Vlsi 2 Embededsyll
Vlsi 2 Embededsyll
Courseobjectives:
• TounderstandthebasicphysicsandoperationofMOSdevices.
• TostudySingle-StageandDifferentialAmplifiers.
• TolearnDataConverterSpecificationsandArchitectures.
• TounderstandSingleendedDifferentialAmplifierandoperations.
• TolearnarchitectureofDataconverterincludesADC(AnalogtoDigital)and DAC(DigitaltoAnalog)
Converters.
MODULE-1
BasicMOSDevicePhysics:Generalconsiderations,MOS1/VCharacteristics,secondordereffects,MOSdeviceMod
els.
RBT Levels: L2
MODULE-2
SinglestageAmplifier:BasicConcepts,CommonSourcestage,Sourcefollower.
RBT Levels: L2, L3
MODULE-3
SinglestageAmplifier:common-gatestage,CascadeStage,choiceofdevicemodels.
RBT Levels: L2, L3
MODULE-4
DifferentialAmplifiers:Singleendedanddifferentialoperation,Basicdifferentialpair,Commonmoderesponse,Dif
ferentialpairwithMOSloads,Gilbertcell.
RBT Levels: L2, L3
MODULE5
DataConverter Architectures : DAC& ADCSpecifications,Current SteeringDAC,ChargeScalingDAC, Flash
ADC,SuccessiveApproximationADC.
RBT Levels: L3, L4
PRACTICALCOMPONENTOFIPCC(Maycoverall/majormodules)
Sl.NO Experiments
1 Designa SingleStagedifferentialamplifier
2
DesignaCommonsourceamplifier
3 Designanop-ampwithgivenspecification*usingdifferentialamplifierCommonsourceamplifierinlibrary.
(ApplicableLibraryshouldbeadded&informationshouldbe giventotheDesigner.)
4 Designa4bitR-2RbasedDACforthegivenspecification(ApplicableLibraryshouldbeadded&information
shouldbegiventotheDesigner.)
5
DesignanIntegratorusingOPAMP(FirstOrder)
6
DesignaDifferentiatorusingOPAMP(FirstOrder)
7
Designandcharacterizeabasic Sigma delta ADCfromtheavailabledesigns.
Note 1. ExperimentstobeconductedusingsuitableCADtool
2. For 1-4 experiments draw the schematic and verify the following i) DC Analysis ii) AC Analysis
iii)TransientAnalysisb.DrawtheLayoutandverifytheDRC,ERC,LVSc.CheckforXXd.ExtractRCandback
annotatethesameandverifytheDesign
1
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether
CIEforthetheorycomponentofIPCC
1. TwoTestseachof25 Marks
2. Twoassignmentseachof25Marks/OneSkillDevelopmentActivityof50marks
3. TotalMarksoftwotestsand
twoassignments/oneSkillDevelopmentActivityaddedwillbeCIEfor60marks,marks
scoredwillbeproportionallyscaleddown to30marks.
CIEforthepracticalcomponentofIPCC
• Oncompletionofeveryexperiment/programinthelaboratory,thestudentsshallbeevaluatedandmark
s shall be awarded on the same day.The 15 marks are for conducting the experiment
andpreparation of the laboratory record, the other 05 marks shall be for the test conducted at
theendof thesemester.
• The CIE marks awarded in the case of the Practical component shall be based on the
continuousevaluationofthelaboratoryreport.Eachexperimentreportcanbeevaluatedfor10marks.
Marksofallexperiments’write-upsareaddedandscaleddownto15marks.
• The laboratory test at the end /after completion of all the experiments shall be conducted for
50marksandscaleddownto 05marks.
Scaled-downmarksofwrite-
upevaluationsandtestsaddedwillbeCIEmarksforthelaboratorycomponentofIPCC for 20marks.
.
SEEforIPCC
TheorySEEwillbeconducted by theUniversityasperthescheduled
timetable,withcommonquestionpapersforthecourse(duration03hours)
1. Thequestionpaperwillbesetfor100marksandmarksscoredwillbescaleddownproportionately
to50marks.
2. Thequestionpaperwillhavetenquestions.Eachquestionisset for20marks.
3. Therewillbe2questionsfromeachmodule.Eachofthetwoquestionsunderamodule(withamaximumof3s
ub-questions),shouldhavea mixoftopicsunderthatmodule.
4. Thestudentshavetoanswer5fullquestions,selecting onefullquestionfromeachmodule.
The theory portion of the IPCC shall be for both CIE and SEE, whereas the practical portion
willhaveaCIEcomponentonly.QuestionsmentionedintheSEEpapershallinclude
questionsfromthepracticalcomponent).
• The minimum marks to be secured in CIE to appear for SEE shall be the 15 (50% of
maximummarks-30)inthetheorycomponentand10(50%ofmaximummarks-
20)inthepracticalcomponent. The laboratory component of the IPCC shall be for CIE only.
However, in SEE, thequestionsfromthelaboratorycomponentshallbeincluded.Themaximum
2
of04/05questionsto
besetfromthepracticalcomponentofIPCC,thetotalmarksofallquestionsshouldnotbemore
3
thanthe20marks.
• SEEwillbeconductedfor100marksandstudentsshallsecure40%ofthemaximummarksto
qualifyintheSEE.Markssecuredwillbescaleddownto50.(Studenthasto secureanaggregateof50% of
maximummarksof thecourse(CIE+SEE)
SuggestedLearningResources:
Books
1) "BehzadRazavi",DesignofAnalogCMOSIntegratedCircuits,TMH 2007.
2) "R.JacobBaker",CMOSCircuitDesign,Layout,andSimulation,WileySecondEdition
"PhillipE.Allen,Douglas R.Holberg",CMOSAnalogCircuitDesignOxfordUniversity PressSecondEdition.
WeblinksandVideoLectures(e-Resources):
VTUe-IearningResources.
ActivityBasedLearning(SuggestedActivitiesinClass)/PracticalBasedlearning
1. Interactwithindustry(small,medium,andlarge).
2. Involvein research/testing/projectsto understandtheirproblemsandhelpcreative
andinnovativemethodstosolvetheproblem.
3. Involveincasestudies andfieldvisits/fieldwork
4. Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5. Handleadvancedinstrumentstoenhancetechnicaltalent.
6. Gain confidence in modellingof systems and algorithms for transient and steady-
stateoperations,thermalstudy,etc.
7. Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpretan
dconclude.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
CO4 Identifythecriticalparametersthataffecttheanalogandmixed- L3
signalVLSIcircuits'performance
CO5 Perform calculationsin the digital or discrete time domain,more L5
sophisticateddataconverterstotranslatethedigitaldatatoandfrominherentlyanalogwor
ld.
4
ProgramOutcomeofthiscourse
5
VLSI Testing &Verification
Course Code MLVS202 CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40Hoursof Teaching Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TostudyFaults indigitalcircuits.
• TolearnvariousalgorithmsfortestgenerationofCombinationalLogic Circuits.
• Tostudytheapproachtodealwiththetesting problemsatthechiplevel(BIST).
• ToknowaboutDesignVerificationConcepts,SimulatorArchitecturesandOperations.
Module-1
Faultsindigitalcircuits: FailuresandFaults,Modelingoffaults,TemporaryFaults.
TestgenerationforCombinationalLogiccircuits:FaultDiagnosisofdigitalcircuits,Testgenerationtechniquesforcom
binationalcircuits(One-DimensionalPathSensitization,BooleanDifference, D-Algorithm).
RBT Levels: L2, L3
Module-2
Testgenerationfor CombinationalLogiccircuits:Test generationtechniquesfor
combinationalcircuits(PODEM,FAN, DelayFaultDetection),Detectionof multiplefaultsinCombinationallogiccircuits.
Designoftestablesequentialcircuits:ControllabilityandObservability,Ad-Hocdesignrulesforimproving
testability,designofdiagnosablesequentialcircuits,thescan-pathtechniquefortestablesequentialcircuitdesign.
RBT Levels: L2, L3
Module-3
Built-InSelfTest: TestpatterngenerationforBIST,Outputresponse analysis,CircularBIST,BISTArchitectures.
RBT Levels: L2, L3
Module-4
An Invitation to Design Verification: What is design verification? The basic verification principle,
Verificationmethodology, Simulation-based verification versus formal verification, Limitations of formal
verification, A quickoverview of Verilog scheduling andexecutionsemantics.
CodingforVerification:Functionalcorrectness,Timingcorrectness.
RBT Levels: L2, L3
Module-5
SimulatorArchitecturesandOperations:Thecompilers,Thesimulators,Simulatortaxonomyandcomparison,Simulato
roperationsandapplications.
RBT Levels: L2, L3
6
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof 50marks
toattaintheCOs andPOs
Thesumof twotests, twoassignments/skillDevelopmentActivities, willbescaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
theoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthe marksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
1) LalaParagK,“DigitalCircuitTestingandTestability”,NewYork,AcademicPress1997.
2) AbramoviciM,BreuerMA,“DigitalSystemsTestingandTestableDesignandFriedmanAD”,Wiley1994.
3) WilliamK.Lam,“HardwareDesignVerification:SimulationandFormalMethod-
BasedApproaches”,PrenticeHallPTR, 2005.
4) VishwaniDAgarwal,“EssentialofElectronicTestingforDigital,MemoryandMixedSignalCircuits”,Springer2002
WeblinksandVideoLectures(e-Resources):
• https://www.youtube.com/watch?v=O5lyBoWR-PA&list=PLx98Qgh5zPjh6oWI73QfQHZAmAiyt8Wkf
• https://www.youtube.com/watch?v=Abld-fSxjNM&list=PLbMVogVj5nJTClnafWQ9FK2nt3cGG8kCF
• https://www.youtube.com/watch?v=MEaMm423t0w&list=PLZjlBaHNchvOFBWBAtAP9exwQgYpKqsO4&i
ndex=1
SkillDevelopmentActivitiesSuggested
SkillDevelopmentActivitiesSuggested:
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnovativemethodstosolvetheproblem.
3) Involveincase studiesandfieldvisits/fieldwork.
4) Accustomtotheuse ofstandards/codesetc.,tonarrowthe gapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingof systemsandalgorithmsfortransientandsteady-state operations,thermalstudy,etc.
7) Workondifferentsoftware/s(tools) tosimulate,analyzeandauthenticatetheoutputtointerpretandconclude.
All activities should enhance student’s abilities to employment and/or self-employment opportunities, management
skills,Statisticalanalysis,fiscalexpertise,etc.
Students and the course instructor/s to involve either individually or in groups to interact together to enhance the
learningand application skills of the study they have undertaken. The students with the help of the course teacher can take up
relevanttechnical–activitieswhichwillenhance theirskill.The preparedreportshallbeevaluatedfor CIEmarks.
7
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description BloomsLevel
CO1 Analyzetheneedforfaultmodeling andtesting ofdigitalcircuits
L3CO2
Generatefaultlists fordigitalcircuits andcompressthetestsforefficiency L2,
L3CO3 Applyboundaryscantechniquetovalidatetheperformanceofdigitalcircuits L3,
L4CO4 Designbuilt-inself tests forcomplexdigitalcircuits L3
CO5 ApplytheVerificationConceptstoDigitalCircuits. L3
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolvepracticalproblemsr
PO1
elatedtoVLSIDesignandembeddedsystems.
2. Demonstratea degree
ofmasteryovertheareasofVLSIDesignandembeddedsystems.Themasteryshouldbeata PO2
levelhigherthantherequirementsinthe bachelor'sinElectronics&
CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternationalstandard
PO3
sinthe area ofVLSIdesignandembeddedsystems.
4. Acquire competency in areas of VLSI and Embedded Systems, IC Fabrication, Design,
Testing,Verification and Integrate multiple sub-systems to develop System On Chip to PO4
optimize itsperformanceandexcelinindustrysectorsrelatedtoVLSI/ Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmentalcontextsand
PO5
demonstratethe knowledge forsustainable development.
8
ARM Cortex-M3 and M4 Processors
Course Code MLVS203 CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningObjectives:
• TostudyARMCortex-M3/M4microcontrollers.
• Developassembly-levelandEmbeddedC-programsandinterfacewithotherexternaldevices.
• Toknow-how todevelopsoftwareforsystemsbasedonCortex-M3/M4processor.
Module-1
IntroductiontoARMCortex-MProcessors:Introduction,AdvantagesandApplicationstoCortex_-
Mprocessors,Resources for using ARM_ processors and ARM Microcontrollers, Background and history of ARM.
Introductionto Embedded Software Development: Inside typical ARM_ microcontrollers, Development suites
&
boards,Softwaredevelopmentflow,Compilingapplications,Softwareflow,DatatypesinCprogramming,Inputs,output
s,
andperipheralsaccessesandMicrocontrollerinterfaces.
RBT Levels: L2, L3
Module-2
Introduction to Embedded Software Development: The Cortex microcontroller software interface
standard(CMSIS)
TechnicalOverview:GeneralinformationabouttheCortex-M3andCortex-M4processors,Featuresofthe
Cortex_-M3andCortex-M4processors.
RBT Levels: L2, L3
Module-3
Architecture:Behaviour of the application program status register (APSR), Memory system, Exceptions
andinterrupts,Systemcontrolblock(SCB),Debug, Resetandresetsequence.
InstructionSet:BackgroundtotheinstructionsetinARMCortexMprocessors,Comparisonoftheinstructionset
inARMCortexMprocessors,Understanding theassemblylanguagesyntax, Useof a suffixininstructions, UAL.
RBT Levels: L2, L3
Module-4
InstructionSet:InstructionSet
RBT Levels: L2, L3
Module-5
ExceptionsandInterrupts:Overviewofexceptionsandinterrupts,Exceptiontypes,Overviewofinterruptmanagement,
Definitionsofpriority,Vectortableandvectortablerelocation,Interruptinputsandpendingbehaviors, Exception
sequence overview, Details of NVIC registers for interrupt control, Details of SCB registers
forexceptionandinterruptcontrol,Detailsofspecialregistersforexceptionorinterruptmasking,Exampleprocedures
insettingupinterrupts,Softwareinterrupts.
RBT Levels: L2, L3
9
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbescaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
theoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
TextBooks
1) J.Yiu,TheDefinitiveGuidetoARMCortex-M3andCortex-M4Processors,3rdEdition,NewnesPublication,2013.
ReferenceBooks:
2) S.Furber,ARMSystem-on-ChipArchitecture,2ndEdition,Addison-Wesley,2000.
3) A.Deshmukh,Microcontroller-Theory&Applications,Tata McGrawHill,2017.
OtherReferences:
1) Cortex-Mseries-ARMReferenceManual
2) Cortex-M3TechnicalReferenceManual(TRM)
3) STM32L152xxARMCortexM3MicrocontrollerReference Manual
4) ARMArchitectureReferenceManual–ARMDDI0100E
5) ARMv7-MArchitectureReferenceManual(ARMv7-MARM)
WeblinksandVideoLectures(e-Resources):
• ARMArchitectureFundamentals–https://youtu.be/7LqPJGnBPMM
• https://www.youtube.com/watch?v=cP6NxivTY94&list=PLbMVogVj5nJRDS4w20GO7l4SepLhuAj9X&index=1
7
• https://www.youtube.com/watch?v=Kju5UMLC7hg
https://nptel.ac.in/courses/108105057:byProf.R.MallandProf.A.Patra,IITKharagpur
10
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnovativemethodstosolvetheproblem.
3) Involveincase studiesandfieldvisits/fieldwork.
4) Accustomtotheuse ofstandards/codesetc.,tonarrowthe gapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingof systemsandalgorithmsfortransientandsteady-state operations,thermalstudy,etc.
7) Workondifferentsoftware/s(tools) tosimulate,analyzeandauthenticatetheoutputtointerpretandconclude.
All activities should enhance student’s abilities to employment and/or self-employment opportunities, management
skills,Statisticalanalysis,fiscalexpertise,etc.
Students and the course instructor/s to involve either individually or in groups to interact together to enhance the
learningand application skills of the study they have undertaken. The students with the help of the course teacher can take up
relevanttechnical–activitieswhichwillenhance theirskill.The preparedreportshallbeevaluatedfor CIEmarks.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description BloomsLevel
CO1 Describethearchitecture,modesofoperation,memoryorganization,interruptsofARMCor L1
tex-M3familyof microprocessors.
CO2 DescribetheprogrammingandinterruptsofARMCortex-M3familyofmicroprocessors. L1
CO3 DemonstrateperipheralinterfacingwithadvancedprogrammingofARMCortex- L2
M3/M4microcontrollersforreal-timeapplications.
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolvepractical
problemsrelatedtoVLSIDesignandembeddedsystems.
PO1
2. Demonstrate adegreeofmasteryovertheareas ofVLSI Design
andembeddedsystems.Themasteryshouldbeatalevelhigherthantherequirementsinthebachelor'sinElec
tronics&
PO2CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternational
standardsinthe area ofVLSIdesignandembeddedsystems.
PO3
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,Testing,Verificationan
dIntegratemultiplesub-systemstodevelopSystemOnChiptooptimizeits
PO4performanceandexcelinindustrysectorsrelatedtoVLSI/ Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmental
contextsanddemonstrate theknowledge for sustainable development.
PO5
11
Real Time Operating System
Course Code MLVS204 CIE Marks 50
Teaching 3:0:0
SEE Marks 50
Hours/Week(L:P:SDA)
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningObjectives:
1. Toexplaintheconceptofareal-
timesystemandwhythesesystemsareusuallyimplementedasconcurrentprocesses
2. Todescribeadesignprocessforreal-timesystems.
3. Toexplaintheroleof a real-timeoperatingsystems.
4. TointroducedebuggingprocessarchitecturesRTOS.
Module-1
Real-Time Systems and Resources: Brief history of Real Time Systems, A brief history of Embedded
Systems.SystemResources,ResourceAnalysis,Real-TimeServiceUtility,Schedulerconcepts,Real-
TimeOS,Statetransitiondiagramandtables, ThreadSafeReentrantFunctions.(Text1:SelectedsectionsfromChap.1,2)
RBT Levels: L2, L3
Module-2
ProcessingwithRealTimeScheduling:SchedulerConcepts,PreemptiveFixedPrioritySchedulingPolicieswithtimin
gdiagramsandproblemsandissues,Feasibility,RateMonotonicleastupperbound,NecessaryandSufficientfeasibility,D
eadline–Monotonic Policy,Dynamicprioritypolicies,AlternativetoRMpolicy.
RBT Levels: L2, L3
Module-3
Memory and I/O: Worst case execution time, Intermediate I/O, Shared Memory, ECC Memory, Flash file
systems.Multi-resourceServices,Blocking,Deadlockandlivelock,Criticalsectionstoprotectsharedresources,Missed
deadline,QoS,ReliabilityandAvailability,Similaritiesanddifferences,Reliablesoftware,Availablesoftware.
RBT Levels: L2, L3
Module-4
FirmwareComponents:The3firmwarecomponents,RTOSsystemsoftwaremechanisms,Softwareapplication
components.DebuggingComponents,Exceptions,assert,Checkingreturncodes,Single-stepdebugging,Testaccessports,
TracePorts.
RBT Levels: L2, L3
Module-5
ProcessandThreads:Processandthreadcreations,Programsrelatedtosemaphores,messagequeue,sharedBufferappli
cationsinvolvingintertask/threadcommunication
RBT Levels: L2, L3
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
12
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbescaleddownto50marks
CIEmethods/questionpaperisdesignedtoattainthedifferentlevelsofBloom’staxonomyaspertheoutcomedefine
dforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
TextBooks:1.SamSiewert,“Real-TimeEmbeddedSystemsandComponents”,CengageLearningIndiaEdition,2007.
2.Dr.K.V.K.KPrasad,Embedded/RealTimeSystems,Concepts,DesignandProgramming,BlackBook,DreamTechPress,Newedition,201
0.
ReferenceBooks:1.JamesWSLiu,“RealTime System”,Pearsoneducation,2008.
2.Dream TechSoftwareTeam,“ProgrammingforEmbeddedSystems”,JohnWiley,IndiaPvt.Ltd.,2008.
WeblinksandVideoLectures(e-Resources):
• https://www.youtube.com/watch?v=dHsHP9RrXBw&list=PLJ5C_6qdAvBH-JNRIlupFb44miyx9M8JD
SkillDevelopmentActivitiesSuggested:
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeand innovativemethods
tosolvetheproblem.
3) Involveincase studiesandfieldvisits/fieldwork.
4) Accustomtotheuse ofstandards/codesetc.,tonarrowthe gapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingof systemsandalgorithmsfortransientandsteady-state operations,thermalstudy,etc.
7) Workondifferentsoftware/s(tools) tosimulate,analyzeandauthenticatetheoutputtointerpretandconclude.
All activities should enhance student’s abilities to employment and/or self-employment opportunities, management
skills,Statisticalanalysis,fiscalexpertise,etc.
Students and the course instructor/s to involve either individually or in groups to interact together to enhance the
learningand application skills of the study they have undertaken. The students with the help of the course teacher can take up
relevanttechnical–activitieswhichwillenhancetheir skill.The preparedreportshallbeevaluatedfor CIEmarks.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description LEVELS
1 Developprogramsforrealtimeservices,firmwareandRTOS,usingthefundamentalsofRealTime
EmbeddedSystem,realtimeserviceutilities,debuggingmethodologiesand L6
optimizationtechniques.
2 Select the appropriate system resources (CPU, I/O, L1,L2
Memory,Cache,ECCMemory,Microcontroller/FPGA/ASICtoimprovethesystemp
erformance.
3 Applyprioritybasedstaticanddynamicrealtimeschedulingtechniquesforthegiven L3
specifications
4 Analyzedeadlockconditions,sharedmemoryproblem,criticalsectionproblem,misseddeadlines L4
,availability,reliabilityandQoS.
5 Develop programsformulti-threadedapplicationsusingsuitabletechniquesanddata L6
structure
13
ProgramOutcomeofthiscourse
Sl.No. Description POs
Independentlycarryoutresearch/investigationanddevelopmentworktosolvepracticalp
1. PO1
roblemsrelatedtoVLSI Designandembeddedsystems.
2. Demonstrate a degree of mastery over the areas of VLSI Design and
embeddedsystems. The mastery should be at a level higher than the PO2
requirements in thebachelor'sinElectronics&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternationa
PO3
lstandardsintheareaofVLSI designandembeddedsystems.
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,Testi
ng, Verification and Integrate multiple sub-systems to develop System On Chipto
PO4
optimize its performance and excel in industry sectors related to VLSI
/Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietaland
environmental contexts and demonstrate the knowledge for PO5
sustainabledevelopment.
14
Fin FETs and Other Multi-Gate Transistors
Course Code MLVS215A CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TolearntheevolutionofSOIMOStransistor.
• Tohaveaninsightintothinfilmformationtechniquesandadvancedgatestackdeposition.
• ToenablethestudentstoanalysephysicsbehindBSIM-CMG.
• Toanalysetheelectrostaticsof themulti-gateMOSsystem.
• Torealisetheinterrelationshipbetweenthemulti-gateFET deviceproperties anddigitalandanalogcircuits.
Module-1
TheSOIMOSFET:FromSingleGatetoMultiGate:AbriefhistoryofMultiple-GateMOSFETs,MultiGateMOSFETphysics.
RBT Levels: L2, L3
Module-2
MultigateMOSFETTechnology:Introduction,ActiveArea:Fins,GateStack
RBT Levels: L2, L3
Module-3
BSIM-CMG:ACompactModelforMult-
GateTransistors:Introduction,FrameworkforMultiGateFETModeling,MultiGateModels, BSIM-CMG andBSIM-IMG,
BSIM-CMG.
RBT Levels: L2, L3
Module-4
PhysicsoftheMultiGateMOSsystem:Deviceelectrostatics,DoublegateMOSsystem,Two-dimensionalconfinement
RBT Levels: L2, L3
Module-5
Multi-GateMOSFETcircuitDesign:Introduction,DigitalCircuitDesign,AnalogCircuitDesign
RBT Levels: L2, L3
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
theoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopics underamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
15
Suggested Learning
Resources:Books
16
1) J.P.Colinge,:FinFETsandother Multi-GateTransistors,springer,Serieson IntegratedCircuitsandSystems.
2) SamarSaha,: FinFETDevicesforVLSICircuitsandSystems,CRCPress, FirstEdition,2020
3) WeihuaHan,ZhimingM.Wang,:TowardQuantumFinFET,Springer Cham,FirstEdition2021.
4) YogeshsinghChauhan,DarsenD,et.al,FinFETModelingforICSimulationandDesign:usingtheBSIM-
CMGstandard,AcademicPress,2015.
WeblinksandVideoLectures(e-Resources):
1. http://www.ee.iitb.ac.in
2. http://onlinecourses.nptel.ac.in
3. http;//icmaskdesign.com
4. http;//link.springer.com
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnovativemethodstosolvetheproblem.
3) Involveincase studiesandfieldvisits/fieldwork.
4) Accustomtotheuse ofstandards/codesetc.,tonarrowthe gapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingof systemsandalgorithmsfortransientandsteady-state operations,thermalstudy,etc.
7) Workondifferentsoftware/s(tools) tosimulate,analyzeandauthenticatetheoutputtointerpretandconclude.
All activities should enhance student’s abilities to employment and/or self-employment opportunities, management
skills,Statisticalanalysis,fiscalexpertise,etc.
Students and the course instructor/s to involve either individually or in groups to interact together to enhance the
learningand application skills of the study they have undertaken. The students with the help of the course teacher can take up
relevanttechnical–activitieswhichwillenhance theirskill.The preparedreportshallbeevaluatedfor CIEmarks.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description BloomsLevel
CO1 ListouttheadvantagesandchallengesofMulti-gateFinFETs. L1
CO2 Describethinfilmformationtechnique,gatestackdepositionandphysicsbeyond L2
BSIMCMG
CO3 Analyseelectrostaticsofmulti-gateMOSsystemandcorelatemultigateFETdevice L4
propertiesandelementarydigitalandanalogcircuits.
17
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryout
PO1
research/investigationanddevelopmentworktosolvepracticalproblemsrelatedtoVLSIDesignan
dembeddedsystems.
2. Demonstrate a degree of mastery over the areas of VLSI Design and embedded systems.
Themastery should be at a level higher than the requirements in the bachelor's in Electronics PO2
&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternationalstandar
PO3
dsinthe area ofVLSIdesignandembeddedsystems.
4. Acquire competency in areas of VLSI and Embedded Systems, IC Fabrication, Design,
Testing,Verification and Integrate multiple sub-systems to develop System On Chip to PO4
optimize itsperformanceandexcelinindustrysectorsrelatedtoVLSI/ Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmentalcontextsand
PO5
demonstratethe knowledge forsustainable development.
18
Hard ware
Security
Course Code MLVS215B CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• Tounderstandthecurrentpracticeof SoCdesignandvalidationmethodology.
• TounderstandtheSecurityassetsandattackmodels.
• TolearnthedetectionofhardwareTrojans inIPs
Module-1
SecurityandTrustVulnerabilitiesinThird-
PartyIPs:DesignandValidationofSoCs,SecurityandTrustVulnerabilitiesinThird-
PartyIPs,TrustworthySoCDesignUsingUntrustedIps
RBT Levels: L2, L3
Module-2
SecurityRuleCheck:Introduction,SecurityAssetsandAttackModels,DSeRC:DesignSecurityRuleCheck,Developm
entof DSeRCFramework
RBT Levels: L2, L3
Module-3
DigitalCircuitVulnerabilitiestoHardwareTrojans:Introduction,TheGate-
LevelDesignVulnerabilityAnalysisFlow,TheLayout-LevelDesignVulnerabilityAnalysisFlow,TrojanAnalyses
RBT Levels: L2, L3
Module-4
CodeCoverageAnalysisforIPTrustVerification,HardwareTrojanStructure,RelatedWork,ACaseStudyfor
IPTrustVerification,SimulationResults
RBT Levels: L2, L3
Module-5
SecurityBasedonPhysicalUnclonabilityandDisorder:Introduction,UniqueObjects,WeakPhysicalUnclonableFunct
ions, StrongPhysicalUnclonableFunctions, ControlledPhysicalUnclonableFunctions,
RBT Levels: L2, L3
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%
ofthemaximummarksofSEE.Astudentshallbedeemedtohavesatisfiedtheacademicrequirementsandearnedthe
credits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100)
inthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether. Con
tinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks.
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
theoutcomedefinedforthecourse.
Semester-EndExamination:
1. The SEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopics underamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
19
SuggestedLearningResources:
Books
• HardwareIPSecurityandTrust,PrabhatMishra•SwarupBhunia•MarkTehranipoorEditors©SpringerInt
ernationalPublishing AG 2017.
• Introduction toHardware
SecurityandTrust,MohammadTehranipoor•CliffWangEditors,SpringerScience+BusinessMedia, LLC
2012.
• HARDWARE SECURITY Design, Threats, and Safeguards Debdeep Mukhopadhyay Rajat Subhra
Chakraborty Indian Institute of Technology Kharagpur West Bengal, India.
WeblinksandVideoLectures(e-Resources):
https://archive.nptel.ac.in/courses/106/105/106105194/
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnovativ
emethodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpretan
dconclude.
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description BloomsLevel
CO1 DescribethecurrentpracticeofSoCdesignandvalidationmethodologyand
L1
securityandtrustvulnerabilitiesinthird-partyIPs. Section.
CO2 Presenttherulesandmetricswhicharerequiredtoquantitativelyanalyze
L3
vulnerabilitiesanddevelopmentDSeRC framework
CO3 Analysethegate-levelvulnerabilityflow L4
CO4 Understandthe detectionof hardwareTrojansin3PIPs
L2CO5
Realizing secureand reliableidentification, authentication, andintegrity L3,L6
checking ofnetworkedsmartobjects.
20
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolvepracticalp
PO1
roblemsrelatedtoVLSI Designandembeddedsystems.
2. Demonstrateadegree ofmasteryoverthe areasofVLSIDesignandembedded
systems.Themasteryshouldbeatalevelhigherthantherequirementsinthebachelor'sinEle PO2
ctronics&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternationa
PO3
lstandardsintheareaof VLSIdesignandembeddedsystems.
4. Acquire competency in areas of VLSI and Embedded Systems, IC Fabrication,
Design,Testing,VerificationandIntegratemultiplesub-
PO4
systemstodevelopSystemOnChiptooptimize its performance and excel in industry
sectors related to VLSI / Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmentalco
ntexts and demonstrate theknowledge for sustainable PO5
development.
21
Static Timing Analysis
Course Code MLVS215C CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TounderstandtheSTAEnvironmentandconcepts.
• Toknowstandardcelllibrarywithtiming modelanddelaymodel.
• Tostudydelaycalculationsandtiming verificationconceptsofflip-flops.
Module-1
Introduction: Nanometer Designs, What is Static Timing Analysis? Why Static Timing Analysis?, Crosstalk
andNoise, Design Flow, CMOS Digital Designs, FPGA Designs, Asynchronous Designs, STA at Different Design
Phases,LimitationsofStaticTimingAnalysis,PowerConsiderations,ReliabilityConsiderationsSTAConcepts:CMOSLo
gicDesign, Basic MOS Structure, CMOS Logic Gate, Standard Cells, Modeling of CMOS Cells, Switching
Waveform,PropagationDelay,SlewofaWaveform,SkewbetweenSignals,TimingArcsandUnateness,Minand Max
Timing
Paths,ClockDomains,OperatingConditions
RBT Levels: L2, L3
Module-2
StandardCellLibrary:PinCapacitance,TimingModeling,LinearTimingModel,Non-LinearDelayModel,Exampleof
Non-Linear, Delay Model Lookup, Threshold Specifications and Slew Derating Timing Models -
CombinationalCells,DelayandSlewModels,PositiveorNegativeUnate,GeneralCombinationalBlock,TimingModels-
SequentialCells,SynchronousChecks:SetupandHold,ExampleofSetupandHoldChecks,NegativeValuesinSetupandH
oldChecks,AsynchronousChecks,RecoveryandRemovalChecksPulseWidthChecks,ExampleofRecovery,Removalan
d Pulse Width Checks, Propagation Delay, State- Dependent Models XOR,XNOR and Sequential Cells,
InterfaceTimingModelforaBlackBox,AdvancedTimingModeling,ReceiverPinCapacitance,SpecifyingCapacitanceatt
hePinLevel,SpecifyingCapacitanceattheTimingArcLevel,OutputCurrent,ModelsforCrosstalkNoiseAnalysis,DCCurr
ent, Output Voltage, Propagated Noise, Noise Models for Two-Stage Cells, Noise Models for Multi-stage
andsequentialCells, OtherNoiseModels,PowerDissipationModeling, ActivePower
RBT Levels: L2, L3
Module-3
Interconnect Parasitics: RLC for Interconnect, Wireload Models, Interconnect Trees, Specifying Wire load
Models,Representation of Extracted Parasitic, Detailed Standard Parasitic Format ,Reduced Standard Parasitic
Format,StandardParasiticExchangeFormat,RepresentingCouplingCapacitances,HierarchicalMethodology,BlockR
eplicated in Layout, Reducing Parasitic for Critical Nets, Reducing Interconnect Resistance, Increasing
WireSpacing, Parasitics for Correlated Nets. Delay Calculation: Overview, Delay Calculation Basics, Delay
Calculationwith Interconnect, Pre-layout Timing, Post-layout Timing, Cell Delay using Effective Capacitance,
InterconnectDelay, Elmore Delay, Higher Order Interconnect Delay Estimation, Full Chip Delay Calculation, Slew
Merging,Different SlewThresholds,DifferentVoltage Domains,PathDelay Calculation,Combinational
PathDelay,Pathto
a Flip-flop, InputtoFlip-flopPath,Flip-floptoFlip-flopPath,MultiplePaths, SlackCalculation.
RBT Levels: L2, L3
Module-4
Configuring the STA Environment: What is theSTA Environment? Specifying Clocks, Clock Uncertainty,
ClockLatency, Generated Clocks, Example of Master Clock at Clock Gating Cell Output, Generated Clock using Edge
andEdgeshiftOptions,GeneratedClockusingInvertOption,ClockLatencyforGeneratedClocks,TypicalClockGeneration
Scenario, Constraining Input Paths, Constraining Output Paths, Example A, Example B, Example
TimingPathGroups,ModelingofExternalAttributes,ModelingDriveStrengths,ModelingCapacitiveLoad,DesignRule
Checks,VirtualClocks,
RBT Levels: L2, L3
Module-5
22
Timing Verification: Setup Timing Check, Flip-flop to Flip-flop Path, Input to Flip-flop Path, Input Path with
ActualClock, Flip flop to Output Path, Input to Output Path, Frequency Histogram, Hold Timing Check, Flip-flop to
FlipflopPath, Hold Slack Calculation, Input to Flip-flop Path, Flip-flop to Output Path, Flip-flop to Output Path with
ActualClock, Input to Output Path, Multicycle Paths, Crossing Clock Domains, False Paths, Half- Cycle Paths,
RemovalTimingCheck,RecoveryTimingCheck,TimingacrossClockDomains,SlowtoFastClockDomains,FasttoSlowCloc
k
Domains, Half-cyclePath- Case1, Half-cyclePath-Case2,FasttoSlowClockDomain, SlowtoFastClockDomain
RBT Levels: L2, L3
23
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End Exam (SEE) is 50%.
Theminimum passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40% of
themaximum marks of SEE.A student shall be deemed to have satisfied the academic requirements and earned
thecredits allotted to each subject/ course if the student secures not less than 50% (50 marks out of 100) in the
sumtotalof theCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as per
theoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
1. J.Bhasker,R Chadha,“StaticTimingAnalysis
forNanometerDesigns:APracticalApproach”,Springer2009ReferenceBooks
2. SridharGangadharan,SanjayChuriwala,“ConstrainingDesignsforSynthesisandTimingAnalysis–
APracticalGuidetoSynopsisDesignConstraints(SDC)”, Springer, 2013
3. NareshMaheshwariandSachinSapatnekar,“TimingAnalysisandOptimizationofSequentialCircuits”,SpringerScience
andBusinessMedia, 1999
WeblinksandVideoLectures(e-Resources):
• https://www.youtube.com/watch?v=KlUn2GjNOfY&list=PLYdInKVfi0Ka5c6kraib5qiCFhPWE9G6e
• https://www.youtube.com/watch?v=yYR8BzysTmM&list=PLYdInKVfi0Ka5c6kraib5qiCFhPWE9G6e&i
ndex=2
24
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnovativemet
hodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrow thegapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticate
theoutputtointerpretandconclude.
25
Embedded Linux System Design and Development Processing
Course Code MLVS215D CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TounderstandtheimportanceofEmbeddedLinuxinembeddedsystemdesign.
• ToGaintheknowledgeof BoardSupportPackage.
• ToAnalysethe memoryrequirementsfordesign.
• Tolearn theembeddeddriversandkernelmodules.
• TolearntheportingapplicationsfromtraditionalRTOS
Module-1
Introduction:HistoryofEmbeddedLinux,WhyEmbeddedLinux,EmbeddedLinuxVersusDesktopLinux,Frequ
entlyAskedQuestions,EmbeddedLinuxDistributions,PortingRoadmap.GettingStarted:ArchitectureofEmbe
ddedLinux,LinuxKernelArchitecture,UserSpace,LinuxStart-UpSequence,GNU
CrossPlatformToolchain
RBT Levels: L2, L3
Module-2
BoardSupportPackage:InsertingBSPinKernelBuildProcedure,MemoryMap,InterruptManagement,ThePCI
Subsystem,Timers, UART, PowerManagement
RBT Levels: L2, L3
Module-3
EmbeddedStorage:FlashMap,MTD—
MemoryTechnologyDevice,MTDArchitecture,SampleMTDDriverforNORFlash,TheFlash-
MappingDrivers,MTDBlockandCharacterDevices,MtdutilsPackage,EmbeddedFileSystems,
OptimizingStorageSpace,Tuning Kernel Memory.
RBT Levels: L2, L3
Module-4
EmbeddedDrivers:Linux
SerialDriver,EthernetDriver,I2CSubsystemonLinux,USBGadgets,WatchdogTimer,KernelModules
RBT Levels: L2, L3
Module-5
PortingApplications:ArchitecturalComparison,ApplicationPortingRoadmap,ProgrammingwithPthreads,
Operating SystemPortingLayer(OSPL), KernelAPIDriver.
RBT Levels: L2, L3
26
AssessmentDetails(bothCIEandSEE)
TheweightageofContinuousInternalEvaluation(CIE)is50%andforSemesterEndExam(SEE)is50%.Theminim
um passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%of the
maximum marks of SEE.A student shall be deemed to have satisfied the academic requirements
andearnedthecreditsallottedtoeachsubject/courseifthestudentsecuresnotlessthan50%(50marksoutof100)i
nthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIEmethods/questionpaperisdesignedtoattainthedifferentlevelsofBloom’staxonomyaspertheoutco
medefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
1. P.Raghavan,AmolLad,SriramNeelakandan”EmbeddedLinuxSystemDesignAndDevelopment”,AuerbachPub
lications,Taylor&FrancisGroup, 2006
2. KarimYaghmour,JonMasters,GiladBenYossef,andPhilippeGerum“BuildingEmbeddedLinuxSystems”O’Rei
llypublications,2ndedition
WeblinksandVideoLectures(e-Resources):
• https://www.youtube.com/watch?v=9vsu67uMcko
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreative
andinnovativemethodstosolve the problem.
3) Involveincase studiesandfieldvisits/fieldwork.
4) Accustomtotheuse of standards/codesetc.,tonarrowthe gapbetweenacademia andindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy,etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpretandconcl
ude.
All activities should enhance student’s abilities to employment and/or self-employment opportunities,
managementskills, Statistical analysis, fiscal expertise, etc. Students and the course instructor/s to involve either
individually orin groups to interact together to enhance the learning and application skills of the study they have
undertaken. Thestudentswiththehelpof thecourseteachercantakeuprelevanttechnical–
activitieswhichwillenhancetheirskill.
ThepreparedreportshallbeevaluatedforCIEmarks.
27
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeable to:
Sl.No. Description
Blo
omsL
evel
CO1 Understand theembeddedLinuxdevelopmentenvironment
L1,L2
CO2 Understand andcreate LinuxBSPfora hardware platform
L1,L2
CO3UnderstandtheLinuxmodelforembeddedstorageandwritedriversand L1,L2
applicationsforthesame
CO4 UnderstandvariousembeddedLinux driverssuchasserial,I2C,andso L1,L2
on
CO5 Portapplicationsto embeddedLinux fromatraditionalRTOS L3
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independently carry outresearch/investigationand developmentworkto solvepractical
problemsrelatedtoVLSIDesignandembeddedsystems.
PO1
2. DemonstrateadegreeofmasteryovertheareasofVLSIDesignandembeddedsystems.
Themasteryshouldbeatalevelhigherthantherequirementsinthebachelor'sin
PO2
Electronics&CommunicationEngineering.
3. Apply appropriate methodology and modern engineering/IT tools to meet the
internationalstandardsinthearea ofVLSIdesignandembeddedsystems.
PO3
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,Testing,Verificatio
nandIntegratemultiplesub-systemstodevelopSystemOnChipto
PO4optimizeitsperformanceandexcelinindustrysectorsrelatedtoVLSI/Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmental
contextsanddemonstratethe knowledge forsustainable development.
PO5
28
Reconfigurable Computing
Course Code MLVS216A CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• Thiscoursewillenablestudentsto:
• TolearnthevariousReconfigurablesystems.
• TostudythedifferentLanguagesandCompilation.
• TounderstandtheImplementationof FPGA.
• TolearnPartialReconfigurationDesign
• TounderstandtheSignalProcessingApplications
Module-1
Introduction:History,ReconfigurablevsProcessorbasedsystem,RCArchitecture.
ReconfigurableLogicDevices:FieldProgrammable Gate Array,CoarseGrainedReconfigurableArrays.
ReconfigurableComputing
System:ParallelProcessingonReconfigurableComputers,AsurveyofReconfigurableComputing System.
RBT Levels: L2, L3
Module-2
LanguagesandCompilation:DesignCycle,Languages,HDL,HighLevelCompilation,LowlevelDesignflow,Debu
gging ReconfigurableComputing Applications.
RBT Levels: L2, L3
Module-3
Implementation:Integration,FPGADesignflow,LogicSynthesis.
HighLevelSynthesisforReconfigurableDevices:Modelling,TemporalPartitioningAlgorithms.
RBT Levels: L2, L3
Module-4
Partial Reconfiguration Design: Partial Reconfiguration Design, Bitstream Manipulation with JBits,
Themodular Design flow, The Early Access Design Flow, Creating Partially Reconfigurable Designs,
PartialReconfigurationusing Hansel-C Designs, PlatformDesign.
RBT Levels: L2, L3
Module-5
SignalProcessingApplications:ReconfigurablecomputingforDSP,DSPapplicationbuildingblocks,Examples:B
eamforming,SoftwareRadio,Imageandvideoprocessing,LocalNeighbourhoodfunctions,
Convolution.SystemonaProgrammableChip:IntroductiontoSoPC,AdaptiveMultiprocessingonChip.
RBT Levels: L2, L3
29
AssessmentDetails(bothCIEandSEE)
TheweightageofContinuousInternalEvaluation(CIE)is50%andforSemesterEndExam(SEE)is50%.Theminim
um passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%of the
maximum marks of SEE.A student shall be deemed to have satisfied the academic requirements
andearnedthecreditsallottedtoeachsubject/courseifthestudentsecuresnotlessthan50%(50marksoutof100)i
nthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests, twoassignments/skillDevelopmentActivities,willbescaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as
pertheoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions,selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
1.Reconfigurable Computing:AcceleratingComputationwithField-Programmable Gate
ArraysM.GokhaleandP. GrahamSpringer, ISBN:978-0-387-26105-82005
2.IntroductiontoReconfigurableComputing:Architectures,AlgorithmsandApplicationsC.BobdaSpringer,ISBN:
978-1-4020-6088-52007
ReferenceBooks
1. PracticalFPGAProgramminginC D. PellerinandS. ThibaultPrentice-Hall2005
2. FPGABasedSystemDesignW.Wolf Prentice-Hall2004
3. RapidSystemPrototypingwithFPGAs:AcceleratingtheDesignProcessR.CoferandB.HardingNewnes2005
WeblinksandVideoLectures(e-Resources):
• nptel.ac.in
30
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnova
tivemethodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpre
tandconclude.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description
Bloo
msLe
vel
CO1 Understandthefundamentalprinciplesandpracticesinreconfigurablearchitecture L2
CO2 Simulateandsynthesizethereconfigurablecomputing architectures.
L5
CO3 UnderstandtheFPGAdesignprinciples, andlogic synthesis
L2
CO4Integratehardwareandsoftwaretechnologiesforreconfigurationcomputingfocusing L3
onpartialreconfigurationdesign.
CO5 Designdigitalsystemsforavarietyofapplicationsonsignalprocessingandsystemon
L6chipconfigurations
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolvepractical
problemsrelatedtoVLSIDesignandembeddedsystems.
PO1
2. Demonstrate adegreeofmasteryovertheareas ofVLSI Design
andembeddedsystems.Themasteryshouldbeatalevelhigherthantherequirementsinthebachelor'sinElec
tronics&
PO2CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternational
standardsinthe area ofVLSIdesignandembeddedsystems.
PO3
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,Testing,Verificationan
dIntegratemultiplesub-systemstodevelopSystemOnChiptooptimizeits
PO4performanceandexcelinindustrysectorsrelatedtoVLSI/ Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmental
contextsanddemonstrate theknowledge for sustainabledevelopment.
PO5
31
Long Term Reliability of VLSI Systems
Course Code MLVS216B CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40 hours Theory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• ToUnderstandtheVariousConceptsRelatedto ElectromigrationReliability.
• TostudytheFastEMStressEvolutionAnalysis.
• TostudytheEMAssessmentforPowerGridNetworks.
• TounderstandtheTransistorAging EffectsandReliability.
• TolearntheAging EffectsinSequentialElements.
Module-1
ElectromigrationReliability:WhyElectromigrationReliability?,Whysystem-
levelEMReliabilityManagement? Physics- based EM Modeling, Electromigration Fundamentals, Stress
based EM
Modelingandstressdiffusionequations,ModelingfortransientEMeffectsandInitialstressconditions,postvoi
dingstressandvoidvolumeevolution,compactphysicsbasedEMmodelforasinglewire,otherrelevantEM
modelsandanalysismethods.
RBT Levels: L2, L3
Module-2
FastEMStressEvolutionAnalysis:Introduction,TheLTIordinary differentialequations
forEMstressevolution,ThepresentedKrylovfastEMstressanalysis,Numericalresultsanddiscussions.
RBT Levels: L2, L3
Module-3
EMAssessmentforPowerGridNetworks:Newpowergridreliabilityanalysismethod,cross-
layouttemperatureandthermalstresscharacterization,impactofacross-layouttemperatureandthermalstress
onEM.
RBT Levels: L2, L3
Module-4
Transistor Aging Effects andReliability:Introduction, Transistor reliability in advanced
technologynodes,TransistorAging,BTI-BiasTemperatureInstability,HCI–
HotCarrierInjection,CouplingmodelsforBTIandHCIdegradations,RTN–RandomTelegraphNoise,TDDB–
TimeDependentDielectricBreakdown.
RBT Levels: L2, L3
Module-5
AgingEffectsinSequentialElements:Introduction,Background:flipfloptiminganalysis,processvariationmod
el, voltagedroopmodel, Robustnessanalysis, reliability-awareflip-flopdesign.
RBT Levels: L2, L3
32
AssessmentDetails(bothCIEandSEE)
TheweightageofContinuousInternalEvaluation(CIE)is50%andforSemesterEndExam(SEE)is50%.Theminim
um passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%of the
maximum marks of SEE.A student shall be deemed to have satisfied the academic requirements
andearnedthecreditsallottedtoeachsubject/courseifthestudentsecuresnotlessthan50%(50marksoutof100)i
nthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIE methods /question paper is designed to attain the different levels of Bloom’s taxonomy as
pertheoutcomedefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions,selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books
1.Long-
TermReliabilityofNanometerVLSISystemsSheldonX.D.Tan,MehdiBaradaranTahoori,TaeyoungKim,SamanKia
mehr,ZeyuSpringerInternationalPublishing1stEdition,2019ISBN:978-3-030-26171-9
ReferenceBooks:
1. ReliabilityWearoutMechanismsinAdvancedCMOSTechnologiesAlvinWayneStrong,Rolf-PeterVollertsen,
Timothy D. Sullivan, Ernest Y. Wu, Giuseppe La Rosa, Jordi Sune Wiley, Copyright © theInstituteof
ElectricalandElectronicsEngineers, Inc.2009PrintISBN:9780471731726
2. Hot-
carrierReliabilityofMOSVLSICircuitsYusufLeblebici,SMKangSpringerScience&BusinessMedia1stEdition
, 1993
Fundamentals of ElectromigrationAware Integrated Circuit Design Matthias Thiele, Jens Lienig
SpringerInternationalPublishing 2018
WeblinksandVideoLectures(e-Resources):
• nptel.ac.in
33
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnova
tivemethodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpre
tandconclude.
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description
Blo
omsL
evel
CO1 Comprehend the recent research in the area of interconnect and device reliability. L2CO2
Understandthephysics-basedEMmodeling.
L2
CO3UnderstandtheunderlyingphenomenaofBTI,HCI,TDDBleadingtodevice-levelL2
reliabilitydegradation.
CO4Relate to considerations at the circuit-level with both combinational and
sequentialL4elements.
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolve
practicalproblemsrelatedtoVLSI Designandembeddedsystems.
PO1
2. Demonstrateadegree ofmasteryoverthe
areasofVLSIDesignandembeddedsystems.Themasteryshouldbeatalevelhigherthantherequir
ementsinthe
PO2bachelor'sinElectronics&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeetthe
internationalstandardsinthearea of VLSI designandembeddedsystems.
PO3
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,
Testing,VerificationandIntegratemultiplesub-systemstodevelopSystemOnChipto
PO4
optimizeitsperformanceandexcelinindustrysectorsrelatedtoVLSI/Embedded
domain.
5. Understandimpactofprofessionalengineeringsolutionsin societal
andenvironmentalcontexts and demonstrate theknowledge for sustainable
PO5development.
34
Low Power VLSI Design
Course Code MLVS216C CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40hoursTheory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TostudyState-of-theartapproachesof powerestimationandreduction.
• Tounderstandpowerdissipationatvariouslevelsof design
Module-1
Introduction:Needforlow powerVLSIchips,charging anddischarging capacitance,shortcircuitcurrent
in CMOS leakage current, static current, basic principles of low power design, low power figure of
merits.Simulationpoweranalysis:SPICEcircuitsimulation, MonteCarlosimulation.
RBT Levels: L2, L3
Module-2
Circuit:Transistorandgatesizing,equivalentpinordering,networkrestructuringandreorganization,speciallatc
hesandflipflops, lowpowerdigitalcelllibrary, adjustabledevicethresholdvoltage.
RBT Levels: L2, L3
Module-3
Logic: Gatereorganization,signalgating,logicencoding,statemachineencoding,pre-
computationlogic.LowpowerClockDistribution:Powerdissipationinclockdistribution,singledriverVsdistribut
edbuffers.
RBT Levels: L2, L3
Module-4
Low power Architecture & Systems: Power & performance management, switching activity reduction,
flowgraphtransformation.Lowpowermemorydesign:Introduction,sourcesandreductionsofpowerdissipatio
ninmemorysubsystem.
RBT Levels: L2, L3
Module-5
Algorithm&ArchitecturalLevelMethodologies:Introduction,designflow,Algorithmiclevelanalysis&optimiz
ation,Architecturallevelestimation&synthesis.AdvancedTechniques:Adiabaticcomputation,
Asynchronouscircuits.
RBT Levels: L2, L3
35
AssessmentDetails(bothCIEandSEE)
TheweightageofContinuousInternalEvaluation(CIE)is50%andforSemesterEndExam(SEE)is50%.Theminim
um passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%of the
maximum marks of SEE.A student shall be deemed to have satisfied the academic requirements
andearnedthecreditsallottedtoeachsubject/courseifthestudentsecuresnotlessthan50%(50marksoutof100)i
nthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIEmethods/questionpaperisdesignedtoattainthedifferentlevelsofBloom’staxonomyaspertheoutco
medefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
36
SuggestedLearningResources:
Books
1) GaryK.Yeap,“PracticalLowPowerDigitalVLSIDesign”,KluwerAcademic,1998.
2) JanM.Rabaey,MassoudPedram,“LowPowerDesignMethodologies”,KluwerAcademic,2010.
3) KaushikRoy, SharatPrasad,“Low-PowerCMOSVLSICircuitDesign”Wiley, 2000
4) A.P.ChandrasekaranandR.W.Broadersen, “LowpowerdigitalCMOSdesign”, KluwerAcademic,1995
.5)ABellamour andMIElmasri,“LowpowerVLSI CMOScircuitdesign”,KluwerAcademic,1995.
WeblinksandVideoLectures(e-Resources):
1. https://archive.nptel.ac.in/courses/106/105/106105034/
2. https://www.youtube.com/watch?v=TFOO1JAll2Y
3. https://www.youtube.com/watch?v=ORtlxpW_LMU
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnova
tivemethodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpre
tandconclude.
37
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolvepractical
PO1
problemsrelatedtoVLSI Design andembeddedsystems.
2. Demonstrateadegree ofmasteryoverthe areasofVLSIDesignandembedded
systems.Themasteryshouldbeatalevelhigherthantherequirementsinthebachelor'sinEl PO2
ectronics&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeettheinternation
PO3
alstandardsintheareaof VLSIdesignandembeddedsystems.
4. Acquire competency in areas of VLSI and Embedded Systems, IC Fabrication,
Design,Testing,VerificationandIntegratemultiplesub-
PO4
systemstodevelopSystemOnChiptooptimize its performance and excel in industry
sectors related to VLSI / Embeddeddomain.
5. Understandimpactofprofessionalengineeringsolutionsinsocietalandenvironmentalco
ntexts and demonstrate theknowledge for sustainable PO5
development.
38
RISC V
Course Code MLVS216D CIE Marks 50
Teaching Hours/Week(L:P:SDA) 3:0:0 SEE Marks 50
Total Hours of Pedagogy 40 hours Theory Total Marks 100
Credits 03 Exam Hours 03
CourseLearningobjectives:
• TostudythebasicsofRISCVarchitecture.
• TounderstandtheRISC-VImplementation
• TocreatethedatapathinRISC-V.
Module-1
Instructions:Introduction ,Operations of the Computer, Operands of the Computer
Hardware,SignedandUnsignedNumbers,RepresentingInstructionsintheComputer,Logical
Operations,InstructionsforMakingDecisions,SupportingProceduresinComputerHardware,Communicati
ngwithPeople,RISC-VAddressingforWideImmediateandAddresses.
RBT Levels: L2, L3
Module-2
Instructionscontinued:ParallelismandInstructions:Synchronization,TranslatingandStartingaProgram, A
C Sort Example to Put it All Together, Real Stuff: The Rest of the RISC-V Instruction SetArithmetic for
Computers: Addition and Subtraction, Multiplication,Multiply in RISC-V ,Division DivideinRISC-
V,Floating-PointInstructionsinRISC-V.
RBT Levels: L2, L3
Module-3
TheProcessor:A Basic RISC-V Implementation, An Overview of the Implementation, LogicDesign
Conventions, Building a Datapath, A Simple Implementation Scheme, Overview of Pipelining.
RBT Levels: L2, L3
Module-4
TheProcessorcontinued:PipelinedDatapathandControl,DataHazards:ForwardingversusStalling,ControlH
azards.HowExceptionsareHandledintheRISC-VArchitecture,Instruction-LevelParallelismandMatrixMultiply,
LargeandFast:ExploitingMemoryHierarchy,MemoryTechnologies.
RBT Levels: L2, L3
Module-5
Large and Fast: Exploiting Memory Hierarchy continued: The Basics of Caches, Virtual Machines,
VirtualMemory,Placing a Page and Finding It Again,Page Faults,Virtual Memory for Large Virtual
Addresses,MakingAddressTranslationFast:theTLB,TheIntrinsityFastMATHTLB,IntegratingVirtualMemory,
TLBs,andCaches.
RBT Levels: L2, L3
39
AssessmentDetails(bothCIEandSEE)
TheweightageofContinuousInternalEvaluation(CIE)is50%andforSemesterEndExam(SEE)is50%.Theminim
um passing mark for the CIE is 50% of the maximum marks. Minimum passing marks in SEE is 40%of the
maximum marks of SEE.A student shall be deemed to have satisfied the academic requirements
andearnedthecreditsallottedtoeachsubject/courseifthestudentsecuresnotlessthan50%(50marksoutof100)i
nthesumtotaloftheCIE(ContinuousInternalEvaluation)andSEE(SemesterEndExamination)takentogether.
ContinuousInternalEvaluation:
1. TwoUnitTests eachof25Marks
2. Twoassignmentseachof 25MarksoroneSkillDevelopmentActivityof50marks
toattaintheCOs andPOs
Thesumoftwotests,twoassignments/skillDevelopmentActivities,willbe scaleddownto50marks
CIEmethods/questionpaperisdesignedtoattainthedifferentlevelsofBloom’staxonomyaspertheoutco
medefinedforthecourse.
Semester-EndExamination:
1. TheSEEquestionpaperwillbesetfor100marksandthemarksscoredwillbeproportionatelyreducedto50.
2. Thequestionpaperwillhavetenfullquestionscarrying equalmarks.
3. Eachfullquestionisfor20marks.Therewillbetwofullquestions(withamaximumoffoursub-
questions)fromeachmodule.
4. Eachfullquestionwillhaveasub-questioncoveringallthetopicsunderamodule.
5. Thestudentswillhavetoanswerfivefullquestions, selecting onefullquestionfromeachmodule
SuggestedLearningResources:
Books:
1. ComputerOrganizationandDesign:TheHardware/SoftwareInterface:RISC-
VEdition,byDavidA.Patterson,JohnL. Hennessy,Elsevier.
2. DigitalDesignandComputerArchitecture,RISC-
VEditionbyDavidHarris,SarahL.Harris.2021MorganKaufmanPublication.
3. GuidetoComputerProcessorArchitecture,ARISCVapproachbyGoossensBernard,SpringerInternationalPu
blishingAG
WeblinksandVideoLectures(e-Resources):
• https://www.youtube.com/watch?v=TVvMPh_P2is&list=PLgzAvj2cYr3qGvecT_PSnKzl5SxECZmI3
&index=2,
• https://www.youtube.com/watch?v=BVvDHhG0RoA&list=PL5AmAh9QoSK7Fwk9vOJu-
3VqBng_HjGFc
SkillDevelopmentActivitiesSuggested
1) Interactwithindustry(small,medium,andlarge).
2) Involveinresearch/testing/projectstounderstandtheirproblemsandhelpcreativeandinnova
tivemethodstosolvetheproblem.
3) Involveincasestudiesandfieldvisits/ fieldwork.
4) Accustomtotheuseofstandards/codesetc.,tonarrowthegapbetweenacademiaandindustry.
5) Handleadvancedinstrumentstoenhancetechnicaltalent.
6) Gainconfidenceinmodellingofsystemsandalgorithmsfortransientandsteady-
stateoperations,thermalstudy, etc.
7) Workondifferentsoftware/s(tools)tosimulate,analyzeandauthenticatetheoutputtointerpre
tandconclude.
All activities should enhance student’s abilities to employment and/or self-employment
opportunities,management skills, Statistical analysis, fiscal expertise, etc. Students and the course
instructor/s
toinvolveeitherindividuallyoringroupstointeracttogethertoenhancethelearningandapplicationskills
40
Courseoutcome(CourseSkillSet)
Attheendof thecoursethestudentwillbeableto:
Sl.No. Description
Blo
omsL
evel
CO1 DescribeRISC-Vinstructionsandthelanguageof thecomputer.
L2
CO2 Constructadatapathandlearning moreaboutfloating-pointarithmetic
L6
CO3UnderstandDataHazardsandhowExceptionsareHandledintheRISC-VL2
Architecture
CO4 Understandthememorymappingtechniques L2
ProgramOutcomeofthiscourse
Sl.No. Description POs
1. Independentlycarryoutresearch/investigationanddevelopmentworktosolve
practicalproblemsrelatedtoVLSI Designandembeddedsystems.
PO1
2. Demonstrateadegree
ofmasteryovertheareasofVLSIDesignandembeddedsystems.Themasteryshouldbeatalevelhig
herthantherequirementsinthe
PO2bachelor'sinElectronics&CommunicationEngineering.
3. Applyappropriatemethodologyandmodernengineering/ITtoolstomeetthe
internationalstandardsinthearea of VLSI designandembeddedsystems.
PO3
4. AcquirecompetencyinareasofVLSIandEmbeddedSystems,ICFabrication,Design,
Testing,VerificationandIntegratemultiplesub-systemstodevelopSystemOnChipto
PO4
optimizeitsperformanceandexcelinindustrysectorsrelatedtoVLSI/Embedded
domain.
5. Understandimpactofprofessionalengineeringsolutionsin societal
andenvironmentalcontexts and demonstrate theknowledge for sustainable
PO5development.
41
VLSI Design and Embedded Systems Lab
Course Code MLVSL207 CIE Marks 50
Teaching Hours/Week(L:T:P:S) 0:0:4 SEE Marks 50
Credits 02 Exam Hours 03
Sl.NO Experiments
PartA:FPGADIGITALDESIGNVLSIFrontEndDesignprograms:
Programmingcanbedoneusinganycompiler.DownloadtheprogramsonFPGA/CPLDboardsandusep
atterngenerator (32 channelsandlogicanalyzer)/Chipscopepro apartfrom
verificationbysimulation
1 WriteVerilogcodeforthedesignof8-biti. CarryRippleAdderii.CarryLookAhead adder
iii.CarrySkip Adder
2 WriteVerilogCode for8-biti.ArrayMultiplication(SignedandUnsigned)ii.Booth
Multiplication(Radix-4)
3
WriteVerilogcodefor4/8-biti.MagnitudeComparatorii.LFSRiii.ParityGenerator
4 Develop a Verilog model for a thermostat that has two 8-bit unsigned binary
inputsrepresenting the target temperature and the actual temperature in degrees
Fahrenheit(˚F). Assume that both temperatures are above freezing (32˚F). The detector
has twooutputs: one to turn a heater on when the actual temperature is more than 5˚F
belowtarget,andonetoturnacooleronwhentheactualtemperatureismorethan5˚Fabove
target
5 DevelopaVerilogmodelofthe7-segmentdecoder,exerciseatestbench,synthesizeand
dotheinitialtimingverificationwithgatelevelsimulation.
6 DesignaMealyandMooreSequenceDetectorusingVerilogtodetectSequence.Eg11101
(withand withoutoverlap)anysequencecanbespecified.
PartB:ARMCortexM3Programs-
ProgrammingtobedoneusingsuitableCADtoolanddownloadtheprogramontoaM3evaluationboard .
7 WriteanAssemblylanguageprogramtocalculatethesumanddisplaytheresultfortheadditiono
ffirsttennumbers.SUM =10+9+8+.+1
8 WriteaEmbedded Cprogramtooutputthe“HelloWorld”messageusingUART
Courseoutcomes(CourseSkillSet):
Attheend ofthecoursethestudentwill beableto:
1. UnderstandthefeaturesofCADtoolinVLSIdesign.
2. Designandverifythebehaviorofdigitalcircuitsusingdigitalflow
3. Verifythedesignusing alogicanalyzer
4. Analysephysicaldesign
42
5. Develop Assembly language programs and C language programs for different
applicationsusing ARM-CortexM3Kit and KeiluVision-4tool.
AssessmentDetails(bothCIEandSEE)
The weightage of Continuous Internal Evaluation (CIE) is 50% and for Semester End
Exam(SEE)is50%.TheminimumpassingmarkfortheCIEis50%ofthemaximummarks.Astudentsh
allbedeemedtohavesatisfiedtheacademicrequirementsandearnedthecreditsallottedtoeach
course. The student has to secure not less than 40% of maximum marks in the semester-end
examination(SEE). In total of CIE and SEE student has to secure 50% maximum marks
ofthecourse.
ContinuousInternalEvaluation(CIE):
CIEmarksfor thepractical courseis 50 Marks.
Thesplit-upofCIEmarksforrecord/ journal andtestareintheratio60:40.
• Each experiment to be evaluated for conduction with an observation sheet and
recordwrite-up. Rubrics for the evaluation of the journal/write-up for
hardware/softwareexperimentsdesignedbythefacultywhoishandlingthelaboratorysessi
onandismadeknowntostudentsatthebeginningofthepracticalsession.
• Recordshouldcontainallthespecifiedexperimentsinthesyllabusandeachexperimentwrite-
upwillbeevaluated for10marks.
• Total marks scored by the students are scaled down to 30 marks (60% of
maximummarks).
• Weightagetobegivenfor neatnessand submissionofrecord/write-upontime.
• Department shall conduct 01 tests for 100 marks, test shall be conducted after the
14thweekofthesemester.
• Intest,testwrite-
up,conductionofexperiment,acceptableresult,andproceduralknowledgewillcarrya
weightageof60%andtherest40%forviva-voce.
• Thesuitablerubricscanbedesignedto
evaluateeachstudent’sperformanceandlearningability.
• Thetestmarks isscaleddownto20 marks(40%ofthemaximummarks).
TheSumofscaled-downmarksscoredinthereportwrite-up/journalandmarksoftestisthetotal CIE
marksscored bythestudent.
SemesterEndEvaluation(SEE):
SEEmarksforthepractical courseis50 Marks.
SEEshallbeconductedjointlybythetwoexaminersofthesameinstitute,examinersareappointedbyt
heUniversity.
Alllaboratoryexperimentsaretobeincludedforpracticalexamination.
(Rubrics) Breakup of marks and the instructions printed on the cover page of the
answerscript to be strictly adhered to by the examiners.OR based on the course
requirementevaluationrubricsshallbedecidedjointlybyexaminers.
Studentscanpick onequestion(experiment)fromthe questionslotpreparedby theinternal
/externalexaminersjointly.
Evaluationoftestwrite-
up/conductionprocedureandresult/vivawillbeconductedjointlybyexaminers.
43
General rubrics suggested for SEE are mentioned here, writeup-20%, Conduction
procedureandresultin-60%,Viva-
voce20%ofmaximummarks.SEEforpracticalshallbeevaluatedfor100 marks and scored marks
shall be scaled down to 50 marks (however, based on coursetype,rubricsshallbedecided
bytheexaminers)
Changeofexperimentisallowedonlyonceand10%Marksallottedto
theprocedureparttobemadezero.
ThedurationofSEEis03 hours
SuggestedLearningResources:
Referencebook:PeterJ.AshendenDigitalDesign(Verilog):AnEmbeddedSystemsApproachUsing
Verilog1stEdition,KindleEdition
44