valve Valve Valve Valve
Regular Gas

Chamber Header Screens

Chamber Open Open Open Open
Pump Upstream Open Open Open
Pump Downstream Open Open
Pump Final Open
No valve No valve
Purge Through Open Open Open Open
Purge Open Open Open
Producer SE PECVD Operations and Programming

Pump Purge Open Open Open

MFC Zero Open Open
Regular Gas with No Final Valve
Chamber Open Open Open
Pump Upstream Open Open
Revision 001

Pump Downstream Open

Purge Through No valve Open Open Open No valve
Purge Open Open Open
Pump Purge Open Open
MFC Zero Open Open
Regular Gas with Divert Valve
Chamber Open Open Open Open
Divert Open Open Open Open Open
Pump Upstream Open Open Open
Pump Downstream Open Open
Pump Final Open
No valve
Pump Thro Divert Open
Purge Through Open Open Open Open Open

APPLIED MATERIALS 
Purge Open Open Open
Pump Purge Open Open Open Open
MFC Zero Open Open
 Table 6-10. Gas and Liquid Path (2 of 3)

APPLIED MATERIALS 
Layout Purge Lower Purge Pump/Purge Safety Upstream MFC/LFC Shutoff Final Valve Divert
Valve Valve Valve Valve Valve Valve Valve
Gas with Safety Valve
Chamber Open Open Open Open Open
Pump Upstream Open Open Open Open
Pump Downstream Open Open
Pump Final Open
No valve No valve
Purge Through Open Open Open Open Open Open
Purge Open Open Open Open Open
Producer SE PECVD Operations and Programming

Pump Purge Open Open Open Open Open

MFC Zero Open Open Open
Gas with Safety Valve and Divert Valve
Chamber Open Open Open Open Open
Divert Open Open Open Open Open Open
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Pump Upstream Open Open Open Open

Pump Downstream Open Open
Pump Final Open
No valve
Pump Thro Divert Open
Purge Through Open Open Open Open Open Open Open
Purge Open Open Open Open Open

Chamber Header Screens

Pump Purge Open Open Open Open Open Open
MFC Zero Open Open Open
Carrier Gas
Chamber Open Open Open Open
Divert Open Open Open Open Open
Pump Upstream Open Open Open
Pump Downstream Open Open
Pump Final No valve Open
Purge Through Open Open Open Open Open
Purge Open Open Open

6-43
Pump Purge Open Open Open Open
MFC Zero Open Open
 Table 6-10. Gas and Liquid Path (3 of 3)

6-44
Layout Purge Lower Purge Pump/Purge Safety Upstream MFC/LFC Shutoff Final Valve Divert
Valve Valve Valve Valve Valve Valve Valve
Liquid

Chamber Header Screens

Chamber Open Open Open Open
Divert Open Open Open Open Open
Pump Upstream Open Open Open
Pump Downstream Open Open
Pump Final Open
No valve No valve
Pump Thro Divert Open
Producer SE PECVD Operations and Programming

Purge Through Open Open Open Open Open Open

Purge Open Open Open Open
Pump Purge Open Open Open Open
Fill Liquid Open
Ozone
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Chamber Open Open Open Open

Divert Open Open Open
Divert off Open Open Open
No valve No valve
Pump Upstream Open Open Open
Pump Downstream Open Open
Pump Final Open
Purge Gas
Vent Open Open
No valve
Pump Downstream Open
Note: Blank cells indicate that the valve is closed.

APPLIED MATERIALS 
 Table 6-11. Usage of Gas and Liquid Paths

APPLIED MATERIALS 
Paths Description Used in Service (note 1) Available Fault Band
in Recipe Monitoring

Chamber Normal path from the gas or liquid source to the chamber Flow Verify Yes On

Divert Path from the gas or liquid source to the foreline Liquid Cal, Ozone MFC Zero Yes On

Divert Off For an ozone stick, this path allows turning the gas off. On

Pump Upstream Pump out the upper section of the stick to the chamber. Yes Off
Producer SE PECVD Operations and Programming

Pump Downstream Pump out the lower section of the stick to the chamber. Yes Off

Pump Final Pump out the final section of the stick to the chamber. Yes Off

Pump Thro Divert Pump out the final gas line to the foreline. Yes Off

Vent Vent the chamber. Chamber Vent On

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Purge Through Flow the purge gas through the stick. Cycle Purge, Liquid Cal, and Liquid Intro Off

Purge Fill the stick with the purge gas. Cycle Purge Off

Pump Purge Pump out the stick. Cycle Purge, Liquid Cal, and Liquid Intro Off

MFC Zero Pressurize the MFC to prepare for the zero adjustment MFC Zero Adjust (DeviceNet) Off

Chamber Header Screens

service.

Fill Liquid Fill the stick with the liquid down to the injection valve. LFC Zero Adjust Off

Note:
1. All paths are also available for manual operation.

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6-46 Chamber Header Screens APPLIED MATERIALS 

6.5.1.2 MFC Window

When you touch each MFC device frame, the MFC window is displayed for that MFC. Use
this window to manually enter the setpoint of the MFC and view the properties of the MFC.
See Figure 6-25 and Table 6-12.

CH X → GAS PANEL → MONITOR GP → MFC DEVICE FRAME

1
2

Figure 6-25. MFC Window

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APPLIED MATERIALS  Chamber Header Screens 6-47

Table 6-12. MFC Window

No. Item Description

1 Mac Id Displays the media access control (MAC) ID of the MFC.

2 MFC status Displays the current status:

• No Link — No communication between the MFC and the
Producer SE.
• Fault — Communication is linked between the MFC and the
Producer SE, and the Producer SE is sending a signal to
the MFC, but the MFC does not accept it for an internal
hardware error. The Event screen (Go To → Event Browser)
displays an event, “Mfc with Mac IdXX has internal error,”
where “XX” indicates the specific ID number. Check for a
hardware problem with the MFC and troubleshoot it.
• Idle — The MFC is OK with no active setpoint (no flow).
• Set — The MFC is OK with an active setpoint (gas flowing).
• Calibration Mismatch — There is a mismatch between the
Mfc Calibration Set on the Set Up Gas Panel screen and
the calibration set stored in the MFC. Enter a correct
calibration set on the screen to fix the error. See item 7 in
Section 6.5.2, Set Up Gas Panel Screen, page 6-48.

3 Setpoint Displays the current setpoint of the MFC and allows manual entry. This
setpoint is applied only for the MFC, not for the gas stick. Note that the
Setpoint field of the Stick window will NOT change when a new setpoint
is entered in this field. See Section 6.5.1.1, Stick Window, page 6-40.

4 Flow Displays the current flow.

5 Zero Offset Displays the current zero offset value of the MFC.

6 Properties Displays the properties information of the MFC.

7 OK Closes the window.

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6.5.2 Set Up Gas Panel Screen

Use the Set Up Gas Panel screen to configure the operational options of the gas and liquid
sticks. Each Twin chamber has its own Set Up Gas Panel screen.

See Figure 6-26 and Table 6-13.

CH X → GAS PANEL → SETUP GP

6
5

7
8

Figure 6-26. Set Up Gas Panel Screen

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APPLIED MATERIALS  Chamber Header Screens 6-49

Table 6-13. Set Up Gas Panel Screen

No. Item Description

1 Stick list Displays the following information for each stick that is configured
for the chamber:
• Stick — The stick number and name of the gas or liquid
• Warn Band — Flow tolerance (%) for a warning. A warning
occurs when the gas or liquid flow is not within this tolerance
from the setpoint.
• Fault Band — Flow tolerance (%) for a fault. A fault occurs
when the gas or liquid flow is not within this tolerance from
the setpoint.
• Timeout — Timeout for a warning or fault. When the flow
(%) is out of the specified tolerance band for longer than
this time, a warning or fault is generated.
• Group — A gas and liquid group that this stick belongs to.
Gases and liquids that are classified in the same group are
allowed to flow simultaneously. Group 0 is used for inert
gases which can flow with any other gas of any group.
• Delay — Indicates that the delay settings are currently
enabled (true) or disabled (false). See item 4.
Touch any stick to display the setup window for that gas on the right.
2 Monitor Bands Define the Warning tolerance (%), Fault tolerance (%), and Timeout
(seconds). See item 1.
3 Gas Exclusion Defines the gas group that this gas belongs to. Enter 0 for inert gases
which can flow with any other gas of any group.
4 Enable Enables or disables the gas flow delay settings that are configured
on the right. Select On to activate the delay settings.
5 On Delay Defines the delay time (in milliseconds) to turn on each element (valve,
MFC, or LFC). The element will delay opening for this specified time
after the stick setpoint is activated in any recipe or by the Set or Open
Full button in the Gas Stick window. See Section 6.5.1.1, Stick
Window, page 6-40. Use the delay feature to prevent pressure spikes
as required.
Only the elements that physically exist for each stick are displayed on
the screen.
6 Off Delay Defines the delay time (milliseconds) to turn off element (valve, MFC,
or LFC). The element will delay closing for this specified time after the
stick is commanded to be placed in the idle state.
7 New Set Allows selection of the MFC calibration gas. Some MFCs can be
calibrated by several gases as set by the manufacturer. Select the
calibration set (left) out of the number of sets available (right). Then,
the gas name and the flow of the selected set are displayed below
this field.
8 Status Displays the current MFC status. See item 2 in Table 6-12, MFC
Window, page 6-47.
9 Cal Date Displays the date that the MFC was most recently calibrated by the
manufacturer.

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6-50 Chamber Header Screens APPLIED MATERIALS 

6.5.3 Service Gas Panel Screen

Use the Service Gas Panel screen to perform service programs. Each Twin chamber has its
own Service Gas Panel screen.

See Figure 6-27, Figure 6-28, Table 6-14 and Table 6-15.

CH X → GAS PANEL → SERVICE GP

Figure 6-27. Service Gas Panel Screen (1 of 2)

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APPLIED MATERIALS  Chamber Header Screens 6-51

Table 6-14. Service Gas Panel Screen (1 of 2)

No. Item Description

1 Stick list Displays the following information for each stick that is configured
for the chamber:
• Stick — The stick number and name of the gas or liquid
• Program — Calibration or gas panel service program name
currently running.
• Step — Current step name in progress within the program.
Each program has different steps to complete.
• Cycle — Current cycle number in progress when the cycle
purge is running.
• Time — Elapsed time within the current step.
• Selected — Indicates whether the stick is enabled (On) or
disabled (Off) for any service program. See item 3
Touch any stick to display the detailed window for that stick on the right.

2 Status Displays the same information shown on the left (see item 1).
Additionally, displays the following information:
• Setpoint — Flow verify setpoint in sccm (gas) or mgm
(liquid).
• Flow — Current flow rate in sccm (gas) or mgm (liquid).

3 Service Settings Provides the following fields:

• Purge Th, Purge, and Pump — Defines the duration of each
service in seconds. When a cycle purge is performed, the
Purge Through, Purge, and Pump paths will open for the
selected time in this order. The whole cycle repeats for the
times specified in the Cycles field.
• Program — Provides the following program options to
perform the service ON THIS STICK ONLY.
• For MFC — Purge Thru, Purge, Pump, Cycle Purge,
and Mfc Zero
• For LFC — Purge Thru, Purge, Pump, Cycle Purge,
Lfc Zero, and Liq Intro
These programs will be performed on the stick from this field
even if the Select field is Off. All programs can be run only
on one stick at a time except that Mfc Zero and Lfc Zero can
be run simultaneously on multiple sticks.
See item 6 for a description of each program.
• Cycles — Defines a number of cycles for a cycle purge.
• Select — Turns on or off the gas (or liquid) for a service
program that is performed on all selected gases (or liquids).
Make the selection before running a program by using the
Run Program for selected sticks field at the bottom (see
item 6).

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6-52 Chamber Header Screens APPLIED MATERIALS 

CH X → GAS PANEL → SERVICE GP

FOR LFC

Figure 6-28. Service Gas Panel Screen (2 of 2)

Producer SE PECVD Operations and Programming

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APPLIED MATERIALS  Chamber Header Screens 6-53

Table 6-15. Service Gas Panel Screen (2 of 2)

No. Item Description

4 Mfc (or Lfc) Displays the following values for the MFC:
• Status — Idle, In Spec, Transition, Fully Open, or Fault.
• Flow — Current flow.
• Zero Off — Current zero offset value of the MFC.
The following field is displayed for an LFC instead of the Status field
for an MFC (see Figure 6-27):
• Offset — Allows an entry of the flow offset.

5 Gaspanel Status Displays the general gas panel status:

• Setpoint — Sum of all the setpoint flows.
• Flow — Sum of all the actual flows.
• Ch Press — Chamber pressure.

6 Run Program for Provides the following service options. See Figure 6-27. These
selected sticks programs are performed on all sticks that are selected On. See
item 3.
• None — No program is currently selected.
• Abort — Aborts the current service program in progress.
• Purge Thru — Flows the purge gas through all the selected
sticks.
• Purge — Fills all the selected sticks with the purge gas.
• Pump — Pumps out all the selected sticks, including the
purge section.
• Cycle Purge — Performs a cycle purge on all the selected
sticks in a sequence.
• Mfc Zero — Performs an MFC zero adjustment on all the
selected gases simultaneously.
• Lfc Zero (when liquid is used) — Performs an LFC zero
adjustment on all the selected liquids simultaneously.
• Liq Intro (when liquid is used) — Performs a liquid turn-on
program on all the selected liquids in a sequence. In this
program, liquid sticks are purged, pumped out, and then
filled with a liquid.
See Table 6-10 on which valves will open for each path. See
Table 6-11 for usage and description of each path.

Producer SE PECVD Operations and Programming

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6-54 Chamber Header Screens APPLIED MATERIALS 

6.5.4 Calibrate Gas Panel Screen

Use the Calibrate Gas Panel screen to confirm the accurate flow rate of each MFC or LFC
and calibrate the flow. Each Twin chamber has its own Calibrate Gas Panel screen.

See Figure 6-29, Figure 6-30, Table 6-16, and Table 6-17.

CH X → GAS PANEL → CALIBRATE GP

3 5
4

6
7

Figure 6-29. Calibrate Gas Panel Screen (1 of 2) — Gas Stick Displayed on Right

Producer SE PECVD Operations and Programming

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APPLIED MATERIALS  Chamber Header Screens 6-55

Table 6-16. Calibrate Gas Panel Screen (1 of 2)

No. Item Description

1 Stick list Displays the following information for each stick that is configured
for the chamber:
• Stick — The stick number and name of the gas or liquid
• Program — Calibration or gas panel service program name
that is currently running such as Flow Verify, Direct Cal, and
Cycle Purge.
• Step — Current step name in progress within the program.
Each program has different steps to complete.
• Time — Elapsed time within the current step.
• Setpoint — Flow verify setpoint in sccm (gas) or mgm
(liquid).
• Flow — Calibrated flow rate in sccm (gas) or mgm (liquid).
After each flow verify service, a new calibrated flow rate is
displayed in this field. Repeat the flow verify service, as
necessary, to obtain the desired flow in this field.
Touch any stick to display the detailed window for that stick on the right.

2 Status Displays the same information shown on the left (see item 1).
Additionally, the Status field displays the current status of the stick:
Idle, In Spec, Transition, Fully Open, or Fault.

3 Select Turns on or off the stick for the flow verify program. Select On in this
field to include that stick in the flow verify program.

4 Flow Under Expected, defines the flow setpoint for the flow verify program
in sccm (gas) or mgm (liquid). If this field is zero, this stick does not
run the flow verify program.
Under Actual, displays the actual flow result calculated by software.

5 Result Different values are displayed and defined for each program that is
selected in the Program field (see item 14):
• Flow Verify program for an MFC — Under Expected,
defines the reference ratio (Rr) of the standard MFC. Under
Actual, displays the actual Rr measured for this stick.
• Liq Cal program — Under Expected, defines the expected
time that it takes to empty the gas line between the safe
valve and the LFC. As default, it displays the time measured
by software when this service is performed for the first time.
Under Actual, displays the actual time measured for the
liquid.

6 Factor Under Expected, defines the current correction factor for the MFC or
LFC.
Under Actual, displays the calculated correction factor that is needed
to correct the MFC or LFC flow according to the calibration result.

7 Accept Factor Touch this button to accept the calculated corrector factor as a new
factor and copy the value under Actual to the value under Expected.

Producer SE PECVD Operations and Programming

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6-56 Chamber Header Screens APPLIED MATERIALS 

CH X → GAS PANEL → CALIBRATE GP

10 11
9

12

13 14

Figure 6-30. Calibrate Gas Panel Screen (2 of 2) — Liquid Stick Displayed on Right

Producer SE PECVD Operations and Programming

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APPLIED MATERIALS  Chamber Header Screens 6-57

Table 6-17. Calibrate Gas Panel Screen (2 of 2)

No. Item Description

8 Carrier Settings (Displayed for a liquid only) Defines the following parameters for the
Liq Cal (liquid calibration) program:
• Stick — Defines the stick number of the carrier gas.
• Setpoint — Defines the flow rate of the carrier gas in sccm.

9 Std Mfc Defines the stick number of the reference MFC used by the flow verify
gas program.

10 Max Press Defines the end pressure of the flow verify gas program in Torr. The
flow verify program will end either when the pressure reaches this value
or when the Max Time has been reached (see item 11).

11 Max Time Defines the maximum time of the flow verify gas program. The flow
verify program will end either when the elapsed time of the flow verify
program reaches this value or the Max Press has been reached (see
item 10).

12 Std Rr Displays the most current reference ratio of the standard (reference)
MFC.

13 Ch Press Displays the current chamber pressure.

14 Program Provides the following options:

• None — No program is currently selected.
• Abort — Aborts the program currently running.
• Flow Verify — Starts the flow verify program for all the
selected sticks. After entering the flow verify setpoint and
other parameters on this screen, select this command. The
flow verify program runs for all the sticks for which On is
selected in the Select field (see item 3) and the flow setpoint
is entered in the Expected Flow field (see item 4).
• Liq Cal (when liquid is used) — Starts the calibration for all
the selected liquids.

Producer SE PECVD Operations and Programming

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6-58 Chamber Header Screens APPLIED MATERIALS 

6.6 RF Calibration Screen

Use the RF Calibration screen to calibrate the RF generators. Each RF generator has its own
RF Calibration screen. See Figure 6-31 and Table 6-18.

NOTE
See the Producer SE PECVD Twin Chamber Manual for the RF calibration
procedures.

CH X → RF GENERATORS → CALIBRATE HF (OR LF) RF SIDE 1 (OR 2)

2 3 4

10

11

12

13

5 6 7

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 6-31. RF Calibration Screen

Producer SE PECVD Operations and Programming

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APPLIED MATERIALS  Chamber Header Screens 6-59

Table 6-18. RF Calibration Screen

No. Item Description

1 High Freq RF Side 1 Displays the name of the RF generator that is calibrated from this
screen. Each RF generator has its own screen.

2 Set Power Enter incremental power setpoints in this field before starting the
RF calibration.

3 Actual During the calibration, an external power meter with a power

measurement head (PMH) is attached to the RF generator. Record
the differences between the PMH forward power and the
PMH reflected power for each setpoint and enter them into this
column except the one for the last setpoint (3000 W for HF RF
generator and 900 W for the LF RF generator).

4 Delivered During the calibration, record the values in the FWD field (see
item 10) for each setpoint and enter them into this column except the
one for the last setpoint (3000 W for HF RF generator and 900 W for
the LF RF generator).
At the end of the calibration, the following specification must be met:
• PMH forward power reading = Setpoint ± 2 W
• Display in the FWD field (see item 10) = Setpoint ± 2 W

5 New Touch this button to enter a new row of calibration values.

6 Edit Select a row to edit and touch this button to edit the calibration data
in each row.

7 Delete Select a row to delete and touch this button to delete the row.

8 Command Displays a window with the following options:

• Off — Turns the generator off.
• On — Turns the generator on.
• Setpoint — Activates change of the setpoint after a new
setpoint is entered in the Setpoint field (see item 9).
• Host Control — Allows the generator control by the host.
• Local Control — Allows the local control at the generator.
• NULL — Do not use this command.

9 Setpoint During the calibration, give the generator each setpoint in this field
as entered in the Set Power field (see item 2) and monitor the reading
at the power meter and the display in the FWD field (see item 10).
Both must be within the specification (see item 4).

10 FWD Actual power delivered to the dummy load read by the Producer SE.
A dummy load is attached to the RF generator during the
RF calibration.

11 Power Output offset Defines the offset for the RF power output from the generator.

12 Delivered Pwr offset Defines the offset for the readback of the RF power delivered to the
chamber.

13 DC bias offset Defines the offset for the readback voltage of the DC bias.

Producer SE PECVD Operations and Programming

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6.7 Lift Calibration Screen

Use the Lift Calibration screen to monitor, control and calibrate the heater lifts in the Twin
chamber. Each Twin chamber has its own Lift Calibration screen.

See Figure 6-32 and Table 6-19.

CH X → LIFTS → CALIBRATE

10

11

12
13

Figure 6-32. Lift Calibration Screen

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Table 6-19. Lift Calibration Screen

No. Item Description

1 State Displays the current heater lift state: Idle, Homing, or Moving.
2 Position Displays the current chamber position. Combination of the heater lift
position and the pin lift position creates the chamber position (see
Figure 6-5):
• Release position — Both are down.
• Lift position — Heater is down; pin lift is up.
• Process position — Both are up.
• Unknown — The lifts are not in any of the above positions
or not homed.
• Process Spacing — The lifts are positioned so that the top
surface of the wafer heater is at the distance (in mils) from
the shower head (gas distribution plate) as specified in the
recipe or as entered in the Htr Space field on this screen
(see item 4).
3 Command Allows the following command entry (see Figure 6-9):
• NULL — Do not use this command.
• Home — Moves the lifts to the home position.
• Move to Release — Moves the lifts to the Release position.
• Move to Lift — Moves the lifts to the Lift position.
• Move to Process — Moves the lifts to the Process position.
• Move to X Steps — Do not use this command.
• Abort — Aborts the current operation.
4 Htr Space Defines the Process Spacing in mils (see item 2). After entering a
value, select Move to Process in the command menu (see item 3).
Then, the lifts move to that position and the Position field displays
Process Spacing.
5 Abs Move Moves the heater lift to the specified absolute distance from the home
position in mils.
6 Rel Move Moves the heater lift by a specified relative distance from the current
position in mils.
7 CurPos Displays the current heater lift position as the distance from the home
position in mils.
8 Req Displays the requested heater lift position as the distance from the
home position in mils.
9 Lift Pos Defines the Lift position of the heater lift from the home position in
mils.
10 Rlse Pos Defines the Release position of the heater lift from the home position
in mils.
11 Proc Pos Defines the Process position of the heater lift from the home position
in mils.
12 Gear Defines the number of the heater lift motor revolutions equivalent to
1000 mils.
13 Shower Dist Defines the distance between the shower head (gas distribution
plate) and the heater home position in mils.

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6.8 Endpoint Screen

Use the Endpoint screen to monitor the endpoint signal that determines the endpoint of the
post deposition plasma clean. Accurately detecting the clean endpoint reduces etching of the
chamber walls and the process kit, thereby reducing particle contamination in the chamber,
rate of wear on the process kit, and gas use. See Figure 6-33, Figure 6-34, Table 6-20, and
Table 6-21.

The endpoint detector is installed downstream of the throttle valve in the Twin chamber
foreline. During the chamber clean step, a plasma (process gases and resulting etch products)
emits optical light. The endpoint detector senses the changes in the level of fluorine radicals
in the plasma and determines when fluorine is not being consumed, which means that the
chamber has been cleaned.

NOTE
Endpoint parameters are defined in the Endpoint Device Parameters screen for
each clean step within the recipe. See Section 10.2.6, Endpoint Device
Parameters Screen, page 10-20.

CH X → ENDPOINT

1
6

10

11

12

2 3 4 5

Figure 6-33. Endpoint Screen (1 of 2)

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Table 6-20. Endpoint Screen (1 of 2)

No. Item Description

1 0–10000 The display range of the voltage (mV) of the endpoint signal.

2 Refresh Refreshes the endpoint chart.

3 Pause Freezes the endpoint signal chart at the desired time. While the chart
is paused, Resume is displayed in this field.

4 + and - buttons Use these buttons to change the time range so that you can see the
slope in greater or lesser detail.

5 arrows (< and >) Scroll the chart to the left or right.

6 Status Displays the endpoint status:

• Idle — Not active
• Wait Min Time — Waiting for the minimum time to be
reached. See item 7.
• Qualifying — Checking for the qualifying slope to match
after the minimum time.
• Endpointing — Checking for the endpoint slope to match
after qualifying.
• Overetching — The clean step continues for a selected
percentage of the actual endpoint time, as defined in the
recipe, after the endpoint has been determined.
• Done — The endpoint is complete.

7 Minimum Time Displays the minimum time from the beginning of the step, as defined
in the recipe, before the endpoint qualification starts.

8 Maximum Time Displays the maximum duration that the endpoint device is allowed to
run as defined in the recipe. This value is independent from the
maximum time of the step. The endpoint device goes idle when the
endpoint is determined. If the endpoint is not determined within this
maximum time, the endpoint device stops running.

9 Current Slope Displays the current voltage slope (mV/sec.) of the endpoint signal.

10 Qualify Mode Displays one of the following modes as defined in the recipe:
• Slope Above — The clean step is qualified when the signal
slope is above the value in the Qualify Slope field. See
item 11.
• Slope Below —The clean step is qualified when the signal
slope is below the value in the Qualify Slope field.

11 Qualify Slope Displays the slope value (mV/sec.) for qualifying the endpoint as
defined in the recipe.

12 Endpoint Mode Displays one of the following modes as defined in the recipe:
• Slope Above — The clean step ends when the signal slope
(mV/sec.) is above the value displayed in the Endpoint
Slope field. See item 13.
• Slope Below — The clean step ends when the signal slope
is below the value entered in the Endpoint Slope field.

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CH X → ENDPOINT

13

14

15

16

17

Figure 6-34. Endpoint Screen (2 of 2)

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Table 6-21. Endpoint Screen (2 of 2)

No. Item Description

13 Endpoint Slope Displays the slope value (mV/sec.) for determining the endpoint as
defined in the recipe. The chamber clean ends when this value is
reached except when an over-etch is programmed in the recipe.
The following conditions must be met in this order for the clean step
to end:
• The minimum time has passed.
• Then, the Qualify Slope has been met in the specified
Qualify Mode.
• Then, the Endpoint Slope has been met in the specified
Endpoint Mode.

14 Overetch Percent Displays the over-etch time as % of the actual endpoint time as
defined in the recipe. Over-etch (edge clean) keeps removing oxide
residue from the outer parts of the chamber after the endpoint is
determined. Software calculates the required over-etch time, using
this setting, when the endpoint is reached.

15 Qualify Time Displays the actual time in seconds from the beginning of the step
until the endpoint was qualified.

16 Endpoint Time Displays the actual time in seconds from the beginning of the step
until the endpoint was determined.

17 Finish Time Displays the actual time in seconds from the beginning to the end of
the clean step.

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 APPLIED MATERIALS 
Mainframe (MF) Header Screens 7-1

7 Mainframe (MF) Header Screens

This chapter describes the screens accessed from the MF (mainframe) header in the following
sections. These screens are used to control and monitor the mainframe components.

• Section 7.1, MF Header Pulldown Menu, page 7-2

• Section 7.2, Monitor Mainframe Screen, page 7-4
– Section 7.2.1, Device-Specifc Windows in Work Area, page 7-8
Section 7.2.1.1, Buffer Robot Detailed Window, page 7-8
Section 7.2.1.2, Wafer Detect Detailed Window, page 7-12
Section 7.2.1.3, Indexer Detailed Window, page 7-16

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7.1 MF Header Pulldown Menu

See Figure 7-1 and Table 7-1 for pulldown menu items under the MF (mainframe) header.

MF

2
5

3
6
4
7

8 9

Figure 7-1. MF (Mainframe) Header Pulldown Menu

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Table 7-1. MF (Mainframe) Header Pulldown Menu

No. Item Description

1 Monitor Accesses the Monitor Mainframe screen. See Section 7.2, Monitor
Mainframe Screen, page 7-4.

2 Put Buffer OnLine Places the buffer (transfer) chamber online.

3 Put Buffer OffLine Places the buffer (transfer) chamber offline.

4 Service Buffer Provides the following service options (see Figure 7-1):
• Pump down — Performs the buffer (transfer) chamber
pumpdown.
• Vent — Vents the buffer (transfer) chamber.
• Leak Rate — Accesses the Leak Rate BUFFER screen.
See Section 6.4, Leak Rate Screen, page 6-32 for a
description of this screen.
• Abort Service — Aborts the current service in progress.

5 Put LL OnLine Places the loadlock online.

6 Put LL OffLine Places the loadlock offline.

7 Service Load Lock Provides the following service options (see Figure 7-1):
• Pump down — Performs the loadlock pumpdown.
• Vent — Vents the loadlock.
• Leak Rate — Accesses the Leak Rate LL screen. See
Section 6.4, Leak Rate Screen, page 6-32 for a
description of this screen.
• Abort Service — Aborts the current service in progress.

8 Start Home All Axis Homes the VHP robot extension and rotation axes and the loadlock
indexers.

9 Stop Home All Axis Aborts the Home All Axis routine.

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7.2 Monitor Mainframe Screen

Use the Monitor Mainframe screen to monitor the operation of the loadlock and the buffer
(transfer) chamber and to manually control the buffer chamber robot, wafer detect sensors,
and loadlock indexers. All valves and the pump on this screen allow manual control, subject
to the interlocks and the system state.

See Figure 7-2, Figure 7-3, Table 7-2 and Table 7-3.

MF → MONITOR

5
2
3
4

8 7
11
1
9

10

12

Figure 7-2. Monitor Mainframe Screen (1 of 2)

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Table 7-2. Monitor Mainframe Screen (1 of 2)

No. Item Description

1 Buffer chamber and The color of the surrounding borders indicates the current status of the
loadlock graphic buffer chamber and the loadlock:
• Blue — Online idle
• Light blue — Offline idle
• Black — Undefined
• Red — In fault
• Green — Running
2 Slit valve graphic Displays the valve status: open, closed, or unknown. When the
position is unknown, the slit valve is displayed dim. A pair of slit valves
seal the wafer transfer openings at the loadlock and each Twin
chamber. Touch the valve graphic to open or close the slit valve pair.
3 344.0 mtorr Displays the current pressure of the buffer (transfer) chamber.

4 Robot graphic Touch this frame to display the Buffer Robot detailed window in the
work area. See Section 7.2.1.1, Buffer Robot Detailed Window,
page 7-8.

5 Wafer Detect Displays the status of the wafer detect sensors: On or Off. Touch this
frame to display the Wafer Detect detailed window in the work area.
See Section 7.2.1.2, Wafer Detect Detailed Window, page 7-12.

6 FL Press Displays the current pressure of the loadlock and buffer chamber
(foreline pressure) foreline.

7 Buffer chamber Displays the status of the foreline isolation valve (open or closed).
isolation valve Touch the valve symbol to open or close it.

8 346.0 mtorr Displays the current pressure of the loadlock.

9 Indexer graphic Touch this frame to display the Indexer detailed window in the work
area. See Section 7.2.1.3, Indexer Detailed Window, page 7-16.

10 Loadlock doors Displays the current status (open or closed) of the loadlock doors.
The FI robots transfer wafers into the loadlock through these doors.
Touch the door graphic to open or close it.

11 Pump Displays the status of the loadlock and buffer chamber shared pump
(Alcatel IPUP A100L): Off, Ready or Fault. Touch this frame to display
the Pump window in the work area. See Section 6.2.1.12, Pump
Detailed Window, page 6-27. The same pump control software is
used for the Twin chamber pumps and the mainframe pump.

12 Loadlock roughing Displays the valve status (open or closed). Two valves are used to
valves reduce turbulence and particles:
• Slow roughing valve — Opens to start evacuating the
loadlock from atmosphere and keeps open during all the
pumping time.
• Fast roughing valve — Opens to evacuate the loadlock
when the loadlock reaches the pressure defined as an
attribute “cChRoughPress” in the Generic Window screen
(Go To → Diagnostics → Generic Window → $ → AT → LL
→ VacSys). See Section 9.5.1, Generic Window Screen,
page 9-14.

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MF → MONITOR

19

13

14

15

16 17

18

Figure 7-3. Monitor Mainframe Screen (2 of 2)

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Table 7-3. Monitor Mainframe Screen (2 of 2)

No. Item Description

13 Buffer chamber vent Displays the valve status (open or closed) of the N2 vent line of the
valve buffer chamber. Touch the valve symbol to open or close it.

14 Buffer chamber Defines the N2 flow setpoint of the purge MFC (top) and displays the
purge MFC actual N2 flow rate (bottom).

15 Loadlock vent Displays the valve status (open or closed). Two valves are used to
valves reduce turbulence and particles:
• Slow vent valve — Opens to start venting the loadlock and
keeps open during all the vent time.
• Fast vent valve — Opens to vent the loadlock when the
loadlock reaches the pressure defined as an attribute
“cSlowVentPress” in the Generic Window screen (Go To →
Diagnostics → Generic Window → $ → AT → LL →
VacSys). See Section 9.5.1, Generic Window Screen,
page 9-14.

16 Equalization valve Displays the status (open or closed) of the pressure equalization
valve. This valve opens when the atmospheric pressure is reached
at the end of the vent routine. This prevents the loadlock from
over-pressurizing when the VAT doors open. Loadlock vent occurs
in the following sequence. Total vent time is typically 12 seconds.
1. The slow vent valve opens (see item 15).
2. The fast vent valve opens at the defined pressure (see item 15).
3. The loadlock pressure reaches atmosphere. The fast vent valve
closes, and the equalization valve opens.
4. The VAT doors open for loading or unloading. The equalization
valve closes.
5. The VAT doors close. The slow vent valve closes before
pumpdown starts.

17 Loadlock isolation Displays the status (open or closed) of the isolation valve that isolates
valves the roughing line from the loadlock. Touch the valve symbol to open
or close it.

18 Temp Displays the current temperature of the loadlock preheaters A (left)

and B (right) in °C. Touch this frame to display further information on
the preheaters in the work area. See Section 6.2.1.9, Heater Detailed
Window, page 6-24. The same heater control software is used for the
Twin chamber wafer heaters and the loadlock preheaters.

19 Work area Displays detailed information of a selected device frame.

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7.2.1 Device-Specifc Windows in Work Area

If you touch a selectable device frame on the left of the Monitor Mainframe screen, detailed
information of that device frame is displayed in the work area on the right. See the following
sections:

• Section 7.2.1.1, Buffer Robot Detailed Window, page 7-8

• Section 7.2.1.2, Wafer Detect Detailed Window, page 7-12
• Section 7.2.1.3, Indexer Detailed Window, page 7-16

7.2.1.1 Buffer Robot Detailed Window

When you touch the buffer robot graphic, the work area will display the Buffer Robot detailed
window and allows manual operation and calibration of the robot. See Figure 7-4, Figure 7-5,
Table 7-4, and Table 7-5.

MF → MONITOR → BUFFER ROBOT GRAPHIC

1a

1
1b

2
1c

1d

1e

1f

1g

1h

1i

1j

1k

1l
TOUCH
ARROWS
TO SCROLL 1m
THROUGH
MENU.
1n

1o

1p

1q

Figure 7-4. Buffer Robot Detailed Window (1 of 2)

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Table 7-4. Buffer Robot Detailed Window (1 of 2)

No. Item Description

1 Command Provides the following options. Before entering a command, specify

the desired settings as required (see item 2 through item 8).
a. No Command
b. Init — Initializes the robot hardware.
c. Home — Returns the robot to the home position.
d. Move To Taught Pos — Moves the robot to the taught
position.
e. Move Rot To Abs Pos — Moves the rotation to the
specified absolute position from the home.
f. Move Ext To Abs Pos — Moves the extension to the
specified absolute position from the home.
g. Move Rot to Rel Pos — Moves the rotation to the specified
relative position from the current position.
h. Move Ext To Rel Pos — Moves the extension to the
specified relative position from the current position.
i. Teach Position — Saves the current position as a new
taught position in the temporary memory. When the system
powers down, this memory will be erased, and the previous
taught position will be restored.
j. Save Position — Saves the current position as a new
taught position in the permanent memory.
k. Query Taught Pos — Displays the current taught position
under Current Calibration.
l. Robot Mode: Auto — Places the robot in the Auto mode.
In the Auto mode, motions are performed according to the
commands received. All teaching boxes are disabled in the
Auto mode.
m. Robot Mode: Phantom — Places the robot in the Phantom
mode. In the Phantom mode, wafer sensing check is
disabled, and the specified commands are performed
without real wafers. All teaching boxes are disabled in the
Phantom mode.
n. Robot Mode: Teaching — Places the robot in the Teaching
mode. In the Teaching mode, the robot is moved to teaching
positions, using a teaching box or teaching commands.
o. Robot Motor On — Turns on the robot motor.
p. Robot Motor Off — Turns off the robot motor.
q. Abort Robot Motion

2 Station Provides the following options. Select a station in this field before
entering a command (see item 1).
• Unknown — No selection as default. When a command is
entered with this selection, an error returns.
• Chamber A
• Chamber B
• Chamber C
• LoadLock

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MF → MONITOR → BUFFER ROBOT

10

11

4a

4b

4c

4d

4e

Figure 7-5. Buffer Robot Detailed Window (2 of 2)

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APPLIED MATERIALS  Mainframe (MF) Header Screens 7-11

Table 7-5. Buffer Robot Detailed Window (2 of 2)

No. Item Description

3 Side Provides the options of Side 1, Side 2, and Both Sides.

4 Position Provides the following options. Select a position in this field before
entering a command (see item 1).
a. Unknown — No selection as default. When a command is
entered with this selection, an error returns.
b. Get Retracted — Robot retraction position.
c. Put Retracted — Same as Get Retracted.
d. Get Extended — Robot extension position.
e. Put Extended — Same as Get Extended.

5 Abs Ext Enter the desired absolute extension position from the home in this
field before selecting Move Ext To Abs Pos in the Command field
(see item 1). The extension unit is 1/100 mm.

6 Abs Rot Enter the desired absolute rotation position from the home in this
field before selecting Move Rot To Abs Pos in the Command field
(see item 1). The rotation unit is 1/100 degree.

7 Rel Ext Enter the desired relative extension position from the current position
in this field before selecting Move Ext To Rel Pos in the Command
field (see item 1). The extension unit is 1/100 mm.

8 Rel Rot Enter the desired relative rotation position from the current position
in this field before selecting Move Rot to Rel Pos in the Command
field (see item 1). The rotation unit is 1/100 degree.

9 Cur Ext Displays the current extension position.

10 Cur Rot Displays the current rotation position.

11 Current Calibration Displays the current taught position when the Query Taught Pos
command is selected in the Command field (see item 1).
• Station — Requested station name
• Side — Requested side
• Position — Requested position name
• Ext — Currently taught extension position from the home.
The extension unit is 1/100 mm.
• Rot — Currently taught rotation position from the home. The
rotation unit is 1/100 degree.
The display under Current Calibration stays the same until another
Query Taught Pos command is requested.

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7.2.1.2 Wafer Detect Detailed Window

When you touch the Wafer Detect device frame, the work area will display the Wafer Detect
detailed window and allows manual operation and calibration of the wafer detect sensors.

Wafer detect sensors are mounted on the buffer chamber lid to detect wafers on the robot
blades. They project a light beam down through the viewports of the buffer chamber, and
polarized reflectors at the chamber bottom reflect it back to the sensors. Edges of the wafers
are detected as the robot retracts from a Twin chamber or loadlock. Up to 16 wafer detect
sensors are used (two for each wafer position).

See Figure 7-6, Figure 7-7, Figure 7-8, and Table 7-6.

MF → MONITOR → WAFER DETECT

1a

1
1b

2
1c

1d

Figure 7-6. Wafer Detect Detailed Window

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APPLIED MATERIALS  Mainframe (MF) Header Screens 7-13

Table 7-6. Wafer Detect Detailed Window

No. Item Description

1 Command Provides the following options. Before entering a command, specify
the desired settings as required (see item 2 through item 5).
a. Unknown — No command.
b. Initialize Wafer Detect — Initializes the wafer detect
hardware and parameters.
c. Calibrate Wafer Detect — Performs the wafer detect
calibration routine. To perform the calibration, the buffer
chamber and the selected Twin chamber or loadlock should
be offline, and the robot blades must have a pair of wafers.
During the calibration, the robot will transfer wafers
between the buffer chamber and the selected Twin
chamber or loadlock ten times. If no faults are detected, the
system will display Calibrated for that chamber or loadlock
in the Current Calibration field (see item 6).
d. Abort Calibrate Wafer Detect — Aborts the wafer detect
calibration that is currently in progress.
2 Chamber Provides the following options. Select a wafer detect sensor position
in this field before entering a command (see item 1).
• Unknown — No selection as default. When a command is
entered with this selection, an error returns.
• Chamber A
• Chamber B
• Chamber C
• LoadLock
3 Detection Enables (On) or disables (Off) the wafer detect sensors:
• On — The wafer detect sensors detect the edges of the
wafer when the robot retracts from a Twin chamber or
loadlock. An error occurs when no wafer is present though
it is supposed to be, when a wafer is present though no
wafer is expected, or when the wafer position on the blade
is out of the fault limit (see item 4).
• Off — The wafer detect sensors are not activated for
maintenance or manual operation.
4 Fault Limit Defines the fault tolerance for the wafer detect sensors by the unit of
1/100 mm. A fault occurs and wafer transfer stops when the wafer
detection result is not within this tolerance from the previously
calibrated position.
5 Warning Limit Defines the warning tolerance for the wafer detect sensors by the
unit of 1/100 mm. A warning occurs when the wafer detection result
is not within this tolerance from the previously calibrated position.
6 Current Calibration Displays the calibration status (Calibrated or Not Calibrated) for each
Twin chamber or loadlock. When Calibrate Wafer Detect is entered
in the Command field (see item 1) and the calibration completes with
no errors, the display for that chamber or loadlock will change to
Calibrated. All of the displays will change to Not Calibrated when
the buffer chamber lid is opened or the whole system powers down
and then powers up. You can also manually enter Calibrated or Not
Calibrated in this field.

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2-2 2-1 7
1-2 1-1
8
5 6

2-2
1-1

4 1
Chamber B
1-2

3 2

2-1
MAINFRAME FRONT
Loadlock Chamber A MAINFRAME REAR
2-1

1-2
2 3
Chamber C
4
1-1
1
2-2

1-1
8 1-2
7 2-1
6 2-2
5

Figure 7-7. Wafer Detector Numbers and Locations

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 APPLIED MATERIALS  Mainframe (MF) Header Screens 7-15

Wafer sensor light

beams down through
the buffer chamber lid

Robot retraction to
LEADING EDGE 1
1. Wafer detectors sense the buffer chamber
LEADING EDGE while the
WAFER
robot retracts the wafer to
the buffer chamber. LEADING EDGE 2

LEADING EDGE 1

2. Robot keeps retracting the

wafer. Wafer detectors
keep sensing the wafer. LEADING EDGE 2

3. Wafer detectors find the CHORD

LENGTH 1
TRAILING EDGE. Software
TRAILING EDGE 1 LEADING EDGE 1
calculates two chord
lengths and determines
wafer presence or absence
and wafer location on the
TRAILING EDGE 2 LEADING EDGE 2
robot blade.
CHORD
LENGTH 2

Figure 7-8. Wafer Detector Operation

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7.2.1.3 Indexer Detailed Window

When you touch the loadlock indexer graphic, the work area will display the Indexer window
and allows manual operation and calibration of the indexers. See Figure 7-9, Figure 7-10,
Table 7-7, and Table 7-8.

MF → MONITOR → INDEXER GRAPHIC

1a

1b

1 1c

2
1d

3
1e

1f

1g

1h

1i

1j

Figure 7-9. Indexer Detailed Window (1 of 2)

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Table 7-7. Indexer Detailed Window (1 of 2)

No. Item Description

1 Command Provides the following options. Before entering a command, specify

the desired settings as required (see item 2 through item 6).
a. No Command — No command.
b. Init — Initializes the indexer hardware.
c. Home — Returns the indexer to the home position.
d. Move To Slot — Moves the selected indexer to the
specified slot.
e. Move To Abs Pos — Moves the selected indexer to the
specified absolute position from the home.
f. Move Rel Position — Moves the selected indexer to the
specified relative position from the current position.
g. Teach Position — Saves the current position as a new
taught position in the temporary memory. When the system
powers down, this memory will be erased, and the previous
taught position will be restored.
h. Save Position — Saves the current position as a new
taught position in the permanent memory.
i. Query Taught Pos — Displays the current taught position
under Current Calibration.
j. Abort — Aborts the current command.

2 Indexer Provides the following options. Select a station in this field before
entering a command (see item 1).
• Unknown — No selection as default. When a command is
entered with this selection, an error returns.
• Load Lock A — Indexer of loadlock A
• Load Lock B — Indexer of loadlock B
• Load Lock — Indexers of both loadlock A and loadlock B.
Select this option when operating or calibrating the
component that is common to both loadlock A and
loadlock B.
Selecting one indexer (Load Lock A or Load Lock B) works with any
command listed in item 1. Selecting the entire loadlock (Load Lock)
works with 1b, 1c, 1d, 1h, and 1j only. An error returns when an invalid
selection is made.

3 Slot Enter the desired slot number before entering a command (see item 1)
as necessary.

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MF → MONITOR → INDEXER

4
4a
5

4b
6

4c
7
4d

4e

4f

Figure 7-10. Indexer Detailed Window (2 of 2)

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Table 7-8. Indexer Detailed Window (2 of 2)

No. Item Description

4 Slot Position Provides the following options. Select a slot position in this field
before entering a command (see item 1) as necessary.
a. Unknown — No selection as default. When a command is
entered with this selection, an error returns.
b. Base Position — Slot base position. In the slot base
position, the robot blade is inserted between wafers, not
touching any wafer.
c. Delta Position — Slot delta position. In the slot delta
position, the wafer in the slot rests on the robot blade, not
contacting the indexer.
d. FI Load/Unload Pos — Load/unload position for the
FI robot.
e. Cool Position — Wafer cooling position (not used for
PECVD).
f. Heater Position — Wafer preheater position.

5 Abs Pos Enter the desired absolute position from the home in this field before
selecting Move To Abs Pos in item 1. The unit is 1/100 mm.

6 Rel Pos Enter the desired relative position from the current position in this
field before selecting Move Rel Position in item 1. The unit is
1/100 mm.

7 Current Calibration Displays the current taught position when the Query Taught Pos
command is selected in the Command field (see item 1).
• Indexer — Requested indexer name
• Slot — Requested slot number
• Base Position — Currently taught slot base position from
the home. The unit is 1/100 mm.
• Slot Delta — Currently taught slot delta position from the
home. The unit is 1/100 mm.
• Slot Spacing — Distance between slot 1 and slot 2.
• FI Ld/Unld Pos — Currently taught FI load/unload position
from the home. The unit is 1/100 mm.
• Cool Position — Currently taught wafer cooling position
from the home (not used for PECVD).
• Preheat Position — Currently taught wafer preheater
position from the home. The unit is 1/100 mm.

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Factory Interface (FI) Header Screens 8-1

8 Factory Interface (FI) Header Screens

This chapter describes the screens accessed from the FI (factory Interface) header in the
following sections. These screens are used to monitor and control the FI functions.

• Section 8.1, FI Header Pulldown Menu, page 8-2

• Section 8.2, Monitor FI Screen, page 8-4
– Section 8.2.1, Device-Specifc Windows in Work Area, page 8-6
Section 8.2.1.1, FI Robot Detailed Window, page 8-6
Section 8.2.1.2, Cooling Station Detailed Window, page 8-7
Section 8.2.1.3, Cassette Detailed Window, page 8-8

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8.1 FI Header Pulldown Menu

See Figure 8-1 and Table 8-1 for pulldown menu items under the FI header.

FI

Figure 8-1. FI Header Pulldown Menu

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Table 8-1. FI Header Pulldown Menu

No. Item Description

1 Monitor Accesses the Monitor FI screen. See Section 8.2, Monitor FI Screen,
page 8-4.

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8.2 Monitor FI Screen

Use the Monitor FI screen to monitor the operations of the factory interface (FI) and to
manually control the FI robots, cooling station, and cassettes (FOUPs).

See Figure 8-2 and Table 8-2.

FI → MONITOR

10
6

1 5

2 7

Figure 8-2. Monitor FI Screen

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Table 8-2. Monitor FI Screen

No. Item Description

1 Command Provides the following command options:

• Unknown — No command.
• Init — Initializes the FI hardware.
• Home — Homes the FI robots and the load ports.
• Refresh Status — Refreshes the FI status.

2 Cmd State Displays the state of the command that has been entered in the
Command field (see item 1).

3 Comm State Displays the state of the communication between the factory
interface controller (FIC) and the host: Communicating or Not
Communicating.

4 Dev State Displays the FI device state: Busy, Idle, or Error.

5 FI graphic The color of the surrounding borders indicates the current status of the
FI and each cooling slot:
• Blue — Online idle
• Light blue — Offline idle
• Black — Undefined
• Red — In fault
• Green — Running

6 SW version Displays the FIC software version, hardware version, and model
HW version number that are currently used.
Model

7 Robot graphic Touch the robot graphic to display the FI Robot window in the work
area. Each robot has its own window. See Section 8.2.1.1, FI Robot
Detailed Window, page 8-6.

8 Cooling station Displays the status of each slot in the wafer cooling station: Online
or Offline. The cooling station houses up to 13 processed wafers for
timed-cooling after the deposition process.
Touch this frame to display the Cooling Station window in the work
area. See Section 8.2.1.2, Cooling Station Detailed Window,
page 8-7.

9 Cassette (FOUP) Touch the cassette (FOUP) graphic to display the Cassette window
graphic in the work area. Each cassette has its own window. See
Section 8.2.1.3, Cassette Detailed Window, page 8-8.

10 Work area Displays detailed information of a selected device frame.

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8.2.1 Device-Specifc Windows in Work Area

If you touch a selectable device frame on the left of the Monitor FI screen, detailed
information of that device frame is displayed in the work area on the right. See the following
sections:

• Section 8.2.1.1, FI Robot Detailed Window, page 8-6

• Section 8.2.1.2, Cooling Station Detailed Window, page 8-7
• Section 8.2.1.3, Cassette Detailed Window, page 8-8

8.2.1.1 FI Robot Detailed Window

When you touch the FI robot graphic, the work area will display the FI Robot detailed window.
Each robot has its own window. See Figure 8-3.

FI → MONITOR → FI ROBOT GRAPHIC

Figure 8-3. FI Robot Detailed Window

• Command — Allows the following command entry (see Figure 8-3):

– Unknown — No command.
– Init — Initializes the FI robot hardware.
– Home — Homes the robot.
• Cmd Pending — Busy or Idle.
• Home Status — Homed or Not Homed.

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8.2.1.2 Cooling Station Detailed Window

When you touch the cooling station graphic, the work area will display the Cooling Station
detailed window. See Figure 8-4.

FI → MONITOR → COOLING STATION GRAPHIC

Figure 8-4. Cooling Station Detailed Window

This window provides following Command buttons:

• Command — Use this button to place an individual slot in the cooling station
online or offline. Enter the desired slot in the Slot field before selecting a command.
– Put slot online — Places a slot online for process.
– Put slot offline — Places a slot offline for maintenance.
• All Slots Command — Use this button to place all slots in the cooling station
online or offline.
– Put all slots online — Places all slots online for process.
– Put all slots offline — Places all slots offline for maintenance.

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8.2.1.3 Cassette Detailed Window

When you touch the FI cassette (FOUP) graphic, the work area will display the Cassette
window for cassette A (left) or cassette B (right). Each FOUP has its own window. See
Figure 8-5, Figure 8-6, Table 8-3, and Table 8-4.

FI → MONITOR → CASSETTE A OR CASSETTE B GRAPHIC

1a

1b

1c

1d

1 1e

2 1f

3 1g

1h
4

1i

1j

1k

1l

1m

TOUCH 1n
ARROWS
TO SCROLL
THROUGH
MENU.
1o

INTERNAL USE BY
SEQUENCER AND CH
FIC ONLY. DO NOT USE
THESE COMMANDS.

Figure 8-5. Cassette Detailed Window (1 of 2)

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Table 8-3. Cassette Detailed Window (1 of 2)

No. Item Description

1 Command Provides the following command options:

a. Unknown — No command.
b. Init — Initializes the load port hardware.
c. Home — Returns the load port to its home position.
d. Map — Performs a wafer mapping for the FOUP.
e. Load — Loads the FOUP. The FOUP will be latched to the
load port and move to the docking position, and the
FOUP door will open.
f. Unload — Unloads the FOUP. The FOUP door will close,
and the FOUP will move back to the load port.
g. Latch — Latches the FOUP to the FI load port.
h. Unlatch — Unlatches the FOUP from the FI load port.
i. Dock — Docks the FOUP toward the FI door.
j. UnDock — Moves the FOUP away from the FI door to the
load/unload position at front.
k. Open Door — Opens the FOUP door.
l. Close Door — Closes the FOUP door.
m. Update State — Refreshes the FOUP position and the
detailed position within the FI software.
n. Read Carrier Id — Reads the FOUP carrier ID and displays
it on the Monitor Wafers screen. See Section 5.3, Monitor
Wafers Screen, page 5-8.
o. Write Carrier Id — Writes the FOUP carrier ID.

2 Cmd State Displays the status of the command that has been entered in the
Command field (see item 1).

3 Presence Displays that the FOUP is currently present or absent at the FI load
port.

4 Map state Displays the wafer mapping state for the FOUP:
• Mapped — Wafer mapping has been performed.
• Not Mapped — Wafers have not been mapped.

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FI → MONITOR → CASSETTE A OR CASSETTE B GRAPHIC

Figure 8-6. Cassette Detailed Window (2 of 2)

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Table 8-4. Cassette Detailed Window (2 of 2)

No. Item Description

5 Position Displays the current position of the FOUP:

• Load/Unload — The FOUP is present at the load port.
• Process — The FOUP is latched and docked. The
FOUP door is open.
• Unknown

6 Detailed Pos Displays further information about the current FOUP state:
• Empty Released
• Empty Latched
• Empty Docked
• Occupied Released
• Occupied Latched
• Occupied Docked
• Unknown

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Go To Header Screens 9-1

9 Go To Header Screens
This chapter describes the screens accessed from the Go To header in the following sections.
These screens are used for system configuration, maintenance, diagnostics, communication,
and other miscellaneous functions.

• Section 9.1, Go To Header Pulldown Menu, page 9-2

• Section 9.2, Event Screen, page 9-4
• Section 9.3, Setup Screens, page 9-6
– Section 9.3.1, Events Configuration for Alarm Line Screen, page 9-6
– Section 9.3.2, Set Up Signal Tower Screen, page 9-8
– Section 9.3.3, User Settings Screen, page 9-10
• Section 9.4, Preventive Maintenance Screen, page 9-12
• Section 9.5, Diagnostics Screens, page 9-13
– Section 9.5.1, Generic Window Screen, page 9-14
– Section 9.5.2, General Charting Screen, page 9-16
• Section 9.6, Factory Automation Screens, page 9-18
– Section 9.6.1, Host Monitor Screen, page 9-18
– Section 9.6.2, SECS Configuration Screen, page 9-22
Section 9.6.2.1, SECS Configuration Screen — HSMS-SS, page 9-22
Section 9.6.2.2, SECS Configuration Screen — SECS-1, page 9-26
– Section 9.6.3, GEM Configuration Screen, page 9-30
– Section 9.6.4, GEM Monitor Screen, page 9-32
– Section 9.6.5, Host Terminal Screen, page 9-38
– Section 9.6.6, PIO Handler Screen, page 9-40
– Section 9.6.7, Carrier Id Screen, page 9-44
– Section 9.6.8, FIC BDS Diagnostics Screen, page 9-46
• Section 9.7, Wafer History Lot Directory Screen, page 9-48
– Section 9.7.1, Wafer Movements for Lot Screen, page 9-50
– Section 9.7.2, Process Summary for Lot Screen, page 9-52
– Section 9.7.3, Process Steps for Lot Screen, page 9-54
• Section 9.8, Configure System Screen, page 9-58

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• Section 9.9, Administration Screens, page 9-60

– Section 9.9.1, Set Date and Time Screen, page 9-60
– Section 9.9.2, User Access Configuration Screen, page 9-62
– Section 9.9.3, Screen Access Configuration Screen, page 9-64
• Section 9.10, I/O Screens, page 9-67
– Section 9.10.1, MF I/O List Screen, page 9-68
– Section 9.10.2, Chamber I/O List Screen, page 9-72

9.1 Go To Header Pulldown Menu

See Figure 9-1 and Table 9-1 for pulldown menu items under the Go To header.

GO TO

1
6
2
7
3
8
4
9
5

Figure 9-1. Go To Header Pulldown Menu

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Table 9-1. Go To Header Pulldown Menu

No. Item Description

1 Event Browser Accesses the Event screen. See Section 9.2, Event Screen,
page 9-4.

2 Setup Displays a window to access the setup screens. See Section 9.3,
Setup Screens, page 9-6.

3 Preventive Accesses the Preventive Maintenance screen. See Section 9.4,

maintenance Preventive Maintenance Screen, page 9-12.

4 Diagnostics Displays a window to access the diagnostics screens. See

Section 9.5, Diagnostics Screens, page 9-13.

5 Factory Automation Accesses the factory automation screens. See Section 9.6, Factory
Automation Screens, page 9-18.

6 Wafer History Accesses the Wafer History Lot Directory screen. See Section 9.7,
Wafer History Lot Directory Screen, page 9-48.

7 Configuration Displays a window to access the Configure System screen. See

Section 9.8, Configure System Screen, page 9-58.

8 Administration Accesses the administration screens. See Section 9.9,

Administration Screens, page 9-60.

9 I/O Displays a window to access the I/O screens. See Section 9.10, I/O
Screens, page 9-67.

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9.2 Event Screen

Use the Event screen to view system events (faults, warnings, prompts, and traces) that occur
while the system is on. See Figure 9-2 and Table 9-2.

Events are color-coded as follows:

• Alarms — Red
• Warnings — Yellow
• Prompts — Blue
• Trace messages (system activities and internal control messages) — White
• Cleared alarms — Black with green text

NOTE
See Section 3.4, Events and Alarms, page 3-11 for further information about
events.

GO TO → EVENT BROWSER

5 6 7

1 2 3 4

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-2. Event Screen

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Table 9-2. Event Screen

No. Item Description

1 Event ID Displays the event identification number.

2 Date Displays the date and time when the event occurred.

3 Source Displays the source that caused the event or the device where the
event occurred.

4 Text Displays the description of the event.

5 Filter Options Accesses an additional screen for filtering events by date, event ID,
or event type (Alarms, Warnings, Prompts, or Traces). After
making a selection, press the Apply button to activate the filter.

6 Sort Options Provides a window to sort the events by one of the following options:
• Time
• ID
• Source
• Severity — Events are categorized according to seven
levels of severity in the following order: Safety (most severe
and critical events), Fatal, Problem, Warning, Caution,
Attention, Information, and Trace. See Section 3.4, Events
and Alarms, page 3-11.
• Text

7 Search Options Provides the following search options:

• ID
• Source
• Text

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9.3 Setup Screens

The Setup submenu of the Go To header provides the access to the following screens:

• Section 9.3.1, Events Configuration for Alarm Line Screen, page 9-6
• Section 9.3.2, Set Up Signal Tower Screen, page 9-8
• Section 9.3.3, User Settings Screen, page 9-10

9.3.1 Events Configuration for Alarm Line Screen

Use the Events Configuration for Alarm Line screen to configure which types of events
(faults, warnings, prompts, and traces) to display in the alarm line at the top of each screen.

See Figure 9-3 and Table 9-3.

GO TO → SETUP → SETUP EVENTS

1 2

3 4
5

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-3. Events Configuration for Alarm Line Screen

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Table 9-3. Events Configuration for Alarm Line Screen

No. Item Description

1 Global Change Provides the following options to configure which events are sent to
the alarm line:
• This Page
• All
• All Alarms
• All Warnings
• All Prompts
• All Traces
After selecting one of the above options, select one of the following:
• Set as “sent”
• Set as “not sent”

2 Save Config Touch this button after any change has been made on this screen.

3 Event ID Displays the event identification number.

4 Event Text Displays the description of the event.

5 Alarm Line Displays whether each event is sent or not sent to the alarm line.
Touch this field to change the setting for each individual event.

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9.3.2 Set Up Signal Tower Screen

Use the Set Up Signal Tower screen to configure the lamp usage and control conditions of
the signal tower. The signal tower has three or four lamps with or without audible alarm
(buzzer). See Section 3.1, Operator Interface, page 3-2 for a description of the signal tower.

See Figure 9-4 and Table 9-4.

GO TO → SETUP → SETUP SIGNAL TOWER

Figure 9-4. Set Up Signal Tower Screen

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Table 9-4. Set Up Signal Tower Screen

No. Item Description

1 Condition Displays the names of the control conditions. When each condition
occurs, the lamps and the buzzer will operate as shown in the line.
The status of each condition is indicated as below:
• Blank values — The condition is disabled.
• Values shown — The condition is enabled.
• White border — The condition is selected, and the detailed
window for that condition is displayed on the right for editing
or viewing.
• Green background — The condition is true (currently
happening).

2 Status Displays the current status of the condition:

• Active — Currently happening
• Not Active

3 Enable Use this field to enable (On) or disable (Off) the condition.

4 Priority Defines the priority of the condition between 1 (highest priority) and
100 (lowest priority). When more than one condition has the same
priority number, a condition with a smaller condition number (01
through 12) has a higher priority.

5 Red Defines the operation mode of each lamp and buzzer:

Amber • Off — The lamp or buzzer turns off when this condition
Green occurs. This operation supersedes any other condition that
Blue has a lower priority than this condition. No other conditions
Buzzer with a lower priority will turn on the lamp or buzzer. See
item 4 for defining the priority.
• Slow Pulse — The lamp or buzzer turns on and off with a
slow pulse when this condition occurs.
• Med Pulse — The lamp or buzzer turns on and off with a
medium pulse when this condition occurs.
• Fast Pulse — The lamp or buzzer turns on and off with a
fast pulse when this condition occurs.
• On — The lamp or buzzer turns on when this condition
occurs.
• No Change

6 Signal Tower Turns on or off the signal tower. This is a master switch for the signal
tower. When it is Off, all the settings on this screen are disabled.

7 Status Displays the status of each lamp (red, amber, green, and blue) and
the buzzer (white). The status of the signal tower is also graphically
displayed at the top right corner of every screen.

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9.3.3 User Settings Screen

Use the User Settings screen to change the password of the user who is currently logged in.
See Figure 9-5. This screen is also accessed from the User Access Configuration screen while
a new user profile is being set up.

NOTE
See also the following screens to set up the user profile and the access
authority:
• Section 9.9.2, User Access Configuration Screen, page 9-62
• Section 9.9.3, Screen Access Configuration Screen, page 9-64

GO TO → SETUP → CHANGE USER SETTINGS

Figure 9-5. User Settings Screen

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THIS PAGE INTENTIONALLY LEFT BLANK.

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9.4 Preventive Maintenance Screen

Use the Preventive Maintenance screen to create a software driven preventive maintenance
(PM) schedule based on the system run time and wafer count. Each Twin chamber has its
own screen.

After the trigger interval is reached for each parameter as defined on this screen, a warning
is displayed. Then, perform the required PM and reset the data and the time on this screen.

See Figure 9-6 and Table 9-5.

GO TO → PREVENTIVE MAINTENANCE → CH X

1 4 5 6 7 8 9 10 11

Figure 9-6. Preventive Maintenance Screen

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Table 9-5. Preventive Maintenance Screen

No. Item Description

1 Time Busy (hours) The number of hours the chamber has been online (either running
process or idle).

2 RPS Time On (hr) The number of hours that the Remote Clean plasma has been on.

3 Side 1 and Side 2 The following parameters are monitored for each side of the chamber:
• PM run counter — The number of wafers processed.
• Wfr# after plasma clean — The number of wafers
processed after the last chamber plasma clean.
• Wfr# after wet clean — The number of wafers processed
after the last chamber wet clean.
• HRF Time On (Hr) — The number of hours that the high
frequency RF generator plasma has been on.
• LRF Time On (Hr) — The number of hours that the low
frequency RF generator plasma has been on (when used).
• HRF Time Used (Hr) — The total amount of the plasma
hours of the high frequency RF generator.
• LRF Time Used (Hr) — The total amount of the plasma
hours of the low frequency RF generator.

4 Data Displays the actual value since the last reset.

5 Reset All Resets the value under Data to zero and the value under Time of last
PM to the current time for all the parameters.

6 Reset Resets the value under Data to zero and the value under Time of last
PM to the current time for one parameter.

7 Trigger Interval Defines the warning trigger interval between PM. If the actual value
reaches this limit, the system generates a warning. To change the
trigger interval, touch the field and enter a desired value.

8 Time of last PM Displays the time when it was reset. See item 5, item 6, item 9, and
item 10.

9 Reset All Resets the value under Time of last PM to zero for all the parameters.

10 Reset Resets the value under Time of last PM to zero for one parameter.

11 Event Notification Configures the warning notification frequency:

• Never Notify — No warning is displayed.
• Notify Once — A warning is displayed only once.
• Notify Every Interval — A warning is repeatedly displayed
every interval configured in item 7 until it is cleared.

9.5 Diagnostics Screens

The Diagnostics submenu of the Go To header provides the access to the following screens:

• Section 9.5.1, Generic Window Screen, page 9-14

• Section 9.5.2, General Charting Screen, page 9-16

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9.5.1 Generic Window Screen

Use the Generic Window screen to create a window that displays a set of selected device
attributes. You can monitor the current value of the attributes or change the value of the
attributes from this screen. See Figure 9-7 and Table 9-6.

There are three types of attributes (see Figure 9-8):

• Writable attributes such as commands

• Read-only attributes such as signals and interlocks
• Configurable attributes (system constants) — There are three types of
configurable attributes:
– Setup (s) — Defines the parameters for system operations and processing.
– Calibration (c) — Saves the calibration data.
– Mount (m) — Defines the hardware specification and configuration data.

NOTE
This screen should be used mainly for troubleshooting. Manual adjustments of
device attributes from this screen, except configurable attributes, should only
be made by qualified Applied Materials personnel.

GO TO → DIAGNOSTICS → GENERIC WINDOW

5
1

2 3

Figure 9-7. Generic Window Screen

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Table 9-6. Generic Window Screen

No. Item Description

1 View area Displays the device attributes that have been selected from the
device attributes list (see item 3). Use the view area to monitor the
current value of a set of desired attributes or change the value of the
attributes.

2 Device tree Displays the tree structure of the devices within the system. Devices
are organized in a single, expandable, hierarchical tree, where each
device may have one or more attributes.
Select the plus (+) symbol to open the tree. Select the minus (−)
symbol to collapse the tree.

3 Device attributes list Displays the attributes of the device that has been selected in the
device tree (see item 2). Use this list to specify the attributes to view
in the view area. Select a desired attribute and touch the Add button.

4 Add button Use this button to display an individual attribute in the view area.

5 Remove button Use this button to remove the display of an individual attribute from
the view area. Select the attribute to be deleted first, then click on this
button.

6 Filters Use these filters to filter the types of attributes to be displayed in the
device attributes list (see item 3). See Figure 9-8.

WRITABLE ATTRIBUTES

READABLE ATTRIBUTES

COMMANDS

SIGNALS

INTERLOCKS

SYSTEM CONSTANTS FOR

SETUP (S)

SYSTEM CONSTANTS FOR

CALIBRATION (C) CONFIGURABLE ATTRIBUTES

SYSTEM CONSTANTS FOR MOUNT

(M; HARDWARE CONFIGURATION)

INTERNAL USE BY APPLIED MATERIALS

FOR TROUBLESHOOTING.
NEVER CHANGE ATTRIBUTE VALUES.

Figure 9-8. Attribute Filters

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9.5.2 General Charting Screen

Use the General Charting screen to trace the change of selected attribute values in a chart.
See Figure 9-9 and Table 9-7.

GO TO → DIAGNOSTICS → GENERAL CHARTING

4 5 7 8
6

ATTRIBUTE SELECTION WINDOW

Figure 9-9. General Charting Screen

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Table 9-7. General Charting Screen

No. Item Description

1 Attribute name Click on this area to display a dialog window for selecting an attribute
name to monitor. See Figure 9-9. Select the plus (+) symbol to open
the tree. Select the minus (−) symbol to collapse the tree.
A total of four attributes can be charted on this screen. Attributes on
the left create a chart in blue. Attributes on the right create a chart
in green.

2 Period Displays the sampling interval: Normal (250). Samplings are taken
every 250 milliseconds.

3 Scale Only the Auto option is currently available to set the display range:
• Auto — Software automatically sets the display range to
the limit of the attribute value currently viewed. Maintains
the range while the signal is viewed and modifies the range
as the signal changes.

4 Start Starts to trace the attribute in the chart.

5 Stop Freezes the charts at the desired time.

6 Start time Displays the charting start time.

7 + and - buttons Use these buttons to change the time range so that you can see the
slope in greater or lesser detail.

8 < and > buttons Scroll the chart to the left or right.

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9.6 Factory Automation Screens

The Factory Automation submenu of the Go To header provides the access to the following
screens:
• Section 9.6.1, Host Monitor Screen, page 9-18
• Section 9.6.2, SECS Configuration Screen, page 9-22
• Section 9.6.3, GEM Configuration Screen, page 9-30
• Section 9.6.4, GEM Monitor Screen, page 9-32
• Section 9.6.5, Host Terminal Screen, page 9-38
• Section 9.6.6, PIO Handler Screen, page 9-40
• Section 9.6.7, Carrier Id Screen, page 9-44
• Section 9.6.8, FIC BDS Diagnostics Screen, page 9-46

NOTE
See the Common Systems Software 300mm Host Communications Manual by
the Synexis Division of Applied Materials for further information about
SECS, GEM, and GEM Process (GP).

9.6.1 Host Monitor Screen

Use the Host Monitor screen to configure the SECS link with the host and monitor the status.
See Figure 9-10, Figure 9-11, Table 9-8 and Table 9-9.
GO TO → FACTORY AUTOMATION → MONITOR HOST

Figure 9-10. Host Monitor Screen (1 of 2)

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Table 9-8. Host Monitor Screen (1 of 2)

No. Item Description

1 Host Displays the current status of the SECS link.

Communication • Disabled — The SECS link is disabled, and no
State communication with the host is established
• Trying — The system has started with the GEM SECS port
enabled, or the operator has enabled the GEM SECS port.
The front-end and real-time processes are trying to be
connected.
• Attempting to Synchronize — The front-end and real-time
processes have connected, and these processes are
synchronizing their data.
• Attempting to Communicate — The GEM spooling feature
is disabled (see Section 9.6.3, GEM Configuration Screen,
page 9-30). The GEM host link cannot be established, or
the host link fails after communication was already
established.
• Spooling — The GEM spooling feature is enabled (see
Section 9.6.3, GEM Configuration Screen, page 9-30). The
GEM host link cannot be established, or the host link fails
after communication was already established.
• Communicating — The equipment is successfully
communicating with the GEM host.
• Communicating - Spooling — The equipment is
successfully communicating with the GEM host, but it had
previously been in the spooling state, and spooling is still
active.

2 SECS Overall Provides the following options:

control • Disabled — No messages are sent to the host. Messages
from the host are ignored.
• Enabled — The Producer SE tries to establish
SECS communication with the host.
• Reset — Resets the communication link.

3 Host Control Mode Provides the following options:

• Offline — The equipment allows no host control and only
very limited information. The host may determine the
equipment identification through the S1F13/14 transaction.
• Online/Local — The host has the full access to information
but places some limits on how the host can affect the
equipment operation. The following SECS-II messages are
disallowed: S2F21, S2F27, S2F31, S2F41, S2F49, and
S7F17.
• Online/Remote — The host may control the equipment to
the full extent possible.

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GO TO → FACTORY AUTOMATION → MONITOR HOST

Figure 9-11. Host Monitor Screen (2 of 2)

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Table 9-9. Host Monitor Screen (2 of 2)

No. Item Description

4 Online System Provides the following options:

Control • Offline — Allows either the operator or the host to control
the process start, cassette load/unload and door
operations.
• Online — Only allows the process start, cassette
load/unload, and cassette door operation from the host.

5 Terminal Services Provides the following options:

Input • Enable — The host input appears at the bottom of the Host
Terminal screen. To send a S10F1 (Terminal Request)
message to the host, enter text in the Send Message to
Host field of the Host Terminal screen. See Section 9.6.5,
Host Terminal Screen, page 9-38.
• Disable — Terminal services between the Producer SE and
the host is disabled.

6 Send Diagnostic Use this field to quickly check the proper operation of the SECS link.
String This button provides the following options (see Figure 9-11):
• Send Diagnostic String — Causes the equipment to send
a simple string of data (up to 50 characters) to the host in
an S2F25 (Loopback Diagnostic Request) message. Upon
receipt of this message, the host should respond with a
S2F26 (Loopback Diagnostic Data) containing the same
string sent by the equipment. The data received from the
host is displayed on the Returned String field.
• Start Looping — Repeats the Send Diagnostic String
operation as loops. When the equipment sends the string
for the second time (and any subsequent times) after the
original string comes back from the host, the string will be
slightly modified so that you can see the difference when it
comes back from the host the next time.
• Stop Looping — Stops sending the string message after
Start Looping was selected.

7 Returned String Displays the string that returned from the host after a test string was
sent by using the Send Diagnostic String or Start Looping button
(see item 6). If the same string returned from the host, string
communication with the host is properly working.

8 Request Date and Use this field to request the date and time from the host. This button
Time causes the equipment to send an S2F17 (Date and Time Request)
message to the host. The host should reply with a S2F18 message
containing the date and time on the host. The date and time received
from the host is displayed on the Returned Date and Time line.

9 Returned Date and Displays the date and time that returned from the host after the
Time Request Date and Time button (see item 8) was selected. If this
time is valid, the equipment will update its date and time to match
the host’s.

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9.6.2 SECS Configuration Screen

Use the SECS Configuration screen to configure the SECS or HSMS communication options.
The screen fields will be different for the SECS option and the HSMS option. See the
following sections:

• Section 9.6.2.1, SECS Configuration Screen — HSMS-SS, page 9-22

• Section 9.6.2.2, SECS Configuration Screen — SECS-1, page 9-26

9.6.2.1 SECS Configuration Screen — HSMS-SS

When HSMS-SS is selected in the Host Communication Interface field (see item 1), the
following fields will be displayed on the SECS Configuration screen.

See Figure 9-12, Figure 9-13, Table 9-10 and Table 9-11.

GO TO → FACTORY AUTOMATION → CONFIGURE SECS

10

Figure 9-12. SECS Configuration Screen — HSMS-SS (1 of 2)

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Table 9-10. SECS Configuration Screen — HSMS-SS(1 of 2)

No. Item Description

1 Host Provides the following options:
Communication • HSMS-SS (single session)
Interface • SECS-1 — See Section 9.6.2.2, SECS Configuration
Screen — SECS-1, page 9-26 for the screen field for this
option.
2 Equipment Device Assigned by the host programmer for each piece of equipment in a
ID fab. This ID forms part of every message sent by the equipment or
to the equipment from the host. Valid values are 0 to 32767.
3 IP Address (HSMS only) Displays the IP address of the front-end system running
the GEM process. This address is necessary for the host to properly
direct message traffic for this piece of equipment.
4 TCP Port (HSMS only) Defines the address of the endpoint for the
TCP/IP connection. Typically 5000.
5 SECS Circuit (HSMS only) Defines the frequency in seconds at which the equipment
Assurance will initiate the HSMS Linktest transaction to verify that the link is still
functional.
Valid values are 0–240 seconds with a default value of 0 seconds
(linktest disabled).
6 T3 Reply timeout Defines the maximum time allowed between sending a SECS-II
primary message and receiving the required SECS-II secondary
reply message. For example, after the sender successfully bids for
the line, the SECS-II primary message S1F1 may be transmitted. If
a delay larger than T3 occurs before the SECS-II secondary
message S1F2 arrives, a T3 Timeout occurs. The sender then
notifies the receiver by sending an S9F9 (Transaction Timer
Timeout).
Valid values are 1–120 seconds with a default value of 45 seconds.
7 T5 Conn Separation (HSMS only) Defines the minimum time between an active connect
timeout procedure terminating and the initiation of another active connect
procedure.
Valid values are 1–240 seconds with a default value of 10 seconds.
8 T6 Ctrl Transaction (HSMS only) Defines the maximum time that an HSMS control
timeout transaction can remain open before a communications failure is
considered to have occurred. A transaction is considered open from
the time the initiator sends a request message until the required
response message is received.
Valid values are 1–240 seconds with a default value of 5 seconds.
9 T7 NOT (HSMS only) Defines the maximum time allowed between the
SELECTED timeout formation of a TCP/IP connection and the use of that connection for
HSMS communications before a communications failure is considered
to have occurred.
Valid values are 1–240 seconds with a default value of 10 seconds.
10 T8 Netwrk Interchar (HSMS only) Defines the maximum amount of time allowed between
timeout the receipt of any two successive bytes of a complete HSMS message
before a communications failure is considered to have occurred.
Valid values are 1–120 seconds with a default value of 5 seconds.

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GO TO → FACTORY AUTOMATION → CONFIGURE SECS → HOST COMMUNICATION INTERFACE → HSMS-SS

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13

14

15

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17

18

19

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Figure 9-13. SECS Configuration Screen — HSMS-SS (2 of 2)

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Table 9-11. SECS Configuration Screen — HSMS-SS (2 of 2)

No. Item Description

11 Conversation Defines the maximum time allowed between sending a SECS-II

timeout secondary message and receiving the consistent SECS-II primary
message in a conversation that requires multiple primary and
secondary messages. If a delay larger than the conversation timeout
occurs before the expected SECS-II primary message arrives, a
S9F13 (Conversation Timeout) message is sent to the host.
Valid values are 1–240 seconds with a default value of 10 seconds.

12 Periodic request of When Enabled, the equipment sends an S2F17 (Date and Time
date/time Request) message to the host every second.

13 ASCII Output When Enabled, wafer history data values in an S6F3 message to
the host will be in ASCII code. When Disabled, wafer history data
values will be in binary codes such as integer.

14 Miscellaneous When Enabled, includes the Miscellaneous Header dataset in the

Header dataset wafer history data. The dataset contains a pre-defined number of
items, depending on the chamber type. Each item can contain the
setpoint, minimum, maximum, mean, standard deviation, and stable
time.

15 Gas Flows dataset When Enabled, includes the Gas flows dataset in the wafer history
data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

16 Pressure Dataset When Enabled, includes the Pressure dataset in the wafer history
data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

17 RF/MW/DC Power When Enabled, includes the RF/MW/DC power dataset in the wafer
dataset history data. The dataset contains a pre-defined number of items,
depending on the chamber type. Each item can contain the setpoint,
minimum, maximum, mean, standard deviation, and stable time.

18 Temperature When Enabled, includes the Temperature dataset in the wafer history
dataset data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

19 Miscellaneous When Enabled, includes the Miscellaneous dataset in the wafer

dataset history data. The dataset contains a pre-defined number of items,
depending on the chamber type. Each item can contain the setpoint,
minimum, maximum, mean, standard deviation, and stable time.

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9.6.2.2 SECS Configuration Screen — SECS-1

When SECS-1 is selected in the Host Communication Interface field (see item 1), the
following fields will be displayed on the SECS Configuration screen.

See Figure 9-14, Figure 9-15, Table 9-12 and Table 9-13.

GO TO → FACTORY AUTOMATION → CONFIGURE SECS → HOST COMMUNICATION INTERFACE → SECS-1

Figure 9-14. SECS Configuration Screen — SECS-1 (1 of 2)

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Table 9-12. SECS Configuration Screen — SECS-1 (1 of 2)

No. Item Description

1 Host Provides the following options:

Communication • HSMS-SS (single session) — See Section 9.6.2.1, SECS
Interface Configuration Screen — HSMS-SS, page 9-22 for the
screen field for this option.
• SECS-1
2 Equipment Device Assigned by the host programmer for each piece of equipment in a
ID fab. This ID forms part of every message sent by the equipment or
to the equipment from the host. Valid values are 0 to 32767.
3 Upstream SECS (SECS-I only) The transmission rate, in bits per second, of individual
Baud Rate bits. This must be set to the same value used by the host.
4 Retries (RTY) (SECS-I only) The maximum number of times a message is sent to
the host without receiving a reply.
Valid values are 0 to 31 with a default value of 3.

5 T1 Interchar. (SECS-I only) Defines the maximum time allowed between reception
timeout of characters. Each bit of an 8-bit character is transmitted at the
specified baud rate, but there may be some delay between multiple
characters. If a delay larger than T1 occurs between the reception of
multiple characters, the equipment responds with a NAK (Negative
Acknowledgment) which causes the host to re-transmit the characters.
Valid values are 0.1–10.0 seconds with a default value of 1.0 seconds.
6 T2 Protocol timeout (SECS-I only) Defines the maximum time spent waiting for a protocol
response. For example, the sender of a message bids for control of
the line by sending an ENQ (Ready to Send) message and then waits
for an EOT (Ready to Receive) message from the receiver. If a delay
larger than T2 occurs before the EOT message arrives, a T2 Timeout
occurs, and the Retry (RTY) counter is activated.
Valid values are 0.2–25.0 seconds with a default value of 5.0 seconds.
7 T3 Reply timeout Defines the maximum time allowed between sending a SECS-II
primary message and receiving the required SECS-II secondary
reply message. For example, after the sender successfully bids for
the line, the SECS-II primary message S1F1 may be transmitted. If
a delay larger than T3 occurs before the SECS-II secondary
message S1F2 arrives, a T3 Timeout occurs. The sender then
notifies the receiver by sending an S9F9 (Transaction Timer
Timeout).
Valid values are 1–120 seconds with a default value of 45 seconds.
8 T4 Inter-Block (SECS-I only) Defines the maximum time allowed between the
timeout reception of each block in a multi-block message. If a delay larger than
T4 occurs before the next block arrives, a T4 Timeout occurs, and the
partially received message is discarded.
Valid values are 1–120 seconds with a default value of 45 seconds.

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GO TO → FACTORY AUTOMATION → CONFIGURE SECS → HOST COMMUNICATION INTERFACE → SECS-1

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13

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16

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Figure 9-15. SECS Configuration Screen — SECS-1 (2 of 2)

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Table 9-13. SECS Configuration Screen — SECS-1 (2 of 2)

No. Item Description

9 Conversation Defines the maximum time allowed between sending a SECS-II

timeout secondary message and receiving the consistent SECS-II primary
message in a conversation that requires multiple primary and
secondary messages. If a delay larger than the conversation timeout
occurs before the expected SECS-II primary message arrives, a
S9F13 (Conversation Timeout) message is sent to the host.
Valid values are 1–240 seconds with a default value of 10 seconds.

10 Periodic request of When Enabled, the equipment sends an S2F17 (Date and Time
date/time Request) message to the host every second.

11 ASCII output When Enabled, wafer history data values in an S6F3 message to
the host will be in ASCII code. When Disabled, wafer history data
values will be in binary codes such as integer.

12 Miscellaneous When Enabled, includes the Miscellaneous Header dataset in the

Header dataset wafer history data. The dataset contains a pre-defined number of
items, depending on the chamber type. Each item can contain the
setpoint, minimum, maximum, mean, standard deviation, and stable
time.

13 Gas Flows dataset When Enabled, includes the Gas flows dataset in the wafer history
data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

14 Pressure Dataset When Enabled, includes the Pressure dataset in the wafer history
data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

15 RF/MW/DC Power When Enabled, includes the RF/MW/DC power dataset in the wafer
dataset history data. The dataset contains a pre-defined number of items,
depending on the chamber type. Each item can contain the setpoint,
minimum, maximum, mean, standard deviation, and stable time.

16 Temperature When Enabled, includes the Temperature dataset in the wafer history
dataset data. The dataset contains a pre-defined number of items, depending
on the chamber type. Each item can contain the setpoint, minimum,
maximum, mean, standard deviation, and stable time.

17 Miscellaneous When Enabled, includes the Miscellaneous dataset in the wafer

dataset history data. The dataset contains a pre-defined number of items,
depending on the chamber type. Each item can contain the setpoint,
minimum, maximum, mean, standard deviation, and stable time.

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9.6.3 GEM Configuration Screen

Use the GEM Configuration screen to configure the GEM options.

See Figure 9-16 and Table 9-14.

GO TO → FACTORY AUTOMATION → CONFIGURE GEM

1 10

2 11

3 12

Figure 9-16. GEM Configuration Screen

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Table 9-14. GEM Configuration Screen

No. Item Description

1 Establish Defines the GemEstabCommDelay EC value in seconds. Determines

Communication the delay period between equipment attempts to establish
Delay communications with the host.

2 S1F1 to Host Defines the GemPollDelay EC value in seconds. Determines how often
Interval (0=Off) the equipment sends an S1F1 (Are You There?) message to the host
to ensure that the SECS link is still up.

3 Required Online Defines the GemOnlineSubstate EC value. Determines the online

Substate substate when the equipment enters the online state from offline or at
startup: Offline/Equipment Offline, Offline/Attempt Online, Offline/
Host Offline, Online/Local or Online/Remote. See Section 9.6.4,
GEM Monitor Screen, page 9-32 for a description of each substate.

4 Required Offline Defines the GemOfflineSubstate EC value. Determines the offline

Substate substate when the equipment transitions into the offline state:
Offline/Equipment Offline, Offline/Attempt Online, Offline/Host
Offline, Online/Local or Online/Remote. See Section 9.6.4, GEM
Monitor Screen, page 9-32 for a description of each substate.

5 Limits Polling Defines the GemLimitsDelay EC value in seconds. Determines how

Interval often the equipment checks whether variables with limits defined
have made any limit transitions.

6 Message Spooling Defines the GemConfigSpool EC value. When Enabled, the

equipment spools primary messages (which have been enabled for
spooling) to the host when the Host Communications State is
Attempting to Communicate and the SECS Overall Control is
Enabled. See Section 9.6.1, Host Monitor Screen, page 9-18.

7 Maximum Spool Defines the GemMaxSpoolFileSize EC value. Determines the

File Size (bytes) maximum number of bytes of non-volatile storage used for spooling.

8 Maximum Spool Defines the GemMaxSpoolTransmit EC value. Determines the

Transmit maximum number of messages that the equipment will transmit from
the spool area in response to a S6F23 (Transmit Spooled Messages)
request. If 0 (zero), all spooled messages are sent.

9 Overwrite Saved Defines the GemOverWriteSpool EC value. If Yes, the equipment

Spool File? overwrites data in the spool area. If No, the equipment discards
further messages when the spool area limits are exceeded.

10 Reply needed for Defines the GemWBitS5 EC value. If Yes, the equipment sends
stream 5 Stream 5 messages with the W-bit set, requesting the host to send
a reply to all Stream 5 messages.

11 Reply needed for Defines the GemWBitS6 EC value. If Yes, the equipment sends
stream 6 Stream 6 messages with the W-bit set, requesting the host to send
a reply to all Stream 6 messages.

12 Reply needed for Defines the GemWBitS10 EC value. If Yes, the equipment sends
stream 10 Stream 10 messages with the W-bit set, requesting the host to send
a reply to all Stream 10 messages.

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9.6.4 GEM Monitor Screen

Use the GEM Monitor screen to monitor the status of the GEM communications and the
GEM Process (GP) interface. The GP is a software application developed by Applied
Materials, to implement the GEM communications option.

See Figure 9-17 through Figure 9-19 and Table 9-15 through Table 9-17.

GO TO → FACTORY AUTOMATION → MONITOR GEM

Figure 9-17. GEM Monitor Screen (1 of 3)

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Table 9-15. GEM Monitor Screen (1 of 3)

No. Item Description

1 Process State Displays the current Process State indicated by SV GemProcessState.

• Power Up — The system starts up after power turns on.
• Manual — The system responds to operator commands but
does not process wafers beyond a specific command. All
maintenance, diagnostics, and setup of the system are
done in the Manual state.
• Automatic — Manual commands are blocked.
• Ready — The tool has valid material and lot with a valid
sequence and is ready to process it.
• Running — The tool processes wafers automatically.
• Stopped — The tool was stopped, either because of a fault
or by the Stop command.
• Idle — Although in the Automatic mode, the tool does
nothing because there is no material to process.

2 Previous Process Displays the Previous Process State indicated by

State SV GemPreviousProcessState.

3 Control State Displays the current Control State indicated by SV GemControlState.

• Offline/EqOff (Offline/Equipment Offline) — While this state
is active, the system maintains the offline state. It waits for
operator instructions to attempt to go online.
• Offline/AtOn (Offline/Attempt Online) — The equipment has
responded to an operator instruction to attempt to go to the
online state. Upon activating this state, the equipment
attempts to send an S1F1 to the host.
• Offline/HOff (Offline/Host Offline) — The operator’s intent
is that the equipment be online. However, the host has not
agreed. Entry to this state may be due to a failed attempt
to go online or to the host’s request that the equipment go
offline from online. while this state is active, the equipment
will respond to any host requests to go online (S1F17). Such
a request will be denied when the Host Offline state is not
active.
• Online/Local — Operation of the equipment is implemented
by direct action of an operator. All operation commands will
be available for input at the local operator console of the
equipment.
• Online/Remote — The host may operate the equipment to
the full extent available through the communication
interface.

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GO TO → FACTORY AUTOMATION → MONITOR GEM

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Figure 9-18. GEM Monitor Screen (2 of 3)

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Table 9-16. GEM Monitor Screen (2 of 3)

No. Item Description

4 Spool State Displays the current major spool state:

• Inactive — Normal operating mode. No spooling occurs,
and the spool area is empty. Primary SECS-II messages
are normally transmitted.
• Active — All primary SECS-II messages ready for sending
and for which spooling is enabled are directed to the spool
area. All other primary messages, except Stream 1, are
discarded. The equipment will attempt to send any
secondary messages that are generated and discard these
messages if the attempt to send fails. Once communication
is established, the host must initiate the spool unload
sequence to restore the full functionality. Since the
equipment will deliver secondary messages, the host may
inquire for information or send commands as needed.

5 Spool Load Displays the current Spool Load state of the Spool Active superstate.
substate This state deals with the messages entering the spool area.
• Not Full — As primary SECS-II messages are sent directly
to the spool area, the equipment will write the messages to
the end of the spool.
• Full — All of the allocated spooling area is filled.

6 Spool Unload Displays the current Spool Unload state of the Spool Active superstate.
substate This state deals with the messages leaving the spool area.
• Purge — The equipment will discard all messages in the
spool and, when the spool is empty, set the value of Spool
Count Actual to zero (0).
• Transmit — The host elects to receive the messages
contained in the spool area, oldest record first. As each
spooled message is successfully transmitted to the host, it
is removed from the spool area, and the value of Spool
Count Actual is decremented. Normal spooling continues
during the spool transmit process.
• No Output — No messages are removed from the spool.

7 Spool Count Actual Displays the number of messages actually stored in the spool area of
the equipment.

8 Spool Count Total Displays the total number of primary messages directed to the spool,
regardless of whether placed or currently retained in the spool area.

9 Spool Start Time Displays the time when spooling was last activated.

10 Spool Full Time Displays the time when the spool last became full. If the spool was not
filled during the last spooling period, this will contain a time value prior
to the current Spool Start Time.

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GO TO → FACTORY AUTOMATION → MONITOR GEM

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Figure 9-19. GEM Monitor Screen (3 of 3)

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Table 9-17. GEM Monitor Screen (3 of 3)

No. Item Description

11 PP Change Status Displays the action taken on the Process Program (PP or recipe).
• Created
• Changed
• Deleted

12 PP Change Name Displays the name of the Process Program (PP or recipe) which was
changed most recently.

13 SP Change Status Displays the action taken on the Sequence Program (SP).
• Created
• Changed
• Deleted

14 SP Change Name Displays the name of the Sequence Program (SP) which was changed
most recently.

15 Equipment Displays the model type and software revision of the equipment.

16 GP Db Variant Displays the software revision of the GEM Process (GP) database.

17 GEM Process Displays the model type and software revision of the GP software.

18 GEM Data Server Displays the model type and software revision of the GEM data server
on the front end system.

19 Host SECS Displays the model type and software revision of the SECS SDR driver.

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9.6.5 Host Terminal Screen

Use the Host Terminal screen to communicate with the host terminal. Any text messages can
be sent between the host and the operator of the Producer SE system through this screen.
This screen is initially blank.

NOTE
To send terminal messages to the host, the Terminal Services Input field on
the Host Monitor screen must be enabled. See Section 9.6.1, Host Monitor
Screen, page 9-18.

See Figure 9-20 and Table 9-18.

GO TO → FACTORY AUTOMATION → HOST TERMINAL

Figure 9-20. Host Terminal Screen

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Table 9-18. Host Terminal Screen

No. Item Description

1 Terminal Message Displays any S10F5 message (multi-block message) sent by the host
from Host terminal.

2 Ack Allows the operator to acknowledge the S10F5 message from the
host. Selecting this button will generate a GemMessageRecognition
event to the host.

3 Send Message to Allows the operator to send an S10F1 (Terminal Request) message
Host to the host terminal.

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9.6.6 PIO Handler Screen

Use the PIO Handler screen to control the parallel I/O (PIO) carrier handoff and monitor the
signal status. See Figure 9-21, Figure 9-22, Table 9-19 and Table 9-20.

NOTE
See the E87 Carrier Management User Manual by the Synexis Division of
Applied Materials for further information about the carrier handoff.

Also, see the following SEMI standards as reference:

• SEMI E15, Specification for Tool Load port

• SEMI E30, Generic Model for Communications and Control of SEMI
Equipment (GEM)
• SEMI E39, Object Services Standard: Concepts, Behavior, and
Services
• SEMI E84, Specification for Enhanced Carrier Handoff Parallel
I/O Interface
• SEMI E87, Specification for Carrier Management (CMS)

GO TO → FACTORY AUTOMATION → PIO HANDLER

Figure 9-21. PIO Handler Screen (1 of 2)

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Table 9-19. PIO Handler Screen (1 of 2)

No. Item Description

1 Port X Selecting each Port button provides the following options:

• Reset Xfer State — Requests to reset the load port transfer
state to ReadyToLoad. This action is only valid if the current
transfer state is either TransferBlocked or ReadyToUnload
and there is no carrier present on the load port.
• Cancel Carrier — Requests the real-time software to carry
out the actions required to prepare the carrier on this load
port for unloading. It is equivalent to the host remote
command to cancel a carrier.

2 CarIdRdr Configures the carrier ID reader:

• Present — The carrier ID reader system is configured for
this load port, and carrier ID reads are possible.
• Absent — No carrier ID reads can be performed at this load
port.
When this field is configured as Present, item 6 through item 9 will be
displayed.

3 Service Defines the PIO control status of the load port.

• In Service — The load port is available for carrier transfers.
• Out of Service — The load port is unavailable for carrier
transfers.

4 Reserved Defines the reservation status of the load port:

• Reserved — The load port is reserved for future activity.
• Not Reserved — No future activity is currently planned for
the load port.

5 Xfer State Displays the current transfer state of the load port.

6 Stop Handoff Touch this button to stop the automated carrier transfer. Operator
action will be necessary to continue.

7 Continue Handoff Touch this button to reset the PIO sensors after an automated transfer
has faulted or been halted by the operator. Until these sensors are
reset, further automated transfers cannot occur at the load port.

8 Manual Mode Touch this button to switch the carrier handoff mode:
• Manual Mode — In this mode, an AMHS will not
communicate with the load port. All carrier transfers have
to be done manually.
• Automatic Mode — In this mode, carrier transfers are
performed automatically by an AMHS.

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GO TO → FACTORY AUTOMATION → PIO HANDLER

10

11

12

Figure 9-22. PIO Handler Screen (2 of 2)

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Table 9-20. PIO Handler Screen (2 of 2)

No. Item Description

9 PIO signal on/off Displays the on/off status of the PIO signals for the load port:
status • VALID — Signal transition is active and selected.
• CS_0 — Carrier Stage 0
• CS_1 — Carrier Stage 1
• TR_REQ — Transfer request
• BUSY — Busy for transfer
• CONT — Continuous handoff
• COMPT — Complete transfer
• L_REQ — Load request
• U_REQ — Unload request
• READY — Ready for transfer
• HO_AVBL — Handoff available
• ES — Emergency stop

10 Update Status Select this button to update the carrier status.

11 Init FIC Select this button to initiate the FIC.

12 Configuration Defines the values of the passive equipment timers (TP1–TP6) and
a delay timer (TD1) in seconds according to SEMI E84.

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9.6.7 Carrier Id Screen

Use the Carrier ID screen to read the carrier ID data from the carrier tag at the cassette or
write the data to the carrier tag.

See Figure 9-23 and Table 9-21.

NOTE
The carrier ID is also called the material ID (MID).

GO TO → FACTORY AUTOMATION → CARRIER ID

Figure 9-23. Carrier Id Screen

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Table 9-21. Carrier Id Screen

No. Item Description

1 Cassette A Provides a menu of cassette (port) options.

2 Carrier Id Number Provides the following options:

• Unknown
• Primary — Selects the primary carrier tag reader (if
installed) at the port.
• Secondary — Selects the secondary carrier tag reader (if
installed) at the port.

3 Data Address This button pops up a numeric keypad. Enter the data address where
the data is to be written to or read from. Enter a value of “-1” to read
the carrier ID.

4 Data Length This button pops up a numeric keypad. Enter the number of bytes to
be read or written. Valid values are 0 through 236.

5 Command Provides the following options:

• Read Carrier Id — Performs a read operation at the
selected data address of the selected carrier tag reader.
• Write Carrier Id — Writes the data in the Data field to the
selected data address of the selected carrier tag reader.

6 Data Displays the carrier ID data when it was requested by the Read
Carrier Id command (see item 5).
Also, this field pops up an alpha-numeric keyboard. Enter the data to
be written to the carrier tag, then select Write Carrier Id in the
Command field (see item 5).

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9.6.8 FIC BDS Diagnostics Screen

Use the FIC BDS Diagnostics screen to monitor the BDS (Bay Distributed Stocker)
operations.

See Figure 9-24 and Table 9-22.

NOTE
BDS settings are made through the FI controller (FIC). For the PIO handler
settings, see Section 9.6.6, PIO Handler Screen, page 9-40

The carrier ID is also called the material ID (MID).

NOTE
See the E87 Carrier Management User Manual by the Synexis Division of
Applied Materials and SEMI E87, Specification for Carrier Management
(CMS), for further information about the carrier handoff and BDS.

GO TO → FACTORY AUTOMATION → FIC BDS DIAGNOSTICS

1
3
9
2
10

11

12

Figure 9-24. FIC BDS Diagnostics Screen

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Table 9-22. FIC BDS Diagnostics Screen

No. Item Description

1 Port X Displays the carrier ID (8-character string) when each port (shelf) holds
a carrier. The BDS can be configured in either OHT or AGV mode with
six or eight shelves.
2 Buffer X Displays the carrier ID when each buffer station holds a carrier. Buffers
are available in the BDS for holding carriers while they are awaiting
processing or transfer to a load port for unloading.

3 Crane Displays the carrier ID when the crane is holding and transferring a
carrier between ports and buffers.
4 LP Usage Displays the load port usage:
• None
• Any Carrier
• Prod Waf (product wafers)
• Non Prod Waf (non-product wafers)

5 LP Mode Displays the load port access mode:

• No AMHS
• AMHS Pck/Del (AMHS pickup and delivery)
• AMHS Pickup
• AMHS Delivery
6 Access Mode Displays the load port access mode: Manual Mode or Auto Mode.

7 Service Displays the PIO control status of the load port.

• In Service — The load port is available for carrier transfers.
• Out of Srvc — The load port is unavailable for carrier
transfers.
8 Reserved Displays the reservation status of the load port:
• Reserved — The load port is reserved for future activity.
• Not Reserved — No future activity is currently planned for
the load port.
9 Control State Displays the BDS control state:
• Disabled
• Automatic-FIFO (first in first out)
• Automatic-Control Job
10 Presence Displays whether the BDS is present or absent.

11 State Displays the BDS Operating state:

• Manual
• Automatic-FIFO
• Automatic-Control Job
12 Fab Configuration Displays the BDS fab configuration:
• Unknown
• OHT Carrier Delivery
• AGV/RGV Carrier Delivery
• Both OHT and AGV Delivery

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9.7 Wafer History Lot Directory Screen

Use the Wafer History Lot Directory screen to display the lot names and their start and end
times. The following screens can be accessed from this screen to view the detailed wafer
history data:

• Section 9.7.1, Wafer Movements for Lot Screen, page 9-50

• Section 9.7.2, Process Summary for Lot Screen, page 9-52
• Section 9.7.3, Process Steps for Lot Screen, page 9-54

See Figure 9-25 and Table 9-23.

GO TO → WAFER HISTORY

1 2 3 4 5 6

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-25. Wafer History Lot Directory Screen

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Table 9-23. Wafer History Lot Directory Screen

No. Item Description

1 Lot name Displays the wafer lot names.

2 Wafer Count Displays the number of wafers associated with each lot.

3 Start Time Displays the date and time when the wafer movement or recipe
activity started.

4 Last Extension Displays the date and time when the wafer movement or recipe
Time activity ended.

5 User Displays the user name who created the lot.

6 Open Select this button to display the detailed wafer history for each lot.
See Section 9.7.1, Wafer Movements for Lot Screen, page 9-50.

7 Delete Select this button to delete a lot name from this screen. This will
delete all the wafer history data associated to the lot from the system,
and it cannot not be recovered.

8 Sort Provides the following options to sort the lot names:

• Lot Name
• Creation Time
• User Name

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9.7.1 Wafer Movements for Lot Screen

Use the Wafer Movements for Lot screen to view all wafer movements and recipe activities
of a lot. Displayed items are color-coded:

• Wafer movement — White background

• Recipe — Gray background

NOTE
Wafer history data is collected only when the following conditions are set in
the Configure System screen (see Section 9.8, Configure System Screen,
page 9-58):

• The Log wafer movement field is Yes. — This activates collection

of the wafer movements data.
• The Log Chamber X field is Yes. — This activates collection of the
recipe data for each chamber.

See Figure 9-26 and Table 9-24.

GO TO → WAFER HISTORY → DESIRED LOT → OPEN

1 2 3 4 5 6

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-26. Wafer Movements for Lot Screen

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Table 9-24. Wafer Movements for Lot Screen

No. Item Description

1 Wafer Displays the cassette name (CASS_A for cassette A or CASS_B for
cassette B) and slot number (1 through 25) where the wafer was
originally located.

2 Source Displays different information, depending on whether it is for a wafer

movement or a recipe:
• Wafer movement (white) — Starting point of the movement.
• Recipe (gray) — Process location.

3 Destination Displays different information, depending on whether it is for a wafer

movement or a recipe:
• Wafer movement (white) — Ending point of the movement.
• Recipe (gray) — Recipe name.

4 Start Time Displays the start time and date of each wafer movement or recipe.

5 End Time Displays the ending time and date of each wafer movement or recipe.

6 Open This field becomes active when a recipe (gray) is selected on the
screen. Selecting this button will bring up the Process Summary for
Lot screen for that recipe. See Section 9.7.2, Process Summary for
Lot Screen, page 9-52.

7 Close Returns to the Wafer History Lot Directory screen to display all lot
names. See Section 9.7, Wafer History Lot Directory Screen,
page 9-48.

8 Sort Provides the following options to sort the entries:

• Wafer
• Data Type — Displays all wafer movements first, then
recipes, in the chronological order.
• Time

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9.7.2 Process Summary for Lot Screen

Use the Process Summary for Lot screen to view a summary of the selected recipe result.

See Figure 9-27 and Table 9-25.

GO TO → WAFER HISTORY → DESIRED LOT → OPEN → DESIRED RECIPE → OPEN

10
1

2 11

3
12
4
6
5
7

Figure 9-27. Process Summary for Lot Screen

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Table 9-25. Process Summary for Lot Screen

No. Item Description

1 Started at Displays the date and time when the recipe started.

2 Run time Displays the time that took to run the recipe.

3 Position Time Displays the time that took to lift a wafer to the process position.

4 Stopped Time Displays the elapsed time from when the process stop command was
initiated to when the process actually stopped.

5 Stabilization Time Displays the elapsed time from when the process flow and pressure
were initiated to when they actually stabilized in the chamber.

6 Ended At Displays the date and time when the recipe ended.

7 Faults Count Displays the number of faults which occurred during the recipe.

8 Warnings Count Displays the number of warnings which occurred during the recipe.

9 Interrupt Count Displays the number of manual interruptions which occurred during
the recipe.

10 Open Access the Process Steps for Lot screen. See Section 9.7.3, Process
Steps for Lot Screen, page 9-54.

11 Close Returns to the Wafer Movements for Lot screen. See Section 9.7.1,
Wafer Movements for Lot Screen, page 9-50.

12 Sort Not available to be used from this screen.

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9.7.3 Process Steps for Lot Screen

Use the Process Steps for Lot screen to view process parameters and statistical data for
individual steps. Items displayed on the screen will be different, depending on the setting on
the WH Samples for Step screen for each step. See Section 10.2.7, WH (Wafer History)
Samples for Step Screen, page 10-22.

This screen has the first page and the second page. See Figure 9-28, Figure 9-29, Table 9-26
and Table 9-27.

NOTE
Detailed process data is collected only when the recipe data collection
parameters were selected for that step in the WH Samples for Step screen
before the recipe was run. See Section 10.2.7, WH (Wafer History) Samples
for Step Screen, page 10-22.

GO TO → WAFER HISTORY → DESIRED LOT → OPEN → DESIRED RECIPE → OPEN → OPEN

1 2 3 4 5 6 7 8 9

10

11

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-28. Process Steps for Lot Screen — First Page

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Table 9-26. Process Steps for Lot Screen — First Page

No. Item Description

1 Step # Displays the step number.

2 Step Name Displays the step name.

3 Start Time Displays the date and time when the step started.

4 End Time Displays the date and time when the step ended.

5 Stab Time Displays the elapsed time from when the process flow and pressure
were initiated to when they actually stabilized in the chamber.

6 Run time Displays the time that took to run the step.

7 Type Displays the recipe type: Process or Clean.

8 Result Displays the step result: OK or Not OK.

9 Open Accesses the second page of the screen to view detailed process
parameters. The second page is available only when the actual
process parameters were available and stored for that step. See
Figure 9-29 and Table 9-27.

10 Close Returns to the Process Summary for Lot screen. See Section 9.7.2,
Process Summary for Lot Screen, page 9-52.

11 Sort Not available to be used from this screen.

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GO TO → WAFER HISTORY → DESIRED LOT → OPEN → DESIRED RECIPE → OPEN → OPEN → DESIRED STEP → OPEN

1 2 3 4 5 6 7 8 9 10
11

12

13

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-29. Process Steps for Lot Screen — Second Page

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Table 9-27. Process Steps for Lot Screen — Second Page

No. Item Description

1 Attribute Displays the process parameters as they were set in the

WH Samples for Step screen for this step before the recipe was run.
See Section 10.2.7, WH (Wafer History) Samples for Step Screen,
page 10-22.

2 Samples Displays the number of samples taken during the step.

3 Start Value Displays the starting value of the attribute.

4 End Value Displays the ending value of the attribute.

5 Min Displays the minimum value of the attribute during the step.

6 Max Displays the maximum value of the attribute during the step.

7 Mean Displays the mean value of the attribute during the step.

8 Std Dev Displays the standard deviation of the attribute during the step.

9 Stab Time Displays the elapsed time from when the process flow and pressure
were initiated to when they actually stabilized in the chamber.

10 SP Displays the setpoint of the attribute.

11 Open Not available to be used from this screen.

12 Close Returns to the first page of the screen. See Figure 9-28 and Table 9-26.

13 Sort Not available to be used from this screen.

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9.8 Configure System Screen

Use the Configure System screen to configure the system software to match the actual
hardware and to set certain system options.

See Figure 9-30 and Table 9-28.

GO TO → CONFIGURATION → CONFIGURE SYSTEM

2 7

4 8

Figure 9-30. Configure System Screen

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Table 9-28. Configure System Screen

No. Item Description

1 Chamber A, B, and Displays a pulldown menu to configure which type of process chamber
C is installed in each location. When a chamber is absent, select Not
configured.

2 Chamber MET Displays a pulldown menu to configure whether or not the metrology
unit (Producer QA) is installed on the system.

3 Loadlock Configures the loadlock with heater, cooler, or without either (no
selection).

4 Cassette Configures the cassettes (FOUPs) that are available with the system.

5 Apply When a change is made to item 1 through item 4, this button will
become available, then select this button to activate the new
configuration.
Note that it will take software substantial time to reconfigure all the
settings. Be patient.

6 Vacuum sensors Provides the following options:

• True — The system will check the vacuum status. This is
for the normal operation.
• False — The system will not check the vacuum status. Use
this mode during maintenance or robot calibration.

7 Log wafer When Yes, wafer movements in the system are recorded and can be
movement viewed through the Wafer History screens. See Section 9.7, Wafer
History Lot Directory Screen, page 9-48.

8 Log Chamber A When Yes, recipe data for that chamber are recorded and can be
Log Chamber B viewed through the Wafer History screens. See Section 9.7, Wafer
Log Chamber C History Lot Directory Screen, page 9-48.
For this features to work, you need to select the process parameters
to be recorded in the WH Samples for Step screen for each step in
each recipe. See Section 10.2.7, WH (Wafer History) Samples for Step
Screen, page 10-22.

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9.9 Administration Screens

The Administration submenu provides the access to the following screens:

• Section 9.9.1, Set Date and Time Screen, page 9-60

• Section 9.9.2, User Access Configuration Screen, page 9-62
• Section 9.9.3, Screen Access Configuration Screen, page 9-64

9.9.1 Set Date and Time Screen

Use the Set Date and Time screen to change the date and time setting on the system.

See Figure 9-31 and Table 9-29.

GO TO → ADMINISTRATION → SET DATE AND TIME

Figure 9-31. Set Date and Time Screen

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Table 9-29. Set Date and Time Screen

No. Item Description

1 Date setting Enter the desired date in month, day, and year.

2 Time setting Enter the desired time in hours, minutes, and seconds. The time is
displayed in the 24-hour format.

3 Set Date and Time Select this button after entering any change. The current date and
time are displayed at the top of the screen.

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9.9.2 User Access Configuration Screen

Use the User Access Configuration screen to add and delete users who can log into the system.
Before each user can log into the system, the user must be registered on this screen and the
password must be set up in the User Settings screen. See Section 9.3.3, User Settings Screen,
page 9-10.

See Figure 9-32 and Table 9-30.

NOTE
See also the following screens to set up the user profile and the access
authority:
• Section 9.3.3, User Settings Screen, page 9-10
• Section 9.9.3, Screen Access Configuration Screen, page 9-64

GO TO → ADMINISTRATION → CONFIGURE USER ACCESS

4 5

1 6

3 8

Figure 9-32. User Access Configuration Screen

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Table 9-30. User Access Configuration Screen

No. Item Description

1 Add User To add a new user:

1. Select this button.
2. Enter a new user name from the keyboard that appears.
3. Set up a user password from the User Settings screen that
appears. See Section 9.3.3, User Settings Screen, page 9-10.
You MUST set up a password for the new user. Otherwise, the
account will not be activated.

2 Edit User Selecting this button brings up the User Setting screen. Use this
screen to set up or change the user password for the selected user.
See Section 9.3.3, User Settings Screen, page 9-10.

3 Remove User Select this button to remove a user. You cannot remove the user who
is currently logged in.

4 Users Provides the following display options:

• in all groups — Displays all the user names that are
configured in the system.
• in selected group — Displays only the users who belong to
the group that is currently selected under the Groups field
on the right. See item 4.

5 Groups Displays the user groups that are configured in the system.

6 Add Group To add a new group:

1. Select this button.
2. Enter a new group name from the keyboard that appears.
3. Configure the screen access for this group from the Screen
Access Configuration screen that appears. See Section 9.9.3,
Screen Access Configuration Screen, page 9-64.

7 Edit Group Selecting this button brings up the Screen Access Configuration
screen. Use this screen to configure the access to each screen for
the selected group. See Section 9.9.3, Screen Access Configuration
Screen, page 9-64.

8 Remove Group Select this button to remove a group. You can remove a group only
when the group contains no users. Remove all the users before
removing a group. Also, predefined groups whose name starts with
@ (such as @FULLACCESS) cannot be removed.

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9.9.3 Screen Access Configuration Screen

Use the Screen Access Configuration screen to configure which screens each user group has
the right to access. This may limit access to certain screens requiring specialized expertise
or authority. This screen is also accessed from the User Access Configuration screen while
a new user profile is being set up. See Figure 9-33 and Table 9-31.

NOTE
See also the following screens to set up the user profile and the access
authority:
• Section 9.3.3, User Settings Screen, page 9-10
• Section 9.9.2, User Access Configuration Screen, page 9-62

GO TO → ADMINISTRATION → CONFIGURE SCREEN ACCESS

1 4 5

9
7
10

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 9-33. Screen Access Configuration Screen

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Table 9-31. Screen Access Configuration Screen

No. Item Description

1 Group Select the group for which you configure the screen access in this
field.

2 Tool control Provides the following options:

• Allowed — Normal setting
• Not Allowed — Totally disables tool control both from all
screens and from all menus. Users can only open and view
screens unless they are configured to be hidden in the
Screen access list. See item 7.

3 Auto-logoff Provides the time options for automatic logoff. See Figure 9-33.
When there is no screen activity for the selected time, the Producer
SE software will automatically log off, and the screen will return to
the Login screen. Setting disabled will disable this feature.

4 Group description Enter any comment about the group in this field. For example, you
can describe who should belong to this group.

5 Apply Use this button to store the new setting for the group.

6 Undo Resets all the settings for the currently selected group to the values
previously stored.

7 Screen access Click on each screen name to toggle the level of access to this screen
to one of the following settings:
• ENABLE (green) — No restrictions
• DISABLE (gray) — Users of this group can open this screen
but cannot control the tool using this screen.
• HIDE (red) — Users of this group cannot open this screen.
The following screens are always enabled for the members of the
@FULLACCESS group and always hidden for the other users:
• Screen Access Configuration screen
• User Access Configuration screen
The following screen is enabled for all users:
• Login screen

8 Enable All Select this button to set the ENABLE access level for all screens.
See item 7. If only a few screens should be restricted for the desired
group, it might be convenient to press this button first and then specify
restrictions by clicking on each individual screen name.

9 Disable All Select this button to set the DISABLE access level for all screens.
See item 7. If the tool control should be restricted for most of the
screens for the desired group, it might be convenient to press this
button first and then modify restrictions by clicking on each individual
screen name.

10 Hide All Select this button to set the HIDE access level for all screens. See
item 7. If only a few screens should be viewed by the desired group,
it might be convenient to press this button first and then make the
desired screens available by clicking on each individual screen
name.

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9.10 I/O Screens

The I/O submenu provides the access to the following screens:

• Section 9.10.1, MF I/O List Screen, page 9-68

• Section 9.10.2, Chamber I/O List Screen, page 9-72

NOTE
The 4-channel DeviceNet Scanner card for the real time controller is located
in the Flex 3 controller. See Figure 9-37. The DeviceNet Scanner card
provides four independent DeviceNet networks for managing network
communications. One network is allocated to the mainframe, and one to each
Twin chamber (A, B, and C).

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9.10.1 MF I/O List Screen

Use the MF I/O List screen to monitor the digital and analog input and output (I/O) signals
for the mainframe components that are controlled through the DeviceNet control system.
See Figure 9-34, Figure 9-35, Table 9-32 and Table 9-33.

GO TO → I/O → MAINFRAME

Figure 9-34. MF I/O List Screen (1 of 2)

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Table 9-32. MF I/O List Screen (1 of 2)

No. Item Description

1 Status Displays the DeviceNet scanner status:

• Not Initialized — No scanner exists.
• Scanning
• Idle
• Tx Idle — The scanner did not receive heartbeat from the
application for five seconds.

2 State Displays the DeviceNet scanner state:

• Device not in device list — No device physically exists.
• Device idle — The device and the scanner are in the idle
state.
• Device being scanned — The scanner is scanning, and the
device is properly responding.
• Device time-out — The device does not respond to
scanner's request.
• Error allocating Master/Slave connection set — The
scanner cannot open the connection to the device.
• Invalid vendor Id
• Error reading vendor Id
• Invalid device type
• Error reading device type
• Invalid product code
• Error reading product code
• Invalid I/O connection 1 input size — The requested input
size (in bytes) does not match the input size reported by
the device.
• Error reading I/O connection 1 input size
• Invalid I/O connection 1 output size — The requested output
size (in bytes) does not match the output size reported by
the device.
• Error reading I/O connection 1 output size

3 Command Provides the following command options:

• Nothing to do — No command
• Send Explicit Mess — Currently not used.
• Go Online — Sets the scanner in the online state (either
scanning or idle)
• Go Offline
• Start Scan
• Stop Scan

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GO TO → I/O → MF I/O LIST

6
4

Figure 9-35. MF I/O List Screen (2 of 2)

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Table 9-33. MF I/O List Screen (2 of 2)

No. Item Description

4 Mainframe I/O Displays the slot assignment and the MAC ID assignment of the
module mainframe I/O module. See Figure 9-38.
• Slot 1 — CDN 491 DI/O card
• Slot 2 — CDN 491 DI/O card
• Slot 3 — Spare
• Slot 4 — CDN 496 AI/O card
• Slot 5 and 6 — Mainframe Interlock board
• Slot 7 — Signal Conditioning board
• Slot 8 — Spare

5 MacId Displays the status of each device with the respective MAC ID
whether it is currently present and online. Select the MAC ID number
range (1–16, 17–32, 33–48, 49–63) to display the page for those
MAC IDs.

6 MacId detailed Displays the status of all the signals assigned to the device. Also
window allows manual control of output signals when the device is offline.

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9.10.2 Chamber I/O List Screen

Use the Chamber I/O List screen to monitor the digital and analog input and output (I/O)
signals for the chamber components that are controlled through the DeviceNet control system.
Each chamber has its own screen.

See Figure 9-36 and Table 9-34.

GO TO → I/O → CHAMBER X

6
1 4

Figure 9-36. Chamber I/O List Screen

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Table 9-34. Chamber I/O List Screen

No. Item Description

1 Status See Table 9-32, MF I/O List Screen (1 of 2), page 9-69.

2 State See Table 9-32, MF I/O List Screen (1 of 2), page 9-69.

3 Command See Table 9-32, MF I/O List Screen (1 of 2), page 9-69.

4 Chamber I/O Displays the slot assignment and MAC ID assignment of the chamber
module I/O module. See Figure 9-39.
• Slot 1 — CDN 491 DI/O card
• Slot 2 — CDN 491 DI/O card
• Slot 3 — CDN 491 DI/O card
• Slot 4 — CDN 496 AI/O card
• Slot 5 — CDN 496 AI/O card
• Slot 6 and 7 — Chamber Interlock board
• Slot 8 — Signal Conditioning board

5 MacId See Table 9-33, MF I/O List Screen (2 of 2), page 9-71.

6 MacId detailed See Table 9-33, MF I/O List Screen (2 of 2), page 9-71.
window

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FACTORY INTERFACE (FI)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

BATTERY DEVICENET FI CPU FI CPU MESA CDN 491 BATTERY DEVICENET SERIAL CARDS, REAL TIME MESA
POWER SCANNER HARD DRIVE POWER DI/O CARDS POWER SCANNER 16-CHANNEL CPU/VIDEO/ POWER
(UPS) CARD, (HDD) CARD (2×) (UPS) CARD, (2×) HARD DRIVE CARD
CARD 2-CHANNEL CARD 4-CHANNEL (HDD)

PCMIP
SERIAL AND
VIDEO CARD

SLOTS 1–12 SLOTS 13–23

FI CONTROLLER REAL TIME
CARDS CONTROLLER CARDS
SLOTS 1–6 COMMUNICATE SLOTS 13–20 COMMUNICATE
ACROSS A COMMON BACKPLANE. ACROSS A COMMON BACKPLANE.

TP01787A.

Figure 9-37. Flex 3 Controller

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CDN 491 DI/O

CARDS (2×)

CDN 496 AI/O

CARD
TOP SLOTS 1-9,
MAINFRAME MAINFRAME IO
INTERLOCK
BOARD

SIGNAL
CONDITIONING
BOARD

MOTION
CONTROLLER
CPU

AXIS INTERFACE
CARDS

BOTTOM SLOTS 1-9,

MOTION CONTROLLER

MOTION I/O
CARD

MESA POWER
CARD

TP01799A.

Figure 9-38. Mainframe IO/Motion Controller Module

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CHAMBER IO MODULES
(ONE FOR EACH CHAMBER)

17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

TP01800A. CDN 496 AI/O CDN 491 DI/O

CARDS (2×) CARDS (3×)

SIGNAL CHAMBER
CONDITIONING INTERLOCK
BOARD BOARD

Figure 9-39. Chamber IO Module

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 APPLIED MATERIALS 
Editor Header Screens 10-1

10 Editor Header Screens

This chapter describes the screens accessed from the Editor header in the following sections.
These screens are used to perform the programming functions including process recipes,
wafer sequences, and lots.

• Section 10.1, Editor Header Pulldown Menu, page 10-2

• Section 10.2, Recipe Editor Screens, page 10-3
– Section 10.2.1, Recipes for Chamber Screen (Recipe Directory), page 10-4
– Section 10.2.2, Recipe Passport Screen, page 10-6
– Section 10.2.3, Recipe Prestep Screen, page 10-10
– Section 10.2.4, Recipe Steps Screen, page 10-14
– Section 10.2.5, Endpoint Screen, page 10-18
– Section 10.2.6, Endpoint Device Parameters Screen, page 10-20
– Section 10.2.7, WH (Wafer History) Samples for Step Screen, page 10-22
• Section 10.3, Sequence Directory Screen, page 10-24
– Section 10.3.1, Sequence Passport Screen, page 10-26
– Section 10.3.2, Sequence Steps Screen, page 10-28
• Section 10.4, Lot-Sequence Association Screen, page 10-30

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10.1 Editor Header Pulldown Menu

See Figure 10-1 and Table 10-1 for pulldown menu items under the Editor header.

EDITOR

Figure 10-1. Editor Header Pulldown Menu

Table 10-1. Editor Header Pulldown Menu

No. Item Description

1 Edit Recipe Accesses the Recipe Editor screens. See Section 10.2, Recipe
Editor Screens, page 10-3.

2 Edit Sequence Accesses the Sequence Editor screens. See Section 10.3,
Sequence Directory Screen, page 10-24.

3 Edit Sequence-Lot Accesses the Sequence-Lot Association screen. See Section 10.4,
Assoc Lot-Sequence Association Screen, page 10-30.

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10.2 Recipe Editor Screens

Use the Recipe Editor screens to create and edit recipes. To open the screen, you should first
touch the Choose Chamber button and select the chamber type. See Figure 10-2. Then,
the screen displays the directory of the recipes that have been created for that chamber. See
the following sections:

• Section 10.2.1, Recipes for Chamber Screen (Recipe Directory), page 10-4.
• Section 10.2.2, Recipe Passport Screen, page 10-6
• Section 10.2.3, Recipe Prestep Screen, page 10-10
• Section 10.2.4, Recipe Steps Screen, page 10-14
• Section 10.2.5, Endpoint Screen, page 10-18

EDITOR → EDIT RECIPE → CHOOSE CHAMBER

Figure 10-2. Recipe Editor Screen — Choose Chamber Type Window

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10.2.1 Recipes for Chamber Screen (Recipe Directory)

The Recipes for Chamber screen displays the names of the recipes saved in the system for
that chamber type. Use this screen to create new recipes or edit existing recipes. See
Figure 10-3 and Table 10-2.

To create a new recipe:

1. Touch the New button at the bottom.

2. From the Choose Recipe Type window that appears, specify the recipe type:
Process or Clean. See Figure 10-3.
3. From the Recipe Passport screen that appears, define the general information for
the entire recipe. See Section 10.2.2, Recipe Passport Screen, page 10-6.
4. Touch the Prestep button and define process conditions that should be
maintained during the entire recipe. See Section 10.2.3, Recipe Prestep Screen,
page 10-10.
5. Touch the Steps button and define process parameters for each step. See
Section 10.2.4, Recipe Steps Screen, page 10-14.
EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER

2 3 4 5 6

7 8 9 10 11
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-3. Recipes for Chamber Screen (Recipe Directory)

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Table 10-2. Recipes for Chamber Screen (Recipe Directory)

No. Item Description

1 Choose Chamber Displays the Choose Chamber Type window to view the recipe
directory of another chamber type.

2 Name Displays the recipe name.

3 Description Displays the additional information entered for the recipe.

4 Type Displays the type of the recipe: Process or Clean.

5 Revisor Displays the login name of the person who modified the recipe most
recently. If the recipe has never been revised, the login name of the
creator is displayed.

6 Revise Time Displays the date and time when the recipe was modified most recently.
If the recipe has never been revised, the date and time when the recipe
was created is displayed.

7 New Select this button to create a new recipe.

8 Open Opens an existing recipe to view or edit it. Select a recipe name to
open before touching this button.

9 Delete Deletes a recipe from the system. Select a recipe name to delete
before touching this button.

10 Copy Copies an existing recipe to create a new recipe. Select a recipe to

copy from before touching this button.

11 Rename Renames an existing recipe. Select a recipe to rename before touching

this button.

12 Print (not shown) (Supported by Version A1.4 software or higher) Provides the
following options when an optional printer is available:
• Directory — Prints out the recipe directory.
• Highlighted Recipe — Prints out all the information of the
selected recipe, including the Passport information and
detailed step parameters.

13 Backup (not shown) (Supported by Version A1.4 software or higher) Provides the
following options to copy recipes between the hard disk and the
floppy disk:
• Backup to Floppy — Copies a recipe from the hard disk
to a floppy.
• Restore from Floppy — Copies a recipe from a floppy to
the hard disk.

14 Export (not shown) (Supported by Version A1.4 software or higher) Provides the
following options:
• Import from .csv file — Imports a recipe file as a Microsoft
Excel .csv file from a floppy to the hard disk.
• Export to .csv file — Exports a recipe file as a Microsoft
Excel .csv file from the hard disk to a floppy.

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10.2.2 Recipe Passport Screen

Use the Recipe Passport screen to define the general information for the entire recipe. See
Figure 10-4, Figure 10-5, Table 10-3 and Table 10-4.

NOTE
The values displayed on a gray background cannot be modified on this screen.
Only the values on a white background can be modified.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → PASSPORT

1
2

5 10

6 11

7 12

8 13

9 14
15

16

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-4. Recipe Passport Screen (1 of 2)

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Table 10-3. Recipe Passport Screen (1 of 2)

No. Item Description

1 Recipe Silane USG: Displays the recipe name and the total number of steps included in the
3 steps recipe.

2 Description Displays additional information entered for the recipe. Touch this field
to enter or edit the description.

3 Creator Displays the login name of the person who created the recipe.

4 Create time Displays the date and time when the recipe was created.

5 Revisor Displays the login name of the person who modified the recipe most
recently. If the recipe has never been revised, the login name of the
creator is displayed.

6 Revise time Displays the date and time when the recipe was modified most recently.
If the recipe has never been revised, the date and time when the recipe
was created is displayed.

7 Chamber type Displays the chamber type for which this recipe was created.

8 Version Displays the version number of the recipe.

9 Wafer Defines the wafer presence condition in the chamber for this recipe to
be run:
• Present — A wafer must be present in the chamber.
• Absent — No wafer must be present in the chamber.
• Don’t Care — The recipe runs when a wafer is either
present or absent.

10 Access display Defines the user group who is authorized to view this recipe:
• Modify Group — Only the group who is authorized to
modify this recipe can view it. See item 11.
• All — Anybody who logs in can view the recipe.

11 Access modify Defines the user group who is authorized to modify this recipe:
• Operator
• Senior Operator
• Process Engineer
• Senior Maint
• All

12 Recipe Type Displays the recipe type: Process or Clean.

13 Template Displays the recipe template name that was used for creating the
recipe. Only the Default template is currently available.

14 Resumable Defines whether the recipe is allowed to be resumed (Yes) or not (No)
after it has been stopped either by the operator or by the system.

15 Frozen Defines whether the recipe is frozen (Yes) or not (No).

16 Max Time (s) Defines the maximum time in seconds that the whole recipe is
estimated to run.

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EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → PASSPORT

17

18

19

20 21 22 23
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-5. Recipe Passport Screen (2 of 2)

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Table 10-4. Recipe Passport Screen (2 of 2)

No. Item Description

17 Passport Press this button to display the Passport screen for the recipe.

18 Prestep Press this button to display the Recipe Prestep screen for the recipe.
See Section 10.2.3, Recipe Prestep Screen, page 10-10.

19 Steps Press this button to display the Recipe Steps screen for the recipe.
See Section 10.2.4, Recipe Steps Screen, page 10-14.

20 Save Saves the Passport parameters.

21 Close Closes this window and returns to the recipe directory. If you have
made any change on this screen, the Recipe Editor window appears
and asks, “Recipe is changed. Do you want to save it?” Select OK if
you want to save the change. Select Cancel if you want to cancel the
change.

22 Add Param Adds a new passport parameter to the recipe. Select a parameter to
add from the window that appears.

23 Delete Param Deletes a passport parameter that will not be used for the recipe. Select
a parameter to delete before touching this button.

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10.2.3 Recipe Prestep Screen

Use the Recipe Prestep screen to define process conditions that should be maintained during
the entire recipe. See Figure 10-6, Figure 10-7, Table 10-5 and Table 10-6.

NOTE
The values displayed on a gray background cannot be modified on this screen.
Only the values on a white background can be modified.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → PRESTEP

9
5

6 10

7 11

8 12

13

14

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-6. Recipe Prestep Screen (1 of 2)

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Table 10-5. Recipe Prestep Screen (1 of 2)

No. Item Description

1 Recipe Silane USG: Displays the recipe name and the total number of steps included in the
3 steps recipe.

2 Max Time (s) The recommended setting is zero (0).

3 Mode This field should always be Time.

4 TV position Defines the throttle valve (TV) preset position as degrees from the
home position. The throttle valve is moved to this position before the
pressure control mode switches from Absolute Control to Servo
between steps. This setting is valid only when Servo is selected in the
Press Mode field for the step. When Absolute Control is selected, it
is disregarded.

5 Press Ramp Rate Defines the chamber pressure ramp rate as Torr per second.

6 TV Ramp Rate Defines the throttle valve (TV) ramp rate as degrees per second.

7 RF Back To Back When True, RF power re-stabilization is not required when adjacent
steps have different RF power settings. When False, RF power turns
off, wait for re-stabilization, and then turns on again between the steps.

8 RF Match By Head When True, the same RF match setting is used throughout the recipe
as defined in the RF Match Selection field on this screen (see item 16).
This setting overrides the value in the RF Match Selection field within
each step if the settings differ from each other.

9 High Freq RF Pwr Defines the fault tolerance from the setpoint for the high frequency
Fault Limit (HF) RF generator forward power in W. A fault occurs when the
forward power is not within this tolerance.

10 High Freq RF Pwr Defines the warning tolerance from the setpoint for the HF RF
Warn Limit generator forward power in W. A warning occurs when the forward
power is not within this tolerance.

11 High Freq RF Pwr Defines the forward power deviation time limit for the HF RF generator
Deviation Timeout in W.

12 Low Freq RF Pwr Defines the fault tolerance from the setpoint for the low frequency
Fault Limit (LF) RF generator forward power in W. A fault occurs when the
forward power is not within this tolerance.

13 Low Freq RF Pwr Defines the warning tolerance from the setpoint for the LF RF generator
Warn Limit forward power in W. A warning occurs when the forward power is not
within this tolerance.

14 Low Freq RF Pwr Defines the forward power deviation time limit for the LF RF generator
Deviation Timeout in W.

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EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → PRESTEP

18

19

20

15

16

17

21 22 23 24
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-7. Recipe Prestep Screen (2 of 2)

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Table 10-6. Recipe Prestep Screen (2 of 2)

No. Item Description

15 Lift Pos After Defines the position of the heater lift and the pin lift after the recipe
Recipe End ends:
• NULL — Do not use this setting.
• Home — Moves the lifts to the home position.
• Move to Release — Moves the lifts to the Release position.
• Move to Lift — Moves the lifts to the Lift position.
• Move to Process — Moves the lifts to the Process position.
• Move X Steps — Do not use this setting.
• Abort — Aborts the current operation. Do not use this
setting.

16 RF Match Selection Defines the RF match setting to be used with the HF RF generator for
positions 1 (left) and 2 (right).

17 Edit Endpoint Displays the Endpoint for Prestep screen. See Section 10.2.5,
Endpoint Screen, page 10-18.

18 Passport Press this button to display the Recipe Passport screen. See
Section 10.2.2, Recipe Passport Screen, page 10-6.

19 Prestep Press this button to display the Recipe Prestep screen.

20 Steps Press this button to display the Recipe Steps screen. See
Section 10.2.4, Recipe Steps Screen, page 10-14.

21 Save Saves the Prestep parameters.

22 Close Closes this window and returns to the recipe directory. If you have
made any change on this screen, the Recipe Editor window appears
and asks, “Recipe is changed. Do you want to save it?” Select OK if
you want to save the change. Select Cancel if you want to cancel the
change.

23 Add Param Adds a new process parameter to the recipe. Select a parameter to
add from the window that appears.

24 Delete Param Deletes a process parameter that will not be used for the recipe. Select
a parameter to delete before touching this button.

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10.2.4 Recipe Steps Screen

Use the Recipe Steps screen to define process parameters for each step. See Figure 10-8,
Figure 10-9, Table 10-7 and Table 10-8.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → STEPS

1
2

7
10

8
11

9
12

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-8. Recipe Steps Screen (1 of 2)

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Table 10-7. Recipe Steps Screen (1 of 2)

No. Item Description

1 Recipe Silane USG: Displays the recipe name and the total number of steps included in the
3 steps recipe.

2 Name Defines the step name.

3 Max Time (s) Defines the maximum step time in seconds for this step to run. When
the Mode (see item 3) is Endpoint and the selected endpoint
parameter is not met within this maximum time, the step will end and
the recipe will stop with a fault. When the Mode is Time Or Endpoint
and the selected endpoint parameter is not met within this maximum
time, the step will end when the Max Time has reached and no fault
occurs.

4 Mode Defines the step end parameter that determines when a step ends.
• Time — The step ends when the Max Time parameter is
reached. See item 3.
• Endpoint — The step ends when the selected endpoint
parameter is achieved. See item 19 and Section 10.2.5,
Endpoint Screen, page 10-18.
• Time Or Endpoint — The step ends either when the Max
Time parameter is reached or when the endpoint parameter
is achieved, whichever the earliest.

5 Chambers Defines a chamber or a chamber combination that the step will run on.
If the recipe is used for another chamber, these steps are skipped.
Default is Any, allowing the step to run on any chamber.

6 Temp Defines the heater temperature setpoint in °C.

7 Press Mode Defines the chamber pressure control mode during the step:
• Servo — Controls the chamber pressure at the setpoint
entered in the Press field (see item 8) by adjusting the
throttle valve position with PID control.
• Absolute Control — Moves the throttle valve to the
position specified in the TV position field (see item 9).
PID will NOT be used to control the chamber pressure.

8 Press Defines the chamber pressure in Torr when the Press mode is Servo
(see item 7).

9 TV position Defines the throttle valve (TV) position as degrees from the home
position when the Press mode is Absolute Control (see item 7).

10 Lift Pos Defines the position of the heater lift and the pin lift during the step:
• Move to Release — Moves the lifts to the Release position.
• Move to Lift — Moves the lifts to the Lift position.
• Move to Process — Moves the lifts to the Process position.
Do not use the other settings (NULL, Home, Move X Steps, and
Abort).

11 RPS Defines the Remote Clean setting: On or Off.

12 RPS Iso Valve Defines the Remote Clean isolation valve position: Open or Close.

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EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → STEPS

13
21
14
22
15
23
16

17

18

19

20

24 25 26 27 28 29 30
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

THIS WINDOW APPEARS FOR A CLEAN PROCESS ONLY.

FOR A PROCESS RECIPE, TOUCHING EDIT ENDPOINT
DIRECTLY DISPLAYS THE ENDPOINT SCREEN.

Figure 10-9. Recipe Steps Screen (2 of 2)

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Table 10-8. Recipe Steps Screen (2 of 2)

No. Item Description

13 Heater Space Defines the distance between the top surface of the wafer heater and
the shower head (gas distribution plate) in mils for positions 1 (left) and
2 (right).
14 RF Time Defines the maximum RF-on time starting from the beginning of step
for the HF RF generators 1 (left) and 2 (right).
15 HF RF Power Defines the RF power setpoint for the HF RF generators 1 (left) and 2
(right).
16 RF Match Selection Defines the RF match setting to be used with the HF RF generators 1
(left) and 2 (right).
17 LF RF Power Defines the RF power setpoint for the LF RF generator (when used)
for positions 1 (left) and 2 (right).
18 Gas Panel Defines the flow rate and the flow path (see Figure 10-9):
Parameter • Flow To Ch — Normal path from the gas or liquid source
to the chamber.
• Flow To Divert — For a liquid, the path from the liquid
source through the divert valve to the foreline. For an ozone
stick, the path from the source through the divert valve to
the ozone destructor.
• Pump Thro UpStream — Pumps out the upper section of
the stick to the chamber.
• Pump Thro DownStream — Pumps out the lower section
of the stick to the chamber.
• Pump Thro Final — Pumps out the final section of the stick
to the chamber.
• Pump Thro Divert — Pumps out the final gas line to the
foreline.
• Purge Thro — Flows the purge gas through the stick.
19 Edit Endpoint For a process recipe, accesses the Endpoint screen. For a clean
recipe, displays the Endpoint Options window to access the Endpoint
screen and the Endpoint Device screen. See Section 10.2.5, Endpoint
Screen, page 10-18 and Section 10.2.6, Endpoint Device Parameters
Screen, page 10-20.
20 Edit WH Samples Accesses the WH (wafer history) Samples for Step screen. See
Section 10.2.7, WH (Wafer History) Samples for Step Screen,
page 10-22.
21 Passport Press this button to display the Recipe Passport screen. See
Section 10.2.2, Recipe Passport Screen, page 10-6.
22 Prestep Press this button to display the Recipe Prestep screen. See
Section 10.2.3, Recipe Prestep Screen, page 10-10.
23 Steps Press this button to display the Recipe Steps screen.
24 Save Saves the step parameters.
25 Close See Table 10-6, Recipe Prestep Screen (2 of 2), page 3-13.
26 Insert Step Adds a new step after an existing step.
27 Delete Step Deletes an existing step.
28 Copy Step Copies an existing step to another step.
29 Add Param See Table 10-6, Recipe Prestep Screen (2 of 2), page 3-13.
30 Delete Param See Table 10-6, Recipe Prestep Screen (2 of 2), page 3-13.

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10.2.5 Endpoint Screen

Use the Endpoint screen to define the endpoint condition that ends the step. See Figure 10-
10 and Table 10-9.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → STEPS → EDIT ENDPOINT

1 2 3

4 5 6

Figure 10-10. Endpoint Screen

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Table 10-9. Endpoint Screen

No. Item Description

1 Parameter Defines the endpoint parameter out of the options shown in

Figure 10-10. Up to 10 parameters can be configured for each step.
When more than one endpoint parameter are selected on this screen,
all of these parameters must be satisfied to end the step.

2 Clause Defines the condition between the parameter and the value (see
Figure 10-10):
• EQ — The parameter is equal to the value.
• NE — The parameter is not equal to the value.
• GT — The parameter is greater than the value.
• GE — The parameter is greater than or equal to the value.
• LT — The parameter is lower than the value.
• LE — The parameter is lower than or equal to the value.

3 Value Defines the endpoint value.

4 Close Closes this window and returns to the Recipe Steps screen.

5 Add Param Adds a new endpoint parameter to the recipe. Select a parameter to
add from the window that appears.

6 Delete Param Deletes a endpoint parameter. Select a parameter to delete before

touching this button.

NOTE
Endpoint parameter settings on this screen become valid when Endpoint or
Time Or Endpoint is selected in the Mode field on the Recipe Steps
screen. See Section 10.2.4, Recipe Steps Screen, page 10-14. When Time is
selected in the Mode field, all these settings are disabled.

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10.2.6 Endpoint Device Parameters Screen

Use the Endpoint Device Parameters screen to define the endpoint parameters that end the
clean step with endpoint.

See Figure 10-11 and Table 10-10.

NOTE
This screen can be accessed only through a clean recipe.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → STEPS → EDIT ENDPOINT→ ENDPOINT DEVICE

6
7
8

9 10 11

Figure 10-11. Endpoint Device Parameters Screen

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Table 10-10. Endpoint Device Parameters Screen

No. Item Description

1 EndpDevice Cmd Execute is the only option currently available.
2 Qualification Mode Provides the following options:
• Unknown
• Slope Above — The endpoint step is qualified when the
signal slope (mV/sec.) is above the value entered in the
Qualification Slope field. See item 3.
• Slope Below —The endpoint step is qualified when the
signal slope is below the value entered in the Qualification
Slope field.
3 Qualification Slope Defines the slope value for qualifying the endpoint in the range of
−10000 mV/sec. to 10000 mV/sec. This value is referenced after the
minimum endpoint time has passed.
4 Endpoint Mode Provides the following options:
• Unknown
• Slope Above — The step ends when the signal slope
(mV/sec.) is above the value entered in the Endpoint Slope
field. See item 5.
• Slope Below — The step ends when the signal slope is
below the value entered in the Endpoint Slope field.
5 Endpoint Slope Defines the slope value for determining the endpoint in the range of
−10000 mV/sec. to 10000 mV/sec. The clean step ends when this
value is reached.
The following conditions must be met in this order for the clean step
to end:
• The minimum time has passed.
• Then, the Qualification Slope has been met in the specified
Qualification Mode.
• Then, the Endpoint Slope has been met in the specified
Endpoint Mode.
6 Overetch Defines the over-etch time as 0–99% of the actual endpoint time.
Over-etch (edge clean) keeps removing oxide residue from the outer
parts of the chamber after the endpoint is determined. Software
calculates the required over-etch time, using this setting, when the
endpoint is reached.
7 Max Duration Defines the maximum duration that the endpoint device is allowed to
run. This value is independent from the maximum time of the step. The
endpoint device goes idle when the endpoint is determined. If the
endpoint is not determined within this maximum time, the endpoint
device stops running.
8 Min Run Time Defines the minimum time from the beginning of the step before the
endpoint qualification starts.
9 Close Returns to the Recipe Steps screen.
10 Add Adds the endpoint device parameter fields to the screen. Select this
button when you first open this screen.
11 Delete Deletes all the endpoint device parameter fields from the screen.

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10.2.7 WH (Wafer History) Samples for Step Screen

Use the WH Samples for Step screen to configure the actual process parameters to be recorded
as part of the wafer history data. Up to 10 parameters can be selected at a time for the step.

NOTE
Data collection configuration on this screen is activated when the Log
Chamber X field is set to Yes in the Configure System screen (see
Section 9.8, Configure System Screen, page 9-58).

To view the wafer history data, see Section 9.7, Wafer History Lot Directory
Screen, page 9-48.

See Figure 10-12 and Table 10-11.

EDITOR → EDIT RECIPE → CHOOSE CHAMBER → DESIRED CHAMBER → NEW OR OPEN → STEPS → EDIT WH SAMPLES

3
5

4 6

7 8 9 10

Figure 10-12. WH Samples for Step Screen

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Table 10-11. WH Samples for Step Screen

No. Item Description

1 N2_1 Flow Reading Records the flow reading of the purge N2 (purge lines 1 through 4).
N2_2 Flow Reading
N2_3 Flow Reading
N2_4 Flow Reading

2 AR Flow Reading Records the argon flow reading for the Remote Clean process.

3 HX Temp. reading Records the coolant temperature reading of the heat exchanger.

4 Heater Temperature Records the heater temperature reading for side 1 and side 2 of the
reading chamber.
Heater Temperature
reading 2

5 PressCtrl pressure Records the chamber pressure as read by the capacitance

reading manometers.

6 PressCtrl Throttle Records the chamber throttle valve position.

valve pos

7 Close Returns to the Recipe Steps screen. See Section 10.2.4, Recipe Steps
Screen, page 10-14.

8 Change Period Use this button to change the sampling period in seconds.

9 Add Sample Use this button to add a row to configure a parameter. Up to

10 parameters can be selected at a time for the step.

10 Delete Sample Use this button to delete a parameter for data collection. Select a
parameter to delete before touching this button.

NOTE
Process parameters that can be selected and recorded depend on the process
type.

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10.3 Sequence Directory Screen

Use the Sequence Directory screen to create and edit process sequences. The screen displays
the directory of all the sequences that have been created. See Figure 10-13 and Table 10-12.

The following screens can be accessed from this screen.

• Section 10.3.1, Sequence Passport Screen, page 10-26

• Section 10.3.2, Sequence Steps Screen, page 10-28

To create a new sequence:

1. Touch the New button at the bottom.

2. From the Sequence Passport screen that appears, define the general information
for the entire sequence. See Section 10.3.1, Sequence Passport Screen,
page 10-26.
3. Touch the Steps button and program the steps in the sequence. See Section 10.3.2,
Sequence Steps Screen, page 10-28.

EDITOR → EDIT SEQUENCE

1 2 3 4 5

480 NIT
480 NIT

480 NIT
SIH4 USG

6 7 8 9 10
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-13. Sequence Directory Screen

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Table 10-12. Sequence Directory Screen

No. Item Description

1 Name Displays the sequence name.

2 Description Displays the additional information entered for the sequence.

3 Type Displays the type of the sequence: Production, Maintenance, or

Clean.

4 Revisor Displays the login name of the person who modified the sequence
most recently. If the sequence has never been revised, the login name
of the creator is displayed.

5 Revise Time Displays the date and time when the sequence was modified most
recently. If the sequence has never been revised, the date and time
when the sequence was created is displayed.

6 New Creates a new sequence.

7 Open Opens an existing sequence to view or edit it. Select a sequence to

open before touching this button.

8 Delete Deletes a sequence from the system. Select a sequence to delete

before touching this button.

9 Copy Copies an existing sequence to create a new sequence. Select a

sequence to copy from before touching this button.

10 Rename Renames an existing sequence. Select a sequence to rename before

touching this button.

11 Print (not shown) (Supported by Version A1.4 software or higher) Provides the
following options when an optional printer is available:
• Directory — Prints out the sequence directory.
• Highlighted Sequence — Prints out all the information of
the selected sequence, including the Passport information
and detailed step parameters.

12 Backup (not shown) (Supported by Version A1.4 software or higher) Provides the
following options to copy sequences between the hard disk and the
floppy disk:
• Backup to Floppy — Copies a sequence from the hard
disk to a floppy.
• Restore from Floppy — Copies a sequence from a floppy
to the hard disk.

13 Export (not shown) (Supported by Version A1.4 software or higher) Provides the
following options:
• Import from .csv file — Imports a sequence file as a
Microsoft Excel .csv file from a floppy to the hard disk.
• Export to.csv file — Exports a sequence file as a Microsoft
Excel .csv file from the hard disk to a floppy.

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10.3.1 Sequence Passport Screen

Use the Sequence Passport screen to define the general information for the entire sequence.
See Figure 10-14 and Table 10-13.

EDITOR → EDIT SEQUENCE → NEW OR OPEN → PASSPORT

2 12

3 13

5 7

8
6

10
11

14 15
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-14. Sequence Passport Screen

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Table 10-13. Sequence Passport Screen

No. Item Description

1 Sequence HT Nit Displays the sequence name and the total number of steps included
500: 4 step(s) in the sequence.

2 Description Displays the additional information entered for the sequence. Touch
this field to enter or edit the description.

3 Creator Displays the login name of the person who created the sequence.

4 Create time Displays the date and time when the sequence was created.

5 Revisor Displays the login name of the person who modified the sequence
most recently. If the sequence has never been revised, the login name
of the creator is displayed.

6 Revise time Displays the date and time when the sequence was modified most
recently. If the sequence has never been revised, the date and time
when the sequence was created is displayed.

7 Version Displays the version number of the sequence.

8 Access display Defines the user group who is authorized to view this sequence:
groups • Modify Group — Only the group who is authorized to
modify this recipe can view it. See item 9.
• All — Anybody who logs in can view the recipe.

9 Access modify Defines the user group who is authorized to modify this sequence:
groups • Operator
• Senior Operator
• Process Engineer
• Senior Maint
• All

10 Type Defines the sequence type: Production, Maintenance, or Clean. See

Figure 10-14.

11 Frozen Defines whether the recipe is frozen (Yes) or not (No).

12 Passport Press this button to display the Sequence Passport screen.

13 Steps Press this button to display the Sequence Steps screen. See
Section 10.3.2, Sequence Steps Screen, page 10-28.

14 Save Saves the Passport parameters.

15 Close Closes this window and returns to the sequence directory. If you have
made any change on this screen, the Sequence Editor window appears
and asks, “Sequence is changed. Do you want to save it?” Select OK
if you want to save the change. Select Cancel if you want to cancel
the change.

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10.3.2 Sequence Steps Screen

Use the Sequence Steps screen to define how wafers are transferred and processed in each
sequence. See Figure 10-15 and Table 10-14.

EDITOR → EDIT SEQUENCE → NEW OR OPEN → STEPS

2 8

9 10 11 12 13
TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-15. Sequence Steps Screen

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Table 10-14. Sequence Steps Screen

No. Item Description

1 Sequence HT Nit Displays the sequence name and the total number of steps included
500: 4 step(s) in the sequence.

2 Chambers Defines the location where the wafers are transferred.

3 Slot Defines the slot of the loadlock where the wafers are transferred.

4 Recipe Defines the recipe that is performed in each location.

(Supported by Version A1.4 software or higher) When Chamber
Recipe is selected in this field, the sequence will run the default
chamber recipe configured in the Chamber Process Recipe field of the
Control System screen. See Section 5.2, Control System Screen,
page 5-4.

5 Clean Recipe Defines the periodic clean recipe that cleans the Twin chamber
internal. When the Periodic clean is also enabled in the Chamber Clean
detailed window, the periodic clean with a lower interval will always
run, and the other periodic clean will not run. See Section 5.2.1,
Chamber Cleans Detailed Window, page 5-6.

6 Clean Interval Defines the chamber cleaning interval. The selected clean recipe is
performed every time the deposition process has occurred in the Twin
chamber this number of times.

7 Passport Press this button to display the Sequence Passport screen. See
Section 10.3.1, Sequence Passport Screen, page 10-26.

8 Steps Press this button to display the Sequence Steps screen.

9 Save Saves the Steps parameters.

10 Close Closes this window and returns to the sequence directory. If you have
made any change on this screen, the Sequence Editor window appears
and asks, “Sequence is changed. Do you want to save it?” Select OK
if you want to save the change. Select Cancel if you want to cancel
the change.

11 Insert Step Adds a new step after an existing step.

12 Delete Step Deletes an existing step.

13 Copy Step Copies an existing step to another step.

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10.4 Lot-Sequence Association Screen

Use the Lot-Sequence Association screen to associate a lot name to a wafer sequence.

See Figure 10-16 and Table 10-15.

EDITOR → EDIT LOT-SEQUENCE ASSOC

1 2

3 4 5

TOUCH ARROWS
TO SCROLL
THROUGH MENU.

Figure 10-16. Lot-Sequence Association Screen

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Table 10-15. Lot-Sequence Association Screen

No. Item Description

1 Lot Name Display the lot names saved in the system.

2 Sequence Name Displays a sequence name associated to the lot.

3 New Creates a new lot name. Enter a new lot name in the window that
appears. To associate the lot name to a sequence, touch the
Sequence Name field in the window and select a sequence name
from the menu.

4 Edit Changes the lot name or lot-sequence association. Select a row to

edit on the left before touching this button. To change the lot name,
enter a new lot name in the window that appears. To associate a
different sequence to the lot, touch the Sequence Name field in the
window and select a sequence name from the menu.

5 Delete Deletes a lot. Select a row to delete on the left before touching this
button.

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 APPLIED MATERIALS  Producer SE PECVD Operations and Programming Index-1

Index Detailed window

buffer robot 7-8
cassette 5-16, 8-8
A cooling station 5-15, 8-7
ABS (acrylonitrile, butadiene, and FI (factory interface) robot 8-6
styrene) 2-2 gas panel 6-11
Acronym list 2-2 heat exchanger 6-25
Administration screens 9-60 heater 6-24
Alarms, defined 3-11 indexer, loadlock 7-16
interlock, Twin chamber 6-12
B lifts, Twin chamber 6-13
BDS Diagnostics screen 9-46 loadlock 5-14
Buffer chamber 2-10 pump 6-27
Buffer Robot detailed window 7-8 Reactor Laminar Flow (RLF) 6-16
recipe control 6-14
RF generator, HF 6-20
C RF generator, LF 6-22
Calibration Gas Panel screen 6-54 RPS (Remote Clean) 6-18
Carrier Id screen 9-44 throttle valve 6-26
Cassette detailed window 5-16, 8-8 Twin Chamber 5-12
Chamber header pulldown 6-2 wafer detect 7-12
Chamber header screens 6-1 Diagnostics screens 9-13
Chamber IO module 9-76 Directory, recipes 10-4
Chamber I/O List screen 9-72 Document conventions 2-1
Chamber positions, Release, Lift, and
Process 6-8
E
Chamber Summary window 5-12
Editor header pulldown 10-2
Color scheme 3-10
Editor header screens 10-1
headers 3-10
Emergency off (EMO) button 3-3
wafers 3-10
Endpoint Device Parameters screen 10-20
Configure System screen 9-58
Endpoint screen 6-62, 10-18
Control System screen 5-4
Error recovery procedures 4-22
Conventions
process errors 4-22
document 2-1
wafer handling errors 4-22
user interface 3-1
Error reporting P-1
Cooling Station detailed window 5-15, 8-7
Event screen 9-4
Copying
Events Configuration for Alarm Line
data files 4-20
recipes 4-13 screen 9-6
Events, defined 3-11
sequences 4-13

D F
Factory Automation screens 9-18
Data files
Factory interface (FI) 3-3
copying 4-20
Factory interface (FI) header pulldown 8-2

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Index-2 Producer SE PECVD Operations and Programming

Factory interface (FI) header screens 8-1 Installing system software 4-14
FI (factory interface) Robot detailed Interface, operator 3-2
window 8-6 Interlock detailed window 6-12
FIC BDS Diagnostics screen 9-46 I/O module
File management procedures 4-13 chamber 9-76
Flex 3 controller 9-74 mainframe 9-75
FOB (free on board) 2-3 I/O screens 9-67
FRACAS (Failure Reporting Analysis and
Corrective Action System) 2-4 L
Lamp tower 3-3
G Leak Rate screen 6-32
Gas Panel detailed window 6-11 Lift Calibration screen 6-60
Gas panel screens 6-36 Lift position 6-8
Calibration Gas Panel screen 6-54 Lifts detailed window 6-13
Monitor Gas Panel screen 6-36 Liquid paths 6-42
MFC window 6-46 description 6-45
Stick window 6-40 Loadlock detailed window 5-14
Service Gas Panel screen 6-50 Login procedure 4-7
Set Up Gas Panel screen 6-48 Login screen 4-6
Gas paths 6-42 Logout procedure 4-7
description 6-45 Lot-Sequence Association screen 10-30
Gas stick window 6-40
GEM Configuration screen 9-30 M
GEM Monitor screen 9-32 Mainframe components 4-12
General Charting screen 9-16
Mainframe IO/motion controller
Generic Window screen 9-14 module 9-75
Go To header pulldown 9-2 Mainframe (MF) header pulldown 7-2
Go To header screens 9-1 Mainframe (MF) header screens 7-1
GUI PC 4-15 Manual error reporting P-1
MF I/O List screen 9-68
H MFC window 6-46
Header status color scheme 3-10 Monitor 3-3
Headers 3-5, 3-8 Monitor Chamber screen 6-4
Go To header 3-9 Monitor FI screen 8-4
Heat Exchanger detailed window 6-25 Monitor Gas Panel screen 6-36
Heater detailed window 6-24 MFC window 6-46
HEPA (high efficiency particle Stick window 6-40
attenuator) 2-4 Monitor Interlocks screen 5-18
Host Monitor screen 9-18 Monitor Mainframe screen 7-4
Host Terminal screen 9-38 Monitor Process screen 6-28
HPM (hazardous production materials) 2-4 Monitor Wafers screen 5-8
Motion controller 9-75
I
Indexer detailed window 7-16

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N S
Navigation headers 3-5 Safety 1-1
Screen Access Configuration screen 9-64
O Screen configuration 3-4
Screen path 2-10
Operation procedures 4-1
SECS Configuration screen 9-22
Operator interface 3-2
HSMS-SS 9-22
Organization, chapter 2-9
SECS-1 9-26
Sequence Directory screen 10-24
P Sequence Passport screen 10-26
Path, gas or liquid 6-42 Sequence Steps screen 10-28
description 6-45 Sequences, copying 4-13
Path, screens 2-10 Service Gas Panel screen 6-50
PIO Handler screen 9-40 Set Date and Time screen 9-60
Powerdown 4-3 Set Up Gas Panel screen 6-48
Powerup 4-5 Set Up Signal Tower screen 9-8
Preventive Maintenance screen 9-12 Setup screens 9-6
Process errors, recovery 4-22 Signal lamp tower 3-3
Process position, Twin chamber 6-8 Software
Process recipes, copying 4-13 installing 4-14
Process run sequence 4-8 Software version 2-8
Process Steps for Lot screen 9-54 Stick window 6-40
Process Summary for Lot screen 9-52 System header pulldown 5-2
Pulldown menus 3-8 System header screens 5-1
Go To header 3-9 System powerdown 4-3
Pump detailed window 6-27 System powerup 4-5

R T
Reactor Laminar Flow (RLF) detailed Throttle Valve detailed window 6-26
window 6-16 Throttle valve positions 6-9
Recipe Control detailed window 6-14 Transfer chamber 2-10
Recipe Editor screen 10-3 Troubleshooting system 4-20
Recipes for Chamber screen 10-4
Recipe Passport screen 10-6
U
Recipe Prestep screen 10-10
ULPA (ultra low particulate attenuator) 2-7
Recipe Steps screen 10-14
User Access Configuration screen 9-62
Recipes for Chamber screen 10-4
User interface conventions 3-1
Recipes, copying 4-13
User Settings screen 9-10
Release position 6-8
RF Calibration screen 6-58
RF Generator detailed window V
HF 6-20 Version, software 2-8
LF 6-22
RPS (Remote Clean) detailed window 6-18
Run sequence 4-8

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Index-4 Producer SE PECVD Operations and Programming

W
Wafer Detect detailed window 7-12
Wafer detector
numbers and locations 7-14
Wafer handling errors, recovery 4-22
Wafer History Lot Directory screen 9-48
Wafer Movements for Lot screen 9-50
Wafer sequences, copying 4-13
Wafer status color scheme 3-10
Wafer transfer sequence 4-12
WH (Wafer History) Samples for Step
screen 10-22

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Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054-3299

Address correspondence to:

Applied Materials, Inc.
P.O. Box 58039
Santa Clara, CA 95052-8039
Tel: (408) 727-5555
Telex: 6719476 AMTUW
Fax: (408) 727-9943
Web Site: http://www.AppliedMaterials.com

To order copies of this manual or other

manuals, call 1-800-HOT-TTTT option 2

Applied Materials, Inc. 2000. All rights reserved. Printed in U.S.A. 1/2/2000 IBSS