IPC-9797

2020 - May
Press-Fit Standard for Automotive
Requirements and Other
High-Reliability Applications
An international standard developed by IPC
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 IPC-9797
®

Press-Fit Standard for

Automotive Requirements
and Other High-Reliability
Applications

Developed by the Cold Joining Press-Fit Task Group (5-21m) of the

Assembly and Joining Committee (5-20) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC
3000 Lakeside Drive, Suite 105N
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
This Page Intentionally Left Blank
May 2020 IPC-9797

Acknowledgment
Any document involving a complex technology draws material from a vast number of sources across many continents. While the
principal members of the IPC Cold Joining Press-Fit Task Group (5-21m) of the Assembly and Joining Committee (5-20) are shown
below, it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of
IPC extend their gratitude.

Assembly and Joining Cold Joining Press-Fit Technical Liaison of the

Committee Task Group IPC Board of Directors

Chair Co-Chairs
Daniel Foster Hans-Peter Tranitz Bob Neves
Missile Defense Agency Continental Automotive GmbH Microtek (Changzhou) Laboratories
Vice Chair Udo Welzel
Karen A. Tellefsen Robert Bosch GmbH
MacDermid Alpha Electronics Solutions

Cold Joining Press-Fit Task Group

David C. Adams, Collins Aerospace Bernd Eifer, ERNI Elektroapparate Chandran Nantha Kumar, Interplex
Thomas Ahrens, Trainalytics GmbH GmbH Precision Technology (Singapore)
Juergen Friedrich, ERSA GmbH Pte.Ltd.
Randy Alexander, CTS Corporation
Hugo GARCIA, Airbus Defence & Dietmar Kurzeja, Possehl Electronics
Frederick P. Beltran, L3Harris
Communications Space Hugues Lenormand, Veoneer
Martin Bleicher, TE Connectivity Joachim Giuriato, Molex Elektronik Francois Le-Rest, Continental
Germany GmbH GmbH Automotive France SAS
William Bowers, ZF TRW Automotive Andrew Goddard, ZF Automotive UK Joseph Lynch, Interplex Industries, Inc
Limited Chris Mahanna, Robisan Laboratory
Bjoern Bretthauer, INOVAN GmbH &
Co. KG Constantino Jose Gonzalez, ACME Inc.
Training & Consulting Jean-Francois Mahe, LCO
Marc Brodbeck, Würth Elektronik ICS
GmbH & Co. KG Thomas Gottwald, Schweizer Electronic Michael Meckl, Interplex Industries, Inc
AG
Jay Brusse, SSAI at NASA Goddard Amit Mensi, Molex, LLC
Space Flight Center Arnaud Grivon, Thales Global Services
Julien Michau, Sonceboz SA
Andreas Buehrle, Wieland-Werke AG Michael Haas, ERSA GmbH
Steve Minich, Amphenol InterCon
Giovanni Casanova, Schweitzer Lutz Haase, HELLA GmbH & Co. Systems
Engineering Laboratories, Inc. KGaA
Shota Mishima, Toyota Motor
Zhiman Chen, Zhuzhou CRRC Times Stefan Hanigk, Ariane Group GmbH Corporation
Electric Co., Ltd. Alafio Hewitt, Lockheed Martin Missiles Werner MORITZ, iwis smart connect
Lenora M. Clark, MacDermid Alpha & Fire Control GmbH
Electronics Solutions Gaston Hidalgo, Toyota Motor North Kristopher Moyer
Charles Copper, FCI USA, Inc. America
Wolfgang Neef, ELCO Europe GmbH
Erika Crandall, TE Connectivity Angela Mary Higgins, Molex Ireland
Thi V. Nguyen, Lockheed Martin Missile
Germany GmbH Ltd.
& Fire Control
Philip Dancison, Delphi Automotive Charles Hirbour, Technic Inc.
Jason Nipper, UTC Aerospace
Pascal Dumontet, Renault Emma Hudson, Emma Hudson Systems
Technocentre Technical Consultancy Ltd
James O’Connor, IBM Corporation
Gene Dunn, Plexus Corporation Philippe Jaeckle, Robert Bosch GmbH
Andres Ojalill, Tallinn Polytechnic
Michael Durkan, Mentor Graphics Rajesh Jayaraj, Webasto Roof & School
Corporation Components SE
Brad Palmer, John Deere Electronic
Juergen Egervari, IMOC Electronic Satoshi Kashiwabara, Toyota Motor Solutions, Inc.
Components (Changzhou) Co., Ltd. Corporation
Timothy John Pearson, Collins
Hermann Eicher, EPT Guglhoer GmbH Daniel Klenk, Nexteer Automotive Aerospace
Yusaku Kono, Japan Unix Co., Ltd. Jan Pedersen, Elmatica AS

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IPC-9797 May 2020

Kenneth Rahn, FCI USA, Inc. Katarzyna Szydlowska, APTIV Lutz Weber, ZF Automotive UK Limited
Suraj Ramani, Molex, LLC Augustin Stan, L&G Advice Serv SRL Benjamin Weihl, Nexteer Automotive
Tarja Rapala, EIPC-The European Hartwig Stein, TBS Sorig Michael Kurt Weinhold, PLUS
Institute for the PCB Community Wayne Zhang, IBM Procurement China Leiterplatten G
Matthias Rink, Gebr. Kemper GmbH + Ltd. Udo Welzel, Robert Bosch GmbH
Co. KG Grzegorz Zmuda, APTIV Jonathon Vermillion, Ball Aerospace &
Jose A. Rios, Raytheon Paul Zutter, U.S. Army Aviation & Technologies Corp.
Ralf-Michael Sander, ebm-papst St. Missile Command Dennis Willie, Flextronics International
Georgen GmbH & Co. KG Toshiyasu Takei, Japan Unix Co., Ltd. Volker Wohlfarth, Umicore
Stefan Scherer, Alicona Imaging GmbH Friedrich Talgner, Umicore Galvanotechnik GmbH
Michael Schleicher, Semikron Elektronik TATSUROH TANAKA, Toyota Motor Heike Woldt, Diehl Metal Applications
GmbH Co. KG Corporation GmbH
Torsten Schmidt, HELLA GmbH & Co. Pascal Thibaut, Sonceboz SA Fonda B. Wu, Raytheon Company
KGaA Frank Xu, MacDermid Alpha Electronics
John Paul Thompson, FCI USA, Inc.
Douglas R. Schueller, AbelConn, LLC Solutions
Hans-Peter Tranitz, Continental
Eduard Schulz, Possehl Electronics Automotive GmbH Yuki Yagyu, Denso Corporation
Takumi Shiomi, Denso Corporation Juergen Turnsek, HAERTER
Pawel Slusarczyk, APTIV Frank Uibel, Uibel Consulting
Bhanu Sood, NASA Goddard Space Jose Maria Vallez Ramos, Webasto
Flight Center Roof & Components SE

1. Figures 1-1, 1-2, 3-1, 4-1; 4-3, 4-4. 4-5, 4-7,

4-8, 4-9, 4-10, 4-11 are © EPT Guglhoer
GmbH, used by permission.

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May 2020 IPC-9797

Table of Contents
1 Scope ........................................................................... 1 2.1 IPC Documents ..................................................... 6
1.1 Purpose ................................................................. 1 2.2 Joint Industry Documents ...................................... 7
1.2 Classification .......................................................... 1 2.3 JEDEC ................................................................... 7
1.3 Measurement Units ................................................ 1 2.4 International Electrotechnical Commission
Documents ............................................................ 7
1.3.1 Verification of Dimensions ...................................... 1
2.5 ASTM .................................................................... 7
1.4 Definition of Requirements ..................................... 1
2.6 Automotive Industry Action Group
1.4.1 Acceptance Criteria ............................................... 2
Documents ............................................................ 7
1.5 Process Control Requirements .............................. 3
2.7 International Organization for Standardization
1.6 Order of Precedence ............................................. 3 (ISO) ...................................................................... 7
1.6.1 Conflict .................................................................. 3
3 REQUIREMENTS ......................................................... 7
1.6.2 Appendices ............................................................ 3
3.1 Compliant Press-Fit Pin Requirements .................. 7
1.7 Use of ‘‘Lead’’ ....................................................... 3
3.1.1 Cleanliness Requirements ...................................... 7
1.8 Abbreviations and Acronyms ................................. 3
3.1.2 Design Requirements ............................................. 7
1.9 Terms and Definitions ............................................ 3
3.1.3 Compliant Press-Fit Pin Contact Finish
1.9.1 Compliant Press-Fit Pin Connection ...................... 3 Requirements ........................................................ 8
1.9.2 Compliant Press-Fit Pin ......................................... 3 3.2 Requirements for Printed Boards for Press-Fit
1.9.3 Compliant Press-Fit Zone ...................................... 3 Technology ............................................................ 8
1.9.4 Contact Area ......................................................... 4 3.2.1 Printed Circuit Board Design Requirements ........... 8
1.9.5 Deposition of Surface Finishes ............................... 4 3.2.2 Material Requirements ........................................... 9
1.9.6 Pad Lifting ............................................................. 4 3.2.3 Surface Finish ........................................................ 9
1.9.7 Pad Bulging ........................................................... 4 3.2.4 Printed Board Requirements for Qualification
and Test of Compliant Press-Fit Zones ................. 9
1.9.8 Laminate Buckling ................................................. 4
1.9.9 Whitening ............................................................... 4 4 TESTS .......................................................................... 9
1.9.10 Intimate Metal to Metal Connection ....................... 4 4.1 General .................................................................. 9
1.9.11 Jet-Effect Deformation j ......................................... 4 4.2 Unassembled Tests – Test Group A .................... 12
1.9.12 Pin Shaft ................................................................ 4 4.2.1 Examination of Pin and Test-Printed Board
Dimensions – A1 ................................................. 12
1.9.13 Pin Neck ................................................................ 4
4.2.2 Optical Inspection of Surface Condition – A2 ...... 12
1.9.14 Pin Shoulder .......................................................... 4
4.2.3 Adhesion Test – A3 ............................................. 12
1.9.15 Compliant Press-Fit Zone Tip ................................ 4
4.2.4 Spring-Force Measurement – A4 ......................... 13
1.9.16 Strip and Strip Thickness ....................................... 4
4.2.5 Cross Sections of Pins and Printed Board – A5 .. 13
1.9.17 Push-In Force ........................................................ 4
4.3 Assembled Tests – Test Group B to F ................ 14
1.9.18 Push-Out Force ..................................................... 5
4.3.1 Push-In and Measurement of Push-In Force –
1.9.19 Pull-Out Force ....................................................... 5 B1, C1, D1, E1, F1 .............................................. 14
1.9.20 Push-Through Force .............................................. 5 4.3.2 Storage – B2, C2, D2, E2 ................................... 14
1.9.21 Electrical Clearance ............................................... 5 4.3.3 Optical Inspection on Protrusion and Insertion
Side – B3, C3+C6, D3+D10, E3+E7 ................... 14
1.9.22 User ....................................................................... 5
4.3.4 Contact Resistance – B4, C4+C7, D4+D11,
1.9.23 Manufacturer (Assembler) ...................................... 5 E4+E8 ................................................................. 14
1.9.24 Supplier ................................................................. 6 4.3.5 Push-Out and Measurement of Push-Out
1.10 Additional Requirements ........................................ 6 Force – B5, C8, D12, E9 ..................................... 15
1.10.1 Requirements Flowdown ....................................... 6 4.3.6 Transverse and Longitudinal Cross-Sections –
B6, C9, D13, E10 ................................................ 15
1.10.2 Personnel Proficiency ............................................ 6
4.4 Environmental Tests – Test Groups C, D, E ........ 17
1.11 Inspection Methodology ......................................... 6
4.4.1 Temperature Cycle – C5, D5, E5 ......................... 17
1.11.1 Lighting .................................................................. 6
4.4.2 Climatic Sequence – D6 ...................................... 17
1.11.2 Magnification Aids .................................................. 6
4.4.3 High Temperature Storage – D7 .......................... 17
2 APPLICABLE DOCUMENTS ...................................... 6 4.4.4 Flowing Mixed Gas Corrosion Test – D8 ............. 17

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IPC-9797 May 2020

4.4.5 Vibration Test – E6 .............................................. 18 Figure 5-6 ..................................................................... 21

4.5 Whisker Test ........................................................ 18 Figure 5-7 ..................................................................... 21
4.5.1 2000 H Storage – E2 .......................................... 18 Figure 5-8 ..................................................................... 21
Figure 5-9 ..................................................................... 22
5 Acceptance Criteria .................................................. 19
Figure 5-10 ..................................................................... 22
5.1 Test Group A ....................................................... 19
Figure 5-11 Cracking of Solder Resist ............................ 22
5.1.1 Adhesion ............................................................. 19
Figure 5-12 ..................................................................... 23
5.2 Acceptance Criteria for Test Groups B-E ............ 20
Figure 5-13 ..................................................................... 23
5.2.1 Optical Inspection ................................................ 20
Figure 5-14 Indications of Delamination (Whitening) ....... 23
5.2.2 Cross-Sectional Criteria ....................................... 28
Figure 5-15 ..................................................................... 24
5.3 Mechanical .......................................................... 36
Figure 5-16 ..................................................................... 24
5.3.1 Push-In Force ...................................................... 36
Figure 5-17 ..................................................................... 24
5.3.2 Push-Out Force ................................................... 36
Figure 5-18 ..................................................................... 25
5.4 Electrical .............................................................. 37
Figure 5-19 ..................................................................... 25
5.4.1 Contact Resistance ............................................. 37
Figure 5-20 ..................................................................... 25
Appendix A Abbreviations and Acronyms ............... 38 Figure 5-21 ..................................................................... 26
Figure 5-22 ..................................................................... 27
Appendix B Requirements for Aerospace
Applications ............................................ 39 Figure 5-23 ..................................................................... 27
Figure 5-24 ..................................................................... 27
Figures Figure 5-25 ..................................................................... 28
Figure 1-1 Schematic of Longitudinal (a) and Transverse Figure 5-26 ..................................................................... 28
(b) Cross-Section of a Compliant Press-Fit Figure 5-27 j = 125 µm .................................................. 28
Connection. ................................................... 4
Figure 5-28 ..................................................................... 29
Figure 1-2 Examples of Interface Contacts, Compliant
Press-Fit Pin and Plated-Through Hole. ........ 5 Figure 5-29 ..................................................................... 29

Figure 4-1 Elasticity Test Tool with Compliant Press-Fit Figure 5-30 ..................................................................... 29
Pin on the Left and Closed Tool on the Right Figure 5-31 ..................................................................... 30
(drawing is not to scale). ............................. 13 Figure 5-32 ..................................................................... 31
Figure 4-2 Typical Spring Force Diagrams and A Figure 5-33 ..................................................................... 31
Corrective Curve. ........................................ 13
Figure 5-34 ..................................................................... 31
Figure 4-3 Regions of Interest for Visual Inspection
of a Press-Fit Joint ...................................... 14 Figure 5-35 ..................................................................... 32
Figure 4-4 Test Setup for the 4-Point Resistance Figure 5-36 ..................................................................... 32
Measurement .............................................. 14 Figure 5-37 ..................................................................... 33
Figure 4-5 Test Setup for the Push-Out Test ............... 15 Figure 5-38 ..................................................................... 33
Figure 4-6 Schematic Force Versus Distance/ Figure 5-39 ..................................................................... 34
Displacement Graph Obtained in A Figure 5-40 ..................................................................... 34
Push-Out Test ............................................. 15
Figure 5-41 ..................................................................... 35
Figure 4-7 Indication of Plane for Transverse
Cross-Section ............................................. 15 Figure 5-42 ..................................................................... 35
Figure 4-8 Indication of Planes for Longitudinal Figure 5-43 ..................................................................... 35
Cross-Sections ............................................ 16
Tables
Figure 4-9 Lateral PTH Deformation a and Remaining
Metallization b Cross-Sections .................... 16 Table 3-1 Examples of Common Press-Fit
Figure 4-10 Remaining Metallization b, Deformation Applications ................................................... 7
of Inner Layers (Jet Effect) j and Whitening Table 4-1 Test Sequence ............................................ 10
of Printed Board w ...................................... 16 Table 4-2 Qualification Tests Required for Initial
Figure 4-11 Cracks in Circles ......................................... 17 Qualification and Changes in Production ..... 12
Figure 5-1 ..................................................................... 19 Table 4-3 Test Conditions for Temperature Cycle ....... 17
Figure 5-2 ..................................................................... 19 Table 5-1 Wisker Documentation ................................ 26
Figure 5-3 ..................................................................... 19 Table 5-2 Typical Minimum Push-Out Forces for
Compliant Press-Fit Zone of Different
Figure 5-4 ..................................................................... 20 Material Thickness Pertaining to Nominal
Figure 5-5 ..................................................................... 20 Hole Sizes ................................................... 36

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May 2020 IPC-9797

Press-Fit Standard for Automotive Requirements

and Other High-Reliability Applications

1 Scope This standard prescribes practices for the characterization, qualification and acceptance requirements of compliant
press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended
for use in harsh environments such as automotive and aerospace.
Additional requirements for aerospace applications in Appendix B may apply.

1.1 Purpose This standard prescribes practices for the characterization, qualification and acceptance requirements of compli-
ant press-fit technology for printed boards.
Standards may be updated at any time, including with the use of amendments. The use of an amendment or newer revision is not
automatically required. The revision in effect shall be as specified by the user.

1.2 Classification

CLASS 1 General Electronic Products

Includes products suitable for applications where the major requirement is function of the completed assembly.

CLASS 2 Dedicated Service Electronic Products

Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but
not critical. Typically, the end-use environment would not cause failures.

CLASS 3 High Performance/Harsh Environment Electronic Products

Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tol-
erated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support
or other critical systems.
All requirements in this standard pertain to IPC Class 3. When this standard is contractually required, IPC Class 3 requirements
shall be adopted for all other contractually required standards.

1.3 Measurement Units This standard uses International System of Units (SI units) per ASTM SI10, IEEE/ASTM SI 10, Section
3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this standard are millimeters (mm) [in] for
dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g) [oz] for weight,
and lumens (lm) [footcandles] for illuminance.
Note: This standard uses other SI prefixes (ASTM SI10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm
becomes 1.2 µm) or as an alternative to powers-of-ten (3.6 x 103 mm becomes 3.6 m).

1.3.1 Verification of Dimensions When an inspection is done on an assembly, measuring dimensions and determining
percentages listed in the standard are not required unless there is a doubt or a question is raised about the acceptance of the
product. When there is a doubt or a question is raised, then a referee determination should be implemented, at which time mea-
surements should be made or percentages calculated using the referee magnifications defined in the Standard. For determining
conformance to the specifications in this standard, round all observed or calculated values ‘‘to the nearest unit’’ in the last right-
hand digit used in expressing the specification limit, in accordance with the rounding method of ASTM Practice E29. For example,
specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round the measured value to the nearest 0.1 mm, 0.01 mm, or
0.001 mm, respectively, and then compare to the specification number cited.

1.4 Definition of Requirements The words ‘‘shall’’ or ‘‘shall not’’ are used in the text of this document wherever there is a
requirement for materials, preparation, process control or acceptance.
The word ‘‘should’’ reflects recommendations and is used to reflect general industry practices and procedures for guidance only.
Line drawings and illustrations are depicted herein to assist in the interpretation of the written requirements of this standard. The
text takes precedence over the figures.